KR100665332B1 - Wireless communication module - Google Patents

Wireless communication module Download PDF

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KR100665332B1
KR100665332B1 KR1020050126773A KR20050126773A KR100665332B1 KR 100665332 B1 KR100665332 B1 KR 100665332B1 KR 1020050126773 A KR1020050126773 A KR 1020050126773A KR 20050126773 A KR20050126773 A KR 20050126773A KR 100665332 B1 KR100665332 B1 KR 100665332B1
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printed circuit
circuit board
baseband
signal
chip element
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Korean (ko)
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최대규
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삼성전기주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/4912—Layout
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Abstract

A wireless communication module is provided to protect signal reception and transmittance from surrounding interference signal by receiving and transmitting a signal through a direct connection wire. Plural conductive patterns and bonding pads(31a) are formed on a printed circuit board(31). Plural passive electronic elements are connected to the bonding pads. A radio frequency chip device(32) is mounted on the printed circuit board, and is connected to a portion of the bonding pads via a first indirect wire(32b). A baseband chip device(33) is mounted on the printed circuit board, and is connected to a portion of the bonding pads via a second indirect wire(33b). The radio frequency chip device is directly connected to the baseband chip device via a direct connection wire(32a).

Description

무선통신 모듈{WIRELESS COMMUNICATION MODULE}Wireless Communication Module {WIRELESS COMMUNICATION MODULE}

도1은 종래의 무선통신 모듈의 개략적인 구성도이다.1 is a schematic configuration diagram of a conventional wireless communication module.

도2는 종래의 무선통신 모듈의 일부 단면도이다.2 is a partial cross-sectional view of a conventional wireless communication module.

도3a 및 도3b는 본 발명에 따른 무선통신 모듈의 일 실시 예를 나타내는 평면도 및 단면도이다.3A and 3B are a plan view and a cross-sectional view showing an embodiment of a wireless communication module according to the present invention.

도4는 본 발명에 따른 무선통신 모듈의 다른 실시 예를 나타내는 단면도이다.4 is a cross-sectional view showing another embodiment of a wireless communication module according to the present invention.

<도면의 주요부분에 대한 상세한 설명><Detailed Description of Main Parts of Drawing>

31...인쇄회로기판 31a...본딩 패드31 ... printed circuit board 31a ... bonding pad

32...RF 칩소자 32a...직접 연결용 와이어 32 ... RF chip element 32a ... Direct connection wire

32b...제1간접 와이어 33...베이스밴드칩소자32b ... first indirect wire 33 ... base band chip element

33b...제2간접 와이어33b ... 2nd indirect wire

본 발명은 무선통신 모듈에 관한 것으로 특히, 모듈의 크기를 더욱 소형화할 수 있는 무선통신 모듈에 관한 것이다.The present invention relates to a wireless communication module, and more particularly, to a wireless communication module that can further reduce the size of the module.

일반적으로, 무선통신 모듈은 신호를 처리하는 반도체 IC 및 수동소자의 조합으로 이루어지며, 주로 PC, PDA 등에 적용되는 무선랜 등에 사용된다. 이러한 무선랜은 경박단소화되어 감에 따라 무선통신 모듈 또한 초소형의 반도체 IC를 사용하고 인쇄회로기판을 집적화하여 소형화되는 추세이다.In general, a wireless communication module is composed of a combination of a semiconductor IC and a passive device for processing a signal, and is mainly used in a wireless LAN applied to a PC, a PDA, and the like. As wireless LANs become smaller and thinner, wireless communication modules also use miniature semiconductor ICs and integrate printed circuit boards.

도1은 종래의 무선통신 모듈의 개략적인 구성도이다.1 is a schematic configuration diagram of a conventional wireless communication module.

도1을 참조하면 종래의 무선통신 모듈(10)은 안테나(ANT)로부터 RF신호를 송수신하여 상기 RF신호와 베이스밴드신호를 상호 변환하는 RF 칩(12)과, 상기 RF 칩(12)과 상기 베이스밴드신호를 송수신하며 상기 베이스밴드를 복변조하는 베이스밴드 칩(13)과, 상기 RF 칩(12) 및 상기 베이스밴드 칩(13)과 소정의 신호를 송수신하여 소정 동작을 수행하는 주변회로(14)로 구성된다.Referring to FIG. 1, the conventional wireless communication module 10 transmits and receives an RF signal from an antenna ANT, and converts the RF signal and the baseband signal to each other. A baseband chip 13 which transmits and receives a baseband signal and demodulates the baseband, and a peripheral circuit which transmits and receives a predetermined signal with the RF chip 12 and the baseband chip 13 to perform a predetermined operation ( 14).

