KR100759094B1 - A fabrication method of Mesh type cathode drum - Google Patents

Abstract

Method for producing a mesh-type negative electrode drum according to the present invention, the pre-treatment step (S10) for washing the surface of the cylindrical member 120 of the hollow hollow, and the surface of the cylindrical member 120 passed through the pretreatment step (S10). Copper plating step (S20) to form a copper layer 160 by plating copper, a photosensitive film applying step (S30) for applying a photosensitive film to the surface of the copper plated cylindrical member 120, and the cylindrical member coated with the photosensitive film (120) an exposure step (S40) of attaching a mask for photoetching on the surface and exposing with ultraviolet rays, a developing step (S50) of removing the photoetching mask and removing a photosensitive film of the exposed portion, and the cylindrical member ( 120) An etching step of forming a negative portion 162 by etching the exposed portion of the photosensitive film curing step (S60) and the outer peripheral surface of the cylindrical member 120 through the photosensitive film curing step (S60) to cure the photoresist remaining on the surface (S70) and the photosensitive which peels the said photosensitive film Peeling step (S80), chromium plating step (S90) to form a chromium layer 180 by plating chromium on the surface of the copper layer 160, and intaglio filling step (S100) to fill the intaglio portion 162 It is configured to include. According to such a structure, there exists an advantage which can continuously mass-produce the metal thin plate which has uniform quality.

Mesh, Cathode Drum, Mask, Photo Etching, Copper, Chrome

Description

A fabrication method of mesh type cathode drum

1 is a perspective view showing the shape of the mesh-type cathode drum produced by the method for producing a mesh-type cathode drum according to the present invention.

Figure 2 is a partial longitudinal cross-sectional view showing an enlarged surface state of the mesh-type cathode drum produced by the mesh-type cathode drum manufacturing method according to the present invention.

Figure 3 is a schematic process flow diagram of a mesh-type cathode drum manufacturing method according to the present invention.

Figure 4 is a block diagram showing in detail the pre-treatment step in the mesh-type cathode drum manufacturing method according to the present invention.

Figure 5 is a block diagram showing in detail the chromium plating step in the mesh type cathode drum manufacturing method according to the present invention.

Explanation of symbols on the main parts of the drawings

100. Cathode drum 120. Cylindrical member

140. Center rod 160. Copper layer

162. Engraved Section 164. Embossed Section

180. Chrome layer R. Filler

S10. Pretreatment step S12. Degreasing Process

S14. Cleaning process S16. Immersion process

S18. Drying Process S20. Copper Plating Step

S30. Photosensitive film coating step S40. Exposure step

S50. Developing Step S60. Photoresist hardening step

S70. Etching Step S80. Photoresist Peeling Step

S90. Chrome plating step S92. Plating process

S94. Polishing process S100. Engraving stage

The present invention relates to a method for producing a cathode drum, and more particularly, after the copper (Cu) plating of the thick film on the surface of the cylindrical member made of carbon steel or sus (SUS) 304, a photoetch process is performed to form a mesh pattern , The present invention relates to a method of manufacturing a mesh negative electrode drum capable of continuously producing a mesh metal sheet by plating chromium (Cr) on an embossed portion of a pattern.

In general, as a method of manufacturing a metal thin plate, a continuous casting method using a double roll, a melt spinning method, and a rolling method are used.

The manufacture of thin plates using continuous casting is currently producing up to a few millimeters of thickness of hot rolled sheet, but the manufacture of ultra-thin plates has not been successful. This method allows the process atmosphere to be controlled by argon (Ar) gas during the manufacturing process. Therefore, at this time, due to gas bubbles, manufacturing problems such as surface defects of the metal thin plate and surface layer destruction due to overheating occur.

Melt spinning method is one of the manufacturing method of the thin plate through rapid solidification, it is advantageous to obtain a relatively uniform thin plate by manufacturing a metal thin plate by spraying molten metal on a rotating cooling roll.

However, in order to manufacture a thin plate of uniform components, it is restricted to perform the work in a vacuum state, and the method developed to overcome this has been made possible in the air by the Planar Flow Casting (PFC) method. There is a problem that the deviation is severe.

