KR100733525B1 - 상호 접속 조립체 및 방법 - Google Patents

상호 접속 조립체 및 방법 Download PDF

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Publication number
KR100733525B1
KR100733525B1 KR1020027001207A KR20027001207A KR100733525B1 KR 100733525 B1 KR100733525 B1 KR 100733525B1 KR 1020027001207 A KR1020027001207 A KR 1020027001207A KR 20027001207 A KR20027001207 A KR 20027001207A KR 100733525 B1 KR100733525 B1 KR 100733525B1
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KR
South Korea
Prior art keywords
delete delete
elastic contact
contact element
substrate
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020027001207A
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English (en)
Korean (ko)
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KR20020022139A (ko
Inventor
엘드릿지벤자민엔.
마씨우게이탄
Original Assignee
폼팩터, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/364,788 external-priority patent/US7435108B1/en
Application filed by 폼팩터, 인크. filed Critical 폼팩터, 인크.
Publication of KR20020022139A publication Critical patent/KR20020022139A/ko
Application granted granted Critical
Publication of KR100733525B1 publication Critical patent/KR100733525B1/ko
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
KR1020027001207A 1999-07-30 2000-07-28 상호 접속 조립체 및 방법 Expired - Fee Related KR100733525B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US36485599A 1999-07-30 1999-07-30
US09/364,855 1999-07-30
US09/364,788 1999-07-30
US09/364,788 US7435108B1 (en) 1999-07-30 1999-07-30 Variable width resilient conductive contact structures

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020077003992A Division KR100807426B1 (ko) 1999-07-30 2000-07-28 상호 접속 조립체 및 방법

Publications (2)

Publication Number Publication Date
KR20020022139A KR20020022139A (ko) 2002-03-25
KR100733525B1 true KR100733525B1 (ko) 2007-06-28

Family

ID=27002648

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020077003992A Expired - Fee Related KR100807426B1 (ko) 1999-07-30 2000-07-28 상호 접속 조립체 및 방법
KR1020027001207A Expired - Fee Related KR100733525B1 (ko) 1999-07-30 2000-07-28 상호 접속 조립체 및 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020077003992A Expired - Fee Related KR100807426B1 (ko) 1999-07-30 2000-07-28 상호 접속 조립체 및 방법

Country Status (6)

Country Link
EP (1) EP1208595A2 (enExample)
JP (1) JP2003506873A (enExample)
KR (2) KR100807426B1 (enExample)
AU (1) AU6385600A (enExample)
TW (1) TW518916B (enExample)
WO (1) WO2001009952A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230170345A (ko) 2022-06-10 2023-12-19 영진전자산업 주식회사 스핀들 미세조정장치를 구비한 pcb 챔퍼링 장치

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7247035B2 (en) 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7137830B2 (en) 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
US6888362B2 (en) 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
DE10143790B4 (de) * 2001-09-06 2007-08-02 Infineon Technologies Ag Elektronisches Bauteil mit wenigstens einem Halbleiterchip
US7010854B2 (en) 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
DE102008001038B4 (de) 2008-04-08 2016-08-11 Robert Bosch Gmbh Mikromechanisches Bauelement mit Schrägstruktur und entsprechendes Herstellungsverfahren
US10281648B2 (en) * 2013-07-30 2019-05-07 President And Fellows Of Harvard College Device support structures from bulk substrates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423401A (en) * 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
JPH05259584A (ja) * 1992-01-14 1993-10-08 Internatl Business Mach Corp <Ibm> 集積光デフレクタおよびその製造方法
JPH06213929A (ja) * 1993-01-19 1994-08-05 Sharp Corp 検査装置のプローブヘッドの製造方法および検査装置のプローブヘッド
JPH06260383A (ja) * 1993-03-03 1994-09-16 Nikon Corp 露光方法
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
JPH08306708A (ja) * 1995-05-09 1996-11-22 Sanyo Electric Co Ltd 半導体装置およびその製造方法
AU6377796A (en) * 1995-05-26 1996-12-11 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substra tes
JP3611637B2 (ja) * 1995-07-07 2005-01-19 ヒューレット・パッカード・カンパニー 回路部材の電気接続構造
JP3294084B2 (ja) * 1995-10-31 2002-06-17 沖電気工業株式会社 素子の実装構造及びその実装方法
JP3022312B2 (ja) 1996-04-15 2000-03-21 日本電気株式会社 プローブカードの製造方法
EP2058667A2 (en) * 1996-05-17 2009-05-13 FormFactor, Inc. Microelectronic spring contact element
JPH10303345A (ja) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd 半導体チップの基板への実装構造
WO1998052224A1 (en) * 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230170345A (ko) 2022-06-10 2023-12-19 영진전자산업 주식회사 스핀들 미세조정장치를 구비한 pcb 챔퍼링 장치

Also Published As

Publication number Publication date
KR20020022139A (ko) 2002-03-25
WO2001009952A3 (en) 2001-11-15
JP2003506873A (ja) 2003-02-18
AU6385600A (en) 2001-02-19
EP1208595A2 (en) 2002-05-29
KR100807426B1 (ko) 2008-02-25
KR20070043856A (ko) 2007-04-25
TW518916B (en) 2003-01-21
WO2001009952A2 (en) 2001-02-08

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