KR100710006B1 - A metalic pattern device for semiconductor - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mold apparatus, and prevents damage such as bending of a lead of a semiconductor package due to a foreign matter placed on the lead of the semiconductor package when removing a slug of a trimmed semiconductor package. The slug can be effectively removed.

To this end, the present invention, the lower holder, the upper holder is installed to be able to move up and down on the upper side of the lower holder, the trimming punch is installed in the upper holder and punching a predetermined portion of the lead frame on the lower holder and And a slug removing punch installed in the upper holder and removing a slug caught between the leads of the lead frame after the trimming operation by the trimming punch, wherein the slug removing punch is the upper holder. A retainer fixed to the at least one slug removal member installed at the retainer so as to be movable up and down a predetermined distance, and having a lower end thereof contacting the slug of the lead frame to remove the slug, and each slug removing member with respect to the retainer. It characterized in that it comprises an elastic member for supporting the individual shot Provides a semiconductor mold apparatus.

Semiconductor, mold equipment, trimming, punch, dambar, slug, slug

Description

A metalic pattern device for semiconductor

1 is a plan view showing the structure of a semiconductor package on a typical lead frame

2 is a sectional view showing the main parts of a conventional semiconductor mold apparatus;

3 and 4 are enlarged views of the portion A of FIG. 2, and a cross-sectional view of the main parts sequentially showing a slug removing operation performed by a slug removing punch in the semiconductor mold apparatus.

Fig. 5 is a sectional view showing the main parts of a semiconductor mold apparatus having a slug removing punch according to the present invention.

6 and 7 are an exploded perspective view showing an embodiment of a slug removal punch according to the present invention

8 is a cross-sectional view taken along line I-I of FIG. 7, with a slug removing punch coupled thereto. FIG.

9 is an enlarged view of a portion B of FIG. 5;

FIG. 10 is an enlarged view of a portion C of FIG. 9, showing that a slug removing operation is performed by the slug removing punch of the present invention.

11 is a sectional view showing the principal parts of another embodiment of a slug removing punch according to the present invention;

12 is an exploded perspective view showing another embodiment of the slug removal punch according to the present invention.

13 is a sectional view of principal parts of a semiconductor mold apparatus to which another embodiment of a slug removing punch according to the present invention is applied.

FIG. 14 is an exploded perspective view showing the structure of the slug removing punch of FIG.

15 is an exploded perspective view showing the structure of another embodiment of the slug removing punch of FIG.

FIG. 16 is an exploded perspective view showing the structure of still another embodiment of the slug removing punch of FIG.

Explanation of symbols on the main parts of the drawings

40: trimming punch 500: slug removal punch

510: retainer 512: spring insertion hole

514: insertion hole 516: air guide groove

520: slug removal member 521: protrusion

522: spring seating groove 523: stopper

540: Retainer Cover 545: Bolt

546: pneumatic connection hole 60: pneumatic line

LF: Leadframe P: Semiconductor Package

L: Lead D: Dambar

S: Slug J: Junk

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mold apparatus, and more particularly, to a slug removing punch of a semiconductor mold apparatus that removes slugs between leads immediately after trimming when trimming is performed during a semiconductor package manufacturing process. It is about.

In general, a semiconductor mold apparatus includes a trimming mold apparatus for removing a dam bar, a forming mold apparatus for cutting and molding a lead of a lead frame, and a singulation mold apparatus for separating a semiconductor package from a main body.

FIG. 1 of the accompanying drawings shows a structure of a semiconductor package on a lead frame, and a dam bar D for interconnecting the leads L of each semiconductor package P is formed on the lead frame. A trimming mold apparatus of the semiconductor mold apparatus serves to perform a trimming operation by punching and cutting the dam bar D of the lead frame.

An example of such a conventional semiconductor trimming mold apparatus will be described with reference to FIGS. 2 to 4 as follows.

The conventional trimming mold apparatus includes a lower holder 10 placed on a base, and an upper holder 20 detachably coupled to a lifting block (not shown) which is installed at an upper end of a press rod (not shown) and moves up and down. do.

