JP2011014659A - Composite electronic component module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite electronic component module wherein even a plurality of modules concerning the combination that has a function of causing interference with high possibility can be arranged properly without enlarging the module size.SOLUTION: An aggregate substrate mounting a plurality of modules each consisting of a plurality of electronic components is sealed with resin collectively. A ground electrode is arranged at least on one surface of the aggregate substrate to substantially reside in the center thereof, and the plurality of modules are arranged around the ground electrode. The plurality of modules concerning the combination that has a function causing interference with high possibility are arranged on both sides of at least one module having a function not causing interference. Alternatively, the plurality of modules may be arranged on both sides of the ground electrode to substantially face each other.

Description

  The present invention relates to a composite electronic component module that can be appropriately arranged without increasing the module size even if it is a combination of modules having a function that is highly likely to cause interference.

  In recent electronic component modules, there are many composite electronic component modules in which a plurality of functions are provided in one electronic component module. In particular, in an electronic component module having a wireless communication function, a composite electronic component module having, for example, a radio broadcast receiving function in addition to the main communication function has been developed.

  In a composite electronic component module having a plurality of functions, interference may occur depending on the types of functions combined, and a desired function may not be exhibited. For example, when a Bluetooth (registered trademark) module (hereinafter referred to as a BT module), which is a short-range wireless communication system, and an FM receiver module are combined, noise from an IC power circuit included in the composite electronic component module is received by FM. There may be a problem that it becomes difficult to receive FM radio waves with high sensitivity by flowing into the module.

  In order to solve such a problem, for example, the high-frequency circuit structure disclosed in Patent Document 1 has a structure in which circuit elements are arranged on both surfaces of a printed circuit board. By separately arranging the circuit elements on the front and back surfaces of the printed circuit board, it is possible to prevent interference between the circuit elements.

JP 2000-151633 A

  However, when the circuit elements are arranged on both the front and back surfaces of the printed circuit board as in the high-frequency circuit structure disclosed in Patent Document 1, it is difficult to reduce the size of the electronic component module. In addition, as electronic component modules become more multifunctional, demands for miniaturization, integration, and integration tend to increase. Separation on both the front and back sides due to an increase in circuit elements to be mounted on the board and restrictions on arrangement space. In many cases, it is difficult to arrange them.

  That is, when a plurality of circuit elements related to a combination having a function that is highly likely to cause interference are arranged adjacent to each other on the same plane, sufficient isolation between the circuit elements cannot be ensured, and a desired There was a problem that it was difficult to perform the function. Patent Document 1 discloses a technique for covering a circuit element with a shield case. However, a mounting method, a form, and the like are not disclosed, and it is unclear how the circuit element can actually be shielded. Cost reduction is difficult due to an increase in points.

  The present invention has been made in view of such circumstances, and even if it is a plurality of modules related to a combination having a function that is highly likely to cause interference, it is appropriately arranged without increasing the module size. An object of the present invention is to provide a composite electronic component module capable of performing

  In order to achieve the above object, a composite electronic component module according to a first aspect of the present invention is a composite electronic component module in which a collective substrate on which a plurality of modules composed of a plurality of electronic components are mounted is collectively sealed with a resin. A ground electrode is disposed substantially at the center of at least one surface of the collective substrate, and a plurality of the modules are disposed around the ground electrode.

  In the first invention, the ground electrode is arranged at substantially the center of at least one surface of the collective substrate, and a plurality of modules are arranged around the ground electrode, so that noise such as an IC power supply circuit included in the module can be reduced. Even when a plurality of modules related to a combination having a function that is highly likely to cause interference can be arranged, the module can be separated on both the front and back sides of the collective board. Therefore, it is possible to provide a miniaturized composite electronic component module.

  Further, the composite electronic component module according to the second invention is the composite electronic component module according to the first invention, wherein the module is configured in a predetermined functional unit, and the plurality of modules related to a combination having a function that is highly likely to cause interference are: It is characterized in that at least one other module that does not cause interference with the module is disposed in between.

  In the second invention, the modules are configured in predetermined functional units. For a plurality of modules related to a combination having a function that is highly likely to cause interference, at least one other module having a function that does not cause interference is interposed between the modules, for example, an IC included in the module. Even if a plurality of modules related to a combination having a function that is highly likely to cause interference can be avoided, such as noise from the power supply circuit or the like directly entering other modules, the front and back of the collective board There is no need to arrange the modules separately on both sides, and a miniaturized composite electronic component module can be provided.

