KR100705053B1 - 발광 다이오드 장치 - Google Patents
발광 다이오드 장치 Download PDFInfo
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- KR100705053B1 KR100705053B1 KR1020017006557A KR20017006557A KR100705053B1 KR 100705053 B1 KR100705053 B1 KR 100705053B1 KR 1020017006557 A KR1020017006557 A KR 1020017006557A KR 20017006557 A KR20017006557 A KR 20017006557A KR 100705053 B1 KR100705053 B1 KR 100705053B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 238000006243 chemical reaction Methods 0.000 title abstract description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title 1
- 239000013078 crystal Substances 0.000 claims abstract description 30
- 230000005855 radiation Effects 0.000 claims abstract description 26
- 150000001875 compounds Chemical class 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 7
- 229910052684 Cerium Inorganic materials 0.000 claims description 6
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 6
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 229910052689 Holmium Inorganic materials 0.000 claims description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 claims 1
- 230000001902 propagating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 238000004020 luminiscence type Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 9
- 239000000975 dye Substances 0.000 description 8
- -1 rare earth ions Chemical class 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 229910052747 lanthanoid Inorganic materials 0.000 description 2
- 150000002602 lanthanoids Chemical class 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Led Devices (AREA)
Abstract
Description
기판 물질은 다른 물질로 이루어질 수 있다. 예컨대, 기판 물질은 가넷 구조를 갖지 않는 (Y, Al) 산화물일 수 있는데, "YAG"에서 "G"는 가넷 구조를 나타낸다. 예를 들면, 단사정계(monoclinic) YAIO와 YAIO-페로브스카이트(perovskite) 이다. 또한 부분적으로 Y를 대체한, 예를 들면, (Y,Ln)AlO,(Y,Ln)(Al,Ga)O과 같은 몇몇 란탄족 원소(Ln)는 본 발명의 목적에 적합하며, 여기서 Ln은 임의의 희토류 이온(rare earth ion)을 나타낸다. 란탄족 원소는 좋은 발광 특성을 촉진하는 것으로 알려진 루테튬(Lu, Lutethium)일 수 있다. 또한, Ce,Pr,Ho,Yb ; Eu2+ 와 같은 하나의 도펀트(dopant)와 (Ce,Pr),(Ce,Ho),(Eu,Pr)와 같은 두 개의 도펀트와 같이 다양한 도펀트가 기판 물질을 도핑하기 위해 사용될 수 있다는 것을 주의해야 한다.
Claims (14)
- 백색 광을 생성하기 위한 발광 다이오드 장치에 있어서,구동시 특정한 파장의 1차 방사광을 방출하는 발광 구조체(a light emitting structure)와,상기 발광 구조체로부터 방출된 상기 1차 방사광의 적어도 일부가 진행하는 광 투과 기판을 포함하되,상기 기판은 자신으로 진행하는 상기 1차 방사광의 적어도 일부가 하나 이상의 다른 파장의 방사광으로 변환되도록 도핑되며, 상기 발광 구조체에 의해 방출되는 상기 1차 방사광의 일부는 상기 하나 이상의 다른 파장의 방사광으로 변환되지 않고, 상기 1차 방사광 중 변환되지 않는 부분과 상기 하나 이상의 다른 파장의 방사광과 결합하여 백색 광을 생성하는,발광 다이오드 장치.
- 제 1 항에 있어서,반사 표면을 더 포함하되,상기 광 투과 기판은 상기 발광 구조체와 상기 반사 표면 사이에 개재되고(sandwitched), 상기 기판으로 진행하는 상기 1차 방사광의 실질적으로 전부가 상기 하나 이상의 다른 파장의 방사광으로 변환되고, 상기 1차 방사광 중 변환되지 않은 부분은 상기 발광 구조체에 의해 상기 기판으로부터 멀어지는 방향으로 방출되는 1차 방사광에 대응하며, 상기 반사 표면은 상기 기판 및 상기 발광 구조체를 통해 상기 하나 이상의 다른 파장의 방사광을 반사하고, 상기 반사된 방사광과 상기 변환되지 않은 1차 방사광이 결합하여 백색 광을 생성하는발광 다이오드 장치.