이러한, 종래의 무선통신 모듈은 인쇄회로기판에 집적화되는데 그 형태는 도2를 참조하여 설명하기로 한다.Such a conventional wireless communication module is integrated in a printed circuit board, the form of which will be described with reference to FIG.

도2는 종래의 무선통신 모듈의 일부 단면도이다.2 is a partial cross-sectional view of a conventional wireless communication module.

도2에 도시된 바와 같이, 종래의 무선통신 모듈(20)은 소정의 도전 패턴이 형성된 인쇄회로기판(21)에 장착된 RF칩(22)과 베이스밴드칩(23)을 포함한다. 상기 인쇄회로기판(21)에는 복수의 본딩 패드(21a)가 마련되어 있어 상기 RF칩(22)에 포 함된 복수의 제1 와이어(22a)와 상기 베이스밴드칩(23)에 포함된 복수의 제2 와이어(13a)가 접촉된다. 상기 RF칩(22) 및 베이스밴드칩(23)은 상기 복수의 제1 와이어(22a)와 제2 와이어(23a)를 통해 신호를 송수신하여 해당되는 동작을 수행한다. 상기 무선통신 모듈(20)은 절연을 위해서 형성된 몰딩부(25)를 갖는다.As shown in FIG. 2, the conventional wireless communication module 20 includes an RF chip 22 and a baseband chip 23 mounted on a printed circuit board 21 having a predetermined conductive pattern. The printed circuit board 21 is provided with a plurality of bonding pads 21a so that a plurality of first wires 22a included in the RF chip 22 and a plurality of second elements included in the baseband chip 23 are provided. The wire 13a is in contact. The RF chip 22 and the baseband chip 23 transmit and receive signals through the plurality of first wires 22a and the second wires 23a to perform a corresponding operation. The wireless communication module 20 has a molding part 25 formed for insulation.

이러한, 종래의 무선통신 모듈(20)은 상기 인쇄회로기판(21)에 다수의 본딩 패드(11a)를 마련하여, 마련된 본딩 패드(21a)가 점유하는 면적만큼 모듈의 크기를 소형화하는데 용이하지 않다. 또한, 상기 RF칩(22) 및 베이스밴드칩(23)간에 송수신 되는 주요 신호가 와이어 및 본딩 패드(21a)를 통해 이루어져 신호손실이 크다는 문제점이 있다. 이러한 문제점을 해결하기 위해, 상기 RF칩(22)과 베이스밴드칩(23)을 적층하여 사용하는 경우도 제시되었으나, 모듈의 크기를 축소하는 대신 본딩 패드를 통해 신호를 송수신하는 와이어의 높이에 의해, 모듈의 높이를 축소할 수 없다는 문제점이 있다. 또한, 송수신되는 주요 신호는 여전히 와이어 및 본딩 패드를 통해 이루어져 신호손실의 문제점은 여전히 해결되지 않는 문제점이 있다.In the conventional wireless communication module 20, a plurality of bonding pads 11a are provided on the printed circuit board 21, and thus, it is not easy to reduce the size of the module by the area occupied by the prepared bonding pads 21a. . In addition, the main signal transmitted and received between the RF chip 22 and the baseband chip 23 through the wire and the bonding pad (21a) has a problem that the signal loss is large. In order to solve this problem, a case where the RF chip 22 and the baseband chip 23 are stacked is also used, but instead of reducing the size of the module, the height of the wire that transmits and receives a signal through a bonding pad is reduced. There is a problem that the height of the module cannot be reduced. In addition, the main signal to be transmitted and received is still made through the wire and the bonding pad, there is a problem that the problem of signal loss is still not solved.

상술한 문제점을 해결하기 위해, 본 발명의 목적은 주요신호의 송수신을 목적으로 하는 와이어를 본딩 패드를 통하지 않고 직접 연결하여 모듈의 크기를 소형화할 수 있는 무선통신 모듈을 제공하는 것이다.In order to solve the above problems, it is an object of the present invention to provide a wireless communication module that can reduce the size of the module by directly connecting the wire for the purpose of transmitting and receiving the main signal through the bonding pads.