  In the composite electronic component module according to the third invention, the plurality of modules according to the combination having a function having a high possibility of causing interference in the second invention are arranged at positions substantially opposed to each other across the ground electrode. It is characterized by the above.

  In the third invention, by disposing a plurality of modules related to the combination having a function that is highly likely to cause interference at positions substantially opposed to each other with the ground electrode interposed therebetween, noise such as an IC power supply circuit included in the module is prevented. Even when a plurality of modules related to a combination having a function that has a low possibility of intruding into another module and a high possibility of causing interference, it is necessary to arrange the modules separately on both the front and back sides of the collective board. Therefore, a miniaturized composite electronic component module can be provided.

  The composite electronic component module according to a fourth aspect of the present invention is the composite electronic component module according to the first aspect, wherein the area where the ground electrode is disposed is a rectangle, and the plurality of modules related to a combination having a function that is highly likely to cause interference The ground electrodes are arranged in regions close to different sides of the region in which the ground electrode is disposed.

  In the fourth invention, the area where the ground electrode is disposed is rectangular, and a plurality of modules having a function having a high possibility of causing interference are brought close to different sides of the area where the ground electrode is disposed. By arranging in the area to be used, it is possible to avoid the direct entry of noise such as the power supply circuit of the IC included in the module into other modules, and a plurality of combinations related to functions having a high possibility of causing interference. Even when the modules are arranged, it is not necessary to arrange the modules separately on both the front and back surfaces of the collective substrate, and a miniaturized composite electronic component module can be provided.

  A composite electronic component module according to a fifth aspect of the present invention is the composite electronic component module according to any one of the first to fourth aspects of the present invention, wherein other grounding is provided on the peripheral portion of the same surface as the surface on which the grounding electrode is disposed. An electrode is arranged.

  In the fifth invention, a plurality of modules having a function that is highly likely to cause interference by disposing another ground electrode separately on the peripheral portion of the same surface as the surface having the ground electrode of the collective substrate. Since it can be placed between the via electrodes connected to the ground electrode, it can also prevent intrusion of external signals, noise, etc., and the function is lost due to interference. It is possible to provide a composite electronic component module that is not able to be used.

  A composite electronic component module according to a sixth aspect of the present invention is the composite electronic component module according to any one of the first to fifth aspects, wherein a plurality of the modules are mounted on both the front and back surfaces of the collective substrate, and the plurality of modules are collectively sealed. A mounting electrode is arranged on the back side of the resin that is stopped.

  In the sixth invention, a plurality of modules are mounted on both the front and back surfaces of the collective substrate. By disposing the mounting electrodes on at least the back surface side of the resin in which a plurality of modules are collectively sealed, the mounting strength can be increased.

  A composite electronic component module according to a seventh invention is the mounting electrode according to the sixth invention, wherein the plurality of modules are collectively connected to the back side of the resin in which the plurality of modules are collectively sealed, And the pseudo electrode which is not electrically connected is arrange | positioned.

  In the seventh invention, at least the back surface side of the resin in which the plurality of modules are collectively sealed is provided with a pseudo electrode that is not electrically connected to the plurality of modules, so that the electrodes can be arranged over the entire back surface. Therefore, the mounting strength can be further increased.

  The composite electronic component module according to an eighth aspect of the present invention is the composite electronic component module according to the sixth or seventh aspect, wherein a plurality of via-hole electrodes are formed in a resin in which a plurality of the modules are collectively sealed, and the grounding of the collective substrate An electrode is connected to at least one of the mounting electrodes via a plurality of the via hole electrodes.

  In the eighth invention, the ground electrode can be reliably functioned as the ground by connecting the ground electrode of the collective substrate and at least one mounting electrode via the plurality of via hole electrodes.

  With the above configuration, it is possible to reduce the possibility that noise such as the power supply circuit of the IC included in the module directly intrudes into other modules, and to arrange a plurality of modules related to combinations having a high possibility of causing interference Even in such a case, it is not necessary to separately arrange the front and back surfaces of the collective substrate, and a compact composite electronic component module can be provided.