Rolling method, which is the most popular method, has many advantages in the production of thin plates, but not only the manufacturing cost increases due to the numerous steps of rolling, but also the production of ultra-thin plates (thickness of 30 μm or less) leads to an increase in product cost. There is a limit to the application.

For example, as disclosed in US Pat. No. 4948434, in order to manufacture a metal sheet having a thickness of about 100 μm or less, multistage rolling and annealing should be performed. The multi-stage cold rolling process has a problem that the yield is less than 30% due to complex, difficult and long time-consuming disadvantages, and problems such as uneven shape, thickness variation, edge crack, etc., and also high manufacturing cost. .

Recently, many studies have been conducted on the method of manufacturing thin plates using electroplating. In the apparatus using the electrocycle method, a separate electrolyte supply means does not exist, and the electrolyte is simply stirred using a paddle. Since the concentration distribution of the electrolyte is not uniform, there is a disadvantage in that numerous bubbles are generated by the vertical movement or the horizontal movement of the rod-shaped paddle. Since this stirring method is not suitable for the production of alloy thin plates requiring a uniform composition, it is necessary to introduce a new production method.

Nickel (Ni), a ferromagnetic material, has excellent performance (E-Field, H-Field) as an electromagnetic shielding material, and is used close to the human body such as mobile communication equipment such as mobile phones, PDAs, and notebook computers. It is known to be effective for shielding the electromagnetic wave of IT products, which are used in various forms in the form of thin plates or meshes. In particular, the mesh has been applied to various fields by having a ventilation function for heat generated from electronic components as well as electromagnetic shielding characteristics.

Until now, metal mesh is manufactured by using the weaving method of metal wires applied in Germany, etc. and polyester, which is a method developed in Japan, and a method of manufacturing metal meshes using electroless plating. There is a disadvantage that such a woven mesh has a large hole size, a small portion occupied by a wire, and difficulty in manufacturing a thin film.

The method developed to compensate for this is to produce a mesh by etching the thin plate and then use the electroplating method to produce the desired metal mesh, which is mainly batch type. ), And the batch type has a disadvantage in that the production cost is high because the work process has to be complicated and expensive.

Therefore, an object of the present invention for solving the above problems is, after the copper (Cu) plating of the thick film on the surface of the cylindrical cathode drum made of sus (SUS) 304 or carbon steel, and then subjected to a photo-etching process to provide a sufficient mesh pattern It is to provide a method of manufacturing a mesh-type cathode drum that can be formed in a fine depth, plating the chromium (Cr) on the embossed portion of the pattern to continuously produce a mesh metal sheet.

Mesh manufacturing method according to the present invention for achieving the object as described above, the pre-treatment step of washing the cylindrical cylindrical member surface is hollow inside, and by plating copper on the surface of the cylindrical member subjected to the pretreatment step A copper plating step of forming a copper layer, a photoresist coating step of applying a photoresist film to the surface of the copper plated cylindrical member, an exposure step of attaching a photoetching mask to the surface of the cylindrical member to which the photoresist film is applied, and exposing with ultraviolet rays; And a developing step of removing the photoetching mask and removing the photosensitive film of the exposed portion, a photosensitive film curing step of curing the photosensitive film remaining on the surface of the cylindrical member, and an exposed portion of the outer peripheral surface of the cylindrical member which has undergone the photosensitive film curing step. Etching to form an intaglio portion, a photosensitive film peeling step of peeling the photosensitive film, and the copper It is characterized in that comprises a chromium plating step and a filling step of filling the concave engraved portion of the plated chromium to the surface to form a chromium layer.

The pretreatment step includes a degreasing process of degreasing the surface of the cylindrical member with alkali, a washing process of washing the degreased cylindrical member with distilled water, and an immersion process of dipping the cylindrical member in alcohol. And, characterized by consisting of a drying process for drying the alcohol remaining on the outer surface of the immersed cylindrical member.

The copper plating step is to form a copper layer of 150 ~ 200㎛ on the outer surface of the cathode drum.

The photoresist coating step to the photoresist curing step is characterized in that carried out in a clean room (Clean room).

