KR100732530B1 - 웨이퍼 수량 검사 장치 - Google Patents
웨이퍼 수량 검사 장치 Download PDFInfo
- Publication number
- KR100732530B1 KR100732530B1 KR1020010039480A KR20010039480A KR100732530B1 KR 100732530 B1 KR100732530 B1 KR 100732530B1 KR 1020010039480 A KR1020010039480 A KR 1020010039480A KR 20010039480 A KR20010039480 A KR 20010039480A KR 100732530 B1 KR100732530 B1 KR 100732530B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- light emitting
- light receiving
- wafers
- unit
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 15
- 238000012545 processing Methods 0.000 claims description 5
- 238000010835 comparative analysis Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 81
- 230000007257 malfunction Effects 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 abstract description 4
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000012552 review Methods 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004148 unit process Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (2)
- 적어도 하나의 웨이퍼(1)가 수납된 웨이퍼 카세트(210)와;상기 웨이퍼 카세트(210)에 수납된 웨이퍼(1) 전체가 인식되도록 실린더 구동에 의해 상승 또는 하강되는 복수 개의 발광 장치(225a,225b)가 포함되고, 상기 웨이퍼 카세트(210) 일측에 구비되는 발광부(220)와;상기 웨이퍼 카세트(210)를 사이에 두고 상기 발광부(220)와 마주보도록 대응되어 형성되며, 상기 발광 장치(225a,225b)와 대응되어 실린더 구동에 의해 상승 또는 하강되는 복수개의 수광 센서(235a,235b)가 구비된 수광부(230); 및상기 수광부(230)로부터 전달된 발광원의 펄스(pulse)를 비교 분석하는 비교 분석부 및 인터록(interlock) 장치가 구비된 중앙처리장치(240);를 포함하는 것을 특징으로 하는 웨이퍼 수량 검사 장치.
- 제 1항에 있어서, 상기 복수 개의 발광 장치(225a,225b)는 두 개가 상하 또는 좌우로 배열되고 상기 발광 장치(225a,225b)에 대응되도록 상기 수광 센서(235a,235b) 두 개가 상하 또는 좌우로 배열되는 것을 특징으로 하는 웨이퍼 수량 검사 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010039480A KR100732530B1 (ko) | 2001-07-03 | 2001-07-03 | 웨이퍼 수량 검사 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010039480A KR100732530B1 (ko) | 2001-07-03 | 2001-07-03 | 웨이퍼 수량 검사 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030003567A KR20030003567A (ko) | 2003-01-10 |
KR100732530B1 true KR100732530B1 (ko) | 2007-06-27 |
Family
ID=27713167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010039480A KR100732530B1 (ko) | 2001-07-03 | 2001-07-03 | 웨이퍼 수량 검사 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100732530B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102025421B1 (ko) * | 2018-04-11 | 2019-09-26 | 주식회사 오라컴 | 플렉시블 회로기판 오버랩 검사 장치 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007040379A1 (en) * | 2005-10-06 | 2007-04-12 | Jinoid Co., Ltd. | Apparatus for sensing glass substrates in a cassette |
KR100892610B1 (ko) * | 2005-10-06 | 2009-04-08 | 주식회사 지노이드 | 카세트내의 기판 유무 검사 장치 |
CN113192872B (zh) * | 2021-04-29 | 2022-05-27 | 长鑫存储技术有限公司 | 晶圆盒、晶圆传送系统及晶圆传送方法 |
US20220351996A1 (en) * | 2021-04-29 | 2022-11-03 | Changxin Memory Technologies, Inc. | Front opening unified pod, wafer transfer system and wafer transfer method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07245270A (ja) * | 1994-03-07 | 1995-09-19 | Shinko Electric Co Ltd | ウェ−ハ取り残し検知システムを有するcvd装置 |
JP2688554B2 (ja) * | 1992-01-22 | 1997-12-10 | 株式会社日立製作所 | ウェハ異常検知装置及びウェハ検査方法 |
-
2001
- 2001-07-03 KR KR1020010039480A patent/KR100732530B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2688554B2 (ja) * | 1992-01-22 | 1997-12-10 | 株式会社日立製作所 | ウェハ異常検知装置及びウェハ検査方法 |
JPH07245270A (ja) * | 1994-03-07 | 1995-09-19 | Shinko Electric Co Ltd | ウェ−ハ取り残し検知システムを有するcvd装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102025421B1 (ko) * | 2018-04-11 | 2019-09-26 | 주식회사 오라컴 | 플렉시블 회로기판 오버랩 검사 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20030003567A (ko) | 2003-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8749773B2 (en) | Method and apparatus for testing light-emitting device | |
US8902428B2 (en) | Process and apparatus for measuring the crystal fraction of crystalline silicon casted mono wafers | |
US3814946A (en) | Method of detecting defects in transparent and semitransparent bodies | |
KR100863140B1 (ko) | 반도체 웨이퍼의 이물 검사 및 리페어 시스템과 그 방법 | |
CN101542707A (zh) | 半导体器件的检查方法与半导体器件的检查装置 | |
KR100732530B1 (ko) | 웨이퍼 수량 검사 장치 | |
US3479514A (en) | Method and means for inspecting glass articles | |
CN112229857A (zh) | 半导体检测装置及检测方法 | |
KR101380700B1 (ko) | 태양 전지 모듈을 구비한 발광소자 측정 장치 및 측정 방법 | |
US6992499B2 (en) | Test method and test apparatus for semiconductor device | |
US7350406B2 (en) | Sensor chip breaking strength inspection apparatus and sensor chip breaking strength inspection method | |
CN102788769A (zh) | 晶圆检测装置及使用其的晶圆检测方法 | |
KR20190020589A (ko) | 다중 방식의 제품 검사시스템 | |
US8389926B2 (en) | Testing apparatus for light-emitting devices with a design for a removable sensing module | |
US11927526B2 (en) | Method and system for detecting cleanliness in cavity of target device | |
US6342704B1 (en) | Method and apparatus for detecting nitride residue on semiconductor wafers | |
KR20070087407A (ko) | 평판표시패널의 자동광학검사장치 및 자동광학검사방법 | |
KR100787742B1 (ko) | 프로브 카드 인식장치 및 이를 이용한 프로브 카드인식방법 | |
JPS62136041A (ja) | ウエハプロ−バ | |
KR970003750A (ko) | 반도체의 생산 방법 및 그 제조설비 | |
KR100953341B1 (ko) | 반도체 제조용 웨이퍼 검사장치 | |
JPS58744A (ja) | 瓶類の検査方法 | |
KR19980039352A (ko) | 반도체 제조공정용 웨이퍼장착 감지장치 | |
CN103645692A (zh) | 晶圆作业控制系统 | |
JPH04159551A (ja) | 異物検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20010703 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20060703 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20010703 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20070331 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20070619 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20070620 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20070621 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20100528 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20110531 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20110531 Start annual number: 5 End annual number: 5 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |