KR102372707B1 - Carrier material for forming perforated metal foil and perforated metal foil with carrier material - Google Patents

Abstract

The present invention relates to a carrier material by which a perforated metal foil having a desired arrangement pattern and a desired aperture ratio can be formed without burrs while not using an expensive anode drum, and a perforated metal foil formed using the same. The perforated metal foil of the present invention includes a carrier material for forming a perforated metal foil and a metal foil having a plurality of opening holes, wherein the carrier material for forming a perforated metal foil includes a metal part having a plurality of through holes and a through hole filling part formed by filling the through holes with a resin composition.

Description

CARRIER MATERIAL FOR FORMING PERFORATED METAL FOIL AND PERFORATED METAL FOIL WITH CARRIER MATERIAL

The present invention relates to a carrier material for forming a perforated metal foil having a plurality of opening holes, a perforated metal foil to which the carrier material is attached, and a method for manufacturing the perforated metallic foil.

According to the trend of high density, light weight, and thin film of electronic devices, it is necessary to reduce the weight of secondary batteries applied to electronic devices, improve safety, and improve energy efficiency. Reconciliation is called for.

Patent Documents 1 and 2 may be mentioned as a technique proposed for making the metal foil porous. Patent Document 1 discloses an electrolytic precipitation apparatus for perforated foil in which a non-conductive part in which a synthetic resin with high insulating properties is embedded in a peripheral surface of a cathode drum is arranged in a predetermined pattern. In Patent Document 2, a groove is machined on the cathode drum to make a non-polishing area by a polishing roll, and the oxide film is removed by the polishing roll from the oxide film on the polishing roll to form a plating precipitation, and the non-polishing area has conductivity and its thickness A method of manufacturing a perforated metal foil through a process in which a predetermined conductive material having an increased electrical resistance is formed and plating precipitation is not made as the thickness of the metal foil is disclosed.

However, Patent Document 1 has a problem in that the embedded synthetic resin falls off from the peripheral surface of the negative electrode drum due to the limitation in that the synthetic resin cannot be firmly bonded to the negative electrode drum made of a metal such as titanium. In addition, Patent Document 2 has a problem in that the oxide film removed by the polishing roll remains in the electrolyte and negatively affects the metal foil deposition, thereby forming a pinhole in the metal foil.

In order to solve these problems, a method of directly drilling a metal foil using a CNC or a laser has been proposed. However, when the metal foil is drilled using CNC or laser, there is a problem in that burrs are generated around the drilled through hole.

Patent Document 1: Japanese Patent Application Laid-Open No. Hei 11-323593 Patent Document 2: International Patent Publication No. WO 2013/030871

An object of the present invention is to provide a carrier material capable of forming a perforated metal foil having a desired arrangement pattern and an aperture ratio without burrs without using an expensive anode drum.

In addition, the present invention is to provide a perforated metal foil to which a carrier material is attached and a method for manufacturing the same.

In order to solve the above problems, the present invention provides a metal part having a plurality of through-holes formed therein; and a through-hole filling portion formed by filling the through-hole with a resin composition.

The metal part may include aluminum.

The thickness of the metal part may be 10 to 500 ㎛.

The resin composition may be an epoxy-based resin composition having a viscosity of 400 to 500 Ps at 25°C.

The diameter of the through hole may be 10 μm or more.

On the other hand, the present invention, the carrier material for forming the perforated metal foil; and a metal foil having a plurality of opening holes, wherein the metal foil includes an electroless plating part and an electrolytic plating part, and the arrangement pattern of the plurality of opening holes is an arrangement pattern of a plurality of through holes formed in the metal part included in the carrier material. It provides a perforated metal foil with a carrier material that corresponds to the.

The opening ratio of the metal foil may be 5 to 50%.

A diameter of the opening hole may be 10 to 500 μm, a thickness of the electroless plating portion may be 0.1 to 1 μm, and a thickness of the electroless plating portion may be 5 to 30 μm.

Further, the present invention provides a perforated metal foil separated from the perforated metallic foil with a carrier material.

The present invention also comprises the steps of preparing a carrier material for forming the perforated metal foil; forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; And it provides a method of manufacturing a perforated metal foil comprising the step of separating the carrier material.

