TW518916B - An contact element in an interconnect assemblies and a method for forming the same - Google Patents

An contact element in an interconnect assemblies and a method for forming the same Download PDF

Info

Publication number
TW518916B
TW518916B TW089115236A TW89115236A TW518916B TW 518916 B TW518916 B TW 518916B TW 089115236 A TW089115236 A TW 089115236A TW 89115236 A TW89115236 A TW 89115236A TW 518916 B TW518916 B TW 518916B
Authority
TW
Taiwan
Prior art keywords
contact element
patent application
item
substrate
beam portion
Prior art date
Application number
TW089115236A
Other languages
English (en)
Chinese (zh)
Inventor
Benjamin N Eldridge
Gaetan Mathieu
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/364,788 external-priority patent/US7435108B1/en
Application filed by Formfactor Inc filed Critical Formfactor Inc
Application granted granted Critical
Publication of TW518916B publication Critical patent/TW518916B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
TW089115236A 1999-07-30 2000-08-18 An contact element in an interconnect assemblies and a method for forming the same TW518916B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36485599A 1999-07-30 1999-07-30
US09/364,788 US7435108B1 (en) 1999-07-30 1999-07-30 Variable width resilient conductive contact structures

Publications (1)

Publication Number Publication Date
TW518916B true TW518916B (en) 2003-01-21

Family

ID=27002648

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089115236A TW518916B (en) 1999-07-30 2000-08-18 An contact element in an interconnect assemblies and a method for forming the same

Country Status (6)

Country Link
EP (1) EP1208595A2 (enExample)
JP (1) JP2003506873A (enExample)
KR (2) KR100733525B1 (enExample)
AU (1) AU6385600A (enExample)
TW (1) TW518916B (enExample)
WO (1) WO2001009952A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7247035B2 (en) 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7137830B2 (en) 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6939474B2 (en) 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
DE10143790B4 (de) * 2001-09-06 2007-08-02 Infineon Technologies Ag Elektronisches Bauteil mit wenigstens einem Halbleiterchip
US7010854B2 (en) 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
DE102008001038B4 (de) 2008-04-08 2016-08-11 Robert Bosch Gmbh Mikromechanisches Bauelement mit Schrägstruktur und entsprechendes Herstellungsverfahren
US10281648B2 (en) * 2013-07-30 2019-05-07 President And Fellows Of Harvard College Device support structures from bulk substrates
KR102655504B1 (ko) 2022-06-10 2024-04-11 영진전자산업 주식회사 스핀들 미세조정장치를 구비한 pcb 챔퍼링 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423401A (en) * 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
JPH05259584A (ja) * 1992-01-14 1993-10-08 Internatl Business Mach Corp <Ibm> 集積光デフレクタおよびその製造方法
JPH06213929A (ja) * 1993-01-19 1994-08-05 Sharp Corp 検査装置のプローブヘッドの製造方法および検査装置のプローブヘッド
JPH06260383A (ja) * 1993-03-03 1994-09-16 Nikon Corp 露光方法
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
JPH08306708A (ja) * 1995-05-09 1996-11-22 Sanyo Electric Co Ltd 半導体装置およびその製造方法
KR100252457B1 (ko) * 1995-05-26 2000-04-15 이고르 와이. 칸드로스 캔틸레버 요소및 희생기층을 사용하는 상호 접속요소의 제작방법
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3611637B2 (ja) * 1995-07-07 2005-01-19 ヒューレット・パッカード・カンパニー 回路部材の電気接続構造
JP3294084B2 (ja) * 1995-10-31 2002-06-17 沖電気工業株式会社 素子の実装構造及びその実装方法
JP3022312B2 (ja) * 1996-04-15 2000-03-21 日本電気株式会社 プローブカードの製造方法
EP0839322B1 (en) * 1996-05-17 2005-08-10 Formfactor, Inc. Microelectronic contact structure and method of making same
JPH10303345A (ja) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd 半導体チップの基板への実装構造
EP0985231A1 (en) * 1997-05-15 2000-03-15 Formfactor, Inc. Lithographically defined microelectronic contact structures
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices

Also Published As

Publication number Publication date
KR100733525B1 (ko) 2007-06-28
KR100807426B1 (ko) 2008-02-25
AU6385600A (en) 2001-02-19
WO2001009952A3 (en) 2001-11-15
EP1208595A2 (en) 2002-05-29
WO2001009952A2 (en) 2001-02-08
KR20070043856A (ko) 2007-04-25
JP2003506873A (ja) 2003-02-18
KR20020022139A (ko) 2002-03-25

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees