KR100791728B1 - 연마 장치 - Google Patents
연마 장치 Download PDFInfo
- Publication number
- KR100791728B1 KR100791728B1 KR1020020022366A KR20020022366A KR100791728B1 KR 100791728 B1 KR100791728 B1 KR 100791728B1 KR 1020020022366 A KR1020020022366 A KR 1020020022366A KR 20020022366 A KR20020022366 A KR 20020022366A KR 100791728 B1 KR100791728 B1 KR 100791728B1
- Authority
- KR
- South Korea
- Prior art keywords
- plate
- polishing
- abrasive
- holder
- fixed
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims abstract description 109
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 230000008878 coupling Effects 0.000 claims abstract description 17
- 238000010168 coupling process Methods 0.000 claims abstract description 17
- 238000005859 coupling reaction Methods 0.000 claims abstract description 17
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims 4
- 239000000498 cooling water Substances 0.000 description 35
- 239000002826 coolant Substances 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000004744 fabric Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims (5)
- 연마 장치에 있어서,연마판과;연마판을 지지하는 판홀더와;연마판의 외측 에지와 결합하고 있으며, 판홀더에 고정되고 링형상으로 형성되어 있는 고정 결합 부재와;연마판의 상부면으로부터 고정 결합 부재의 가압면을 분리시키며, 연마판의 상부면과 고정 결합 부재의 가압면 사이에 구비되어 있는 제 1의 O형링과;연마판의 하부면으로부터 판홀더의 상부면을 분리시키며, 연마판의 하부면과 판홀더의 상부면 사이에 구비되어 있는 제 2의 O형링과;유체의 압력을 변화시켜 연마판의 연마면의 형상을 변경하며, 연마판의 하부면과, 판홀더와 제 2의 o형링의 상부면에 의해 형성된 영역으로부터 유체를 공급하고 배출하기 위한 유체 공급-배출 기구를 포함하며,연마판의 외측 외주가 고정 결합 부재의 내측 외주로부터 분리된 것을 특징으로 하는 연마 장치.
- 제 1 항에 있어서,상기 연마판의 상부면내의 상기 제 1의 O형링의 위치는 상기 연마판의 하부면내의 상기 제 2의 O형링의 위치에 대응하는 것을 특징으로 하는 연마 장치.
- 제 1 항에 있어서,상기 고정 결합 부재는:상기 판홀더에 고정되어 있는 고정부와;상기 연마판의 외측 외주를 덮고 상기 고정 결합 부재의 내측 외주면으로부터 내측으로 연장된 연장부를 포함하는 것을 특징으로 하는 연마 장치.
- 제 3 항에 있어서,스텝부가 상기 연마판의 외측 에지내에 형성되고, 스텝부는 상기 고정 결합 부재의 연장부에 의해 지지되어 있는 것을 특징으로 하는 연마 장치.
- 제 1 항에 있어서,상기 연마판은 세라믹으로 제조된 것을 특징으로 하는 연마 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00131717 | 2001-04-27 | ||
JP2001131717A JP4489320B2 (ja) | 2001-04-27 | 2001-04-27 | 研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020083436A KR20020083436A (ko) | 2002-11-02 |
KR100791728B1 true KR100791728B1 (ko) | 2008-01-03 |
Family
ID=18979855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020022366A KR100791728B1 (ko) | 2001-04-27 | 2002-04-24 | 연마 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6692341B2 (ko) |
EP (1) | EP1252974B1 (ko) |
JP (1) | JP4489320B2 (ko) |
KR (1) | KR100791728B1 (ko) |
DE (1) | DE60207137T2 (ko) |
MY (1) | MY126202A (ko) |
TW (1) | TW589237B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6942544B2 (en) * | 2003-09-30 | 2005-09-13 | Hitachi Global Storage Technologies Netherlands B.V. | Method of achieving very high crown-to-camber ratios on magnetic sliders |
US6913515B2 (en) * | 2003-09-30 | 2005-07-05 | Hitachi Global Storage Technologies Netherlands B.V. | System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders |
JP2005268566A (ja) * | 2004-03-19 | 2005-09-29 | Ebara Corp | 化学機械研磨装置の基板把持機構のヘッド構造 |
JP5303491B2 (ja) | 2010-02-19 | 2013-10-02 | 信越半導体株式会社 | 研磨ヘッド及び研磨装置 |
JP6736404B2 (ja) * | 2016-07-26 | 2020-08-05 | 株式会社ディスコ | 研削装置 |
DE102021103709B4 (de) * | 2021-02-17 | 2024-08-29 | Lapmaster Wolters Gmbh | Doppel- oder Einseiten-Bearbeitungsmaschine |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0860238A2 (en) * | 1997-02-24 | 1998-08-26 | Ebara Corporation | Polishing apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
JPH11307486A (ja) | 1998-04-23 | 1999-11-05 | Toshiba Corp | Cmp方法およびそれに使用するcmp装置 |
JP2000094307A (ja) * | 1998-09-18 | 2000-04-04 | Ebara Corp | ポリッシング装置 |
US6227950B1 (en) * | 1999-03-08 | 2001-05-08 | Speedfam-Ipec Corporation | Dual purpose handoff station for workpiece polishing machine |
US6527632B1 (en) * | 1999-12-01 | 2003-03-04 | Gerber Coburn Optical, Inc. | Lap having a layer conformable to curvatures of optical surfaces on lenses and a method for finishing optical surfaces |
-
2001
- 2001-04-27 JP JP2001131717A patent/JP4489320B2/ja not_active Expired - Lifetime
-
2002
- 2002-04-19 TW TW091108033A patent/TW589237B/zh not_active IP Right Cessation
- 2002-04-24 DE DE60207137T patent/DE60207137T2/de not_active Expired - Lifetime
- 2002-04-24 KR KR1020020022366A patent/KR100791728B1/ko active IP Right Grant
- 2002-04-24 EP EP02252907A patent/EP1252974B1/en not_active Expired - Lifetime
- 2002-04-25 US US10/136,578 patent/US6692341B2/en not_active Expired - Lifetime
- 2002-04-26 MY MYPI20021532A patent/MY126202A/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0860238A2 (en) * | 1997-02-24 | 1998-08-26 | Ebara Corporation | Polishing apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20020160702A1 (en) | 2002-10-31 |
EP1252974A2 (en) | 2002-10-30 |
MY126202A (en) | 2006-09-29 |
US6692341B2 (en) | 2004-02-17 |
KR20020083436A (ko) | 2002-11-02 |
EP1252974A3 (en) | 2004-01-28 |
JP2002326155A (ja) | 2002-11-12 |
DE60207137D1 (de) | 2005-12-15 |
DE60207137T2 (de) | 2006-07-20 |
TW589237B (en) | 2004-06-01 |
JP4489320B2 (ja) | 2010-06-23 |
EP1252974B1 (en) | 2005-11-09 |
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