- 제 1 항에 있어서,상기 발광 구조체의 제 1 표면 상에 위치한 반사 전극을 더 포함하며,상기 발광 구조체에 의해 방출되어 상기 반사 전극 상에 닿는 임의의 방사광은 상기 반사 전극에 의해 상기 발광 구조체를 향해 반사되어 상기 반사된 방사광이 상기 기판을 향하게 되는발광 다이오드 장치.
- 제 1 항에 있어서,상기 기판은 단결정 이트륨-알루미늄-가넷(Y3Al5O12) 화합물로 구성되고, 상기 하나 이상의 다른 파장의 방사광은 황색 광이고, 상기 황색 광은 상기 변환되지 않은 1차 방사광와 결합하여 백색 광을 생성하는발광 다이오드 장치.
- 제 4 항에 있어서,상기 1차 방사광은 청색 광인 발광 다이오드 장치.
- 제 4 항에 있어서,상기 단결정 이트륨-알루미늄-가넷(Y3Al5O12) 화합물은 세륨으로 도핑되어 화학적으로 Y3Al5O12:Ce3+로 규정되는 화합물을 생성하는발광 다이오드 장치.
- 제 4 항에 있어서.상기 단결정 이트륨-알루미늄-가넷(Y3Al5O12) 화합물은 홀뮴으로 도핑되어 화학적으로 Y3Al5O12:Ho3+로 규정되는 화합물을 생성하는발광 다이오드 장치.
- 제 4 항에 있어서.상기 단결정 이트륨-알루미늄-가넷(Y3AL5O12) 화합물은 프라세오디뮴으로 도핑되어 화학적으로 Y3Al5O12:Pr3+로 규정되는 화합물을 생성하는발광 다이오드 장치.
- 제 1 항에 있어서,상기 기판은 실리콘 카바이드(Silicon Carbide)로 구성되고, 상기 실리콘 카바이드 기판은 상기 기판으로 진행하는 상기 1차 방사광의 일부가 적색 광으로 변환되고, 상기 기판으로 진행하는 상기 1차 방사광의 일부는 녹색으로 변환되며, 상기 적색과 상기 녹색 광은 상기 변환되지 않은 1차 방사광와 결합하여 백색 광을 생성하는발광 다이오드 장치.
- 제 9 항에 있어서,상기 1차 방사광은 청색 광인 발광 다이오드 장치.
- 제 10 항에 있어서,상기 광 방출 구조의 제 2 표면상에 위치한 반사 전극을 더 포함하며,상기 반사 전극 상에 닿는 상기 발광 구조체에 의해 방출되는 1차 방사광이 상기 반사 전극에 의해 상기 발광 구조체를 향해 반사되어 상기 반사된 방사광이 상기 기판으로 향하게 되는발광 다이오드 장치.
- 제 1 항에 있어서,상기 기판은 알루미늄 산화물(Al2O3)로 구성되고, 상기 알루미늄 산화물 기판은 상기 기판으로 진행하는 상기 1차 방사광의 일부가 적색 광으로 변환되고 상기 기판으로 진행하는 상기 1차 방사광의 일부가 녹색 광으로 변환되는 방식으로 도핑되고, 상기 적색 및 녹색 광이 상기 변환되지 않은 1차 방사광와 결합하여 백색 광을 생성하는발광 다이오드 장치.
- 제 12 항에 있어서,상기 1차 방사광은 청색 광인 발광 다이오드 장치.
