KR100721925B1 - 열전모듈의 제조 방법 - Google Patents
열전모듈의 제조 방법 Download PDFInfo
- Publication number
- KR100721925B1 KR100721925B1 KR1020050126629A KR20050126629A KR100721925B1 KR 100721925 B1 KR100721925 B1 KR 100721925B1 KR 1020050126629 A KR1020050126629 A KR 1020050126629A KR 20050126629 A KR20050126629 A KR 20050126629A KR 100721925 B1 KR100721925 B1 KR 100721925B1
- Authority
- KR
- South Korea
- Prior art keywords
- thermoelectric
- thermoelectric module
- electrode
- manufacturing
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
| 구성 | 전기저항(Ω) | |
| 비교예 1 | 열전소자 / Ag 페이스트 | 0.29 |
| 비교예 2 | 열전소자 / Ag 페이스트 / 전도성 본드 | 0.39 |
| 비교예 3 | 열전소자 / 전도성 본드 | 0.43 |
| 발명예 1 | 열전소자 / Au 스퍼터링 / Ag 페이스트 | 0.013 |
| 발명예 2 | 열전소자 / Au 스퍼터링 / Ag 페이스트 / 전도성 본드 | 0.013 |
| 발명예 3 | 열전소자 / Ni 전기도금 / Ag 페이스트 | 0.02 |
Claims (2)
- 열전모듈의 제조 방법에 있어서,열전모듈의 저온부 전극 접합시 열전소자와 전극 사이에 치밀하고 연속적인 도전층(ohmic contact layer)을 형성하고, 도전성 접착제를 사용하여 상기 전극에 외부단자를 연결하는 것을 특징으로 하는 열전모듈의 제조 방법.
- 제 1 항에 있어서,상기 도전층은 Au층, Ni층 중 어느 하나로 이루어진 것을 특징으로 하는 열전모듈의 제조 방법.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050126629A KR100721925B1 (ko) | 2005-12-21 | 2005-12-21 | 열전모듈의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050126629A KR100721925B1 (ko) | 2005-12-21 | 2005-12-21 | 열전모듈의 제조 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100721925B1 true KR100721925B1 (ko) | 2007-05-28 |
Family
ID=38278242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050126629A Expired - Fee Related KR100721925B1 (ko) | 2005-12-21 | 2005-12-21 | 열전모듈의 제조 방법 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100721925B1 (ko) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990067520A (ko) * | 1996-12-24 | 1999-08-25 | 이마이 키요스케 | 열전소자및그제조방법 |
| JP2002246658A (ja) * | 2001-02-21 | 2002-08-30 | Toyo Kohan Co Ltd | Zn−Sb系熱電材料の接合方法および接合体 |
| JP2004014766A (ja) * | 2002-06-06 | 2004-01-15 | Yamaha Corp | 熱電モジュール |
| JP2004296901A (ja) * | 2003-03-27 | 2004-10-21 | Yamaha Corp | 熱電モジュール |
| KR20050066337A (ko) * | 2003-12-26 | 2005-06-30 | 엘지전자 주식회사 | 열전모듈의 제조방법 |
-
2005
- 2005-12-21 KR KR1020050126629A patent/KR100721925B1/ko not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990067520A (ko) * | 1996-12-24 | 1999-08-25 | 이마이 키요스케 | 열전소자및그제조방법 |
| JP2002246658A (ja) * | 2001-02-21 | 2002-08-30 | Toyo Kohan Co Ltd | Zn−Sb系熱電材料の接合方法および接合体 |
| JP2004014766A (ja) * | 2002-06-06 | 2004-01-15 | Yamaha Corp | 熱電モジュール |
| JP2004296901A (ja) * | 2003-03-27 | 2004-10-21 | Yamaha Corp | 熱電モジュール |
| KR20050066337A (ko) * | 2003-12-26 | 2005-06-30 | 엘지전자 주식회사 | 열전모듈의 제조방법 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7601909B2 (en) | Power generation method using thermoelectric element, thermoelectric element and fabrication method thereof, and thermoelectric device | |
| EP1835551B1 (en) | Thermoelectric conversion module, heat exchanger using same, and thermoelectric power generating system | |
| CN100508232C (zh) | 热电转换器 | |
| WO2007105361A1 (ja) | 電子部品モジュール | |
| US7449628B2 (en) | Electric power generation method using thermoelectric power generation element, thermoelectric power generation element and method of producing the same, and thermoelectric power generation device | |
| CN111261767A (zh) | 一种碲化铋基热电元件及其制备方法 | |
| JP2004273489A (ja) | 熱電変換モジュール及びその製造方法 | |
| JP2007103580A (ja) | 熱電変換素子及びその製造方法 | |
| JP5669103B2 (ja) | 熱電薄膜デバイス | |
| JP2003179273A (ja) | 熱電変換装置 | |
| JP3472593B2 (ja) | 熱電装置 | |
| CN110976863B (zh) | 铬镍系奥氏体不锈钢合金用于热电材料电极的应用及Mg3Sb2热电接头 | |
| WO2006043402A1 (ja) | 熱電変換モジュール | |
| JP3482094B2 (ja) | 熱電変換素子用熱応力緩和パッド及び熱電変換素子 | |
| JPH09172204A (ja) | 熱電変換装置およびその製造方法 | |
| KR101266449B1 (ko) | 열전모듈의 제조방법 | |
| JPH0485973A (ja) | 熱電発電装置 | |
| JP3573448B2 (ja) | 熱電変換素子 | |
| JPH1168172A (ja) | シリコン−ゲルマニウム系材料の接合方法および熱電変換モジュールの製造方法ならびに熱電変換モジュール | |
| WO1995017020A1 (en) | Thermoelectric conversion element, thermoelectric conversion element array, and thermal displacement converter | |
| JP2000091650A (ja) | 高温度熱電変換素子 | |
| JP2002076448A (ja) | 熱電素子 | |
| JP5176609B2 (ja) | 熱発電デバイス素子 | |
| JP3056047B2 (ja) | 熱電変換素子用熱応力緩和パッド及び熱電変換素子 | |
| JP3007904U (ja) | 熱電池 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20100518 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20110517 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20120517 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| FPAY | Annual fee payment |
Payment date: 20130516 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20140519 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20150513 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20160518 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20170517 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20180516 Year of fee payment: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| FPAY | Annual fee payment |
Payment date: 20190514 Year of fee payment: 13 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| FPAY | Annual fee payment |
Payment date: 20200514 Year of fee payment: 14 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20220519 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20220519 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |