WO2023027473A1 - Carrier material for forming perforated metal foil, and perforated metal foil having carrier material attached thereon - Google Patents

Carrier material for forming perforated metal foil, and perforated metal foil having carrier material attached thereon Download PDF

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Publication number
WO2023027473A1
WO2023027473A1 PCT/KR2022/012561 KR2022012561W WO2023027473A1 WO 2023027473 A1 WO2023027473 A1 WO 2023027473A1 KR 2022012561 W KR2022012561 W KR 2022012561W WO 2023027473 A1 WO2023027473 A1 WO 2023027473A1
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Prior art keywords
metal foil
carrier material
perforated metal
forming
perforated
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PCT/KR2022/012561
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French (fr)
Korean (ko)
Inventor
전성욱
장원봉
김정일
강병걸
한정민
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와이엠티 주식회사
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Publication of WO2023027473A1 publication Critical patent/WO2023027473A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a carrier material for forming a perforated metal foil having a plurality of opening holes, a perforated metal foil to which the carrier material is attached, and a manufacturing method of the perforated metal foil.
  • Patent Documents 1 and 2 may be cited as techniques proposed for making the metal foil porous.
  • Patent Literature 1 discloses a perforated foil electrolytic deposition device in which a non-conductor portion in which a highly insulating synthetic resin is embedded in a peripheral surface of a cathode drum is arranged in a predetermined pattern.
  • grooves are machined in the cathode drum to create areas that cannot be polished by a polishing roll, and the oxide film in the polishable area is removed by the polishing roll to deposit plating, and the thickness of the oxide film in the polishable area while having conductivity.
  • Disclosed is a method of manufacturing a perforated metal foil through a process in which a predetermined conductive material having an increased electrical resistance is formed as the thickness increases, and plating is not deposited.
  • Patent Document 1 has a problem in that the buried synthetic resin is detached from the peripheral surface of the negative electrode drum due to the limitation that the synthetic resin cannot be firmly bonded to the negative electrode drum made of metal such as titanium.
  • Patent Document 2 has a problem in that pinholes are formed in the metal foil by negatively affecting the metal foil deposition while the oxide film removed by the polishing roll remains in the electrolyte.
  • An object of the present invention is to provide a carrier material capable of forming a perforated metal foil having a desired arrangement pattern and aperture ratio without generating burrs without using an expensive cathode drum.
  • the present invention is to provide a perforated metal foil attached to the carrier material and a manufacturing method thereof.
  • the present invention in order to solve the above problems, a plurality of through-hole formed metal portion; And it provides a carrier material for forming a perforated metal foil comprising a through-hole filling portion formed by filling the through-hole with a resin composition.
  • the metal part may include aluminum.
  • the metal part may have a thickness of 10 to 500 ⁇ m.
  • the resin composition may be an epoxy-based resin composition having a viscosity of 400 to 500 Ps at 25 °C.
  • the through hole may have a diameter of 10 ⁇ m or more.
  • the carrier material for forming the perforated metal foil and a metal foil having a plurality of opening holes, wherein the metal foil includes an electroless plating part and an electrolytic plating part, and the arrangement pattern of the plurality of opening holes is an arrangement pattern of a plurality of through holes formed in the metal part included in the carrier material.
  • An aperture ratio of the metal foil may be 5 to 50%.
  • the diameter of the opening hole may be 10 to 500 ⁇ m
  • the thickness of the electroless plating portion may be 0.1 ⁇ m to 1 ⁇ m
  • the thickness of the electrolytic plating portion may be 5 ⁇ m to 30 ⁇ m.
  • this invention provides the perforated metal foil separated from the said perforated metal foil with a carrier material.
  • preparing a carrier material for forming the perforated metal foil forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; And it provides a method for manufacturing a perforated metal foil comprising the step of separating the carrier material.
  • Preparing the carrier material may include preparing a base material in which a first protective layer, a first adhesive layer, a metal layer, a second adhesive layer, and a second protective layer are sequentially stacked; Forming a plurality of base through-holes in the base material; filling the plurality of base through-holes with a resin composition; and removing the first protective layer, the first adhesive layer, the second adhesive layer, and the second protective layer.
  • the through-hole filling part formed by filling the resin composition corresponds to the non-metal area (insulation area)
  • plating is not performed on the through-hole filling part during plating, and plating is performed on the metal part, which is the other area.
  • the present invention can easily provide a perforated metal foil having a desired arrangement pattern and aperture ratio, thereby contributing to achieving weight reduction, safety improvement, and energy efficiency improvement of a secondary battery.
  • FIG. 1 is a schematic diagram showing a carrier material according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing a perforated metal foil with a carrier material according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram showing a manufacturing process of a perforated metal foil according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram showing a manufacturing process of a carrier material according to an embodiment of the present invention.
  • the present invention relates to a carrier material serving as a support material in the process of forming a perforated metal foil, a perforated metal foil attached to the carrier material, a perforated metal foil separated from the perforated metal foil attached to the carrier material, and a method for manufacturing the perforated metal foil. , a detailed description of this is as follows.
  • a carrier material for forming a perforated metal foil according to the present invention (hereinafter referred to as a 'carrier material') includes a metal part 10 and a through-hole filling part 20.
  • the metal part 10 included in the carrier material according to the present invention is made of a metal material and has a plurality of through holes formed (provided).
  • the metal material constituting the metal part 10 is not particularly limited, but may be aluminum in consideration of ease of formation of through holes, handling properties, economic feasibility, and the like.
  • the diameter of each through hole formed in the metal part 10 corresponds to the diameter of the opening hole of the later perforated metal foil, and the diameter may be 10 ⁇ m or more, specifically 10 to 500 ⁇ m, and more specifically 50 to 200 ⁇ m. .
  • the diameter of the through-hole is less than 10 ⁇ m, the filling of the resin composition may not be performed smoothly, and when the diameter exceeds 500 ⁇ m, the perforated metal foil has an excessively large opening hole, and the stiffness of the perforated metal foil is lowered. this may fall
  • the thickness of the metal part 10 may be 10 to 500 ⁇ m, specifically 20 to 100 ⁇ m. When the thickness of the metal part 10 is less than 10 ⁇ m, handling properties may deteriorate or wrinkles may occur, and when the thickness exceeds 500 ⁇ m, roll workability may deteriorate.
  • the through-hole filling part 20 included in the carrier material according to the present invention is formed (provided) by filling the through-hole formed in the metal part 10 with a resin composition.
  • the through-hole filling part 20 corresponds to the non-metal area (insulation area) in the plating process for forming the perforated metal foil later, so that plating is not performed on the through-hole filling part 20, and thus the present invention provides a plurality of openings A perforated metal foil having holes can be obtained.
  • the resin composition is not particularly limited as long as it is a thermosetting resin composition, but is an epoxy resin composition having a viscosity of 400 to 500 Ps at 25 ° C. can
  • the present invention provides a perforated metal foil with a carrier material described above.
  • the perforated metal foil attached to a carrier material according to the present invention includes a carrier material 100 and a metal foil 200 .
  • the carrier material 100 included in the perforated metal foil attached to the carrier material according to the present invention includes the above-described metal part 10 and the through-hole filling part 20, and a detailed description thereof is the same as described above, so it will be omitted. do.
  • the metal foil 200 included in the perforated metal foil attached to the carrier material according to the present invention is selectively formed (provided) on one side, the other side, or both sides of the carrier material 100, and has a plurality of opening holes.
  • This metal foil 200 includes an electroless plating portion 201 and an electrolytic plating portion 202 .
  • the electroless plating part 201 included in the metal foil 200 has a role of releasing the electroplating part 202 to be separated from the carrier material 100 and the formation (growth) of the electrolytic plating part 202 It serves as a seed to make it work.
  • Components constituting the electroless plating portion 201 are not particularly limited, but considering plating efficiency, releasability, and the like, copper may be included.