It is sectional drawing which shows the structure of the composite electronic component module which concerns on embodiment of this invention. It is a block diagram which shows the structure of the module which concerns on embodiment of this invention. It is a bottom view which shows module arrangement | positioning in the back surface of the aggregate substrate of the composite electronic component module which concerns on embodiment of this invention. It is a schematic diagram which shows arrangement | positioning of the electrode in the back surface of the aggregate substrate of the composite electronic component module which concerns on embodiment of this invention. It is a schematic diagram which shows other arrangement | positioning of the electrode in the back surface of the aggregate substrate of the composite electronic component module which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing a configuration of a composite electronic component module according to an embodiment of the present invention. The composite electronic component module 1 according to the embodiment of the present invention has a rectangular parallelepiped shape of 5.6 mm × 4.55 mm × 1.35 mm as an example, and a collective substrate 11 made of ceramic, glass, epoxy resin, and the like, , And a module 13 having a plurality of functions. The semiconductor element is mounted on the surface of the collective substrate 11, and the electronic components 12, 12,.

  The module 13 according to the present embodiment is configured as a composite module in which a BT module and an FM receiving module are integrated. FIG. 2 is a block diagram showing the configuration of the module 13 according to the embodiment of the present invention.

  As shown in FIG. 2, the module 13 includes a composite chipset 131 that realizes two functions, that is, a short-range wireless communication function and an FM radio reception function based on Bluetooth, and a band-pass filter (BPF) used for Bluetooth communication. 132. The composite chipset 131 includes a Bluetooth RF (High Frequency Processing) module (BT module) 133 that performs short-range wireless communication using Bluetooth and an FM reception module 134 that receives FM radio waves. . Further, communication antennas 135 and 135 are extended from the Bluetooth RF module 133 and the FM reception module 134, respectively. The composite chip set 131 incorporates a power supply circuit 136.

  The module 13 includes a terminal group 137 capable of transmitting and receiving data through a plurality of interfaces. For example, a module control interface UART, a voice input / output interface PCM,..., A Bluetooth / wireless LAN connection interface WLANCoex, and the like are provided.

  Returning to FIG. 1, the collective substrate 11 is, for example, an LTCC (Low Temperature Co-fired Ceramics) substrate having a rectangular top surface and a thickness of approximately 0.6 mm. On the collective substrate 11, signal patterns (not shown) that also serve as bonding pads for the electronic components 12, 12,... And the module 13 are formed. The signal pattern of the collective substrate 11 is connected to the electronic components 12, 12,..., Such as semiconductor elements, ICs, and the terminals of the module 13 by bonding wires, solder, or the like.

  A sealing resin layer 14 made of synthetic resin is formed on both the front and back surfaces of the collective substrate 11 so as to cover the collective substrate 11, the electronic components 12, 12,. On the top surface (top surface) and side surfaces of the sealing resin layer 14, a shield layer 15 that shields the electronic components 12, 12,... And the module 13 from electric field noise and electromagnetic wave noise is formed. Further, mounting electrodes 16, 16,... For connecting the composite electronic component module 1 to the mounting substrate are arranged on the lower surface of the sealing resin layer 14, and a signal pattern inside or on the surface of the collective substrate 11. Are electrically connected via via-hole electrodes 17, 17,.

  Conventionally, in a composite electronic component module in which electronic components and modules are mounted on both the front and back sides of a collective substrate, the entire surface of one of the surfaces (hereinafter referred to as a surface) is used as a mounting area for mounting electronic components and modules. The other surface (hereinafter referred to as the back surface) has been used as a mounting region and a module terminal region in which external terminals of the composite electronic component module are arranged. That is, on the back surface of the collective substrate, the mounting area and the module terminal area are clearly separated.

  Since the mounting area and the module terminal area are clearly separated, the module terminal area cannot be arranged in the mounting area, and the electronic component and the module related to the combination having a function having a high possibility of causing interference. In order to secure the necessary isolation, there was no method other than disposing the distance between them. Therefore, the distance between the electronic components and modules arranged in the mounting area and the ground electrode is inevitably long. For example, the ground electrode is weakened by repeatedly attaching and detaching the composite electronic component module. There was a risk of causing deterioration of the mechanical characteristics.

