KR100697477B1 - 피검체 두께 결정 방법 및 장치와 ir 과도 서모그래피 방법 - Google Patents

피검체 두께 결정 방법 및 장치와 ir 과도 서모그래피 방법 Download PDF

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KR100697477B1
KR100697477B1 KR1020027000845A KR20027000845A KR100697477B1 KR 100697477 B1 KR100697477 B1 KR 100697477B1 KR 1020027000845 A KR1020027000845 A KR 1020027000845A KR 20027000845 A KR20027000845 A KR 20027000845A KR 100697477 B1 KR100697477 B1 KR 100697477B1
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KR20020035105A (ko
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링어마처해리이스라엘
하워드도널드로버트
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제너럴 일렉트릭 캄파니
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/72Investigating presence of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • G01B21/085Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness using thermal means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Radiation Pyrometers (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020027000845A 1999-07-21 2000-06-13 피검체 두께 결정 방법 및 장치와 ir 과도 서모그래피 방법 Expired - Fee Related KR100697477B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14488599P 1999-07-21 1999-07-21
US60/144,885 1999-07-21
US09/568,052 2000-05-10
US09/568,052 US6367968B1 (en) 1999-07-21 2000-05-10 Thermal resonance imaging method

Publications (2)

Publication Number Publication Date
KR20020035105A KR20020035105A (ko) 2002-05-09
KR100697477B1 true KR100697477B1 (ko) 2007-03-20

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KR1020027000845A Expired - Fee Related KR100697477B1 (ko) 1999-07-21 2000-06-13 피검체 두께 결정 방법 및 장치와 ir 과도 서모그래피 방법

Country Status (9)

Country Link
US (1) US6367968B1 (https=)
EP (1) EP1203199B1 (https=)
JP (1) JP2003505683A (https=)
KR (1) KR100697477B1 (https=)
BR (1) BR0012644A (https=)
DE (1) DE60015555T2 (https=)
TR (1) TR200200140T2 (https=)
TW (1) TW463047B (https=)
WO (1) WO2001007867A1 (https=)

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EP1262765A1 (de) * 2001-05-28 2002-12-04 Solectron GmbH Verfahren und Vorrichtung zur Detektion von defekten Leiterplattenrohlingen
US6712502B2 (en) * 2002-04-10 2004-03-30 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Synchronized electronic shutter system and method for thermal nondestructive evaluation
US20050018748A1 (en) * 2003-07-24 2005-01-27 Ringermacher Harry Israel Actively quenched lamp, infrared thermography imaging system, and method for actively controlling flash duration
AU2003279935A1 (en) * 2003-08-29 2005-04-14 Nielsen Media Research, Inc. Methods and apparatus for embedding and recovering an image for use with video content
US7419298B2 (en) * 2005-05-24 2008-09-02 United Technologies Corporation Thermal imaging method and apparatus
US7388204B2 (en) * 2005-12-07 2008-06-17 Meyer Tool, Inc. Apparatus and method for analyzing relative outward flow characterizations of fabricated features
FR2895688B1 (fr) * 2005-12-30 2010-08-27 Pellenc Selective Technologies Procede et machine automatiques d'inspection et de tri d'objets non metalliques
US7432505B2 (en) * 2006-05-04 2008-10-07 Siemens Power Generation, Inc. Infrared-based method and apparatus for online detection of cracks in steam turbine components
US7671338B2 (en) * 2006-06-14 2010-03-02 Meyer Tool, Inc. Apparatus and method for analyzing relative outward flow characterizations of fabricated features
DE102006043339B4 (de) * 2006-09-15 2010-11-11 Siemens Ag Verfahren und Vorrichtung zur Bestimmung von Bauteilwandstärken mittels Thermographie
DE102006044443A1 (de) * 2006-09-21 2008-04-03 Robert Bosch Gmbh Automatische Erkennung von Beschichtungsfehlern
GB2442744B (en) * 2006-10-12 2009-07-08 Rolls Royce Plc A test apparatus and method
US7516663B2 (en) * 2006-11-03 2009-04-14 General Electric Company Systems and method for locating failure events in samples under load
US7549789B2 (en) * 2007-06-20 2009-06-23 General Electric Company Method and apparatus for thermographic nondestructive evaluation of an object
US8393784B2 (en) * 2008-03-31 2013-03-12 General Electric Company Characterization of flaws in composites identified by thermography
WO2010070383A1 (en) 2008-12-16 2010-06-24 Sabanci Universitesi A 3d scanner
US8577120B1 (en) 2009-11-05 2013-11-05 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Methods and systems for characterization of an anomaly using infrared flash thermography
US9066028B1 (en) 2010-01-08 2015-06-23 The United States Of America As Represented By The Administator Of The National Aeronautics And Space Administration Methods and systems for measurement and estimation of normalized contrast in infrared thermography
DE102010020874B4 (de) * 2010-05-18 2014-04-03 Dcg Systems, Inc. Verfahren zur Messzeitreduktion bei der thermografischen Prüfung eines Bauteils
US8692887B2 (en) * 2010-08-27 2014-04-08 General Electric Company Thermal imaging method and apparatus for evaluating coatings
US9007466B2 (en) * 2011-04-27 2015-04-14 General Electric Company System and method for thermographic inspection
US9357204B2 (en) * 2012-03-19 2016-05-31 Fittingbox Method for constructing images of a pair of glasses
US10343211B2 (en) 2016-08-25 2019-07-09 Honda Motor Co., Ltd. Thermal camera system for die-cast machine
CN110741136B (zh) * 2017-06-20 2022-04-12 西门子能源全球两合公司 暴露至使用中的腐蚀损伤的动力涡轮盘的寿命延长
KR101877480B1 (ko) 2017-11-24 2018-08-07 한국과학기술원 도막 두께 분포 시각화 방법 및 이를 위한 능동형 열화상 장치
JP7308577B2 (ja) * 2020-06-01 2023-07-14 ヤマハロボティクスホールディングス株式会社 音響式不良検出装置及び不良検出方法