상술한 목적을 달성하기 위해, 본 발명은,In order to achieve the above object, the present invention,

다수의 도전 패턴과 본딩패드가 형성된 인쇄회로기판과, 다수의 본딩패드 중 일부의 본딩패드에서 연결된 복수의 수동 전자부품과, 상기 인쇄회로기판 상에 장착되어 다수의 본딩패드 중 다른 일부에 제1 간접 와이어를 통해 연결되며 RF신호를 송수신하고 상기 RF신호와 베이스밴드신호를 상호 변환하는 RF 칩소자와, 상기 인쇄회로기판 상에 장착되어 다수의 본딩패드 중 또 다른 일부에 제2 간접 와이어를 연결되며, 상기 베이스밴드신호를 복변조하여 송수신하고 상기 RF 칩소자를 제어하는 베이스밴드 칩소자와, 상기 RF칩소자와 상기 베이스밴드 칩소자의 적어도 일부 단자를 직접 상호 연결하는 직접 연결용 와이어를 포함하는 것을 특징으로 하는 무선통신 모듈을 제공한다. A printed circuit board on which a plurality of conductive patterns and bonding pads are formed, a plurality of passive electronic components connected by bonding pads of some of the plurality of bonding pads, and a plurality of passive pads mounted on the printed circuit board to a first portion of the plurality of bonding pads An RF chip element connected via an indirect wire to transmit and receive an RF signal and convert the RF signal and the baseband signal to each other, and a second indirect wire mounted on the printed circuit board to connect another second portion of the plurality of bonding pads. And a baseband chip device for transmitting and receiving the baseband signal by demodulating and controlling the RF chip device, and a direct connection wire for directly connecting at least some terminals of the RF chip device and the baseband chip device. It provides a wireless communication module, characterized in that.

상기 RF 칩소자 및 베이스밴드 칩소자는 상기 인쇄회로기판 상면에 인접하여 장착되거나, 상기 베이스밴드 칩소자는 상기 인쇄회로기판에 장착된 RF 칩소자의 상면에 적층된 형태로 구현될 수 있다. 이 경우에 상기 RF 칩소자 및 상기 RF 칩소자 상면에 적층된 상기 베이스밴드 칩소자 사이에는 절연성 접합층이 형성되는 것이 바람직하다.The RF chip device and the baseband chip device may be mounted adjacent to an upper surface of the printed circuit board, or the baseband chip device may be implemented in a stacked form on an upper surface of the RF chip device mounted on the printed circuit board. In this case, it is preferable that an insulating bonding layer is formed between the RF chip element and the baseband chip element stacked on the RF chip element.

이하, 본 발명의 바람직한 실시 예를 첨부한 도면을 참조하여 상세히 설명한다. 본 발명에 참조 된 도면에서 실질적으로 동일한 구성과 기능을 가진 구성요소 들은 동일한 부호를 사용할 것이다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings referred to in the present invention, components having substantially the same configuration and function will use the same reference numerals.

도3a는 본 발명에 따른 무선통신 모듈의 일 실시 예를 나타내는 평면도이다.Figure 3a is a plan view showing an embodiment of a wireless communication module according to the present invention.

도3a를 참조하면, 본 발명에 따른 무선통신 모듈(30)은 소정의 도전성 패턴 및 본딩 패드(31a)가 형성된 인쇄회로기판(31)을 포함한다. 상기 인쇄회로기판(31)에는 상기 도전성 패턴을 통해 RF신호를 송수신하며 상기 RF신호와 베이스밴드신호를 상호 변환하는 RF 칩소자(32) 및 상기 RF 칩소자와 직접 접촉된 와이어를 통해 상기 베이스밴드신호를 송수신하고, 상기 RF 칩소자를 제어하며 상기 베이스밴드신호를 복변조하는 베이스밴드 칩소자(33)가 인접하여 장착된다.Referring to FIG. 3A, the wireless communication module 30 according to the present invention includes a printed circuit board 31 having a predetermined conductive pattern and a bonding pad 31a formed thereon. The printed circuit board 31 transmits and receives an RF signal through the conductive pattern and converts the RF signal and the baseband signal to each other, and the baseband through a wire in direct contact with the RF chip element. Baseband chip elements 33 for transmitting and receiving signals, controlling the RF chip elements, and demodulating the baseband signals are mounted adjacent to each other.