The chromium plating step is characterized by consisting of a plating process for plating chromium (Cr) on the outer surface of the copper layer, and a polishing process for polishing and polishing the outer surface of the plated chromium layer.

The etching step is characterized in that the recessed to the outer surface of the cylindrical member to a depth of 100 ~ 150㎛.

The chromium plating step is to form a chromium layer of 20 ~ 30㎛ on the outer surface of the copper layer.

The intaglio filling step is characterized in that the filling of the polymer resin having chemical resistance to the intaglio.

According to the present invention having such a configuration, there is an advantage that can continuously mass-produce a metal sheet having a uniform quality.

Hereinafter will be described in detail with reference to the accompanying drawings the configuration of a mesh type cathode drum employing a preferred embodiment of the present invention.

1 is a perspective view showing the shape of the mesh-type cathode drum produced by the mesh-type cathode drum manufacturing method according to the present invention, Figure 2 is a mesh-type cathode drum produced by the mesh-type cathode drum manufacturing method according to the present invention A partial longitudinal cross-sectional view showing an enlarged surface state of is shown.

As shown in these figures, the mesh type cathode drum (hereinafter referred to as "cathode drum 100") according to the present invention has a long cylindrical shape approximately left and right, and is configured to be rotatable.

In addition, a cylindrical member 120 having a hollow inside is provided inside the cathode drum 100. The cylindrical member 120 is shielded from the left and right sides to form a space therein, and is formed of carbon steel or stainless steel (SUS) 304.

If necessary, the cylindrical member 120 may be manufactured by rolling a rod-shaped or hollow hollow pipe or thin cylindrical plate.

Then, the center rod 140 is provided in the longitudinal direction through the center of the shielded left and right side surfaces. The central rod 140 serves as a pivot center of the cylindrical member 120, and the cylindrical member 120 is rotatable based on the central rod 140.

 The outer circumferential surface of the cylindrical member 120 is plated with a copper layer 160. The copper layer 160 is formed on the outer surface of the cylindrical member 120 when the negative electrode (-) is installed on the cylindrical member 120 and the positive electrode (+) is connected to the copper sulfate plating solution to perform the electroplating method.

In addition, the copper layer 160 may be precisely processed by etching, and a mesh pattern is formed on an outer surface of the copper layer 160. The mesh pattern is recessed by a photo-etching process and has a plurality of intaglio portions 162 having a hexagonal shape, and other portions except the intaglio portions 162 on the outer circumferential surface of the cylindrical member 120, that is, a honeycomb-shaped embossed portion. 164 is configured.

The engraved portion 162, as shown in Figure 1 in the embodiment of the present invention, but was molded to have a regular hexagon, can be implemented in a variety of shapes, such as circular, square, depending on the purpose of the metal foil.

The mesh pattern has a shape corresponding to the metal thin plate to be manufactured. More specifically, the engraved portion 162 has the same shape and size as a hole formed in the metal thin plate.

The chromium layer 180 is plated on the outer surface of the copper layer 160. The chromium layer 180 is a component for facilitating the peeling of the metal thin plate (not shown) formed on the outer surface. To this end, the copper layer 160 is plated on the outer circumferential surface of the cylindrical member 120, the chromium layer 180 is plated on the outer circumferential surface of the copper layer 160.

In order to form the chromium layer 180, the electroplating method is performed by installing a cathode (−) on the cylindrical member 120 on which the copper layer 160 is formed and connecting the anode (+) to the chromium plating solution.

On the other hand, the filling material (R) is filled in the intaglio portion 162. The filler R blocks the engraved portion 162 from reacting with the metal forming the metal thin plate, and a polymer resin having chemical resistance is applied.

Therefore, when the metal thin plate is manufactured using the negative electrode drum 100, the metal thin plate is formed only at the embossed portion 164 by the filler R filled in the negative portion 162, whereby the metal thin plate is embossed. It will have the same pattern as the unit 164.

Hereinafter, a method of manufacturing a mesh type negative electrode drum configured as described above will be described with reference to the accompanying drawings.

Figure 3 is a schematic process flow diagram of a mesh-type cathode drum manufacturing method according to the present invention, Figure 4 is a block diagram showing in detail the pre-treatment step in the mesh-type cathode drum manufacturing method according to the present invention, Figure 5 is a block diagram showing in detail the chromium plating step in the mesh type cathode drum manufacturing method according to the present invention.