The lower holder 10 is mounted on the lower holder body 11 which is placed and fixed to the base, the die holder housing 12 fixed to the upper surface of the lower holder body 11, and the die holder housing 12. The die holder reinforcing plate 131 is fixed, and the die holder 132 is mounted on the upper surface of the die holder reinforcing plate 131 is fixed. A plurality of dies 15 are firmly fixed to the die holder 132.

The lower fixing plate 14 is coupled to both side surfaces of the die holder housing 12, the die holder reinforcing plate 131, and the die holder 132.

In addition, the upper holder 20 is coupled to the lifting block (not shown) and the upper and lower holder body 21 to move up and down, and the punch holder housing 22 fixed to the bottom of the upper holder body 21 and , The punch holder reinforcing plate 231 is sequentially coupled to the bottom of the punch holder housing 22, and a punch holder 232. The upper fixing plate 24 is coupled to both sides of the punch holder housing 22, the punch holder reinforcing plate 231, and the punch holder 232.

The die holder reinforcing plate 131 and the die holder 132 are referred to as a lower module 13, and the punch holder reinforcing plate 231 and the punch holder 232 are referred to as an upper module 23. When the type of lead frame is replaced, the lower module 13 and the upper module 23 are replaced with ones corresponding to the corresponding lead frame.

The punch holder 232 is fixed to the trimming punch 40 and the slug removal punch 50 for cutting the lead frame at a position corresponding to the die 15. The trimming punch 40 performs a trimming operation of removing the dam bar D (refer to FIG. 1) of the lead frame, and the slug removing punch 50 performs the trimming punch and the dam bar after trimming. The dambar is attached to the trimming punch by pressing, so that the dambar does not fall after cutting, and the dambar was cut again when the trimming punch was raised, that is, the dambar (so-called slug). ')' Function.

In addition, a punch guide pin 28 is installed in the punch holder 232, and the punch guide pin 28 is inserted into the die holder 132, the die holder reinforcing plate 131, and the die holder housing 12. Guide holes 16 are guided while being formed.

The stripper holder 30 is coupled to the lower portion of the punch holder 232 so as to be movable upward and downward with respect to the punch holder 232, and is elastically supported downward by a spring (not shown). When the trimming punch 40 cuts the dam bar of the leadframe, the stripper 35 serving to guide the trimming punch 40 to fix the leadframe is fixed.

Here, the trimming punch 40 and the slug removal punch 50 are slid freely up and down while being guided through the holes formed in the stripper holder 30 and the stripper 35, and the punch guide pin ( 28) It is also able to slide up and down through the stripper holder 30.

The conventional mold apparatus configured as described above operates as follows.

When the lead frame LF in which the plurality of semiconductor packages P are formed is transferred along a plotter (not shown) constituting the transfer device and aligned at the punching position, the upper holder 20 and the press holder (not shown), Trimming punch 40 and stripper 35 are lowered together.

When the upper holder 20 continues to descend and the upper and lower stoppers (not shown) contact each other, the stripper 35 and the stripper holder 30 stop at this position in a state close to the upper surface of the lead frame. At this time, since the stripper holder 30 is elastically supported by the upper holder body 21 by a spring (not shown), when the upper holder 20 continues to descend, the trimming punch 40 is stripper ( It descends through the hole of 35 to cut the dam bar of the lead frame LF placed on the die 15.

After the trimming punch 40 cuts the dam bar of the lead frame LF, the trimming punch 40 is raised along the hole of the stripper 35 by the lifting of the upper holder 20, and then the stripper 35. Will also rise.

Subsequently, the lead frame LF is moved by one step by the operation of the plotter (not shown) so that the trimmed semiconductor package P is positioned below the slug removing punch 50.

Then, as described above, the upper holder 200 descends again to push and remove the slug S sandwiched between the sled removing punch 50 and the trimmed lead.

After that, the lead frame LF is transferred to the vision inspection apparatus, and the lead frame LF is inspected after the trimming operation.