상기 RF 칩소자(32) 및 베이스밴드 칩소자(33)는 상기 인쇄회로기판(31)에 형성되어 소정의 동작을 수행하는 주변 회로부품으로서 복수의 수동소자(미도시)와 소정 신호를 송수신한다. 이때 신호의 송수신은 상기 인쇄회로기판(31)에 형성된 본딩패드(31a)에 통해 이루어지는데, 상기 RF 칩소자(32) 및 베이스밴드 칩소자(33)는 각각에 포함된 간접 와이어(32b, 33b)를 상기 본딩패드(31a)에 접속하여 소정신호를 송수신한다.The RF chip element 32 and the baseband chip element 33 are formed on the printed circuit board 31 and transmit and receive a predetermined signal with a plurality of passive elements (not shown) as peripheral circuit components for performing a predetermined operation. . At this time, the signal is transmitted and received through the bonding pad 31a formed on the printed circuit board 31, the RF chip element 32 and the baseband chip element 33 are indirect wires (32b, 33b) included in each ) Is connected to the bonding pad 31a to transmit and receive a predetermined signal.

또한, 상기 RF 칩소자(32) 및 베이스밴드 칩소자(33)는 상호 간에 베이스밴드신호 및 제어신호를 송수신한다. 상호 송수신되는 베이스밴드신호는 상기 무선통신 모듈(30)의 주요특성에 관련된 주요 신호중 하나이며, 또한, 주변신호 간섭에 민감하다. 이러한, 베이스밴드신호는 상기 RF 칩소자(32) 및 베이스밴드 칩소자(33)간에 직접 연결용 와이어(32a)를 통하여 상호 송수신된다. In addition, the RF chip element 32 and the baseband chip element 33 transmit and receive a baseband signal and a control signal to each other. The baseband signal transmitted and received to each other is one of the main signals related to the main characteristics of the wireless communication module 30, and is also sensitive to peripheral signal interference. The baseband signal is mutually transmitted and received between the RF chip element 32 and the baseband chip element 33 through a direct connection wire 32a.

상기 RF 칩소자(32) 및 베이스밴드 칩소자(33)에 연결되어 신호를 송수신하는 직접 연결용 와이어(32a) 및 간접 와이어(32b,33b)의 연결관계는 도3b를 참조하여 보다 상세히 설명한다.The connection relationship between the direct connection wire 32a and the indirect wires 32b and 33b connected to the RF chip element 32 and the baseband chip element 33 to transmit and receive signals will be described in more detail with reference to FIG. 3B. .

도3b는 도3a를 a-a' 방향으로 절개한 단면도이다.FIG. 3B is a cross-sectional view of FIG. 3A taken along the a-a 'direction.

도3b를 참조하면, 본 발명에 따른 무선통신 모듈(30)은 본딩 패드(31a)가 형성된 인쇄회로기판(31)을 포함한다. 상기 인쇄회로기판(31)의 동일면에는 상기 RF 칩소자(32) 및 베이스밴드 칩소자(33)가 인접하여 장착되어 있다. Referring to FIG. 3B, the wireless communication module 30 according to the present invention includes a printed circuit board 31 on which a bonding pad 31a is formed. The RF chip element 32 and the baseband chip element 33 are adjacently mounted on the same surface of the printed circuit board 31.

상기 RF 칩소자(32)는 제1 간접 와이어(32b)와 직접 연결용 와이어(32a)를 포함한다. 상기 제1 간접 와이어(32b)는 상기 본딩 패드(31a)에 연결되어 상기 주변회로부품(미도시) 및/또는 베이스밴드 칩소자(33)와 소정 신호를 교환한다. 상기 직접 와이어(32a)는 상기 베이스밴드 칩소자(33)와 직접연결되어 상기 베이스밴드신호를 송수신한다.The RF chip element 32 includes a first indirect wire 32b and a wire 32a for direct connection. The first indirect wire 32b is connected to the bonding pad 31a to exchange a predetermined signal with the peripheral circuit component (not shown) and / or the baseband chip element 33. The direct wire 32a is directly connected to the baseband chip element 33 to transmit and receive the baseband signal.

상기 베이스밴드 칩소자(33)는 상기 직접 연결용 와이어(32a)를 통해 상기 베이스밴드신호를 송수신하며, 제2 간접 와이어(33b)를 포함한다. 상기 제2간접 와이어(33b)는 상기 본딩 패드(31a)에 연결되어 상기 주변회로(미도시) 및/또는 RF 칩소자(32)와 소정 신호를 교환한다.The baseband chip element 33 transmits and receives the baseband signal through the direct connection wire 32a and includes a second indirect wire 33b. The second indirect wire 33b is connected to the bonding pad 31a to exchange a predetermined signal with the peripheral circuit (not shown) and / or the RF chip element 32.