Preparing the carrier material may include: preparing a base material in which a first protective layer, a first adhesive layer, a metal layer, a second adhesive layer, and a second protective layer are sequentially stacked; forming a plurality of base through-holes in the base material; filling the plurality of base through-holes with a resin composition; and removing the first protective layer, the first adhesive layer, the second adhesive layer, and the second protective layer.

In the carrier material according to the present invention, since the through-hole filling portion formed by filling the resin composition corresponds to the non-metal region (insulation region), plating is not performed on the through-hole filling portion during plating, and plating is performed on the metal portion, which is another region. By having a , it is possible to easily form a perforated metal foil having a plurality of opening holes by this mechanism. That is, the present invention can efficiently provide a perforated metal foil having a desired arrangement pattern and aperture ratio without burrs without using an expensive negative electrode drum.

As described above, the present invention can easily provide a perforated metal foil having a desired arrangement pattern and aperture ratio, thereby contributing to achieving weight reduction, safety improvement, and energy efficiency improvement of the secondary battery.

1 is a schematic view showing a carrier material according to an embodiment of the present invention.
Figure 2 is a schematic view showing a perforated metal foil with a carrier material according to an embodiment of the present invention.
Figure 3 is a schematic view showing the manufacturing process of the perforated metal foil according to an embodiment of the present invention.
4 is a schematic view showing a manufacturing process of a carrier material according to an embodiment of the present invention.
5 is a reference diagram for explaining Experimental Example 1 of the present invention.

The terms or words used in the description and claims of the present invention should not be construed as being limited to their ordinary or dictionary meanings, and the inventor must properly understand the concept of the term in order to best describe his invention. Based on the principle that can be defined, it should be interpreted as meaning and concept consistent with the technical idea of the present invention.

The present invention relates to a carrier material serving as a support material in the process of forming the perforated metal foil, the perforated metal foil attached to the carrier material, the perforated metal foil separated from the perforated metal foil attached to the carrier material, and a method of manufacturing the perforated metal foil. , which will be described in detail as follows.

Referring to FIG. 1 , a carrier material for forming a perforated metal foil according to the present invention (hereinafter, referred to as a 'carrier material') includes a metal part 10 and a through-hole filling part 20 .

The metal part 10 included in the carrier material according to the present invention is made of a metal material, and a plurality of through-holes are formed (provided). The metal material constituting the metal part 10 is not particularly limited, but may be aluminum in consideration of the ease of forming a through-hole, handling, economic feasibility, and the like.

The diameter of each through-hole formed in the metal part 10 corresponds to the diameter of the opening hole of the later perforated metal foil, and the diameter may be 10 μm or more, specifically 10 to 500 μm, and more specifically 50 to 200 μm. . When the diameter of the through-hole is less than 10 μm, the filling of the resin composition may not be performed smoothly. This can fall.

The thickness of the metal part 10 may be 10 to 500 μm, specifically, 20 to 100 μm. When the thickness of the metal part 10 is less than 10 μm, handling may be deteriorated or wrinkling may occur, and if it exceeds 500 μm, roll workability may be deteriorated.

The through-hole filling part 20 included in the carrier material according to the present invention is formed (provided) by filling the through-hole formed in the metal part 10 with a resin composition. The through-hole filling part 20 corresponds to a non-metal region (insulation region) in the plating process for forming the perforated metal foil later, so that plating is not performed on the through-hole filling part 20, so that the present invention provides a plurality of openings A perforated metal foil having a hole can be obtained.

The resin composition is not particularly limited as long as it is a thermosetting resin composition, but considering the through-hole fillability, bonding property (adhesiveness) to the through-hole, heat resistance, etc., the epoxy resin composition having a viscosity of 400 to 500 Ps at 25 ° C. can

The present invention provides a perforated metal foil to which the carrier material described above is attached. Referring specifically to FIG. 2 , the perforated metal foil with a carrier material according to the present invention includes a carrier material 100 and a metal foil 200 .

The carrier material 100 included in the perforated metal foil with a carrier material according to the present invention includes the above-described metal portion 10 and the through-hole filling portion 20, and a detailed description thereof is the same as described above, so to be omitted. do.

The metal foil 200 included in the perforated metal foil with a carrier material according to the present invention is selectively formed (provided) on one side, the other side, or both sides of the carrier material 100, and has a plurality of opening holes. The metal foil 200 includes an electroless plating unit 201 and an electrolytic plating unit 202 .