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US4854724A (en) 1984-07-09 1989-08-08 Lockheed Corporation Method of and apparatus for thermographic evaluation of spot welds
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JPS62172249A (ja) 1986-01-25 1987-07-29 Kajima Corp 煙突の劣化診断方法及び装置
US4792683A (en) * 1987-01-16 1988-12-20 Hughes Aircraft Company Thermal technique for simultaneous testing of circuit board solder joints
US4872762A (en) 1987-08-25 1989-10-10 Nkk Corporation Method and apparatus for detecting defective portion on inner surface of pipe
GB8813423D0 (en) 1988-06-07 1988-07-13 Atomic Energy Authority Uk Coating inspection
US5032727A (en) 1990-09-14 1991-07-16 Digital Equipment Corporation Product defect detection using thermal ratio analysis
US5250809A (en) 1992-01-24 1993-10-05 Shuji Nakata Method and device for checking joint of electronic component
US5201582A (en) * 1992-05-15 1993-04-13 Stress Photonics, Inc. Differential temperature stress measurement employing array sensor with local offset
US5246291A (en) 1992-06-01 1993-09-21 Motorola, Inc. Bond inspection technique for a semiconductor chip
US5292195A (en) 1992-09-09 1994-03-08 Martin Marietta Corporation Thermographic evaluation technique
US5376793A (en) 1993-09-15 1994-12-27 Stress Photonics, Inc. Forced-diffusion thermal imaging apparatus and method
US5539656A (en) 1994-10-11 1996-07-23 United Technologies Corporation Crack monitoring apparatus
US5683181A (en) 1995-05-12 1997-11-04 Thermal Wave Imaging, Inc. Method and apparatus for enhancing thermal wave imaging of reflective low-emissivity solids
US5631465A (en) 1996-02-29 1997-05-20 Shepard; Steven M. Method of interpreting thermographic data for non-destructive evaluation
WO1998005921A1 (de) 1996-07-31 1998-02-12 Siemens Aktiengesellschaft Verfahren zur wanddickenbestimmung an einer turbinenschaufel und vorrichtung zur durchführung des verfahrens
WO1998005949A1 (de) 1996-07-31 1998-02-12 Siemens Aktiengesellschaft Verfahren und vorrichtung zur delaminationsprüfung bei beschichtungen auf substraten, insbesondere bei vps-beschichtungen auf gasturbinenschaufeln
US5711603A (en) 1996-10-30 1998-01-27 United Technologies Corporation Nondestructive testing: transient depth thermography
JPH10274675A (ja) 1997-03-31 1998-10-13 Shimadzu Corp 放射線検出器

Also Published As

Publication number Publication date
JP2003505683A (ja) 2003-02-12
TR200200140T2 (tr) 2002-06-21
EP1203199A1 (en) 2002-05-08
KR20020035105A (ko) 2002-05-09
EP1203199B1 (en) 2004-11-03
WO2001007867A1 (en) 2001-02-01
US6367968B1 (en) 2002-04-09
DE60015555D1 (de) 2004-12-09
BR0012644A (pt) 2002-04-09
DE60015555T2 (de) 2005-12-08
TW463047B (en) 2001-11-11

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