상기 무선통신 모듈(30)은 각 회로구성 및 칩부품을 외부로부터 보호하기 위해서 인쇄회로기판 상면에 형성된 몰딩부(35)를 포함한다.The wireless communication module 30 includes a molding part 35 formed on an upper surface of a printed circuit board to protect each circuit configuration and chip components from the outside.

상기 본딩패드(31a)를 통하지 않고 상기 직접 와이어(32a)를 통하여 신호를 송수신하는 경우에는, 주위의 신호간섭으로부터 신호손실을 방지할 수 있을 뿐만 아니라, 직접 연결용 와이어(32a)에 의해 생략가능한 본딩패드가 점유하는 공간만큼 무선통신 모듈의 집적화 및 소형화가 가능하다는 장점이 있다.In the case of transmitting and receiving a signal through the direct wire 32a without passing through the bonding pad 31a, it is possible not only to prevent signal loss from surrounding signal interference, but also to omit it by the direct connection wire 32a. Wireless communication modules can be integrated and miniaturized as much as space occupied by the bonding pads.

상기 RF 칩소자(32) 및 베이스밴드부(33)는 상기 인쇄회로기판(31)의 동일면에 인접하여 장착되는데, 이러한 인접한 형태는 다양하게 구성될 수 있으며, 도4를 참조하여 본 발명의 다양한 형태를 설명한다.The RF chip element 32 and the base band unit 33 are mounted adjacent to the same surface of the printed circuit board 31. Such adjacent forms may be configured in various ways, and with reference to FIG. Explain.

도4는 본 발명에 따른 무선통신 모듈의 다른 실시 예를 나타내는 단면도이다.4 is a cross-sectional view showing another embodiment of a wireless communication module according to the present invention.

도4를 참조하면, 본 발명에 따른 무선통신 모듈(40)은 본딩패드(41a)가 형성된 인쇄회로기판(41)을 포함한다.Referring to FIG. 4, the wireless communication module 40 according to the present invention includes a printed circuit board 41 on which a bonding pad 41a is formed.

상기 인쇄회로기판(41)의 상면에는 RF 칩소자(42) 및 베이스밴드 칩소자(43)가 인접하여 장착되는데, 적층되어 장착된다. 일반적으로, RF 칩소자(42)의 크기가 상기 베이스밴드 칩소자(43)보다 더 크므로, 상기 인쇄회로기판(41)의 상면에 상기 RF 칩소자(42)가 장착되고 상기 베이스밴드 칩소자(43)는 상기 RF 칩소자(42)의 상면에 적층된다.The RF chip element 42 and the baseband chip element 43 are mounted adjacent to the upper surface of the printed circuit board 41, and are stacked and mounted. In general, since the size of the RF chip element 42 is larger than that of the baseband chip element 43, the RF chip element 42 is mounted on the upper surface of the printed circuit board 41 and the baseband chip element. 43 is laminated on the upper surface of the RF chip element 42.

상기 RF 칩소자(42) 및 상기 RF 칩소자(42)의 상면에 적층된 베이스밴드 칩소자(43)의 사이에는 전기적 절연뿐만 아니라, 전자기적 간섭을 저감시키기 위해서절연성 접합층(46)을 형성한다.An insulating bonding layer 46 is formed between the RF chip element 42 and the baseband chip element 43 stacked on the upper surface of the RF chip element 42 to reduce electromagnetic interference as well as electrical insulation. do.

직접연결용 와이어를 사용함으로써 본딩패드 면적의 감소를 통한 소형화뿐만 아니라, 본 실시형태와 같이, 상기 베이스밴드 칩소자(43)가 상기 RF 칩소자(42)의 상면에 적층되는 경우에는, 상기 베이스밴드 칩소자(43)의 점유면적만큼 모듈을 추가적으로 소형화시킬 수 있다.In addition to miniaturization by reducing the bonding pad area by using a wire for direct connection, as in the present embodiment, when the baseband chip element 43 is stacked on the upper surface of the RF chip element 42, the base The module can be further miniaturized by the area occupied by the band chip element 43.