- 제 12 항에 있어서,상기 발광 구조체의 제 2 표면상에 위치하는 반사 전극을 더 포함하며,상기 발광 구조체에 의해 방출되어 상기 반사 전극 상에 닿는 1차 방사광이 상기 반사 전극에 의해 상기 발광 구조체 쪽으로 반사되어 상기 반사된 방사광이 상기 기판으로 향하게 되는발광 다이오드 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/407,231 | 1999-09-27 | ||
US09/407,231 US6630691B1 (en) | 1999-09-27 | 1999-09-27 | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010089505A KR20010089505A (ko) | 2001-10-06 |
KR100705053B1 true KR100705053B1 (ko) | 2007-04-06 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020017006557A KR100705053B1 (ko) | 1999-09-27 | 2000-09-26 | 발광 다이오드 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6630691B1 (ko) |
EP (1) | EP1142034B1 (ko) |
JP (1) | JP2001203383A (ko) |
KR (1) | KR100705053B1 (ko) |
AU (1) | AU7720900A (ko) |
DE (1) | DE60035856T2 (ko) |
WO (1) | WO2001024285A1 (ko) |
Families Citing this family (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030133292A1 (en) | 1999-11-18 | 2003-07-17 | Mueller George G. | Methods and apparatus for generating and modulating white light illumination conditions |
US20020176259A1 (en) * | 1999-11-18 | 2002-11-28 | Ducharme Alfred D. | Systems and methods for converting illumination |
US7202506B1 (en) * | 1999-11-19 | 2007-04-10 | Cree, Inc. | Multi element, multi color solid state LED/laser |
US7615780B2 (en) | 2000-10-23 | 2009-11-10 | General Electric Company | DNA biosensor and methods for making and using the same |
US7053413B2 (en) | 2000-10-23 | 2006-05-30 | General Electric Company | Homoepitaxial gallium-nitride-based light emitting device and method for producing |
GB2373368B (en) * | 2001-03-12 | 2004-10-27 | Arima Optoelectronics Corp | Light emitting devices |
US6653166B2 (en) * | 2001-05-09 | 2003-11-25 | Nsc-Nanosemiconductor Gmbh | Semiconductor device and method of making same |
US6784074B2 (en) | 2001-05-09 | 2004-08-31 | Nsc-Nanosemiconductor Gmbh | Defect-free semiconductor templates for epitaxial growth and method of making same |
US7528421B2 (en) * | 2003-05-05 | 2009-05-05 | Lamina Lighting, Inc. | Surface mountable light emitting diode assemblies packaged for high temperature operation |
US7157745B2 (en) * | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
US7633093B2 (en) * | 2003-05-05 | 2009-12-15 | Lighting Science Group Corporation | Method of making optical light engines with elevated LEDs and resulting product |
US7777235B2 (en) | 2003-05-05 | 2010-08-17 | Lighting Science Group Corporation | Light emitting diodes with improved light collimation |
US20050006659A1 (en) * | 2003-07-09 | 2005-01-13 | Ng Kee Yean | Light emitting diode utilizing a discrete wavelength-converting layer for color conversion |
US7009215B2 (en) | 2003-10-24 | 2006-03-07 | General Electric Company | Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates |
US20070262702A1 (en) * | 2004-03-31 | 2007-11-15 | Shunsuke Fujita | Phoshor and Light-Emitting Diode |
US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
EP2803898B1 (en) | 2004-05-05 | 2020-08-19 | Rensselaer Polytechnic Institute | A light-emitting apparatus |
US20050274965A1 (en) * | 2004-06-02 | 2005-12-15 | Phillips David L | Sterilizing method, system, and device utilizing ultraviolet light emitting diodes powered by direct current or solar power in a recreational vehicle or marine environment |
US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
US8227820B2 (en) | 2005-02-09 | 2012-07-24 | The Regents Of The University Of California | Semiconductor light-emitting device |