However, when the slug removal punch 50 removes the slug after the trimming operation as described above, when the foreign matter J accumulates on the lead L of the semiconductor package as shown in FIG. The lead L of the lead frame is bent downward due to the load of the punch 50, or scratches are generated in the lead. In particular, when the lead is bent, there is a problem such as cracking in the semiconductor package.

More specifically, the slug removal punch 50 of the conventional semiconductor trimming mold apparatus is integrally formed so as to remove slugs of four sides of the semiconductor package and is fixed to the upper holder 20. . Therefore, when the slug removal punch 50 descends and the foreign matter J is present on the lead L of the semiconductor package P when the slug is removed, the lower end of the slug removal punch 50 removes the foreign matter. At this time, the load of the slug removal punch 50 is transmitted to the lead as it is, and a problem such as bending of the lead occurs.

Of course, when the slug removal punch 50 is elastically supported on the upper holder 20 with an elastic body such as a spring, the load transmitted to the lead of the semiconductor package may be reduced, but in this case, the slug removal punch ( 50) Since its own load is transmitted to the lead, deformation of the lead, such as bending, cannot be prevented at the source.

In addition, in the conventional slug removal punch 50, the slug removal punch 50 is inclined to one side when one of the above problems occurs, and at this time, the slug removal punch 50 is formed in the upper holder. There was also a problem that the slug removal failure occurs after being caught in the inner wall of the installation space.

The present invention is to solve the above problems, an object of the present invention is that the lead of the semiconductor package is bent due to the foreign matter (junk) placed on the lead of the semiconductor package when removing the slug of the trimmed semiconductor package It is to provide a slug removal punch of a semiconductor mold apparatus that can prevent damage such as occurrence of the sludge and can effectively remove slugs.

According to an aspect of the present invention for achieving the above object, the semiconductor mold apparatus of the present invention comprises a lower holder seated on the upper lead frame; An upper holder installed up and down relative to the lower holder; A trimming punch installed at the upper holder to cut a predetermined portion of the lead frame; In addition, at least one side is provided at each side of the retainer provided in the upper holder to remove slugs caught between the leads of the lead frame after the trimming operation by the trimming punch. And a slug removing member for removing the slug of the lead frame, and an elastic member interposed between one end of the retainer and one side of the slug removing member to support the slug removing member individually in the moving direction of the slug removing member. do.

Preferably it further comprises a retainer cover that is fixed to the upper portion of the retainer to support the upper portion of the elastic member.
The size of the elastic force of the elastic member is characterized in that it is within the range to remove the slug without applying deformation to the lead of the lead frame.
The retainer is characterized in that the insertion hole through which the slug removing member penetrates is formed to be stepped, and a stopper is formed on the upper end of the slug removing member to restrict the downward movement of the slug removing member to the stepped portion of the insertion hole. .
An air guide groove formed to communicate from the upper side to the lower side between the surface where the retainer and the slug removing member are in contact with each other is installed to be connected to the air guide groove in the retainer, so that the slug can be removed before the slug removing member approaches. It characterized in that it further comprises a pneumatic line for supplying air toward the lead frame through the air guide groove.
The air guide groove is characterized in that formed in the form extending to the outside toward the lower end.
According to another aspect of the present invention, a semiconductor mold apparatus includes a lower holder on which a lead frame is mounted; An upper holder installed up and down relative to the lower holder; A trimming punch installed at the upper holder to cut a predetermined portion of the lead frame; And a retainer provided in the upper holder and a retainer provided in the upper holder to remove slugs between the leads of the lead frame after trimming by the trimming punch. It is characterized in that it further comprises an air injection unit for injecting air to remove the slug of the lead frame when approaching.

Hereinafter, preferred embodiments of the semiconductor mold apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

For reference, for the sake of understanding, the same reference numerals are given to the same parts of the structure of the semiconductor mold apparatus in the related art, and the detailed description thereof will be omitted.

First, Figure 5 shows the overall configuration of a semiconductor mold apparatus having a slug removal punch according to the present invention, the semiconductor mold apparatus of the present invention includes a lower holder 10 and an upper holder 20 placed on the base do.

