KR100711705B1 - 원활한 가스빼기 구조를 갖는 다이캐스팅용 금형 - Google Patents
원활한 가스빼기 구조를 갖는 다이캐스팅용 금형 Download PDFInfo
- Publication number
- KR100711705B1 KR100711705B1 KR1020050100187A KR20050100187A KR100711705B1 KR 100711705 B1 KR100711705 B1 KR 100711705B1 KR 1020050100187 A KR1020050100187 A KR 1020050100187A KR 20050100187 A KR20050100187 A KR 20050100187A KR 100711705 B1 KR100711705 B1 KR 100711705B1
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- cavity
- side mold
- vent
- die casting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/14—Machines with evacuated die cavity
- B22D17/145—Venting means therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/2015—Means for forcing the molten metal into the die
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/02—Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
- B22D21/04—Casting aluminium or magnesium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
Description
Claims (4)
- 주조제품 형상의 캐비티를 갖는 고정측 금형 및 가동측 금형을 포함하며, 게이트를 통해 알루미늄 합금 용탕을 캐비티내에 주입하도록 구성되며, 상기 고정측 금형과 상기 가동측 금형이 서로 밀착되는 밀착면의 어느 한 일면에 상기 캐비티내의 가스를 외부로 빼기 위한 벤트를 구비한 다이캐스팅용 금형에 있어서,상기 벤트는 상기 고정측 금형과 상기 가동측 금형간의 충분한 체결력을 제공할 수 있는 밀착면을 갖는 다수개의 철(凸)부와, 상기 다수개의 철(凸)부 사이사이에 위치하여 상기 캐비티내의 가스를 외부로 원활하게 빼는 공간을 제공하는 다수개의 요(凹)부를 구비하되, 상기 요(凹)부 끼리는 서로 연통되어 상기 캐비티와 외부가 서로 연통되도록 구성된 것을 특징으로 하는 원활한 가스빼기 구조를 갖는 다이캐스팅용 금형.
- 청구항 1에 있어서,상기 요(凹)부 및 철(凸)부는 반복적으로 배열되는 바둑판 형태를 이루는 것을 특징으로 하는 원활한 가스빼기 구조를 갖는 다이캐스팅용 금형.
- 청구항 1에 있어서,상기 요(凹)부 및 철(凸)부는 상기 캐비티의 테두리와 평행하게 다열로 배열되며, 열간에는 기다란 연통홈이 형성되는 것을 특징으로 하는 원활한 가스빼기 구 조를 갖는 다이캐스팅용 금형.
- 청구항 2 또는 청구항 3에 있어서,상기 벤트는 탕구가 설치되는 부분을 제외한 3곳의 측부에 형성되는 것을 특징으로 하는 원활한 가스빼기 구조를 갖는 다이캐스팅용 금형.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050100187A KR100711705B1 (ko) | 2005-10-24 | 2005-10-24 | 원활한 가스빼기 구조를 갖는 다이캐스팅용 금형 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050100187A KR100711705B1 (ko) | 2005-10-24 | 2005-10-24 | 원활한 가스빼기 구조를 갖는 다이캐스팅용 금형 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100711705B1 true KR100711705B1 (ko) | 2007-04-25 |
Family
ID=38182394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050100187A Expired - Fee Related KR100711705B1 (ko) | 2005-10-24 | 2005-10-24 | 원활한 가스빼기 구조를 갖는 다이캐스팅용 금형 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100711705B1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9024448B2 (en) | 2012-07-17 | 2015-05-05 | Samsung Electronics Co., Ltd. | Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000301313A (ja) | 1999-04-26 | 2000-10-31 | Denso Corp | 成形用金型 |
| KR20050013651A (ko) * | 2002-07-03 | 2005-02-04 | 가부시키가이샤 도요다 지도숏키 | 다이 캐스팅용 금형 |
| KR20060072431A (ko) * | 2004-12-23 | 2006-06-28 | 제일정공 주식회사 | 성형용 금형 |
-
2005
- 2005-10-24 KR KR1020050100187A patent/KR100711705B1/ko not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000301313A (ja) | 1999-04-26 | 2000-10-31 | Denso Corp | 成形用金型 |
| KR20050013651A (ko) * | 2002-07-03 | 2005-02-04 | 가부시키가이샤 도요다 지도숏키 | 다이 캐스팅용 금형 |
| KR20060072431A (ko) * | 2004-12-23 | 2006-06-28 | 제일정공 주식회사 | 성형용 금형 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9024448B2 (en) | 2012-07-17 | 2015-05-05 | Samsung Electronics Co., Ltd. | Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor package |
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