  • the electroless plating portion 201 may have a thickness of 0.1 to 1 ⁇ m, and specifically, 0.3 to 0.5 ⁇ m. If the thickness of the electroless plating portion 201 is less than 0.1 ⁇ m, the release role may be reduced or the electrolytic plating portion 202 may not be formed smoothly, and if the thickness exceeds 1 ⁇ m, the electroless plating portion 201 Since the thickness of the film is thicker than necessary, economic feasibility may decrease or releasability may decrease.
  • the electrolytic plating part 202 included in the metal foil 200 is formed on the electroless plating part 201, and corresponds to a substantial part of the perforated metal foil obtained by separating the metal foil 200 from the carrier material 100 later. do.
  • Components constituting the electrolytic plating portion 202 are not particularly limited, but may include copper, copper alloy, nickel, or a nickel alloy in consideration of plating properties and applicability.
  • components constituting the electrolytic plating portion 202 may be the same as or different from those constituting the electroless plating portion 201, and preferably may be the same.
  • the thickness of the electrolytic plating portion 202 may be 5 to 30 ⁇ m, specifically 10 to 20 ⁇ m. If the thickness of the electrolytic plating part 202 is less than 5 ⁇ m, it may be difficult to obtain the required level of rigidity, and if it exceeds 30 ⁇ m, the thickness of the electrolytic plating part 202 is thicker than necessary, resulting in economic feasibility, applicability, etc. this may deteriorate.
  • the arrangement pattern of the plurality of opening holes of the metal foil 200 including the electroless plating portion 201 and the electrolytic plating portion 202 is a plurality of through holes formed in the metal portion 10 included in the carrier material 100.
  • the through-hole filling portion 20 formed by filling the resin composition exists in the plurality of through-holes formed in the metal portion 10, and as the resin composition, which is an insulating material, is filled, the plurality of through-holes form a non-metal area (insulation).
  • plating is not performed on the through-hole filling part 20 corresponding to a plurality of through-holes in each plating process for forming the electroless plating part 201 and the electrolytic plating part 202, and the metal part Plating is performed only on (10) to form a plurality of opening holes having an arrangement pattern corresponding to the arrangement pattern of the plurality of through holes.
  • the metal foil 100 has a plurality of opening holes having an arrangement pattern corresponding to the arrangement pattern of the plurality of through holes.
  • the diameter of each opening hole may be 10 to 500 ⁇ m, because of the above Since the diameter of the through hole is the same as the description, it is omitted.
  • the aperture ratio of the metal foil 200 having a plurality of aperture holes may be 5 to 50%, specifically 10 to 30%.
  • the aperture ratio of the metal foil 200 corresponds to the aperture ratio of the perforated metal foil separated from the carrier material 100.
  • the aperture ratio is less than 5%, when the metal foil 200 is applied to the negative electrode material (current collector) of the secondary battery It is difficult to expect the required efficiency and characteristics, and if it exceeds 50%, it may be difficult to obtain the required level of rigidity of the metal foil 200.
  • This invention provides the perforated metal foil separated from the above-mentioned perforated metal foil with a carrier material.
  • the perforated metal foil according to the present invention has the same aperture ratio as the metal foil 200 described above, and its thickness may be 5 to 30 ⁇ m in consideration of applicability.
  • the perforated metal foil according to the present invention can be applied to various technical fields, and for example, it can be usefully applied as a current collector used in the electrode manufacturing process.
  • the present invention provides a method for manufacturing the above-described perforated metal foil.
  • the manufacturing method of the perforated metal foil according to the present invention comprises the steps of preparing a carrier material for forming a perforated metal foil; forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; And a step of separating the carrier material, which will be described in detail with reference to FIG. 3 as follows.
  • a carrier material for forming a perforated metal foil is prepared (A)).
  • the process of preparing the carrier material is not particularly limited, but in order to prepare a carrier material in which the metal part 10 and the through-hole forming part 20 are well formed, a base through-hole is formed in the base material and then filled with a resin composition. process can be tough.
  • the first protective layer 101, the first adhesive layer 102, the metal layer 103, the second adhesive layer 104, and the second protective layer 105 are sequentially formed.
  • a base material obtained by bonding a protective film is prepared (a)). That is, to prepare a base material in which the first protective layer 101, the first adhesive layer 102, the metal layer 103, the second adhesive layer 104, and the second protective layer 105 are sequentially laminated.
  • a method of forming the base through-hole is not particularly limited, but may be formed through laser processing.
  • the base through hole may be formed by determining the diameter of the base through hole according to the required aperture ratio and the size of the opening hole.
  • the resin composition may be the above-described epoxy-based resin composition.
  • the resin composition may be cured through first and second curing processes.
  • the primary curing may be performed at 100 to 150 °C for 35 to 55 minutes, and the secondary curing may be performed at 120 to 170 °C for 50 to 70 minutes.
  • the through-hole filling portion 20 of the carrier material may be formed.
  • the first protective layer 101, the first adhesive layer 102, the second adhesive layer 103, and the second protective layer 104 are removed (d).
  • the removal may be performed through a conventional method, and through this, a carrier material including the metal part 10 and the through-hole filling part 20 may be manufactured and prepared.
  • Electroless plating and electrolytic plating are sequentially performed on the carrier material 100 prepared through this process to form a metal foil 200 having a plurality of opening holes (B).
  • the carrier material 100 is put into a plating bath containing an electroless plating composition, and electroless plating is performed by a substitution reaction to form an electroless plating portion 201 having a plurality of opening holes, followed by electrolytic plating.
  • the metal foil 200 may be formed by pouring the composition into a plating bath and performing electrolytic plating to form an electroplated portion 202 having a plurality of opening holes.
  • a conventionally known plating composition may be used as the electroless plating composition.
  • electroless plating may be performed at 20 to 30° C. for 30 seconds to 3 minutes so that a stable electroless plating portion 201 may be formed.
  • Electrolytic plating may be performed at 45 to 55° C. for 30 minutes to 40 minutes under application of a current density of 1 to 3 ASD so that the stable electrolytic plating portion 202 may be formed.
  • the carrier material 100 is separated (C).
  • the perforated metal foil according to the present invention is obtained through a process of separating the carrier material 100 and the metal foil 200 using the release property of the electroless plating portion 201 included in the metal foil 200.
  • the present invention is a carrier material 100 including a metal part 10 and a through-hole filling part 20 instead of the conventional technique of using an expensive cathode drum or directly forming a through-hole in a metal foil. Since the perforated metal foil is manufactured by passing through electroless plating and electrolytic plating, the perforated metal foil can be efficiently manufactured. In addition, the present invention controls the size (diameter) and pattern of through holes formed in the carrier foil 100 without major design changes such as manufacturing process and equipment, and can easily manufacture a perforated metal foil having a desired arrangement pattern and aperture ratio. there is.
  • a first protective layer having a thickness of 40 ⁇ m, a first adhesive layer having a thickness of 3 ⁇ m, an aluminum layer having a thickness of 60 ⁇ m, a second adhesive layer having a thickness of 3 ⁇ m, and a second protective layer having a thickness of 40 ⁇ m are sequentially formed.
  • UV laser was irradiated to form a plurality of base through holes having a diameter of about 350 ⁇ m in the base material.
  • an epoxy-based resin composition (viscosity at 25° C.: 450 Ps) was applied and filled in the through-holes of the base, followed by primary curing at 130° C. for 45 minutes.
  • the aluminum carrier material is subjected to a secondary curing process at 150 ° C. for 60 minutes. was manufactured.
  • the aluminum carrier material was put into a plating bath containing an electroless copper plating composition (YMT Co., PIC-100) and electroless for 1 minute at 25 ° C. Electroless plating was performed to form an electroless plating portion having a thickness of 0.3 to 0.5 ⁇ m while having a plurality of opening holes having a diameter of about 350 ⁇ m.
  • an electroless copper plating composition YMT Co., PIC-100
  • Electrolytic plating was performed for 35 minutes to form an electroplated portion having a thickness of 15 ⁇ m while having a plurality of opening holes having a diameter of about 350 ⁇ m.
  • the electroless plating part and the electrolytic plating part were separated from the aluminum carrier material, and a perforated copper foil having a thickness of 15 ⁇ m having a plurality of opening holes with a diameter of about 350 ⁇ m was manufactured. .
  • the perforated copper foil prepared in Example 1 was confirmed with a scanning electron microscope (TESCAN VEGA 4 LMS), and the results are shown in FIG. 5 .

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Abstract

The present invention relates to: a carrier material, which enables forming a perforated metal foil having a desired array pattern and aperture ratio, without using an expensive cathode drum or generating burrs; and a perforated metal foil formed by using the carrier material.

Description

천공 금속박 형성용 캐리어재 및 캐리어재 부착 천공 금속박Carrier material for forming perforated metal foil and perforated metal foil with carrier material
본 발명은 복수의 개구홀을 갖는 천공 금속박을 형성하기 위한 캐리어재, 상기 캐리어재가 부착된 천공 금속박 및 상기 천공 금속박의 제조방법에 관한 것이다.The present invention relates to a carrier material for forming a perforated metal foil having a plurality of opening holes, a perforated metal foil to which the carrier material is attached, and a manufacturing method of the perforated metal foil.
전자기기의 고밀도, 경량화, 박막화의 추세에 따라 전자기기에 적용되는 2차 전지의 경량화, 안전성 향상 및 에너지 효율 향상 등이 필요하며, 이를 달성하기 위해 2차 전지의 전극 소재로 사용되는 금속박의 다공화가 요구되고 있다.According to the trend of high density, light weight, and thin film of electronic devices, it is necessary to reduce the weight of secondary batteries applied to electronic devices, improve safety, and improve energy efficiency. Reconciliation is demanded.
상기 금속박의 다공화를 위해 제안된 기술로는 특허문헌 1 및 2를 들 수 있다. 상기 특허문헌 1에는 음극 드럼의 주위면에 절연성이 높은 합성수지를 매설한 부도체부를 소정의 패턴으로 배치한 천공박 전해 석출 장치가 개시되어 있다. 상기 특허문헌 2에는 음극 드럼에 홈을 가공하여 연마 롤에 의해 연마 불가능한 영역을 만들고 연마 가능한 부위의 산화막은 연마 롤에 의해 산화막이 제거되어 도금 석출이 이루어지고 연마 불가능 영역에는 도전성을 가지면서 그 두께가 두꺼워짐에 따라 전기 저항이 증가하는 소정의 도전성 물질이 형성되어 도금 석출이 이루어지지 않는 과정을 거쳐 천공된 금속박을 제조하는 방법이 개시되어 있다.Patent Documents 1 and 2 may be cited as techniques proposed for making the metal foil porous. Patent Literature 1 discloses a perforated foil electrolytic deposition device in which a non-conductor portion in which a highly insulating synthetic resin is embedded in a peripheral surface of a cathode drum is arranged in a predetermined pattern. In Patent Document 2, grooves are machined in the cathode drum to create areas that cannot be polished by a polishing roll, and the oxide film in the polishable area is removed by the polishing roll to deposit plating, and the thickness of the oxide film in the polishable area while having conductivity. Disclosed is a method of manufacturing a perforated metal foil through a process in which a predetermined conductive material having an increased electrical resistance is formed as the thickness increases, and plating is not deposited.
그러나 상기 특허문헌 1은 합성수지가 티탄 등의 금속으로 이루어진 음극 드럼에 견고하게 접합하지 못하는 한계로 인해 매설한 합성수지가 음극 드럼의 주위면으로부터 탈락하는 문제점이 있다. 또한 상기 특허문헌 2는 연마 롤에 의해 제거된 산화막이 전해액에 잔류하면서 금속박 석출에 부정적인 영향을 미쳐 금속박에 핀홀이 형성되는 문제점이 있다.However, Patent Document 1 has a problem in that the buried synthetic resin is detached from the peripheral surface of the negative electrode drum due to the limitation that the synthetic resin cannot be firmly bonded to the negative electrode drum made of metal such as titanium. In addition, Patent Document 2 has a problem in that pinholes are formed in the metal foil by negatively affecting the metal foil deposition while the oxide film removed by the polishing roll remains in the electrolyte.
이러한 문제점들을 해결하고자 CNC 또는 Laser를 이용하여 금속박을 직접 천공하는 방법이 제안된 바 있다. 그러나 CNC 또는 Laser를 이용하여 금속박을 천공할 경우, 천공된 관통홀 주변에 버(Burr)가 발생하는 문제점이 있다.In order to solve these problems, a method of directly perforating the metal foil using CNC or laser has been proposed. However, when the metal foil is perforated using CNC or Laser, there is a problem in that burrs are generated around the perforated through-holes.
본 발명은 고가의 음극 드럼을 사용하지 않으면서 버(burr) 발생 없이 원하는 배열패턴과 개구율을 가지는 천공 금속박을 형성할 수 있도록 하는 캐리어재를 제공하고자 한다.An object of the present invention is to provide a carrier material capable of forming a perforated metal foil having a desired arrangement pattern and aperture ratio without generating burrs without using an expensive cathode drum.
또한 본 발명은 캐리어재가 부착된 천공 금속박 및 이의 제조방법을 제공하고자 한다.In addition, the present invention is to provide a perforated metal foil attached to the carrier material and a manufacturing method thereof.
상기 과제를 해결하기 위해 본 발명은, 복수의 관통홀이 형성된 금속부; 및 상기 관통홀에 수지 조성물이 충진되어 형성된 관통홀충진부를 포함하는 천공 금속박 형성용 캐리어재를 제공한다.The present invention in order to solve the above problems, a plurality of through-hole formed metal portion; And it provides a carrier material for forming a perforated metal foil comprising a through-hole filling portion formed by filling the through-hole with a resin composition.
상기 금속부는 알루미늄을 포함할 수 있다.The metal part may include aluminum.
상기 금속부의 두께는 10 내지 500 ㎛일 수 있다.The metal part may have a thickness of 10 to 500 μm.
상기 수지 조성물은 25 ℃에서 점도가 400 내지 500 Ps인 에폭시계 수지 조성물일 수 있다.The resin composition may be an epoxy-based resin composition having a viscosity of 400 to 500 Ps at 25 °C.
상기 관통홀의 직경은 10 ㎛ 이상일 수 있다.The through hole may have a diameter of 10 μm or more.
한편 본 발명은, 상기 천공 금속박 형성용 캐리어재; 및 복수의 개구홀을 갖는 금속박을 포함하고, 상기 금속박은 무전해 도금부와 전해 도금부를 포함하며, 상기 복수의 개구홀의 배열패턴이 상기 캐리어재에 포함된 금속부에 형성된 복수의 관통홀의 배열패턴에 대응되는 것인 캐리어재 부착 천공 금속박을 제공한다.On the other hand, the present invention, the carrier material for forming the perforated metal foil; and a metal foil having a plurality of opening holes, wherein the metal foil includes an electroless plating part and an electrolytic plating part, and the arrangement pattern of the plurality of opening holes is an arrangement pattern of a plurality of through holes formed in the metal part included in the carrier material. Provides a perforated metal foil with a carrier material that corresponds to.
상기 금속박의 개구율은 5 내지 50 %일 수 있다.An aperture ratio of the metal foil may be 5 to 50%.
상기 개구홀의 직경은 10 내지 500 ㎛이고, 상기 무전해 도금부의 두께는 0.1 내지 1 ㎛이며, 상기 전해 도금부의 두께는 5 내지 30 ㎛일 수 있다.The diameter of the opening hole may be 10 to 500 μm, the thickness of the electroless plating portion may be 0.1 μm to 1 μm, and the thickness of the electrolytic plating portion may be 5 μm to 30 μm.
또한 본 발명은, 상기 캐리어재 부착 천공 금속박에서 분리된 천공 금속박을 제공한다.Moreover, this invention provides the perforated metal foil separated from the said perforated metal foil with a carrier material.
또 본 발명은, 상기 천공 금속박 형성용 캐리어재를 준비하는 단계; 상기 캐리어재에 무전해 도금과 전해 도금을 순차적으로 진행하여 복수의 개구홀을 갖는 금속박을 형성하는 단계; 및 상기 캐리어재를 분리하는 단계를 포함하는 천공 금속박의 제조방법을 제공한다.In another aspect of the present invention, preparing a carrier material for forming the perforated metal foil; forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; And it provides a method for manufacturing a perforated metal foil comprising the step of separating the carrier material.
상기 캐리어재를 준비하는 단계는, 제1 보호층, 제1 접착제층, 금속층, 제2 접착제층 및 제2 보호층이 순차적으로 적층된 베이스 자재를 준비하는 단계; 상기 베이스 자재에 복수의 베이스 관통홀을 형성하는 단계; 상기 복수의 베이스 관통홀에 수지 조성물을 충진하는 단계; 및 상기 제1 보호층, 상기 제1 접착제층, 상기 제2 접착제층 및 상기 제2 보호층을 제거하는 단계를 포함할 수 있다.Preparing the carrier material may include preparing a base material in which a first protective layer, a first adhesive layer, a metal layer, a second adhesive layer, and a second protective layer are sequentially stacked; Forming a plurality of base through-holes in the base material; filling the plurality of base through-holes with a resin composition; and removing the first protective layer, the first adhesive layer, the second adhesive layer, and the second protective layer.
본 발명에 따른 캐리어재는 수지 조성물이 충진되어 형성된 관통홀충진부가 비금속 영역(절연 영역)에 해당되어 도금 시 관통홀충진부 상에는 도금이 이루어지지 않고, 그 외 영역인 금속부 상에 도금이 이루어지는 메커니즘을 갖는 것으로, 이러한 메커니즘에 의해 복수의 개구홀을 갖는 천공 금속박을 용이하게 형성할 수 있다. 즉, 본 발명은 고가의 음극 드럼을 사용하지 않으면서 버(burr) 발생 없이 원하는 배열패턴과 개구율을 가지는 천공 금속박을 효율적으로 제공할 수 있다.In the carrier material according to the present invention, since the through-hole filling part formed by filling the resin composition corresponds to the non-metal area (insulation area), plating is not performed on the through-hole filling part during plating, and plating is performed on the metal part, which is the other area. By having, it is possible to easily form a perforated metal foil having a plurality of opening holes by this mechanism. That is, the present invention can efficiently provide a perforated metal foil having a desired arrangement pattern and aperture ratio without using an expensive cathode drum and without generating burrs.
이와 같이 본 발명은 원하는 배열패턴과 개구율을 가지는 천공 금속박을 용이하게 제공할 수 있으며, 이로 인해 2차 전지의 경량화, 안전성 향상 및 에너지 효율 향상 등을 달성하는 것에 기여할 수 있다.As such, the present invention can easily provide a perforated metal foil having a desired arrangement pattern and aperture ratio, thereby contributing to achieving weight reduction, safety improvement, and energy efficiency improvement of a secondary battery.
도 1은 본 발명의 일 실시예에 따른 캐리어재를 나타낸 개략도이다.1 is a schematic diagram showing a carrier material according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 캐리어재 부착 천공 금속박을 나타낸 개략도이다.2 is a schematic diagram showing a perforated metal foil with a carrier material according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 천공 금속박의 제조과정을 나타낸 개략도이다.3 is a schematic diagram showing a manufacturing process of a perforated metal foil according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 캐리어재의 제조과정을 나타낸 개략도이다.4 is a schematic diagram showing a manufacturing process of a carrier material according to an embodiment of the present invention.
도 5는 본 발명의 실험예 1을 설명하기 위한 참고도이다.5 is a reference diagram for explaining Experimental Example 1 of the present invention.
본 발명의 설명 및 청구범위에서 사용된 용어나 단어는, 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여, 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.The terms or words used in the description and claims of the present invention should not be construed as being limited to ordinary or dictionary meanings, and the inventors use the concept of terms appropriately to describe their invention in the best way. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical spirit of the present invention.
본 발명은 천공 금속박을 형성하는 과정에서 지지재 역할을 하는 캐리어재, 상기 캐리어재에 부착된 천공 금속박, 상기 캐리어재에 부착된 천공 금속박에서 분리된 천공 금속박 및 상기 천공 금속박의 제조방법에 관한 것으로, 이에 대해 구체적으로 설명하면 다음과 같다.The present invention relates to a carrier material serving as a support material in the process of forming a perforated metal foil, a perforated metal foil attached to the carrier material, a perforated metal foil separated from the perforated metal foil attached to the carrier material, and a method for manufacturing the perforated metal foil. , a detailed description of this is as follows.
도 1을 참조하면, 본 발명에 따른 천공 금속박 형성용 캐리어재(이하, '캐리어재'라 함)는 금속부(10)와 관통홀충진부(20)를 포함한다.Referring to FIG. 1, a carrier material for forming a perforated metal foil according to the present invention (hereinafter referred to as a 'carrier material') includes a metal part 10 and a through-hole filling part 20.
본 발명에 따른 캐리어재에 포함되는 금속부(10)는 금속 소재로 이루어지며, 복수의 관통홀이 형성(구비)되어 있다. 상기 금속부(10)를 이루는 금속 소재는 특별히 한정되지 않으나, 관통홀 형성의 용이성, 취급성, 경제성 등을 고려할 때, 알루미늄일 수 있다.The metal part 10 included in the carrier material according to the present invention is made of a metal material and has a plurality of through holes formed (provided). The metal material constituting the metal part 10 is not particularly limited, but may be aluminum in consideration of ease of formation of through holes, handling properties, economic feasibility, and the like.
상기 금속부(10)에 형성된 각 관통홀의 직경은 추후 천공 금속박이 갖는 개구홀의 직경에 대응되는 것으로, 그 직경은 10 ㎛ 이상, 구체적으로 10 내지 500 ㎛, 보다 구체적으로 50 내지 200 ㎛일 수 있다. 관통홀의 직경이 10 ㎛ 미만일 경우에는 수지 조성물의 충진이 원활히 이루어지지 않을 수 있고, 500 ㎛를 초과할 경우에는 천공 금속박이 과도하게 큰 개구홀을 갖게 되어 천공 금속박의 강성이 저하됨에 따라 그 응용성이 떨어질 수 있다.The diameter of each through hole formed in the metal part 10 corresponds to the diameter of the opening hole of the later perforated metal foil, and the diameter may be 10 μm or more, specifically 10 to 500 μm, and more specifically 50 to 200 μm. . When the diameter of the through-hole is less than 10 μm, the filling of the resin composition may not be performed smoothly, and when the diameter exceeds 500 μm, the perforated metal foil has an excessively large opening hole, and the stiffness of the perforated metal foil is lowered. this may fall
이러한 금속부(10)의 두께는 10 내지 500 ㎛일 수 있고, 구체적으로는 20 내지 100 ㎛일 수 있다. 금속부(10)의 두께가 10 ㎛ 미만일 경우에는 취급성이 떨어지거나 구김 등이 발생할 수 있고, 500 ㎛를 초과할 경우에는 Roll 작업성 등이 떨어질 수 있다.The thickness of the metal part 10 may be 10 to 500 μm, specifically 20 to 100 μm. When the thickness of the metal part 10 is less than 10 μm, handling properties may deteriorate or wrinkles may occur, and when the thickness exceeds 500 μm, roll workability may deteriorate.
