KR100768560B1 - 기판 처리 장치 - Google Patents
기판 처리 장치 Download PDFInfo
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- KR100768560B1 KR100768560B1 KR1020060089695A KR20060089695A KR100768560B1 KR 100768560 B1 KR100768560 B1 KR 100768560B1 KR 1020060089695 A KR1020060089695 A KR 1020060089695A KR 20060089695 A KR20060089695 A KR 20060089695A KR 100768560 B1 KR100768560 B1 KR 100768560B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
- 다수의 처리 모듈이 U 형태로 배치된 공정 처리부로, 상기 U 형태의 일단으로 들어온 기판이 상기 다수의 처리 모듈을 연속적으로 거쳐서 U 형태의 타단으로 나가는 공정 처리부;상기 U 형태의 일단과 타단의 서로 마주보는 부분 사이에 설치된 버퍼부로, 상기 버퍼부를 통해서 상기 기판이 상기 일단으로 들어가거나 상기 타단으로부터 나가는 버퍼부; 및상기 기판이 적재된 카세트가 놓여지는 적어도 하나의 로드 포트와, 상기 버퍼부와 상기 카세트 사이의 기판 이송을 전담하는 인덱서 로봇을 포함하는 인덱서부를 포함하며,상기 버퍼부는,상기 U 형태의 일단과 연결되고 상기 인덱서 로봇으로부터 기판을 받는 로딩 버퍼부와,상기 U 형태의 타단과 연결되고 상기 인덱서 로봇으로 기판을 전달하는 언로딩 버퍼부를 포함하는 기판 처리 장치.
- 삭제
- 제 1 항에 있어서,상기 로딩 버퍼부와 상기 언로딩 버퍼부는 각각 컨베이어 반송을 하는 기판 처리 장치.
- 제 1 항에 있어서,상기 버퍼부는 1단으로 구성되어, 상기 로딩 버퍼부와 상기 언로딩 버퍼부는 상기 U 형태의 일단과 타단의 서로 마주보는 부분 사이에 나란히 배치된 기판 처리 장치.
- 제 1 항에 있어서,상기 버퍼부는 2단으로 구성되어, 상기 2단 중 하단은 상기 로딩 버퍼부가 배치되고, 상기 2단 중 상단은 상기 언로딩 버퍼부가 배치되는 기판 처리 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060089695A KR100768560B1 (ko) | 2006-09-15 | 2006-09-15 | 기판 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020060089695A KR100768560B1 (ko) | 2006-09-15 | 2006-09-15 | 기판 처리 장치 |
Publications (1)
Publication Number | Publication Date |
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KR100768560B1 true KR100768560B1 (ko) | 2007-10-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020060089695A KR100768560B1 (ko) | 2006-09-15 | 2006-09-15 | 기판 처리 장치 |
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KR (1) | KR100768560B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100978127B1 (ko) | 2008-07-16 | 2010-08-26 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980079549A (ko) * | 1997-03-10 | 1998-11-25 | 이시다 아키라 | 기판처리장치 및 기판처리방법 |
KR19990045297A (ko) * | 1997-11-14 | 1999-06-25 | 이시다 아키라 | 기판처리장치 |
KR20060014457A (ko) * | 2006-01-27 | 2006-02-15 | 주식회사 디엠에스 | 평판 처리 장치 |
JP2006131372A (ja) | 2004-11-08 | 2006-05-25 | Tokyo Electron Ltd | 基板処理装置及びローダ装置及びアンローダ装置 |
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2006
- 2006-09-15 KR KR1020060089695A patent/KR100768560B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980079549A (ko) * | 1997-03-10 | 1998-11-25 | 이시다 아키라 | 기판처리장치 및 기판처리방법 |
KR19990045297A (ko) * | 1997-11-14 | 1999-06-25 | 이시다 아키라 | 기판처리장치 |
JP2006131372A (ja) | 2004-11-08 | 2006-05-25 | Tokyo Electron Ltd | 基板処理装置及びローダ装置及びアンローダ装置 |
KR20060014457A (ko) * | 2006-01-27 | 2006-02-15 | 주식회사 디엠에스 | 평판 처리 장치 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100978127B1 (ko) | 2008-07-16 | 2010-08-26 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
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