US20070267646A1 (en) * | 2004-06-03 | 2007-11-22 | Philips Lumileds Lighting Company, Llc | Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic |
US7345298B2 (en) * | 2005-02-28 | 2008-03-18 | The Regents Of The University Of California | Horizontal emitting, vertical emitting, beam shaped, distributed feedback (DFB) lasers by growth over a patterned substrate |
US7553683B2 (en) * | 2004-06-09 | 2009-06-30 | Philips Lumiled Lighting Co., Llc | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
US7223998B2 (en) * | 2004-09-10 | 2007-05-29 | The Regents Of The University Of California | White, single or multi-color light emitting diodes by recycling guided modes |
EP1811580A4 (en) * | 2004-10-21 | 2012-05-23 | Ube Industries | LUMINOUS DIODE ELEMENT, PLATE FOR LIGHT DIODE, AND METHOD FOR MANUFACTURING LIGHT DIODE ELEMENT |
US7671529B2 (en) * | 2004-12-10 | 2010-03-02 | Philips Lumileds Lighting Company, Llc | Phosphor converted light emitting device |
KR20070115961A (ko) * | 2005-02-16 | 2007-12-06 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 무기 발광 다이오드(들)를 포함하는 발광 디바이스 |
US8748923B2 (en) * | 2005-03-14 | 2014-06-10 | Philips Lumileds Lighting Company Llc | Wavelength-converted semiconductor light emitting device |
US7341878B2 (en) * | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
JP4843990B2 (ja) * | 2005-04-22 | 2011-12-21 | 日亜化学工業株式会社 | 蛍光体およびそれを用いた発光装置 |
US7753553B2 (en) | 2005-06-02 | 2010-07-13 | Koniklijke Philips Electronics N.V. | Illumination system comprising color deficiency compensating luminescent material |
WO2007002234A1 (en) | 2005-06-23 | 2007-01-04 | Rensselaer Polytechnic Institute | Package design for producing white light with short-wavelength leds and down-conversion materials |
US8425858B2 (en) | 2005-10-14 | 2013-04-23 | Morpho Detection, Inc. | Detection apparatus and associated method |
US7514721B2 (en) * | 2005-11-29 | 2009-04-07 | Koninklijke Philips Electronics N.V. | Luminescent ceramic element for a light emitting device |
CN100389504C (zh) * | 2005-12-19 | 2008-05-21 | 中山大学 | 一种yag晶片式白光发光二极管及其封装方法 |
KR20080106402A (ko) | 2006-01-05 | 2008-12-05 | 일루미텍스, 인크. | Led로부터 광을 유도하기 위한 개별 광학 디바이스 |
EP1979439A1 (en) * | 2006-01-16 | 2008-10-15 | Philips Intellectual Property & Standards GmbH | Light emitting device with a eu-comprising phosphor material |
US7795600B2 (en) * | 2006-03-24 | 2010-09-14 | Goldeneye, Inc. | Wavelength conversion chip for use with light emitting diodes and method for making same |
US8481977B2 (en) | 2006-03-24 | 2013-07-09 | Goldeneye, Inc. | LED light source with thermally conductive luminescent matrix |
US7285791B2 (en) * | 2006-03-24 | 2007-10-23 | Goldeneye, Inc. | Wavelength conversion chip for use in solid-state lighting and method for making same |
WO2007122543A2 (en) * | 2006-04-26 | 2007-11-01 | Philips Intellectual Property & Standards Gmbh | Light delivery device with improved conversion element |
JP4959693B2 (ja) | 2006-05-23 | 2012-06-27 | 学校法人 名城大学 | 半導体発光素子 |
JP2008041739A (ja) * | 2006-08-02 | 2008-02-21 | Tokai Kogaku Kk | 蛍光発光装置 |
EP2057693A1 (en) * | 2006-08-29 | 2009-05-13 | Osram-Sylvania Inc. | Enhanced emission from phosphor-converted leds using interferometric filters |
US7703942B2 (en) | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
CN101553928B (zh) | 2006-10-02 | 2011-06-01 | 伊鲁米特克有限公司 | Led系统和方法 |
US9018619B2 (en) | 2006-10-09 | 2015-04-28 | Cree, Inc. | Quantum wells for light conversion |