본 발명에 따른 캐리어재에 포함되는 관통홀충진부(20)는 금속부(10)에 형성되어 있는 관통홀에 수지 조성물이 충진되어 형성(구비)된다. 상기 관통홀충진부(20)는 추후 천공 금속박 형성을 위한 도금 과정에서 비금속 영역(절연 영역)에 해당되어 관통홀충진부(20) 상에는 도금이 이루어지지 않게 되며, 이로 인해 본 발명은 복수의 개구홀을 갖는 천공 금속박을 얻을 수 있다.The through-hole filling part 20 included in the carrier material according to the present invention is formed (provided) by filling the through-hole formed in the metal part 10 with a resin composition. The through-hole filling part 20 corresponds to the non-metal area (insulation area) in the plating process for forming the perforated metal foil later, so that plating is not performed on the through-hole filling part 20, and thus the present invention provides a plurality of openings A perforated metal foil having holes can be obtained.
상기 수지 조성물은 열경화성 수지 조성물이라면 특별히 한정되지 않으나, 관통홀 충진성, 관통홀에 대한 결합성(접착성), 내열성 등을 고려할 때, 25 ℃에서 점도가 400 내지 500 Ps인 에폭시계 수지 조성물일 수 있다.The resin composition is not particularly limited as long as it is a thermosetting resin composition, but is an epoxy resin composition having a viscosity of 400 to 500 Ps at 25 ° C. can
본 발명은 상기에서 설명한 캐리어재가 부착된 천공 금속박을 제공한다. 구체적으로 도 2를 참조하면, 본 발명에 따른 캐리어재 부착 천공 금속박은 캐리어재(100) 및 금속박(200)을 포함한다.The present invention provides a perforated metal foil with a carrier material described above. Specifically, referring to FIG. 2 , the perforated metal foil attached to a carrier material according to the present invention includes a carrier material 100 and a metal foil 200 .
본 발명에 따른 캐리어재 부착 천공 금속박에 포함되는 캐리어재(100)는 상술한 금속부(10)와 관통홀충진부(20)를 포함하는 것으로, 이에 대한 구체적인 설명은 상술한 바와 동일하므로 생략하도록 한다.The carrier material 100 included in the perforated metal foil attached to the carrier material according to the present invention includes the above-described metal part 10 and the through-hole filling part 20, and a detailed description thereof is the same as described above, so it will be omitted. do.
본 발명에 따른 캐리어재 부착 천공 금속박에 포함되는 금속박(200)은 캐리어재(100)의 일 측, 타 측, 또는 양 측에 선택적으로 형성(구비)되고, 복수의 개구홀을 갖는다. 이러한 금속박(200)은 무전해 도금부(201)와 전해 도금부(202)를 포함한다.The metal foil 200 included in the perforated metal foil attached to the carrier material according to the present invention is selectively formed (provided) on one side, the other side, or both sides of the carrier material 100, and has a plurality of opening holes. This metal foil 200 includes an electroless plating portion 201 and an electrolytic plating portion 202 .
상기 금속박(200)에 포함되는 무전해 도금부(201)는 전해 도금부(202)가 캐리어재(100)에서 분리될 수 있도록 하는 이형 역할과 함께 전해 도금부(202)의 형성(성장)이 잘 이루어지도록 하는 씨드(seed) 역할을 한다. 이러한 무전해 도금부(201)를 이루는 성분은 특별히 한정되지 않으나, 도금효율성, 이형성 등을 고려할 때, 구리를 포함할 수 있다.The electroless plating part 201 included in the metal foil 200 has a role of releasing the electroplating part 202 to be separated from the carrier material 100 and the formation (growth) of the electrolytic plating part 202 It serves as a seed to make it work. Components constituting the electroless plating portion 201 are not particularly limited, but considering plating efficiency, releasability, and the like, copper may be included.
상기 무전해 도금부(201)의 두께는 0.1 내지 1 ㎛일 수 있고, 구체적으로는 0.3 내지 0.5 ㎛일 수 있다. 무전해 도금부(201)의 두께가 0.1 ㎛ 미만일 경우에는 이형 역할이 저하되거나 전해 도금부(202)의 형성이 원활히 이루어지지 않을 수 있고, 1 ㎛를 초과할 경우에는 무전해 도금부(201)의 두께가 필요 이상으로 두꺼워 경제성이 떨어지거나 이형성이 저하될 수 있다.The electroless plating portion 201 may have a thickness of 0.1 to 1 μm, and specifically, 0.3 to 0.5 μm. If the thickness of the electroless plating portion 201 is less than 0.1 μm, the release role may be reduced or the electrolytic plating portion 202 may not be formed smoothly, and if the thickness exceeds 1 μm, the electroless plating portion 201 Since the thickness of the film is thicker than necessary, economic feasibility may decrease or releasability may decrease.
상기 금속박(200)에 포함되는 전해 도금부(202)는 무전해 도금부(201) 상에 형성되는 것으로, 추후 캐리어재(100)에서 금속박(200)을 분리하여 얻어지는 천공 금속박의 실질적인 부분에 해당한다. 이러한 전해 도금부(202)를 이루는 성분은 특별히 한정되지 않으나, 도금성, 응용성 등을 고려할 때, 구리, 구리 합금, 니켈, 또는 니켈 합금을 포함할 수 있다. 여기서 전해 도금부(202)를 이루는 성분은 무전해 도금부(201)를 이루는 성분과 동일하거나 상이할 수 있으며, 바람직하게는 동일할 수 있다.The electrolytic plating part 202 included in the metal foil 200 is formed on the electroless plating part 201, and corresponds to a substantial part of the perforated metal foil obtained by separating the metal foil 200 from the carrier material 100 later. do. Components constituting the electrolytic plating portion 202 are not particularly limited, but may include copper, copper alloy, nickel, or a nickel alloy in consideration of plating properties and applicability. Here, components constituting the electrolytic plating portion 202 may be the same as or different from those constituting the electroless plating portion 201, and preferably may be the same.
상기 전해 도금부(202)의 두께는 5 내지 30 ㎛일 수 있고, 구체적으로는 10 내지 20 ㎛일 수 있다. 전해 도금부(202)의 두께가 5 ㎛ 미만일 경우에는 요구되는 수준의 강성을 얻기 어려울 수 있고, 30 ㎛를 초과할 경우에는 전해 도금부(202)의 두께가 필요 이상으로 두꺼워 경제성, 응용성 등이 저하될 수 있다.The thickness of the electrolytic plating portion 202 may be 5 to 30 μm, specifically 10 to 20 μm. If the thickness of the electrolytic plating part 202 is less than 5 μm, it may be difficult to obtain the required level of rigidity, and if it exceeds 30 μm, the thickness of the electrolytic plating part 202 is thicker than necessary, resulting in economic feasibility, applicability, etc. this may deteriorate.
한편 무전해 도금부(201)와 전해 도금부(202)를 포함하는 금속박(200)이 갖는 복수의 개구홀의 배열패턴은 캐리어재(100)에 포함된 금속부(10)에 형성된 복수의 관통홀의 배열패턴에 대응된다. 즉, 금속부(10)에 형성된 복수의 관통홀에는 수지 조성물이 충진되어 형성된 관통홀충진부(20)가 존재하는 것으로, 절연 소재인 수지 조성물이 충진됨에 따라 복수의 관통홀은 비금속 영역(절연 영역)이 되어, 무전해 도금부(201)와 전해 도금부(202)를 형성하기 위한 각 도금 과정에서 복수의 관통홀에 해당하는 관통홀충진부(20) 상에는 도금이 이루어지지 않고, 금속부(10) 상에만 도금이 이루어져, 복수의 관통홀의 배열패턴에 대응되는 배열패턴을 갖는 복수의 개구홀이 형성되는 것이다. 이와 같은 과정을 통해 금속박(100)은 복수의 관통홀의 배열패턴에 대응되는 배열패턴을 갖는 복수의 개구홀을 갖게 되는데, 이때, 각 개구홀의 직경은 10 내지 500 ㎛일 수 있고, 그 이유는 상기 관통홀의 직경을 설명한 내용과 동일하므로 생략하도록 한다.Meanwhile, the arrangement pattern of the plurality of opening holes of the metal foil 200 including the electroless plating portion 201 and the electrolytic plating portion 202 is a plurality of through holes formed in the metal portion 10 included in the carrier material 100. Corresponds to the array pattern. That is, the through-hole filling portion 20 formed by filling the resin composition exists in the plurality of through-holes formed in the metal portion 10, and as the resin composition, which is an insulating material, is filled, the plurality of through-holes form a non-metal area (insulation). area), plating is not performed on the through-hole filling part 20 corresponding to a plurality of through-holes in each plating process for forming the electroless plating part 201 and the electrolytic plating part 202, and the metal part Plating is performed only on (10) to form a plurality of opening holes having an arrangement pattern corresponding to the arrangement pattern of the plurality of through holes. Through this process, the metal foil 100 has a plurality of opening holes having an arrangement pattern corresponding to the arrangement pattern of the plurality of through holes. At this time, the diameter of each opening hole may be 10 to 500 μm, because of the above Since the diameter of the through hole is the same as the description, it is omitted.