Prior to the description of the cathode drum manufacturing method, a photoetching mask (not shown) is required in order to proceed with the above-described photoetching process on the surface of the cylindrical member 120. Such a mask for photoetching is a precision product. For manufacturing, it is preferable to design a CAD by considering an etching factor on the basis of the drawing.

In this case, the line width becomes wider than the drawing, and when the drawing designed by CAD is drawn directly on the film using a photoplotter and developed, a mask for photoetching is completed.

As shown in Figures 3 to 5, the mesh type cathode drum manufacturing method according to the present invention, starting from a pre-treatment step (S10) for cleaning the surface of the cylindrical member 120, the pre-treatment step (S10) is The process is performed to improve the adhesion between the surface of the cylindrical member 120 and the copper layer 160.

That is, the pre-treatment step (S10) is a method for removing foreign substances such as dust, oil, and fingerprints attached to the surface of the cylindrical member 120. After degreasing alkali (Alkali) on the surface of the cylindrical member 120, distilled water (蒸 溜 水) ) And immersed in alcohol (Alcohol) and dried by hot air drying or hot air of a hot air fan.

To further break down, the pretreatment step (S10) is a degreasing process (S12) for degreasing the surface of the cylindrical member 120 with alkali, as shown in Figure 4, and washing the degreasing cylindrical member 120 with distilled water. Washing process (S14), the immersion process (S16) for immersing the cylindrical member 120 in alcohol (Alcohol) and the alcohol remaining on the outer surface of the immersed cylindrical member (120) Drying is made of a drying process (S18).

When foreign material on the outer surface of the cylindrical member 120 is removed by the pretreatment step S10, a copper plating step S20 is performed to plate copper (Cu) on the surface of the cylindrical member 120. The copper plating step (S20) is a process of forming the copper layer 160 on the outer surface of the embossed portion 164 by an electroplating method, by applying an etching process to the cylindrical member 120 to increase the accuracy of the honeycomb shape will be.

More specifically, the copper plating step S20 may be performed by installing the cylindrical member 120 on the cathode (-) and using the copper sulfate plating solution as the anode (+) on the upper surface of the embossed portion 164 as shown in FIG. 2. It is a process of forming the copper layer 160 of ˜200 μm.

When the copper plating step (S20) is completed, a photosensitive film applying step (S30) for applying the photosensitive film PR is performed. The photoresist coating step (S30) is sprayed or sprayed while spraying the cylindrical member 120 while rotating the cylindrical member 120 to form a uniform coating layer of the photosensitive film PR while the photoresist film PR is evenly distributed on the surface of the cylindrical member 120. The roll 120 corresponding to the shape of the member 120 is prepared and rotated so that the outer peripheral surfaces thereof come into contact with each other.

Here, since the mesh type cathode drum manufactured by the present invention requires very high precision, when fine impurities or dust present in the air are introduced during the application of the photoresist film, the line width is not partially broken or etched. Since a part occurs to cause a product defect, the photoresist coating step (S30) to the photoresist curing step (S60) to be described below should be worked in a clean room.

The photoresist film PR in the photoresist coating step S30 is used differently depending on whether the photoetching mask is a positive type or a negative type. In the positive type, RC is used. -100PR is used, and in negative type, PVA (PolyVinyl Alcohol) resin is used.

In addition, in the photoresist coating step (S30), after the photoresist is applied, a soft bake is performed. In the case of using the RC-100PR, about 30 to about 30 ° C. in a dry oven of 90 to 95 ° C. It is carried out for a minute and when the PVA resin is used, it is dried at 60 ° C.

After the photoresist coating step S30, an exposure step S40 is performed in which a mask for photoetching is attached to the surface of the cylindrical member 120 and exposed with ultraviolet rays.

The exposure step (S40) is strong on the surface of the cylindrical member 120, which is divided into a portion where the photoresist film PR is exposed and a portion that is not exposed according to the negative and positive difference of the photoetching mask. In the process of passing ultraviolet rays, the pattern of the photoetching mask is transferred to the surface of the cylindrical member 120 by the ultraviolet light.