  In addition, when the ratio of the total area of the module terminal area where the external terminals of the composite electronic component module are arranged on the back surface of the collective board is reduced, and the mounting area cannot be arranged at the approximate center of the back face of the collective board The module terminal area cannot be arranged rotationally symmetrically about the approximate center of the back surface of the collective substrate. Therefore, there is a possibility that the fixing force of the module is lowered and the mechanical characteristics are deteriorated.

  For example, as shown in FIG. 2, when the Bluetooth RF module 133 and the FM receiver module 134 are mounted at the same time, the FM receiver module 134 interferes due to power noise leaked from the power circuit 136 when both are arranged adjacent to each other. Therefore, FM radio waves cannot be received normally. Therefore, in the embodiment of the present invention, by considering the position where the ground electrode is disposed, it is possible to secure isolation between the power supply circuit 136 and the FM reception module 134 and prevent interference from occurring. Yes.

  FIG. 3 is a bottom view showing the module arrangement on the back surface of the collective substrate 11 of the composite electronic component module 1 according to the embodiment of the present invention. A ground electrode 31 that functions as a ground by connecting the composite electronic component module 1 to a grounding mounting electrode on the mounting substrate is disposed at substantially the center of the back surface of the collective substrate 11 of the composite electronic component module 1. Then, the FM receiving module 32 and the power supply circuit 33 are arranged around the ground electrode 31, for example, at positions that are substantially opposed to each other with the ground electrode 31 in FIG. Between the FM receiving module 32 and the power supply circuit 33, at least one other module having a function that does not cause interference is arranged.

  In the conventional composite electronic component module, since the ground electrode is not arranged at the approximate center of the back surface of the collective substrate, a power circuit that easily generates noise, and an electronic component or module that has a wireless communication function that easily interferes with noise It was difficult to ensure isolation between the two. However, as shown in FIG. 3, by arranging the ground electrode 31 substantially at the center of the back surface of the collective substrate 11, most of the noise generated in the power supply circuit 33 is induced to the outside through the ground electrode 31. Therefore, if it avoids arrange | positioning in the position where both adjoin, the possibility that the FM receiving module 32 will interfere with the noise of the power supply circuit 33 will reduce markedly.

  Of course, as shown in FIG. 3, the FM receiving module 32 and the power supply circuit 33 are preferably arranged at positions substantially opposite to each other with the ground electrode 31 interposed therebetween, but they are not adjacent to each other, that is, the FM receiving module 32 and the power supply circuit 33. When at least one other module having a function that does not cause interference is disposed between the two, the FM reception module 32 is interfered by the noise of the power supply circuit 33 and the reception sensitivity is reduced. The possibility of damage is reduced.

  In addition, when the region where the ground electrode is arranged as shown in FIG. 3 is a rectangle, a plurality of composite electronic component modules having a function having a high possibility of causing interference are arranged with the ground electrode 31. By arranging them in areas that are close to different sides of each other, it is possible to avoid the FM receiving module 32 and the power supply circuit 33 from being adjacent to each other.

  FIG. 4 is a schematic diagram showing the arrangement of electrodes on the back surface of the collective substrate 11 of the composite electronic component module 1 according to the embodiment of the present invention. Regardless of the arrangement of the ground electrode 31, FM receiver module 32, power supply circuit 33, other electronic components 12, 12,..., Modules 13, 13,. .. Are arranged in alignment with the positions of the via-hole electrodes 17, 17,... (Circular broken line) arranged in a matrix. That is, not only the mounting electrodes 16, 16,... Electrically connected to the arranged electronic components 12, 12,..., Modules 13, 13,. ..,... Can be maintained at a high mounting strength (mechanical strength) by arranging the pseudo electrodes 18, 18,... That are not electrically connected to the modules 13, 13,. It becomes possible. The ground electrode 31 formed on the back surface of the collective substrate 11 and the ground electrode region 43 formed on the lower surface of the sealing resin layer 14 are connected by via-hole electrodes 17, 17,.

  In FIG. 4, the mounting electrodes 16, 16,... Are arranged in the mounting electrode region 41 corresponding to the region in which the electronic components 12, 12,. ing. On the other hand, the pseudo electrodes 18, 18,... Are the ground electrode region 43 (hatched portion) corresponding to the region where the ground electrode 31 is disposed, the electronic components 12, 12,. Are arranged in a peripheral region 42 corresponding to a region where. By arranging the electrodes in this way, the electrodes can be arranged evenly on the surface opposite to the surface on which the shield layer 15 is formed, and a reduction in the fixing force of the composite electronic component module 1 can be avoided. Can do. Therefore, the mounting strength can be kept high.