여기서 복수의 개구홀을 갖는 금속박(200)의 개구율은 5 내지 50 %, 구체적으로 10 내지 30 %일 수 있다. 상기 금속박(200)의 개구율은 캐리어재(100)에서 분리된 천공 금속박의 개구율에 대응되는 것으로, 개구율이 5 % 미만일 경우에는 금속박(200)을 2차 전지의 음극 소재(집전체)에 적용 시 요구되는 효율성 및 특성을 기대하기 어렵고, 50 %를 초과할 경우에는 금속박(200)의 강성을 요구되는 수준으로 얻기 어려울 수 있다.Here, the aperture ratio of the metal foil 200 having a plurality of aperture holes may be 5 to 50%, specifically 10 to 30%. The aperture ratio of the metal foil 200 corresponds to the aperture ratio of the perforated metal foil separated from the carrier material 100. When the aperture ratio is less than 5%, when the metal foil 200 is applied to the negative electrode material (current collector) of the secondary battery It is difficult to expect the required efficiency and characteristics, and if it exceeds 50%, it may be difficult to obtain the required level of rigidity of the metal foil 200.
본 발명은 상술한 캐리어재 부착 천공 금속박에서 분리된 천공 금속박을 제공한다. 본 발명에 따른 천공 금속박은 상술한 금속박(200)과 동일한 개구율을 가지며, 그 두께는 응용성 등을 고려할 때, 5 내지 30 ㎛일 수 있다. 이러한 본 발명에 따른 천공 금속박은 다양한 기술분야에 적용될 수 있으며, 일례로 전극 제조 과정에서 사용되는 집전체로 유용하게 적용될 수 있다.This invention provides the perforated metal foil separated from the above-mentioned perforated metal foil with a carrier material. The perforated metal foil according to the present invention has the same aperture ratio as the metal foil 200 described above, and its thickness may be 5 to 30 μm in consideration of applicability. The perforated metal foil according to the present invention can be applied to various technical fields, and for example, it can be usefully applied as a current collector used in the electrode manufacturing process.
본 발명은 상술한 천공 금속박을 제조하는 방법을 제공한다. 구체적으로 본 발명에 따른 천공 금속박의 제조방법은 천공 금속박 형성용 캐리어재를 준비하는 단계; 상기 캐리어재에 무전해 도금과 전해 도금을 순차적으로 진행하여 복수의 개구홀을 갖는 금속박을 형성하는 단계; 및 상기 캐리어재를 분리하는 단계를 포함하는데, 이에 대해 도 3을 참조하여 구체적으로 설명하면 다음과 같다.The present invention provides a method for manufacturing the above-described perforated metal foil. Specifically, the manufacturing method of the perforated metal foil according to the present invention comprises the steps of preparing a carrier material for forming a perforated metal foil; forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; And a step of separating the carrier material, which will be described in detail with reference to FIG. 3 as follows.
먼저, 천공 금속박 형성용 캐리어재를 준비한다(A)). 상기 캐리어재를 준비하는 과정을 특별히 한정되지 않으나, 금속부(10)와 관통홀형성부(20)가 잘 형성된 캐리어재를 준비하기 위해 베이스 자재에 베이스 관통홀을 형성한 후 수지 조성물을 충진하는 과정을 거칠 수 있다. 구체적으로 상기 캐리어재를 준비하는 단계는, 제1 보호층(101), 제1 접착제층(102), 금속층(103), 제2 접착제층(104) 및 제2 보호층(105)이 순차적으로 적층된 베이스 자재를 준비하는 단계; 상기 베이스 자재에 복수의 베이스 관통홀을 형성하는 단계; 상기 복수의 베이스 관통홀에 수지 조성물을 충진하는 단계; 및 상기 제1 보호층(101), 상기 제1 접착제층(102), 상기 제2 접착제층(103) 및 상기 제2 보호층(104)을 제거하는 단계를 포함할 수 있는데, 이에 대해 도 4를 참조하여 설명하면 다음과 같다.First, a carrier material for forming a perforated metal foil is prepared (A)). The process of preparing the carrier material is not particularly limited, but in order to prepare a carrier material in which the metal part 10 and the through-hole forming part 20 are well formed, a base through-hole is formed in the base material and then filled with a resin composition. process can be tough. Specifically, in the step of preparing the carrier material, the first protective layer 101, the first adhesive layer 102, the metal layer 103, the second adhesive layer 104, and the second protective layer 105 are sequentially formed. preparing a laminated base material; Forming a plurality of base through-holes in the base material; filling the plurality of base through-holes with a resin composition; and removing the first protective layer 101, the first adhesive layer 102, the second adhesive layer 103, and the second protective layer 104, for which FIG. 4 Referring to, the explanation is as follows.
도 4를 참조하면, 캐리어재의 금속부(10)에 해당하는 금속 기재의 상하면에 각각 접착제를 도포한 후, 보호필름을 결합시켜 얻어진 베이스 자재를 준비한다(a)). 즉, 제1 보호층(101), 제1 접착제층(102), 금속층(103), 제2 접착제층(104) 및 제2 보호층(105)이 순차적으로 적층된 베이스 자재를 준비하는 것이다.Referring to FIG. 4, after applying an adhesive to the upper and lower surfaces of the metal substrate corresponding to the metal part 10 of the carrier material, a base material obtained by bonding a protective film is prepared (a)). That is, to prepare a base material in which the first protective layer 101, the first adhesive layer 102, the metal layer 103, the second adhesive layer 104, and the second protective layer 105 are sequentially laminated.
다음, 베이스 자재에 복수의 베이스 관통홀을 형성한다(b)). 상기 베이스 관통홀을 형성하는 방법은 특별히 한정되지 않으나, Laser 가공을 통해 형성할 수 있다. 여기서 베이스 관통홀의 직경은 상술한 관통홀과 개구홀 각각의 직경에 대응되므로, 요구되는 개구율 및 개구홀의 크기에 따라 베이스 관통홀의 직경을 결정하여 베이스 관통홀이 형성될 수 있다.Next, a plurality of base through-holes are formed in the base material (b)). A method of forming the base through-hole is not particularly limited, but may be formed through laser processing. Here, since the diameter of the base through hole corresponds to the diameter of each of the through hole and the opening hole described above, the base through hole may be formed by determining the diameter of the base through hole according to the required aperture ratio and the size of the opening hole.
그 다음, 복수의 베이스 관통홀에 수지 조성물을 충진한다. 상기 수지 조성물은 상술한 에폭시계 수지 조성물일 수 있다. 여기서 수지 조성물 충진 후 1차 및 2 차의 경화 과정을 거쳐 수지 조성물의 경화가 이루어질 수 있다. 상기 에폭시계 수지 조성물의 완전 경화를 위해 상기 1차 경화는 100 내지 150 ℃에서 35 내지 55 분 동안 이루어질 수 있고, 상기 2차 경화는 120 내지 170 ℃에서 50 내지 70 분 동안 이루어질 수 있다. 이와 같은 충진 및 경화 과정을 거침에 따라 캐리어재의 관통홀충진부(20)가 형성될 수 있다.Then, a resin composition is filled in the plurality of base through-holes. The resin composition may be the above-described epoxy-based resin composition. Here, after filling the resin composition, the resin composition may be cured through first and second curing processes. For complete curing of the epoxy-based resin composition, the primary curing may be performed at 100 to 150 °C for 35 to 55 minutes, and the secondary curing may be performed at 120 to 170 °C for 50 to 70 minutes. Through such a filling and curing process, the through-hole filling portion 20 of the carrier material may be formed.