The exposure machine used in the exposure step (S40) is a mercury bulb of 400W is used, it is exposed while rotating the cylindrical member 120 slowly. At this time, the exposure time is 3 minutes when using the RC-100PR, 5 minutes when using a PVA resin of water-soluble photoresist film (PR).

After the exposure step S40 is performed, a developing step S50 of removing the photoetching mask from the surface of the cylindrical member 120 and removing the photosensitive film PR of the exposed portion is performed. The developing step (S50) is a process in which the portion received by the ultraviolet light of the exposure step (S40) is melted and removed so that the cylindrical member 120 is exposed and the portion not receiving the light remains and hardens.

In the developing step (S50), when the RC-100PR is used, development is carried out for 1 to 2 minutes at a temperature range of 20 to 25 ° C. using a developer diluted with distilled water to 25% of RC-351 of SHIPLEY. In the case of using the PVA resin, it is possible not only to develop at room temperature by using tap water as a developer, but also to develop by spraying water with a developer using warm water at 25 to 30 ° C.

After the developing step S50 is performed, a photosensitive film curing step S60 is performed to cure the photosensitive film PR remaining on the surface of the cylindrical member 120. The photoresist film PR after the development step S50 is vulnerable to mechanical impacts or scratches because the film is soft and soft in a dry state only, and is peeled or partially eroded in the etching step S70 to be described below. Since the part that should not be etched may be etched, a process of hardening the film is required to perform the photosensitive film curing step (S60).

The photoresist curing step (S60) is a process called a hard bake (Hard Bake), when using the RC-100PR is carried out for about 30 minutes in a dry oven at 120 ℃ temperature, the PVA resin In case of use, before the photoresist hardening step (S60), it is first immersed in 8% chromic acid solution for 20-30 seconds to make the resin react with chromic acid for easy visual observation, and the resin itself is cured and then washed with water. After immersing in alcohol for 5 seconds and dried to 65 ℃ and then to the photoresist curing step (S60) is to proceed in a dry oven (Dry oven) of 130 ~ 150 ℃ for about 5 minutes.

After the photoresist curing step S60 is performed, an etching step S70 of etching the exposed portion of the surface of the cylindrical member 120 is performed. The etching step (S70) is a process of selectively removing unnecessary portions exposed on the surface of the cylindrical member 120, leaving the remaining portion of the photoresist film PR to corrode the remaining portion to corrode the outer surface of the cylindrical member 120. Will be depressed.

As the etchant in the etching step (S70) it is carried out at a temperature of 45 ℃ using a 42% ferric chloride solution which is most widely used for stainless and other metal etching.

At this time, the etching depth is preferably 100 ~ 150㎛. This is to ensure the quality of the metal sheet when manufacturing the metal sheet using the cathode drum 100, it is possible to implement by increasing the precision of the mesh pattern.

After the etching step (S70) is finished, the photosensitive film peeling step (S80) for peeling the photoresist film (PR) remaining on the surface of the cylindrical member 120 is in progress. When the photosensitive film peeling step S80 is performed, the mesh pattern of the photoetching mask is formed on the surface of the cylindrical member 120.

The photosensitive film peeling step (S80) is performed in an acetone solution when using the RC-100PR, and when the PVA resin is used, the 5% sodium hypochlorite solution is heated to 80 ° C. to immerse for 1 minute. do.

After the photosensitive film peeling step S80 is completed, a chromium plating step S90 is performed to plate chromium (Cr) on the copper layer 160. The chromium plating step (S90) is a configuration that allows the metal sheet produced as a final product in the mesh type cathode drum to be peeled off from the cathode drum 100 smoothly.

The chromium plating step (S90) is a process performed by the electroplating method as in the copper plating step (S20), the cylindrical member 120 having the copper layer 160 is formed on the cathode (-) and the anode By using the chromium plating solution as (+) it is to form a chromium layer 180 of 20 ~ 30㎛ on the copper layer 160, as shown in FIG.

To further refine the chromium plating step (S90), as shown in FIG. 5, a plating process (S92) of forming chromium layer 180 by plating chromium on the outer surface of the copper layer 160 and the chromium layer ( 180 is made of a polishing process (S94) for polishing the outer surface of the.