US7889421B2 (en) | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
US7521862B2 (en) * | 2006-11-20 | 2009-04-21 | Philips Lumileds Lighting Co., Llc | Light emitting device including luminescent ceramic and light-scattering material |
US8704254B2 (en) | 2006-12-22 | 2014-04-22 | Philips Lumileds Lighting Company, Llc | Light emitting device including a filter |
US7902564B2 (en) * | 2006-12-22 | 2011-03-08 | Koninklijke Philips Electronics N.V. | Multi-grain luminescent ceramics for light emitting devices |
JP2008231218A (ja) * | 2007-03-20 | 2008-10-02 | Nippon Electric Glass Co Ltd | 蛍光体材料及び白色led |
US20080283864A1 (en) * | 2007-05-16 | 2008-11-20 | Letoquin Ronan P | Single Crystal Phosphor Light Conversion Structures for Light Emitting Devices |
US7810956B2 (en) * | 2007-08-23 | 2010-10-12 | Koninklijke Philips Electronics N.V. | Light source including reflective wavelength-converting layer |
US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
US20090140279A1 (en) * | 2007-12-03 | 2009-06-04 | Goldeneye, Inc. | Substrate-free light emitting diode chip |
WO2009074944A1 (en) * | 2007-12-11 | 2009-06-18 | Koninklijke Philips Electronics N.V. | Side emitting device with hybrid top reflector |
EP2240968A1 (en) | 2008-02-08 | 2010-10-20 | Illumitex, Inc. | System and method for emitter layer shaping |
US8575641B2 (en) * | 2011-08-11 | 2013-11-05 | Goldeneye, Inc | Solid state light sources based on thermally conductive luminescent elements containing interconnects |
US7859000B2 (en) * | 2008-04-10 | 2010-12-28 | Cree, Inc. | LEDs using single crystalline phosphor and methods of fabricating same |
JP2010024278A (ja) * | 2008-07-16 | 2010-02-04 | Stanley Electric Co Ltd | 蛍光体セラミック板およびそれを用いた発光素子 |
CN100565000C (zh) * | 2008-08-11 | 2009-12-02 | 山东华光光电子有限公司 | 利用yag透明陶瓷制备白光led的方法 |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
US8169135B2 (en) * | 2008-12-17 | 2012-05-01 | Lednovation, Inc. | Semiconductor lighting device with wavelength conversion on back-transferred light path |
US8123981B2 (en) * | 2009-02-19 | 2012-02-28 | Nitto Denko Corporation | Method of fabricating translucent phosphor ceramics |
US8137587B2 (en) | 2009-02-19 | 2012-03-20 | Nitto Denko Corporation | Method of manufacturing phosphor translucent ceramics and light emitting devices |
WO2010141235A1 (en) * | 2009-06-01 | 2010-12-09 | Nitto Denko Corporation | Light-emitting divice comprising a dome-shaped ceramic phosphor |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
TWI492422B (zh) * | 2010-03-18 | 2015-07-11 | Everlight Electronics Co Ltd | 具有螢光粉層之發光二極體晶片的製作方法 |
US8154052B2 (en) * | 2010-05-06 | 2012-04-10 | Koninklijke Philips Electronics N.V. | Light emitting device grown on wavelength converting substrate |
WO2012012354A2 (en) * | 2010-07-19 | 2012-01-26 | Rensselaer Polytechnic Institute | Full spectrum solid state white light source, method for manufacturing and applications |
CN101931040A (zh) * | 2010-07-20 | 2010-12-29 | 嘉兴嘉尼光电科技有限公司 | Led面光源封装 |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
TWI446590B (zh) * | 2010-09-30 | 2014-07-21 | Everlight Electronics Co Ltd | 發光二極體封裝結構及其製作方法 |
EP2634234B1 (en) * | 2010-10-29 | 2017-12-06 | National Institute for Materials Science | Light-emitting device |
JP2012186414A (ja) * | 2011-03-08 | 2012-09-27 | Toshiba Corp | 発光装置 |
JP2012216712A (ja) * | 2011-03-28 | 2012-11-08 | Nitto Denko Corp | 発光ダイオード装置の製造方法および発光ダイオード素子 |