The lower holder 10 includes a lower holder body 11, a die holder housing 12, a die holder reinforcing plate 131, a die holder 132, and a lower fixing plate 14. A plurality of dies 15 are firmly fixed to the die holder 132.

The upper holder 20 includes an upper holder body 21, a punch holder housing 22, a punch holder reinforcing plate 231, a punch holder 232, and an upper fixing plate 24.

A trimming punch 40 and a slug removing punch 500 are fixed to the upper holder 20 to perform trimming of the lead frame at a position corresponding to the die 15. The trimming punch 40 performs a trimming operation of removing the dam bar D (see FIG. 1) of the lead frame, and the slug removing punch 50 is a slug that is caught between the leads after trimming. It functions to remove slugs.

In addition, a punch guide pin 28 is installed in the punch holder 232, and the punch guide pin 28 is inserted into the die holder 132, the die holder reinforcing plate 131, and the die holder housing 12. Guide holes 16 are guided while being formed.

The stripper holder 30 is coupled to the lower portion of the punch holder 232 so as to be movable upward and downward with respect to the punch holder 232, and is elastically supported downward by a spring (not shown). When the trimming punch 40 cuts the dam bar of the lead frame, the stripper 35 which fixes the lead frame is fixed.

Here, the trimming punch 40 and the slug removing punch 500 slide freely up and down while being guided through holes formed in the stripper holder 30 and the stripper 35.

6 to 8, the slug removing punch 500 has a rectangular parallelepiped retainer 510 (retainer) having an area larger than the lower part, and four sides of the retainer 510. Four slug removing members 520 are installed to be movable up and down, four springs 530 elastically supporting the upper portions of the respective slug removing members 520, and upper portions of the springs 530. The retainer cover 540 is coupled to the upper surface of the slug removing member 520 and is fixed to the punch holder reinforcing plate 231 of the upper holder 20 (see FIG. 5).

The retainer 510 is formed such that the insertion hole 514 into which the slug removing member 520 is inserted is penetrated from the upper portion to the lower portion. A stepped portion 515 is formed on the inner wall of the insertion hole 514 to be stepped.

In addition, a spring insertion hole 512 into which the spring 530 is inserted is formed in communication with the insertion hole 514 at the center of each side of the retainer 510.

In addition, the slug removing member 520 is formed in a plate shape, and at the lower end thereof, protrusions 521 for removing slugs S are inserted at intervals between the leads L of the semiconductor package P on the lead frame. Are arranged.

In addition, a spring seating groove 522 in which the spring 530 is seated is formed at an upper end of each slug removing member 520, and insertion holes of the retainer 510 are formed at both sides of the spring seating recess 522. The stopper 523 which limits the downward movement of the slug removal member 520 by being caught by the step part 515 of 514 is formed stepped.

The spring 530 is a compression coil spring, the elastic force is used to the size enough to remove the slug sandwiched between the leads (L) without deforming the lead (L) of the semiconductor package (P). This is preferred.

A fastening hole 542 is formed in the center of the retainer cover 540, and a fastening hole 518 corresponding to the fastening hole 542 is formed in the center of the upper end of the retainer 510. The retainer cover 540 is fixed to the retainer 510 by fastening the bolt 545 through the 542 and 518.

On the other hand, as shown in Figure 9, the retainer 510 of the slug removal punch 500 is the retainer cover 540 by a fastening means such as a bolt (not shown) to the punch holder reinforcement plate 231 It is fixed to the inside of the punch holder 232 by being fixed.

And, each of the slug removal member 520 is supported by the stripper 35 so as to move both sides and the outer surface.

The slug removal punch 500 configured as described above operates as follows.

When the lead frame LF is conveyed along the plotter (not shown) constituting the conveying device and aligned at the punching position, the upper holder 20 and the trimming punch 40 fixed thereto are lowered by the press device (not shown). The trimming operation of cutting the dam bar D (see FIG. 1) of the lead frame LF is performed.

Subsequently, the upper holder 20 is raised again, and the lead frame LF is moved by one step by a plotter (not shown) so that the trimmed portion is aligned with the lower portion of the slug removing punch 500.

