GB2356084B - Apparatus for the reduction of interfacial stress caused by differential thermal expansion in a integrated circuit package - Google Patents

Apparatus for the reduction of interfacial stress caused by differential thermal expansion in a integrated circuit package

Info

Publication number
GB2356084B
GB2356084B GB0017054A GB0017054A GB2356084B GB 2356084 B GB2356084 B GB 2356084B GB 0017054 A GB0017054 A GB 0017054A GB 0017054 A GB0017054 A GB 0017054A GB 2356084 B GB2356084 B GB 2356084B
Authority
GB
United Kingdom
Prior art keywords
reduction
integrated circuit
thermal expansion
circuit package
differential thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0017054A
Other languages
English (en)
Other versions
GB0017054D0 (en
GB2356084A (en
Inventor
Walter J Dauksher
Pedro F Engel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of GB0017054D0 publication Critical patent/GB0017054D0/en
Publication of GB2356084A publication Critical patent/GB2356084A/en
Application granted granted Critical
Publication of GB2356084B publication Critical patent/GB2356084B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
GB0017054A 1999-08-06 2000-07-11 Apparatus for the reduction of interfacial stress caused by differential thermal expansion in a integrated circuit package Expired - Fee Related GB2356084B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/369,898 US6320754B1 (en) 1999-08-06 1999-08-06 Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package

Publications (3)

Publication Number Publication Date
GB0017054D0 GB0017054D0 (en) 2000-08-30
GB2356084A GB2356084A (en) 2001-05-09
GB2356084B true GB2356084B (en) 2003-10-22

Family

ID=23457388

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0017054A Expired - Fee Related GB2356084B (en) 1999-08-06 2000-07-11 Apparatus for the reduction of interfacial stress caused by differential thermal expansion in a integrated circuit package

Country Status (6)

Country Link
US (1) US6320754B1 (https=)
JP (1) JP2001085819A (https=)
KR (1) KR100709832B1 (https=)
DE (1) DE10034309B4 (https=)
GB (1) GB2356084B (https=)
TW (1) TW497233B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235886B1 (en) * 2001-12-21 2007-06-26 Intel Corporation Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
US20030116860A1 (en) * 2001-12-21 2003-06-26 Biju Chandran Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses
US20040240188A1 (en) * 2003-05-28 2004-12-02 Cromwell Stephen Daniel Protective coating for attach hardware for circuits
DE10340866A1 (de) * 2003-09-04 2005-03-31 Siemens Ag Verfahren zum Befestigen einer Elementgruppe an einer Trägerschicht
US20120081872A1 (en) * 2010-09-30 2012-04-05 Alcatel-Lucent Canada Inc. Thermal warp compensation ic package
DE102018104521B4 (de) * 2018-02-28 2022-11-17 Rogers Germany Gmbh Metall-Keramik-Substrate
CN108550559B (zh) * 2018-05-28 2024-07-30 北京比特大陆科技有限公司 散热片、芯片组件及电路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0452752A2 (en) * 1990-04-16 1991-10-23 Fujitsu Limited Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
GB2276977A (en) * 1992-12-08 1994-10-12 Hughes Aircraft Co Reducing thermal stress in I.C. chip mountings
US5936304A (en) * 1997-12-10 1999-08-10 Intel Corporation C4 package die backside coating

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107247A (en) * 1979-02-09 1980-08-16 Matsushita Electric Ind Co Ltd Hybrid integrated circuit
US4437718A (en) * 1981-12-17 1984-03-20 Motorola Inc. Non-hermetically sealed stackable chip carrier package
JPS58138050A (ja) * 1982-02-10 1983-08-16 Sumitomo Electric Ind Ltd 半導体装置の製造方法
JP2541487B2 (ja) * 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
US5766982A (en) * 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
JP2828021B2 (ja) * 1996-04-22 1998-11-25 日本電気株式会社 ベアチップ実装構造及び製造方法
US5868887A (en) 1996-11-08 1999-02-09 W. L. Gore & Associates, Inc. Method for minimizing warp and die stress in the production of an electronic assembly
US5844319A (en) * 1997-03-03 1998-12-01 Motorola Corporation Microelectronic assembly with collar surrounding integrated circuit component on a substrate
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
US5877070A (en) * 1997-05-31 1999-03-02 Max-Planck Society Method for the transfer of thin layers of monocrystalline material to a desirable substrate
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
US6081416A (en) * 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0452752A2 (en) * 1990-04-16 1991-10-23 Fujitsu Limited Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
GB2276977A (en) * 1992-12-08 1994-10-12 Hughes Aircraft Co Reducing thermal stress in I.C. chip mountings
US5936304A (en) * 1997-12-10 1999-08-10 Intel Corporation C4 package die backside coating

Also Published As

Publication number Publication date
DE10034309A1 (de) 2001-04-05
KR100709832B1 (ko) 2007-04-23
TW497233B (en) 2002-08-01
DE10034309B4 (de) 2004-03-04
GB0017054D0 (en) 2000-08-30
GB2356084A (en) 2001-05-09
US6320754B1 (en) 2001-11-20
JP2001085819A (ja) 2001-03-30
KR20010021214A (ko) 2001-03-15

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070711