SG106115A1 - Apparatus for assembling integrated circuit packages - Google Patents

Apparatus for assembling integrated circuit packages

Info

Publication number
SG106115A1
SG106115A1 SG200207207A SG200207207A SG106115A1 SG 106115 A1 SG106115 A1 SG 106115A1 SG 200207207 A SG200207207 A SG 200207207A SG 200207207 A SG200207207 A SG 200207207A SG 106115 A1 SG106115 A1 SG 106115A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
circuit packages
assembling integrated
assembling
packages
Prior art date
Application number
SG200207207A
Inventor
Wee Kiun Francis How
Jian Zhang
Lian Hok Tan
Original Assignee
Asm Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Tech Singapore Pte Ltd filed Critical Asm Tech Singapore Pte Ltd
Publication of SG106115A1 publication Critical patent/SG106115A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53365—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/534—Multiple station assembly or disassembly apparatus
    • Y10T29/53409—Multiple station assembly or disassembly apparatus including converging conveyors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/534—Multiple station assembly or disassembly apparatus
    • Y10T29/53409—Multiple station assembly or disassembly apparatus including converging conveyors
    • Y10T29/53413—Multiple station assembly or disassembly apparatus including converging conveyors and primary central conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
SG200207207A 2001-11-28 2002-11-27 Apparatus for assembling integrated circuit packages SG106115A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/996,210 US6705001B2 (en) 2001-11-28 2001-11-28 Apparatus for assembling integrated circuit packages

Publications (1)

Publication Number Publication Date
SG106115A1 true SG106115A1 (en) 2004-09-30

Family

ID=25542623

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200207207A SG106115A1 (en) 2001-11-28 2002-11-27 Apparatus for assembling integrated circuit packages

Country Status (2)

Country Link
US (1) US6705001B2 (en)
SG (1) SG106115A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030132528A1 (en) * 2001-12-28 2003-07-17 Jimmy Liang Method and apparatus for flip chip device assembly by radiant heating
US20070079502A1 (en) * 2005-09-21 2007-04-12 Chung Yuan Christian University Convenient auto-assembling system for small shell devices
KR100967526B1 (en) * 2008-04-25 2010-07-05 에스티에스반도체통신 주식회사 Apparatus for manufacturing semiconductor package for wide lead frame and method for constructing semiconductor package using the same
KR100996264B1 (en) * 2008-04-25 2010-11-23 에스티에스반도체통신 주식회사 Apparatus for manufacturing semiconductor package for wide lead frame and method for constructing semiconductor package using the same
CN101772296B (en) * 2008-12-27 2012-12-19 深圳富泰宏精密工业有限公司 Assembly line
EP2585656A4 (en) * 2010-01-07 2014-05-14 Comau Inc Modular manufacturing facility and method
US9789572B1 (en) * 2014-01-09 2017-10-17 Flextronics Ap, Llc Universal automation line
EP3233370B1 (en) 2014-12-15 2018-09-12 Comau LLC Modular vehicle assembly system and method
CN104536171B (en) 2015-01-13 2017-04-12 京东方科技集团股份有限公司 Liquid crystal display screen detection device
JP2017097631A (en) * 2015-11-25 2017-06-01 ファナック株式会社 Utilization monitoring device of machine tool
EP3452391B1 (en) 2016-05-06 2024-01-10 Comau LLC Inverted carrier lift device system
US11420853B2 (en) 2019-10-03 2022-08-23 Comau Llc Assembly material logistics system and methods
BR112022025091A2 (en) 2020-06-08 2022-12-27 Comau Llc ASSEMBLY MATERIAL LOGISTICS SYSTEM AND METHODS
CN113478238B (en) * 2021-07-02 2022-07-12 深圳市瑞福自动化设备有限公司 3C mainboard full automatization precision assembly test production line

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4301958A (en) * 1978-08-24 1981-11-24 Fujitsu Limited Arrangement for automatically fabricating and bonding semiconductor devices
WO1980002461A1 (en) * 1979-05-08 1980-11-13 Tokyo Shibaura Electric Co Automatic testing system for printed circuit boards
US4631812A (en) * 1984-05-10 1986-12-30 Quad Systems Corporation Programmable substrate transport for electronic assembly
JP2811613B2 (en) * 1991-09-02 1998-10-15 ティーディーケイ株式会社 Manufacturing method and apparatus for electronic components

Also Published As

Publication number Publication date
US20030097748A1 (en) 2003-05-29
US6705001B2 (en) 2004-03-16

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