Then, the upper holder 20 and the slug removal punch 500 fixed thereto are lowered by the operation of the press apparatus (not shown). At this time, the stripper 35 is also lowered and stopped immediately above the lead frame LF, the slug removal punch 500 continues to descend.

When the slug removing punch 500 descends, the slug removing member 520 is lowered while both sides and the outer surface thereof are guided by the stripper 35. The slug removing member 520 pushes the slug S while the protrusions 521 of the lower end thereof enter between the leads L.

However, as shown in FIG. 10, when the foreign matter J is present on the lead L of one side of the semiconductor package P, the lower end of the slug removing member 520 corresponding to the foreign matter ( The slug removal member 520 that is in contact with the foreign matter (J) cannot be lowered any more while touching J), and moves upward. At this time, since the elastic force of the spring 530 elastically supporting the slug removing member 520 is large enough not to deform the lead L, deformation such as bending of the lead L does not occur.

On the other hand, the lead frame is trimmed and slug removed in the mold apparatus as described above is conveyed to the vision inspection device is inspected whether the trimming operation is made correctly. When the foreign matter J is detected in the lid L of the semiconductor package P during this inspection process, the worker takes necessary measures such as removing the foreign matter of the semiconductor package.

In addition, as illustrated in FIG. 11, the operator immediately detects the rise of the slug removing member 520 due to the foreign matter in the aforementioned slug removing process before detecting the foreign matter J of the lid L in the vision inspection apparatus. You might want to take action.

That is, the sensor 550 is installed at one side of the insertion hole 514 of the retainer 510 to detect the upper end of the slug removing member 520, when the slug removing member 520 is raised. By detecting the upper end of the slug removal member 520 can detect that the slug removal member 520 has been raised by the foreign matter, it can be delivered to the operator by an external display device or sound, so that appropriate measures can be taken.

The sensor 550 may be configured using a non-contact sensor or a contact sensor such as a proximity sensor or an optical sensor.

And, Figure 12 shows another embodiment of the slug removal punch according to the present invention, the slug removal punch of this embodiment is formed of a plurality of retainers integrally to form one retainer 510, each retainer 510 The plurality of slug removal members 520 are configured to be movable up and down individually. Of course, each slug removal member 520 is elastically supported by the spring 530 individually.

In addition, a retainer cover 540 is fixed to the upper portion of the integrated retainer 510 by a bolt 545 to cover and fix the entire upper surface of the retainer at one time.

Typically, since a plurality of semiconductor packages are arranged in a plurality of rows in one lead frame, a plurality of trimming punches and slug removal punches are mounted in one mold apparatus. Therefore, when the plurality of retainers are integrally formed as described above, the slug removal punch 500 can be fixed to the upper holder 20 (see FIG. 5) at a time, so assembling is easy and assembly tolerance is reduced. It also has the advantage of improving the accuracy of the work.

On the other hand, as shown in Figure 13, by connecting the pneumatic line 60 to the slug removal punch 500, when performing the slug removal operation with the slug removal punch 500 in the slug removal punch 500 Injecting air of a predetermined pressure toward the lead frame LF, thereby removing slug and foreign matter on the lid L (see FIG. 10) before the slug removal punch 500 reaches the lid L. FIG. You can also make sure this is done.

14 shows one embodiment of a slug removal punch 500 for injecting such air. The slug removal punch 500 of this embodiment is the same as the slug removal punch 500 shown in FIG. 12 in a basic configuration. However, the slug removal punch 500 of this embodiment has an air guide groove 516 extending from the upper side to the lower side so that air can flow to the outer surface of the retainer 510 to which the slug removing member 520 is connected. The retainer cover 540 has a structure in which a pneumatic coupling hole 546 is formed to communicate with each spring insertion hole 512.