다음, 제1 보호층(101), 제1 접착제층(102), 제2 접착제층(103) 및 제2 보호층(104)을 제거한다(d)). 상기 제거는 통상적인 방법을 통해 이루어질 수 있으며, 이를 거쳐 금속부(10)와 관통홀충진부(20)를 포함하는 캐리어재를 제조 및 준비할 수 있다.Next, the first protective layer 101, the first adhesive layer 102, the second adhesive layer 103, and the second protective layer 104 are removed (d). The removal may be performed through a conventional method, and through this, a carrier material including the metal part 10 and the through-hole filling part 20 may be manufactured and prepared.
이러한 과정을 거쳐 준비된 캐리어재(100)에 무전해 도금과 전해 도금을 순차적으로 진행하여 복수의 개구홀을 갖는 금속박(200)을 형성한다(B)). 구체적으로 캐리어재(100)를 무전해 도금 조성물이 존재하는 도금욕에 투입하고 치환 반응에 의한 무전해 도금을 진행하여 복수의 개구홀을 갖는 무전해 도금부(201)를 형성한 후, 전해 도금 조성물이 존재하는 도금욕에 투입하고 전해 도금을 진행하여 복수의 개구홀을 갖는 전해 도금부(202)를 형성하는 과정을 거쳐 금속박(200)을 형성할 수 있다.Electroless plating and electrolytic plating are sequentially performed on the carrier material 100 prepared through this process to form a metal foil 200 having a plurality of opening holes (B). Specifically, the carrier material 100 is put into a plating bath containing an electroless plating composition, and electroless plating is performed by a substitution reaction to form an electroless plating portion 201 having a plurality of opening holes, followed by electrolytic plating. The metal foil 200 may be formed by pouring the composition into a plating bath and performing electrolytic plating to form an electroplated portion 202 having a plurality of opening holes.
상기 무전해 도금 조성물로는 통상적으로 공지된 도금 조성물을 사용할 수 있다. 여기서 안정적인 무전해 도금부(201)가 형성될 수 있도록 무전해 도금은 20 내지 30 ℃에서 30 초 내지 3 분 동안 이루어질 수 있다.A conventionally known plating composition may be used as the electroless plating composition. Here, electroless plating may be performed at 20 to 30° C. for 30 seconds to 3 minutes so that a stable electroless plating portion 201 may be formed.
상기 전해 도금 조성물로는 황산구리, 황산, 염소 이온, 광택제 및 캐리어를 포함하는 도금 조성물을 사용할 수 있다. 여기서 안정적인 전해 도금부(202)가 형성될 수 있도록 전해 도금은 1 내지 3 ASD의 전류밀도 인가 하에 45 내지 55 ℃에서 30 분 내지 40 분 동안 이루어질 수 있다.As the electrolytic plating composition, a plating composition containing copper sulfate, sulfuric acid, chlorine ions, a brightener, and a carrier may be used. Electrolytic plating may be performed at 45 to 55° C. for 30 minutes to 40 minutes under application of a current density of 1 to 3 ASD so that the stable electrolytic plating portion 202 may be formed.
그 다음, 캐리어재(100)를 분리한다(C)). 구체적으로 금속박(200)에 포함된 무전해 도금부(201)의 이형성을 이용하여 캐리어재(100)와 금속박(200)을 분리하는 과정을 거쳐 본 발명에 따른 천공 금속박을 얻는다.Then, the carrier material 100 is separated (C). Specifically, the perforated metal foil according to the present invention is obtained through a process of separating the carrier material 100 and the metal foil 200 using the release property of the electroless plating portion 201 included in the metal foil 200.
이와 같이 본 발명은 고가의 음극 드럼을 사용하거나 금속박에 직접적으로 관통홀을 형성시키는 과정을 거치는 종래의 기술 대신 금속부(10)와 관통홀충진부(20)를 포함하는 캐리어재(100)에 무전해 도금과 전해 도금을 거치는 것으로 천공 금속박을 제조하기 때문에 천공 금속박을 효율적으로 제조할 수 있다. 또한 본 발명은 제조 과정 및 기기 등의 큰 설계 변경없이 캐리어박(100)에 형성되는 관통홀의 크기(직경) 및 패턴을 제어하는 것으로, 원하는 배열패턴 및 개구율을 가지는 천공 금속박을 용이하게 제조할 수 있다.As described above, the present invention is a carrier material 100 including a metal part 10 and a through-hole filling part 20 instead of the conventional technique of using an expensive cathode drum or directly forming a through-hole in a metal foil. Since the perforated metal foil is manufactured by passing through electroless plating and electrolytic plating, the perforated metal foil can be efficiently manufactured. In addition, the present invention controls the size (diameter) and pattern of through holes formed in the carrier foil 100 without major design changes such as manufacturing process and equipment, and can easily manufacture a perforated metal foil having a desired arrangement pattern and aperture ratio. there is.
이하, 실시예에 의하여 본 발명을 더욱 상세하게 설명하고자 한다. 그러나, 하기 실시예는 본 발명을 예시하기 위한 것으로 본 발명의 범주 및 기술사상 범위 내에서 다양한 변경 및 수정이 가능함은 통상의 기술자에게 있어서 명백한 것이며, 이들 만으로 본 발명의 범위가 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail by examples. However, the following examples are intended to illustrate the present invention, and it is obvious to those skilled in the art that various changes and modifications are possible within the scope and spirit of the present invention, and the scope of the present invention is not limited only to these.
[준비예 1][Preparation Example 1]
두께가 40 ㎛인 제1 보호층, 두께가 3 ㎛인 제1 접착제층, 두께가 60 ㎛인 알루미늄층, 두께가 3 ㎛인 제2 접착제층, 두께가 40 ㎛인 제2 보호층이 순차적으로 적층된 베이스 자재를 준비한 후, UV Laser를 조사하여 직경이 약 350 ㎛인 베이스 관통홀을 베이스 자재에 복수로 형성하였다. 다음, 에폭시계 수지 조성물(25 ℃에서의 점도: 450 Ps)을 베이스 관통홀에 도포 및 충진한 후, 130 ℃에서 45 분 동안 1차 경화시켰다. 그 다음, 제1 보호층, 제1 접착제층, 제2 접착제층 및 제2 보호층을 알루미늄층의 상부 및 하부에서 각각 제거한 후, 150 ℃에서 60 분 동안 2차 경화시키는 과정을 거쳐 알루미늄 캐리어재를 제조하였다.A first protective layer having a thickness of 40 μm, a first adhesive layer having a thickness of 3 μm, an aluminum layer having a thickness of 60 μm, a second adhesive layer having a thickness of 3 μm, and a second protective layer having a thickness of 40 μm are sequentially formed. After preparing the laminated base material, UV laser was irradiated to form a plurality of base through holes having a diameter of about 350 μm in the base material. Next, an epoxy-based resin composition (viscosity at 25° C.: 450 Ps) was applied and filled in the through-holes of the base, followed by primary curing at 130° C. for 45 minutes. Then, after removing the first protective layer, the first adhesive layer, the second adhesive layer, and the second protective layer from the top and bottom of the aluminum layer, respectively, the aluminum carrier material is subjected to a secondary curing process at 150 ° C. for 60 minutes. was manufactured.
[실시예 1][Example 1]
상기 준비예 1에 제조된 알루미늄 캐리어재를 탈지 및 수세한 후, 무전해 구리도금 조성물(와이엠티社, PIC-100)이 존재하는 도금욕에 알루미늄 캐리어재를 투입하고 25 ℃에서 1 분 동안 무전해 도금을 진행하여 직경이 약 350 ㎛ 내외인 개구홀을 복수로 가지면서 두께가 0.3 내지 0.5 ㎛인 무전해 도금부를 형성하였다.After degreasing and washing the aluminum carrier material prepared in Preparation Example 1, the aluminum carrier material was put into a plating bath containing an electroless copper plating composition (YMT Co., PIC-100) and electroless for 1 minute at 25 ° C. Electroless plating was performed to form an electroless plating portion having a thickness of 0.3 to 0.5 μm while having a plurality of opening holes having a diameter of about 350 μm.
다음, 무전해 도금부가 형성된 알루미늄 캐리어재를 탈지 및 수세한 후, 전해 구리도금 조성물(와이엠티社, BJ Series)이 존재하는 도금욕에 투입하고, 2 ASD의 전류밀도를 인가하면서 20 내지 25 ℃에서 35 분 동안 전해 도금을 진행하여 직경이 약 350 ㎛ 내외인 개구홀을 복수로 가지면서 두께가 15 ㎛인 전해 도금부를 형성하였다.Next, after degreasing and washing the aluminum carrier material on which the electroless plating part is formed, it is put into a plating bath containing an electrolytic copper plating composition (YMT Co., BJ Series), and 20 to 25 ℃ while applying a current density of 2 ASD. Electrolytic plating was performed for 35 minutes to form an electroplated portion having a thickness of 15 μm while having a plurality of opening holes having a diameter of about 350 μm.
그 다음, 무전해 도금부의 이형 역할을 통해 알루미늄 캐리어재에서 무전해 도금부와 전해 도금부를 분리하여 직경이 약 350 ㎛ 내외인 개구홀을 복수로 가지면서 두께가 15 ㎛인 천공 구리박을 제조하였다.Then, through the release role of the electroless plating part, the electroless plating part and the electrolytic plating part were separated from the aluminum carrier material, and a perforated copper foil having a thickness of 15 ㎛ having a plurality of opening holes with a diameter of about 350 ㎛ was manufactured. .
[실험예 1][Experimental Example 1]
실시예 1에서 제조된 천공 구리박을 주사전자현미경(TESCAN VEGA 4 LMS)으로 확인하였으며, 그 결과를 도 5에 나타내었다. The perforated copper foil prepared in Example 1 was confirmed with a scanning electron microscope (TESCAN VEGA 4 LMS), and the results are shown in FIG. 5 .
도 5를 참조하면 균일한 배열패턴을 갖는 복수의 개구홀이 형성된 천공 구리박(개구율: 30 %)이 얻어진 것을 확인할 수 있었다.Referring to FIG. 5 , it was confirmed that a perforated copper foil (opening ratio: 30%) having a plurality of opening holes having a uniform arrangement pattern was obtained.

Claims (11)

  1. 복수의 관통홀이 형성된 금속부; 및a metal part having a plurality of through holes; and
    상기 관통홀에 수지 조성물이 충진되어 형성된 관통홀충진부를 포함하는 천공 금속박 형성용 캐리어재.A carrier material for forming a perforated metal foil comprising a through-hole filling portion formed by filling the through-hole with a resin composition.
  2. 청구항 1에 있어서,The method of claim 1,
    상기 금속부가 알루미늄을 포함하는 것인 천공 금속박 형성용 캐리어재.A carrier material for forming a perforated metal foil in which the metal portion includes aluminum.
  3. 청구항 1에 있어서,The method of claim 1,
    상기 금속부의 두께가 10 내지 500 ㎛인 것인 천공 금속박 형성용 캐리어재.A carrier material for forming a perforated metal foil having a thickness of the metal portion of 10 to 500 μm.
  4. 청구항 1에 있어서,The method of claim 1,
    상기 수지 조성물은 25 ℃에서 점도가 400 내지 500 Ps인 에폭시계 수지 조성물인 것인 천공 금속박 형성용 캐리어재.The resin composition is a carrier material for forming a perforated metal foil that is an epoxy resin composition having a viscosity of 400 to 500 Ps at 25 °C.
  5. 청구항 1에 있어서,The method of claim 1,
    상기 관통홀의 직경이 10 ㎛ 이상인 것인 천공 금속박 형성용 캐리어재.A carrier material for forming a perforated metal foil having a diameter of 10 μm or more of the through hole.
  6. 청구항 1 내지 청구항 5 중 어느 한 항에 따른 천공 금속박 형성용 캐리어재; 및A carrier material for forming a perforated metal foil according to any one of claims 1 to 5; and
    복수의 개구홀을 갖는 금속박을 포함하고,Including a metal foil having a plurality of opening holes,
    상기 금속박은 무전해 도금부와 전해 도금부를 포함하며,The metal foil includes an electroless plating part and an electrolytic plating part,
    상기 복수의 개구홀의 배열패턴이 상기 캐리어재에 포함된 금속부에 형성된 복수의 관통홀의 배열패턴에 대응되는 것인 캐리어재 부착 천공 금속박.Perforated metal foil with a carrier material in which the arrangement pattern of the plurality of opening holes corresponds to the arrangement pattern of the plurality of through holes formed in the metal portion included in the carrier material.
  7. 청구항 6에 있어서,The method of claim 6,
    상기 금속박의 개구율이 5 내지 50 %인 것인 캐리어재 부착 천공 금속박.Perforated metal foil with a carrier material having an aperture ratio of 5 to 50% of the metal foil.
  8. 청구항 6에 있어서,The method of claim 6,
    상기 개구홀의 직경이 10 내지 500 ㎛이고,The diameter of the opening hole is 10 to 500 μm,
    상기 무전해 도금부의 두께가 0.1 내지 1 ㎛이며,The thickness of the electroless plating portion is 0.1 to 1 μm,
    상기 전해 도금부의 두께가 5 내지 30 ㎛인 것인 캐리어재 부착 천공 금속박.Perforated metal foil with a carrier material having a thickness of the electrolytic plating portion of 5 to 30 μm.
  9. 청구항 6에 따른 캐리어재 부착 천공 금속박에서 분리된 천공 금속박.Perforated metal foil separated from the perforated metal foil with a carrier material according to claim 6.
  10. 청구항 1 내지 청구항 5 중 어느 한 항에 따른 천공 금속박 형성용 캐리어재를 준비하는 단계;Preparing a carrier material for forming a perforated metal foil according to any one of claims 1 to 5;
    상기 캐리어재에 무전해 도금과 전해 도금을 순차적으로 진행하여 복수의 개구홀을 갖는 금속박을 형성하는 단계; 및forming a metal foil having a plurality of opening holes by sequentially performing electroless plating and electrolytic plating on the carrier material; and
    상기 캐리어재를 분리하는 단계를 포함하는 천공 금속박의 제조방법.Method for producing a perforated metal foil comprising the step of separating the carrier material.
  11. 청구항 10에 있어서,The method of claim 10,
    상기 캐리어재를 준비하는 단계는,Preparing the carrier material,
    제1 보호층, 제1 접착제층, 금속층, 제2 접착제층 및 제2 보호층이 순차적으로 적층된 베이스 자재를 준비하는 단계;Preparing a base material in which a first protective layer, a first adhesive layer, a metal layer, a second adhesive layer and a second protective layer are sequentially laminated;
    상기 베이스 자재에 복수의 베이스 관통홀을 형성하는 단계;Forming a plurality of base through-holes in the base material;
    상기 복수의 베이스 관통홀에 수지 조성물을 충진하는 단계; 및filling the plurality of base through-holes with a resin composition; and
    상기 제1 보호층, 상기 제1 접착제층, 상기 제2 접착제층 및 상기 제2 보호층을 제거하는 단계를 포함하는 것인 천공 금속박의 제조방법.The method of manufacturing a perforated metal foil comprising the step of removing the first protective layer, the first adhesive layer, the second adhesive layer and the second protective layer.
PCT/KR2022/012561 2021-08-23 2022-08-23 Carrier material for forming perforated metal foil, and perforated metal foil having carrier material attached thereon WO2023027473A1 (en)

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