  The ground electrode 31 may be disposed at substantially the center of the back surface of the collective substrate 11 of the composite electronic component module 1. For example, another ground electrode is disposed at the periphery of the back surface of the collective substrate 11 of the composite electronic component module 1. May be. FIG. 5 is a schematic diagram showing another arrangement of electrodes on the back surface of the collective substrate 11 of the composite electronic component module 1 according to the embodiment of the present invention.

  In the example of FIG. 5, not only the ground electrode 31 is arranged at the approximate center of the back surface of the collective substrate 11 of the composite electronic component module 1 but also the peripheral edge portion on the back surface of the collective substrate 11 of the composite electronic component module 1. The ground electrode is arranged. Therefore, the pseudo electrodes 18, 18,... Are the ground electrode region 43 (hatched portion) corresponding to the region where the ground electrode 31 is disposed and the peripheral electrode region corresponding to the region where another ground electrode is disposed. 51 (hatching part). In this way, by arranging the electronic components 12, 12,... And the modules 13, 13,... In the region 52 sandwiched between the regions where the ground electrodes are disposed, for example, with the FM receiving module 32 Even when there is a possibility that the FM receiver module 32 may be interfered by noise of the power supply circuit 33 as in the combination with the power supply circuit 33, it is easy to induce noise to the outside through the ground electrode 31. It is not necessary to arrange the modules apart from each other, and the degree of freedom in layout increases.

  As described above, according to the present embodiment, it is possible to reduce the possibility that noise such as a power circuit of an IC included in the composite electronic component module 1 directly enters another module, and there is a high possibility that interference will occur. Even when a plurality of electronic components, modules, etc. related to a combination having a function are arranged, there is no restriction such as arranging separately on the front and back sides of the collective substrate, and a compact electronic component module can be provided. It becomes possible.

  It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications and substitutions are possible within the scope of the gist of the present invention. For example, the ground electrode may be arranged on the front surface as well as the back surface of the collective substrate.

DESCRIPTION OF SYMBOLS 1 Composite electronic component module 11 Collective board 12 Electronic component 13 Module 14 Sealing resin layer 15 Shield layer 16 Mounting electrode 17 Via-hole electrode 18 Pseudo electrode

Claims (8)

In a composite electronic component module in which a collective substrate on which a plurality of modules composed of a plurality of electronic components are mounted is sealed with a resin,
A ground electrode is disposed at substantially the center of at least one surface of the collective substrate,
A composite electronic component module comprising a plurality of the modules arranged around the ground electrode. The module is configured in a predetermined functional unit,
A plurality of the modules related to a combination having a function that is highly likely to cause interference are arranged such that at least one other module that does not cause interference with the module is interposed therebetween. The composite electronic component module according to claim 1.   3. The composite electronic component module according to claim 2, wherein the plurality of modules related to a combination having a function that is highly likely to cause interference are arranged at substantially opposing positions with the ground electrode interposed therebetween. .   The area where the ground electrode is arranged is a rectangle, and the plurality of modules according to the combination having a function that is highly likely to cause interference are areas close to different sides of the area where the ground electrode is arranged. The composite electronic component module according to claim 1, wherein the composite electronic component module is arranged in a vertical direction.   5. The composite electron according to claim 1, wherein another ground electrode is disposed on a peripheral portion of the same surface as the surface on which the ground electrode is disposed of the collective substrate. Parts module. A plurality of the modules are mounted on both front and back surfaces of the collective substrate,
6. The composite electronic component module according to claim 1, wherein a mounting electrode is disposed on a back surface side of a resin in which a plurality of the modules are sealed together.   A mounting electrode that is electrically connected to the plurality of modules and a pseudo electrode that is not electrically connected are arranged on the back surface side of the resin in which the plurality of modules are collectively sealed. The composite electronic component module according to claim 6. A plurality of via hole electrodes are formed in a resin in which a plurality of the modules are collectively sealed,
The composite electronic component module according to claim 6, wherein the ground electrode of the collective substrate and at least one of the mounting electrodes are connected via a plurality of the via-hole electrodes.

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