KR100806060B1 - 멀티-칩 패키지들의 ｉｃ칩들의 클러스터 패키징 - Google Patents

멀티-칩 패키지들의 ｉｃ칩들의 클러스터 패키징 Download PDF

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Publication number
KR100806060B1
KR100806060B1 KR1020000070909A KR20000070909A KR100806060B1 KR 100806060 B1 KR100806060 B1 KR 100806060B1 KR 1020000070909 A KR1020000070909 A KR 1020000070909A KR 20000070909 A KR20000070909 A KR 20000070909A KR 100806060 B1 KR100806060 B1 KR 100806060B1
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South Korea
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chip
chips
sites
chip sites
functional
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Expired - Fee Related
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KR1020000070909A
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English (en)
Korean (ko)
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KR20010051973A (ko
Inventor
가바라태디어스존
자칼라제리코제이
오코너케빈존
타이킹엘
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루센트 테크놀러지스 인크
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Publication of KR20010051973A publication Critical patent/KR20010051973A/ko
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Publication of KR100806060B1 publication Critical patent/KR100806060B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020000070909A 1999-11-29 2000-11-27 멀티-칩 패키지들의 ｉｃ칩들의 클러스터 패키징 Expired - Fee Related KR100806060B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US45052499A 1999-11-29 1999-11-29
US09/450,524 1999-11-29
US9/450,524 1999-11-29

Publications (2)

Publication Number Publication Date
KR20010051973A KR20010051973A (ko) 2001-06-25
KR100806060B1 true KR100806060B1 (ko) 2008-02-21

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KR1020000070909A Expired - Fee Related KR100806060B1 (ko) 1999-11-29 2000-11-27 멀티-칩 패키지들의 ｉｃ칩들의 클러스터 패키징

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JP (1) JP2001203315A (enExample)
KR (1) KR100806060B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4707446B2 (ja) * 2005-04-26 2011-06-22 富士通セミコンダクター株式会社 半導体装置
US7622313B2 (en) * 2005-07-29 2009-11-24 Freescale Semiconductor, Inc. Fabrication of three dimensional integrated circuit employing multiple die panels
KR102080865B1 (ko) * 2018-02-12 2020-02-24 세메스 주식회사 다이 본딩 방법
CN113825202B (zh) * 2021-09-28 2025-06-10 上海兆芯集成电路股份有限公司 跨芯片处理系统以及其路由方法
CN115116880A (zh) * 2022-07-22 2022-09-27 上海壁仞智能科技有限公司 芯片制造方法及设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661314A (ja) * 1992-02-03 1994-03-04 American Teleph & Telegr Co <Att> 半導体ウェーハ上の欠陥集積回路の特徴付け方法
US5915231A (en) * 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142481A (en) * 1976-05-22 1977-11-28 Toshiba Corp Production of semiconductor device
JPH01235264A (ja) * 1988-03-15 1989-09-20 Toshiba Corp 半導体集積回路装置
JPH03214764A (ja) * 1990-01-19 1991-09-19 Sharp Corp 半導体チップの製造方法
JP2746093B2 (ja) * 1993-12-30 1998-04-28 日本電気株式会社 半導体装置
JPH11330256A (ja) * 1998-05-19 1999-11-30 Tif:Kk 半導体装置およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661314A (ja) * 1992-02-03 1994-03-04 American Teleph & Telegr Co <Att> 半導体ウェーハ上の欠陥集積回路の特徴付け方法
US5915231A (en) * 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture

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Publication number Publication date
JP2001203315A (ja) 2001-07-27
KR20010051973A (ko) 2001-06-25

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