US8492182B2 (en) * | 2011-04-29 | 2013-07-23 | Osram Opto Semiconductors Gmbh | Method for the producing of a light-emitting semiconductor chip, method for the production of a conversion die and light-emitting semiconductor chip |
JP2013203762A (ja) * | 2012-03-27 | 2013-10-07 | Shin-Etsu Chemical Co Ltd | 波長変換部品及びその製造方法並びに発光装置 |
US9685585B2 (en) | 2012-06-25 | 2017-06-20 | Cree, Inc. | Quantum dot narrow-band downconverters for high efficiency LEDs |
TWI474516B (zh) | 2012-08-30 | 2015-02-21 | Lextar Electronics Corp | 覆晶式發光二極體結構及其製造方法 |
CN104332539B (zh) * | 2013-07-22 | 2017-10-24 | 中国科学院福建物质结构研究所 | GaN基LED外延结构及其制造方法 |
JP5620562B1 (ja) * | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
CZ307024B6 (cs) * | 2014-05-05 | 2017-11-22 | Crytur, Spol.S R.O. | Světelný zdroj |
CN104952986B (zh) * | 2015-06-03 | 2017-12-08 | 西安交通大学 | 一种GaN基白光LED外延结构的制备方法 |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
US20200243726A1 (en) * | 2017-11-21 | 2020-07-30 | Nippon Electric Glass Co., Ltd. | Wavelength conversion member and light emitting device |
USD920934S1 (en) * | 2018-07-27 | 2021-06-01 | Creeled, Inc. | Light emitting diode chip |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS493899A (ko) * | 1972-05-04 | 1974-01-14 | ||
NL7707008A (nl) * | 1977-06-24 | 1978-12-28 | Philips Nv | Luminescentiescherm. |
US4550256A (en) * | 1983-10-17 | 1985-10-29 | At&T Bell Laboratories | Visual display system utilizing high luminosity single crystal garnet material |
JPH04206979A (ja) * | 1990-11-30 | 1992-07-28 | Hoya Corp | Qスイッチ固体レーザ装置 |
JP3717196B2 (ja) * | 1994-07-19 | 2005-11-16 | 豊田合成株式会社 | 発光素子 |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JPH1056203A (ja) | 1996-08-07 | 1998-02-24 | Nippon Sanso Kk | 発光素子 |
JP3378465B2 (ja) * | 1997-05-16 | 2003-02-17 | 株式会社東芝 | 発光装置 |
US6239901B1 (en) * | 1998-04-03 | 2001-05-29 | Agilent Technologies, Inc. | Light source utilizing a light emitting device constructed on the surface of a substrate and light conversion device that includes a portion of the substrate |
JPH11307813A (ja) * | 1998-04-03 | 1999-11-05 | Hewlett Packard Co <Hp> | 発光装置、その製造方法およびディスプレイ |
TW406442B (en) | 1998-07-09 | 2000-09-21 | Sumitomo Electric Industries | White colored LED and intermediate colored LED |
TW413956B (en) | 1998-07-28 | 2000-12-01 | Sumitomo Electric Industries | Fluorescent substrate LED |
JP3785820B2 (ja) * | 1998-08-03 | 2006-06-14 | 豊田合成株式会社 | 発光装置 |
US6291839B1 (en) * | 1998-09-11 | 2001-09-18 | Lulileds Lighting, U.S. Llc | Light emitting device having a finely-patterned reflective contact |
-
1999
- 1999-09-27 US US09/407,231 patent/US6630691B1/en not_active Expired - Lifetime
-
2000
- 2000-09-26 KR KR1020017006557A patent/KR100705053B1/ko active IP Right Grant
- 2000-09-26 AU AU77209/00A patent/AU7720900A/en not_active Abandoned
- 2000-09-26 EP EP00966936A patent/EP1142034B1/en not_active Expired - Lifetime
- 2000-09-26 WO PCT/US2000/026507 patent/WO2001024285A1/en active IP Right Grant
- 2000-09-26 DE DE60035856T patent/DE60035856T2/de not_active Expired - Lifetime
- 2000-09-27 JP JP2000335223A patent/JP2001203383A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2001024285A1 (en) | 2001-04-05 |
AU7720900A (en) | 2001-04-30 |
JP2001203383A (ja) | 2001-07-27 |
EP1142034A1 (en) | 2001-10-10 |
DE60035856D1 (de) | 2007-09-20 |
DE60035856T2 (de) | 2008-04-30 |
KR20010089505A (ko) | 2001-10-06 |
EP1142034B1 (en) | 2007-08-08 |
US6630691B1 (en) | 2003-10-07 |
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