The electroless plating part 201 included in the metal foil 200 has a releasing role for allowing the electrolytic plating part 202 to be separated from the carrier material 100 and the formation (growth) of the electrolytic plating part 202 is performed. It acts as a seed to make it work well. Components constituting the electroless plating portion 201 are not particularly limited, but may include copper in consideration of plating efficiency and releasability.

The thickness of the electroless plating part 201 may be 0.1 to 1 μm, specifically, 0.3 to 0.5 μm. If the thickness of the electroless plating part 201 is less than 0.1 μm, the release role may be lowered or the formation of the electrolytic plating part 202 may not be performed smoothly, and if it exceeds 1 μm, the electroless plating part 201 may be formed. The thickness of the material may be thicker than necessary, which may reduce economic feasibility or reduce releasability.

The electrolytic plating part 202 included in the metal foil 200 is formed on the electroless plating part 201, and corresponds to a substantial part of the perforated metal foil obtained by separating the metal foil 200 from the carrier material 100 later. do. Components constituting the electrolytic plating part 202 are not particularly limited, but may include copper, a copper alloy, nickel, or a nickel alloy in consideration of plating properties and applicability. Here, the components constituting the electroplating part 202 may be the same as or different from those constituting the electroless plating part 201 , and preferably may be the same.

The thickness of the electrolytic plating part 202 may be 5 to 30 μm, specifically, 10 to 20 μm. When the thickness of the electrolytic plating part 202 is less than 5 μm, it may be difficult to obtain a required level of rigidity, and when it exceeds 30 μm, the thickness of the electrolytic plating part 202 is thicker than necessary, such as economic feasibility, applicability, etc. this may be lowered.

On the other hand, the arrangement pattern of the plurality of opening holes of the metal foil 200 including the electroless plating portion 201 and the electrolytic plating portion 202 is of the plurality of through holes formed in the metal portion 10 included in the carrier material 100 . Corresponds to the array pattern. That is, in the plurality of through-holes formed in the metal part 10, the through-hole filling part 20 formed by filling the resin composition is present. region), and in each plating process for forming the electroless plating portion 201 and the electrolytic plating portion 202, plating is not performed on the through-hole filling portion 20 corresponding to the plurality of through-holes, and the metal portion (10) The plating is made only on the top, so that a plurality of opening holes having an arrangement pattern corresponding to the arrangement pattern of the plurality of through holes are formed. Through this process, the metal foil 100 has a plurality of opening holes having an arrangement pattern corresponding to the arrangement pattern of the plurality of through holes. At this time, the diameter of each opening hole may be 10 to 500 μm, and the reason is that Since the diameter of the through hole is the same as the description, it will be omitted.

Here, the opening ratio of the metal foil 200 having a plurality of opening holes may be 5 to 50%, specifically, 10 to 30%. The opening ratio of the metal foil 200 corresponds to the opening ratio of the perforated metal foil separated from the carrier material 100. When the opening ratio is less than 5%, the metal foil 200 is applied to the negative electrode material (current collector) of the secondary battery. It is difficult to expect the required efficiency and characteristics, and when it exceeds 50%, it may be difficult to obtain the required level of rigidity of the metal foil 200 .

The present invention provides a perforated metal foil separated from the perforated metallic foil with a carrier material described above. The perforated metal foil according to the present invention has the same opening ratio as the metal foil 200 described above, and the thickness thereof may be 5 to 30 μm in consideration of applicability and the like. The perforated metal foil according to the present invention can be applied to various technical fields, and for example, it can be usefully applied as a current collector used in an electrode manufacturing process.

The present invention provides a method for manufacturing the perforated metal foil described above. Specifically, the method of manufacturing a perforated metal foil according to the present invention comprises the steps of preparing a carrier material for forming a perforated metal foil; forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; and separating the carrier material, which will be described in detail with reference to FIG. 3 as follows.

