KR100709832B1 - 조립체 내의 차별적인 열 팽창으로 인해 발생되는 계면 응력을 감소시키는 장치 및 방법 - Google Patents

조립체 내의 차별적인 열 팽창으로 인해 발생되는 계면 응력을 감소시키는 장치 및 방법 Download PDF

Info

Publication number
KR100709832B1
KR100709832B1 KR1020000045190A KR20000045190A KR100709832B1 KR 100709832 B1 KR100709832 B1 KR 100709832B1 KR 1020000045190 A KR1020000045190 A KR 1020000045190A KR 20000045190 A KR20000045190 A KR 20000045190A KR 100709832 B1 KR100709832 B1 KR 100709832B1
Authority
KR
South Korea
Prior art keywords
substrate
thermal expansion
board
temperature
interfacial stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020000045190A
Other languages
English (en)
Korean (ko)
Other versions
KR20010021214A (ko
Inventor
다크셔왈터제이
엔젤페드로에프
Original Assignee
아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 filed Critical 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드
Publication of KR20010021214A publication Critical patent/KR20010021214A/ko
Application granted granted Critical
Publication of KR100709832B1 publication Critical patent/KR100709832B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020000045190A 1999-08-06 2000-08-04 조립체 내의 차별적인 열 팽창으로 인해 발생되는 계면 응력을 감소시키는 장치 및 방법 Expired - Fee Related KR100709832B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9/369,898 1999-08-06
US09/369,898 US6320754B1 (en) 1999-08-06 1999-08-06 Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package
US09/369,898 1999-08-06

Publications (2)

Publication Number Publication Date
KR20010021214A KR20010021214A (ko) 2001-03-15
KR100709832B1 true KR100709832B1 (ko) 2007-04-23

Family

ID=23457388

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000045190A Expired - Fee Related KR100709832B1 (ko) 1999-08-06 2000-08-04 조립체 내의 차별적인 열 팽창으로 인해 발생되는 계면 응력을 감소시키는 장치 및 방법

Country Status (6)

Country Link
US (1) US6320754B1 (https=)
JP (1) JP2001085819A (https=)
KR (1) KR100709832B1 (https=)
DE (1) DE10034309B4 (https=)
GB (1) GB2356084B (https=)
TW (1) TW497233B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235886B1 (en) * 2001-12-21 2007-06-26 Intel Corporation Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
US20030116860A1 (en) * 2001-12-21 2003-06-26 Biju Chandran Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses
US20040240188A1 (en) * 2003-05-28 2004-12-02 Cromwell Stephen Daniel Protective coating for attach hardware for circuits
DE10340866A1 (de) * 2003-09-04 2005-03-31 Siemens Ag Verfahren zum Befestigen einer Elementgruppe an einer Trägerschicht
US20120081872A1 (en) * 2010-09-30 2012-04-05 Alcatel-Lucent Canada Inc. Thermal warp compensation ic package
DE102018104521B4 (de) * 2018-02-28 2022-11-17 Rogers Germany Gmbh Metall-Keramik-Substrate
CN108550559B (zh) * 2018-05-28 2024-07-30 北京比特大陆科技有限公司 散热片、芯片组件及电路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107247A (en) * 1979-02-09 1980-08-16 Matsushita Electric Ind Co Ltd Hybrid integrated circuit
JPS58138050A (ja) * 1982-02-10 1983-08-16 Sumitomo Electric Ind Ltd 半導体装置の製造方法
US5877070A (en) * 1997-05-31 1999-03-02 Max-Planck Society Method for the transfer of thin layers of monocrystalline material to a desirable substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4437718A (en) * 1981-12-17 1984-03-20 Motorola Inc. Non-hermetically sealed stackable chip carrier package
EP0452752B1 (en) 1990-04-16 1996-12-18 Fujitsu Limited Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
GB2276977B (en) 1992-12-08 1996-09-18 Hughes Aircraft Co Thermal matched ic chip assembly and fabrication method
JP2541487B2 (ja) * 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
US5766982A (en) * 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
JP2828021B2 (ja) * 1996-04-22 1998-11-25 日本電気株式会社 ベアチップ実装構造及び製造方法
US5868887A (en) 1996-11-08 1999-02-09 W. L. Gore & Associates, Inc. Method for minimizing warp and die stress in the production of an electronic assembly
US5844319A (en) * 1997-03-03 1998-12-01 Motorola Corporation Microelectronic assembly with collar surrounding integrated circuit component on a substrate
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
US5936304A (en) 1997-12-10 1999-08-10 Intel Corporation C4 package die backside coating
US6081416A (en) * 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107247A (en) * 1979-02-09 1980-08-16 Matsushita Electric Ind Co Ltd Hybrid integrated circuit
JPS58138050A (ja) * 1982-02-10 1983-08-16 Sumitomo Electric Ind Ltd 半導体装置の製造方法
US5877070A (en) * 1997-05-31 1999-03-02 Max-Planck Society Method for the transfer of thin layers of monocrystalline material to a desirable substrate

Also Published As

Publication number Publication date
DE10034309A1 (de) 2001-04-05
TW497233B (en) 2002-08-01
DE10034309B4 (de) 2004-03-04
GB0017054D0 (en) 2000-08-30
GB2356084B (en) 2003-10-22
GB2356084A (en) 2001-05-09
US6320754B1 (en) 2001-11-20
JP2001085819A (ja) 2001-03-30
KR20010021214A (ko) 2001-03-15

Similar Documents

Publication Publication Date Title
JP3201868B2 (ja) 導電性熱インターフェース及びその方法
US6049128A (en) Semiconductor device
US6111322A (en) Semiconductor device and manufacturing method thereof
US4081825A (en) Conduction-cooled circuit package
EP1588407B1 (en) Area array package with non-electrically connected solder balls
US6483708B2 (en) Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
US6104093A (en) Thermally enhanced and mechanically balanced flip chip package and method of forming
KR100811581B1 (ko) 범프들을 사용하는 반도체 디바이스, 이를 제작하는 방법, 및 범프들을 형성하는 방법
US6784535B1 (en) Composite lid for land grid array (LGA) flip-chip package assembly
US20180204807A1 (en) Semiconductor device
JP3070579B2 (ja) 半導体装置の実装構造および実装方法
KR980013574A (ko) 스트레스 경감을 위한 히트 싱크가 부착된 칼럼 그리드 어레이(Column Grid Array Substrate Attachment with Geat Sink Stress Rdlief)
US6703560B2 (en) Stress resistant land grid array (LGA) module and method of forming the same
JPH08507656A (ja) 半導体パッケージにおいて熱循環を低減する素子および方法
US5844319A (en) Microelectronic assembly with collar surrounding integrated circuit component on a substrate
KR100709832B1 (ko) 조립체 내의 차별적인 열 팽창으로 인해 발생되는 계면 응력을 감소시키는 장치 및 방법
US7268427B2 (en) Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board
US7498198B2 (en) Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties
KR100748558B1 (ko) 칩 사이즈 패키지 및 그 제조 방법
JP2710986B2 (ja) 電子装置
US6020638A (en) Packaging structure of BGA type semiconductor device mounted on circuit substrate
JPS6395637A (ja) 半導体集積回路装置
JP4128722B2 (ja) 回路基板および電子機器
JPS60100443A (ja) 半導体装置の実装構造
CN115172287B (zh) 具有散热盖板的芯片封装结构及其制作方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20100414

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20100414

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000