The air guide groove 516 is in communication with the spring insertion hole 512 to remove the slug before the slug removal member 520, the pneumatic connecting hole 546 is an external pneumatic line 60 ( 13). Therefore, the air supplied through the external pneumatic line 60 is injected into the lower end of the retainer 510 through the pneumatic connection hole 546, the spring insertion hole 512 and the air guide groove 516 lead (L) The slug (S) on the (see FIG. 10) is removed in advance, and if foreign matter (J) is present on the lead, this foreign matter can also be removed.

On the other hand, the air guide groove 516 is preferably made of a form that gradually extends from the upper side to the lower side. This is to induce and spray the air supplied from the middle of the retainer 510 evenly to the entire region of the lid (L).

At this time, the form in which the air guide groove 516 is expanded may be formed as a straight line, as shown in Figure 14, or may be made of a substantially semi-circular curve as shown in FIG. In addition, as illustrated in FIG. 16, the air guide groove 516 may be formed in a branched shape.

On the other hand, although not shown in the drawings, unlike the above-described embodiments, the pneumatic line is connected to the conventional integrated slug removal punch 50 (see FIG. 2), and the slug removal punch 50 is removed from the pneumatic line. Even though the air is guided through the air guide groove that guides the supplied air toward the lower lead frame, it is possible to reliably remove the slug by removing foreign substances on the lead L (see FIG. 10) immediately before removing the slug as described above. Could be

In addition, unlike the above-described embodiment of the mold apparatus, after the trimming operation by the trimming punch, a separate air spraying operation for removing foreign matter by spraying air to the lead frame as described above, the lead after the air spraying operation The mold apparatus may be configured to return the frame to a slug removal process to remove slugs.

As described above, according to the present invention, since the slug removal member constituting the slug removal punch is moved up and down individually, if there is a foreign material on the lead of the lead frame, only the slug removing member contacting the foreign material wins the elastic force and rises individually. Therefore, the load applied to the lead by the slug removing punch can be minimized, so that the lead is not damaged.

In addition, if the slug removal member is to inject air toward the lead before reaching the lead, it is possible to remove the foreign matter of the lead before the slug removal operation. Therefore, since the phenomenon that the slug removal member is disturbed by foreign matters is prevented in advance, there is an advantage that the slug removal operation can be surely performed.

Claims (7)

A lower holder on which a lead frame is seated; An upper holder installed up and down relative to the lower holder; A trimming punch installed at the upper holder to cut a predetermined portion of the lead frame; And, At least one side is provided at each side of the retainer provided in the upper holder to remove slugs caught between the leads of the lead frame after the trimming operation by the trimming punch. A slug removing punch having a slug removing member for removing slug of the slug, and an elastic member interposed between one end of the retainer and one side of the slug removing member, the elastic member individually elastically supporting in the moving direction of each slug removing member. Semiconductor mold apparatus comprising a. The method of claim 1, And a retainer cover fixed to the upper portion of the retainer to support the upper portion of the elastic member. The method according to claim 1 or 2, The size of the elastic force of the elastic member is a semiconductor mold apparatus, characterized in that within the range to remove the slug without applying deformation to the lead of the lead frame. The method of claim 1, The retainer is provided with a stepped insertion hole through which the slug removing member penetrates, and a stopper is formed on the upper end of the slug removing member to restrict the downward movement of the slug removing member. Semiconductor mold apparatus. The method of claim 1, An air guide groove formed to communicate from the upper side to the lower side between the surface where the retainer and the slug removing member are in contact with each other is installed to be connected to the air guide groove in the retainer, so that the slug can be removed before the slug removing member approaches. And a pneumatic line for supplying air toward the lead frame through the air guide groove. The method of claim 5, The air guide groove is a semiconductor mold apparatus, characterized in that formed in the form extending to the outside toward the lower end. A lower holder on which a lead frame is seated; An upper holder installed up and down relative to the lower holder; A trimming punch installed at the upper holder to cut a predetermined portion of the lead frame; It includes a slug removal punch for removing the slug of the lead frame, A retainer provided in the upper holder to remove slugs caught between the leads of the leadframe after the trimming operation by the trimming punch, and air is blown to remove slugs of the leadframe when the retainer is close to the leadframe. The semiconductor mold apparatus further comprises an air injection unit.

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