First, a carrier material for forming a perforated metal foil is prepared (A)). The process of preparing the carrier material is not particularly limited, but in order to prepare a carrier material in which the metal part 10 and the through-hole forming part 20 are well formed, the resin composition is filled after forming the base through-hole in the base material. process can be rough. Specifically, in the step of preparing the carrier material, the first protective layer 101 , the first adhesive layer 102 , the metal layer 103 , the second adhesive layer 104 and the second protective layer 105 are sequentially formed. preparing a laminated base material; forming a plurality of base through-holes in the base material; filling the plurality of base through-holes with a resin composition; and removing the first protective layer 101 , the first adhesive layer 102 , the second adhesive layer 103 , and the second protective layer 104 , for which FIG. 4 . It is explained with reference to the following.

Referring to FIG. 4 , an adhesive is applied to the upper and lower surfaces of the metal substrate corresponding to the metal part 10 of the carrier material, respectively, and the base material obtained by bonding the protective film is prepared (a)). That is, to prepare a base material in which the first protective layer 101, the first adhesive layer 102, the metal layer 103, the second adhesive layer 104, and the second protective layer 105 are sequentially stacked.

Next, a plurality of base through-holes are formed in the base material (b)). A method of forming the base through-hole is not particularly limited, but may be formed through laser processing. Here, since the diameter of the base through-hole corresponds to the diameter of each of the above-described through-hole and the opening hole, the base through-hole may be formed by determining the diameter of the base through-hole according to the required opening ratio and the size of the opening hole.

Then, a resin composition is filled in the plurality of base through-holes. The resin composition may be the above-described epoxy-based resin composition. Here, after filling the resin composition, the resin composition may be cured through primary and secondary curing processes. For complete curing of the epoxy-based resin composition, the primary curing may be performed at 100 to 150° C. for 35 to 55 minutes, and the secondary curing may be performed at 120 to 170° C. for 50 to 70 minutes. Through such a filling and curing process, the through-hole filling part 20 of the carrier material may be formed.

Next, the first protective layer 101, the first adhesive layer 102, the second adhesive layer 103, and the second protective layer 104 are removed (d)). The removal may be accomplished through a conventional method, and through this, a carrier material including the metal part 10 and the through-hole filling part 20 may be manufactured and prepared.

Electroless plating and electrolytic plating are sequentially performed on the carrier material 100 prepared through this process to form the metal foil 200 having a plurality of opening holes (B)). Specifically, the carrier material 100 is put into a plating bath in which the electroless plating composition is present, and electroless plating is performed by a substitution reaction to form the electroless plating part 201 having a plurality of opening holes, and then electroplating. The metal foil 200 may be formed through a process of putting the composition into a plating bath in which the composition is present and performing electrolytic plating to form the electrolytic plating unit 202 having a plurality of opening holes.

As the electroless plating composition, a commonly known plating composition may be used. Here, the electroless plating may be performed at 20 to 30° C. for 30 seconds to 3 minutes so that the stable electroless plating part 201 can be formed.

As the electrolytic plating composition, a plating composition including copper sulfate, sulfuric acid, chlorine ions, a brightener and a carrier may be used. Here, the electrolytic plating may be performed at 45 to 55° C. for 30 to 40 minutes under application of a current density of 1 to 3 ASD so that a stable electrolytic plating portion 202 can be formed.

Then, the carrier material 100 is separated (C)). Specifically, a perforated metal foil according to the present invention is obtained through a process of separating the carrier material 100 and the metal foil 200 using the releasability of the electroless plating portion 201 included in the metal foil 200 .

As described above, the present invention provides a carrier material 100 including a metal part 10 and a through-hole filling part 20 instead of the conventional technique of using an expensive anode drum or a process of directly forming a through-hole in a metal foil. Since the perforated metal foil is manufactured by passing through electroless plating and electrolytic plating, the perforated metal foil can be efficiently manufactured. In addition, the present invention is to control the size (diameter) and pattern of the through-holes formed in the carrier foil 100 without major design changes such as manufacturing processes and devices, and it is possible to easily manufacture a perforated metal foil having a desired arrangement pattern and aperture ratio. there is.

Hereinafter, the present invention will be described in more detail by way of Examples. However, the following examples are intended to illustrate the present invention, and it is apparent to those skilled in the art that various changes and modifications can be made within the scope and spirit of the present invention, and the scope of the present invention is not limited thereto.

[ preparation example One]

A first protective layer having a thickness of 40 μm, a first adhesive layer having a thickness of 3 μm, an aluminum layer having a thickness of 60 μm, a second adhesive layer having a thickness of 3 μm, and a second protective layer having a thickness of 40 μm are sequentially After preparing the laminated base material, a plurality of base through-holes having a diameter of about 350 μm were formed in the base material by irradiating a UV laser. Next, an epoxy-based resin composition (viscosity at 25° C.: 450 Ps) was applied and filled in the base through-hole, followed by primary curing at 130° C. for 45 minutes. Then, after removing the first protective layer, the first adhesive layer, the second adhesive layer and the second protective layer from the upper and lower portions of the aluminum layer, respectively, the aluminum carrier material is subjected to secondary curing at 150° C. for 60 minutes. was prepared.

[ Example One]

After the aluminum carrier material prepared in Preparation Example 1 was degreased and washed with water, the aluminum carrier material was put into a plating bath in which the electroless copper plating composition (YMT, PIC-100) was present, and then there was no electricity at 25° C. for 1 minute. The electroless plating part was formed with a thickness of 0.3 to 0.5 μm while having a plurality of opening holes each having a diameter of about 350 μm by performing electroplating.

Next, after degreasing and washing the aluminum carrier material on which the electroless plating part is formed, it is put into a plating bath in which an electrolytic copper plating composition (YMT, BJ Series) is present, and 20 to 25 ℃ while applying a current density of 2 ASD Electrolytic plating was carried out for 35 minutes in an electrolytic plating unit having a plurality of opening holes having a diameter of about 350 µm and an electrolytic plating part having a thickness of 15 µm.

Then, by separating the electroless plating part and the electrolytic plating part from the aluminum carrier material through the release role of the electroless plating part, a perforated copper foil having a thickness of 15 μm was prepared while having a plurality of opening holes having a diameter of about 350 μm. .

[ Experimental example One]

The perforated copper foil prepared in Example 1 was confirmed with a scanning electron microscope (TESCAN VEGA 4 LMS), and the results are shown in FIG. 5 .

Referring to FIG. 5 , it was confirmed that a perforated copper foil (aperture ratio: 30%) having a plurality of opening holes having a uniform arrangement pattern was obtained.

10: metal part
20: through-hole filling part
100: carrier material
200: metal foil
201: electroless plating unit 202: electrolytic plating unit

Claims (11)

Carrier material for forming perforated metal foil; and
A metal foil having a plurality of opening holes,
The metal foil includes an electroless plating part and an electrolytic plating part,
In the perforated metal foil with a carrier material, the arrangement pattern of the plurality of opening holes corresponds to the arrangement pattern of the plurality of through holes formed in the metal part included in the carrier material,
The carrier material for forming the perforated metal foil includes a metal part having a plurality of through-holes formed thereon; and
A perforated metal foil with a carrier material including a through-hole filling portion formed by filling the through-hole with a resin composition. The method according to claim 1,
The perforated metal foil with a carrier material which the said metal part contains aluminum. The method according to claim 1,
A perforated metal foil with a carrier material having a thickness of 10 to 500 µm of the metal part. The method according to claim 1,
The resin composition is an epoxy-based resin composition having a viscosity of 400 to 500 Ps at 25 ° C. A perforated metal foil with a carrier material. The method according to claim 1,
A perforated metal foil with a carrier material having a diameter of 10 µm or more of the through hole. delete The method according to claim 1,
The perforated metal foil with a carrier material that the opening ratio of the metal foil is 5 to 50%. The method according to claim 1,
The diameter of the opening hole is 10 to 500 ㎛,
The thickness of the electroless plating portion is 0.1 to 1 ㎛,
A perforated metal foil with a carrier material that has a thickness of 5 to 30 μm of the electrolytic plating portion. A perforated metal foil separated from the perforated metal foil with a carrier material according to claim 1. Preparing a carrier material for forming a perforated metal foil according to any one of claims 1 to 5, 7 to 8;
forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; and
Method of manufacturing a perforated metal foil comprising the step of separating the carrier material. 11. The method of claim 10,
The step of preparing the carrier material,
preparing a base material in which a first protective layer, a first adhesive layer, a metal layer, a second adhesive layer, and a second protective layer are sequentially stacked;
forming a plurality of base through-holes in the base material;
filling the plurality of base through-holes with a resin composition; and
The method of manufacturing a perforated metal foil comprising the step of removing the first protective layer, the first adhesive layer, the second adhesive layer, and the second protective layer.

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