Therefore, even if the metal thin plate is formed on the outer surface of the polished and polished chromium layer 180, the metal thin plate can be easily peeled from the chromium layer 180.

After the chromium plating step S90, the intaglio filling step S100 for filling the intaglio part 162 is performed. The intaglio filling step (S100) is due to the smooth peeling of the mesh-shaped metal plate produced in the cathode drum 100 after the chrome plating step (S90) and the energization of the intaglio portion 162 on the surface of the cathode drum 100. In order to prevent the blockage of the mesh shape.

That is, as shown in Figure 2 the filling material (R) is filled in the intaglio portion 162 in the intaglio filling step (S100) is to use a resin (resin) type with chemical resistance, this intaglio portion 162 ) And then dried by heat treatment to complete the mesh type cathode drum according to the present invention.

The scope of the present invention is not limited to the above-exemplified embodiments, and many other modifications based on the present invention may be made by those skilled in the art within the above technical scope.

For example, in the embodiment of the present invention, the cylindrical member is formed of sus 304, but, if necessary, it can be applied by molding to various materials such as carbon steel.

As described in detail above, in the method of manufacturing a mesh type cathode drum according to the present invention, a copper layer of a thick film is formed on the surface of a cylindrical member made of carbon steel or sus (304), and a chromium layer is formed on an outer surface of the copper layer. It is composed.

Therefore, when the metal thin plate is formed on the outer surface of the chromium layer, there is an advantage of easy separation of the metal thin plate.

In addition, there is an advantage that the thickness of the metal thin plate is uniform, thereby improving quality.

In addition, it is expected that the production cost of the metal sheet is reduced because the continuous mass production of the metal sheet is possible.

Claims (8)

A pretreatment step of cleaning the surface of the cylindrical member having a hollow interior; A copper plating step of forming a copper layer by plating copper on the surface of the cylindrical member subjected to the pretreatment step; A photoresist coating step of applying a photoresist film to the copper plated cylindrical member surface; An exposure step of attaching a photo-etching mask to the surface of the cylindrical member to which the photosensitive film is applied and exposing with ultraviolet rays; A developing step of removing the photoetching mask and removing the photosensitive film of the exposed portion; A photosensitive film curing step of curing the photosensitive film remaining on the surface of the cylindrical member; An etching step of etching the exposed portion of the outer peripheral surface of the cylindrical member through the photosensitive film curing step to form an intaglio portion; A photosensitive film peeling step of peeling the photosensitive film; A chromium plating step of forming a chromium layer by plating chromium on the surface of the copper layer; Mesh-type negative electrode drum manufacturing method characterized in that it comprises an intaglio filling step of filling the intaglio. The method of claim 1, wherein the pretreatment step, Degreasing process for degreasing the surface of the cylindrical member with alkali (Alkali), Washing process of washing the degreasing cylindrical member with distilled water, An immersion process of immersing the cylindrical member in alcohol; Method for producing a mesh-type negative electrode drum, characterized in that the drying process for drying the alcohol remaining on the outer surface of the immersed cylindrical member. The method of claim 1, wherein the copper plating step is a mesh type cathode drum manufacturing method, characterized in that to form a copper layer of 150 ~ 200㎛ on the outer surface of the cylindrical member. The method of claim 1, wherein the photoresist coating step to the photoresist curing step are performed in a clean room. The method of claim 1, wherein the etching step is a method of manufacturing a mesh type cathode drum, characterized in that the recessed to the outer surface of the cylindrical member to a depth of 100 ~ 150㎛. According to claim 1, The chromium plating step, A plating process of plating chromium (Cr) on the outer surface of the copper layer; Method for producing a mesh-type negative electrode drum, characterized in that the polishing process is performed by polishing the plated chromium layer outer surface. [6] The method of claim 5, wherein the chromium plating step forms a chromium layer having a thickness of 20 to 30 µm on the outer surface of the copper layer. The method of claim 1, wherein the intaglio filling step is a mesh-type anode drum manufacturing method characterized in that the filling of the polymer resin having chemical resistance to the intaglio.

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