이상에서 설명한 본 발명은 전술한 실시 예 및 첨부된 도면에 의해 한정되는 것이 아니고 특허청구범위에 의해 한정되며, 본 발명의 구성은 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 그 구성의 다양한 변경 및 개조가 가능하다는 것을 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자는 쉽게 알 수 있다.The present invention described above is not limited to the above-described embodiment and the accompanying drawings, but is defined by the claims, and the configuration of the present invention may be modified in various ways without departing from the spirit of the present invention. It will be apparent to those skilled in the art that modifications are possible.

상술한 바와 같이, 본 발명에 따르면, RF 칩소자 및 베이스밴드 칩소자 간에 본딩패드를 통하지 않고 직접 연결용 와이어를 통해 신호를 송수신함으로써, 주위의 간섭신호로부터 신호 송수신을 보호받을 수 있으며 본딩패드가 제외된 면적만큼 무선통신 모듈을 집적화 및 소형화할 수 있다. 또한, 베이스밴드 칩소자를 RF 칩소자에 적층함으로써, 베이스밴드 칩소자의 점유면적만큼 무선통신 모듈을 더욱 집적화 및 소형화할 수 있는 효과가 있다.As described above, according to the present invention, by transmitting and receiving a signal between the RF chip element and the baseband chip element through a wire for direct connection without a bonding pad, it is possible to protect the signal transmission and reception from the surrounding interference signal and the bonding pad is Wireless communication modules can be integrated and miniaturized as much as the excluded area. In addition, by stacking the baseband chip element on the RF chip element, there is an effect that the wireless communication module can be further integrated and downsized as much as the occupied area of the baseband chip element.

Claims (4)

다수의 도전 패턴과 본딩패드가 형성된 인쇄회로기판;A printed circuit board on which a plurality of conductive patterns and bonding pads are formed; 다수의 본딩패드 중 일부의 본딩패드에서 연결된 복수의 수동 전자부품;A plurality of passive electronic components connected in the bonding pads of some of the plurality of bonding pads; 상기 인쇄회로기판 상에 장착되어 다수의 본딩패드 중 다른 일부에 제1 간접 와이어를 통해 연결되며 RF신호를 송수신하고 상기 RF신호와 베이스밴드신호를 상호 변환하는 RF 칩소자;An RF chip device mounted on the printed circuit board and connected to another portion of the plurality of bonding pads through a first indirect wire, for transmitting and receiving an RF signal and converting the RF signal and the baseband signal to each other; 상기 인쇄회로기판 상에 장착되어 다수의 본딩패드 중 또 다른 일부에 제2 간접 와이어를 연결되며, 상기 베이스밴드신호를 복변조하여 송수신하고 상기 RF 칩소자를 제어하는 베이스밴드 칩소자; 및A baseband chip device mounted on the printed circuit board to connect a second indirect wire to another portion of the plurality of bonding pads, and to demodulate and transmit the baseband signal and to control the RF chip device; And 상기 RF칩소자와 상기 베이스밴드 칩소자의 적어도 일부 단자를 직접 상호 연결하는 직접 연결용 와이어를 포함하는 것을 특징으로 하는 무선통신 모듈. And a direct connection wire for directly connecting at least some terminals of the RF chip element and the baseband chip element. 제1항에 있어서The method of claim 1 상기 RF 칩소자 및 베이스밴드 칩소자는 상기 인쇄회로기판 상면에 인접하여 장착되는 것을 특징으로 하는 무선통신 모듈. And the RF chip element and the baseband chip element are mounted adjacent to an upper surface of the printed circuit board. 제1항에 있어서The method of claim 1 상기 베이스밴드 칩소자는 상기 인쇄회로기판에 장착된 RF 칩소자의 상면에 탑재되는 것을 특징으로 하는 무선통신 모듈.The baseband chip device is a wireless communication module, characterized in that mounted on the upper surface of the RF chip device mounted on the printed circuit board. 제3항에 있어서The method of claim 3, 상기 RF 칩소자와 상기 베이스밴드 칩소자 사이에 형성된 절연성 접합층을 더 포함하는 것을 특징으로 하는 무선통신 모듈.And an insulating bonding layer formed between the RF chip element and the baseband chip element.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019182197A1 (en) * 2018-03-23 2019-09-26 김선국 Rf chip package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019182197A1 (en) * 2018-03-23 2019-09-26 김선국 Rf chip package

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