KR100660779B1 - 기판 상에 식각 및 비식각 영역을 만들기 위한 장치 - Google Patents
기판 상에 식각 및 비식각 영역을 만들기 위한 장치 Download PDFInfo
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- KR100660779B1 KR100660779B1 KR1020050092824A KR20050092824A KR100660779B1 KR 100660779 B1 KR100660779 B1 KR 100660779B1 KR 1020050092824 A KR1020050092824 A KR 1020050092824A KR 20050092824 A KR20050092824 A KR 20050092824A KR 100660779 B1 KR100660779 B1 KR 100660779B1
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- 239000007921 spray Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 230000000873 masking effect Effects 0.000 description 9
- 238000000059 patterning Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
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- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
Description
Claims (7)
- 평판 인쇄 작업이 진행되는 공간에 배치되며 기판을 로딩하기 위한 스테이지;상기 스테이지에 로딩된 기판측에 식각 및 비식각 영역을 구분하기 위한 패턴면을 가지는 소프트 몰드;상기 스테이지 위쪽에 위치하고 상기 기판에 대응하는 자세로 상기 소프트 몰드를 분리 가능하게 고정하기 위한 고정수단;상기 기판 또는 상기 소프트 몰드 중에서 어느 하나의 위치를 변화시키면서 임프린트 동작이 진행되도록 하는 리프트수단;상기 기판과 상기 소프트 몰드가 임프린트 동작된 후 이들을 분리하기 전에 서로 맞대어진 접촉면 사이에 작용하는 접착력을 기체의 분사 압력으로 제거하기 위한 분사수단을 포함하는 기판 상에 식각 및 비식각 영역을 만들기 위한 장치.
- 청구항 1에 있어서, 상기 고정수단은, 상기 소프트 몰드를 평탄하게 고정하기 위한 홀더와, 이 홀더를 적어도 2군데 이상 걸림 상태로 수평하게 고정하기 위한 로더를 포함하는 기판 상에 식각 및 비식각 영역을 만들기 위한 장치.
- 청구항 1에 있어서, 상기 분사수단은, 노즐부와, 이 노즐부에 분사용 기체를 공급하기 위한 기체공급부를 포함하는 기판 상에 식각 및 비식각 영역을 만들기 위 한 장치.
- 청구항 3에 있어서, 상기 노즐부는, 서로 맞대어진 기판과 소프트 몰드를 사이에 두고 배치되며 이들의 테두리변을 향하여 적어도 2군데 이상의 지점에서 일정한 압력으로 기체를 분사하는 것을 특징으로 하는 기판 상에 식각 및 비식각 영역을 만들기 위한 장치.
- 청구항 3에 있어서, 상기 기체공급부는, 콤프레서나 블로워가 사용되는 기판 상에 식각 및 비식각 영역을 만들기 위한 장치.
- 청구항 3에 있어서, 상기 노즐부는, 기판과 소프트 몰드의 테두리변에 대응하는 단일 또는 복수개의 노즐홀들로 이루어지는 기판 상에 식각 및 비식각 영역을 만들기 위한 장치.
- 청구항 1에 있어서, 상기 리프트수단은, 실린더나 모터와 같은 구동원에 의해 상기 스테이지나 상기 고정수단 중에서 어느 하나의 위치를 변화시키면서 상기 기판 또는 상기 소프트 몰드가 임프린트 동작되도록 하는 기판 상에 식각 및 비식각 영역을 만들기 위한 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020050092824A KR100660779B1 (ko) | 2005-10-04 | 2005-10-04 | 기판 상에 식각 및 비식각 영역을 만들기 위한 장치 |
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KR1020050092824A KR100660779B1 (ko) | 2005-10-04 | 2005-10-04 | 기판 상에 식각 및 비식각 영역을 만들기 위한 장치 |
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KR100660779B1 true KR100660779B1 (ko) | 2006-12-26 |
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KR1020050092824A KR100660779B1 (ko) | 2005-10-04 | 2005-10-04 | 기판 상에 식각 및 비식각 영역을 만들기 위한 장치 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100957229B1 (ko) * | 2007-12-07 | 2010-05-11 | 주식회사 디엠에스 | 기판에 식각 영역을 만들기 위한 장치 |
KR101054920B1 (ko) | 2009-01-09 | 2011-08-05 | 주식회사 디엠에스 | 임프린트 장치 |
CN105034344A (zh) * | 2015-06-01 | 2015-11-11 | 青岛博纳光电装备有限公司 | 一种大面积纳米压印软模具复制装置及方法 |
KR101568271B1 (ko) | 2009-12-30 | 2015-11-12 | 엘지디스플레이 주식회사 | 평판 표시 소자의 제조 장치 및 방법 |
-
2005
- 2005-10-04 KR KR1020050092824A patent/KR100660779B1/ko not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100957229B1 (ko) * | 2007-12-07 | 2010-05-11 | 주식회사 디엠에스 | 기판에 식각 영역을 만들기 위한 장치 |
KR101054920B1 (ko) | 2009-01-09 | 2011-08-05 | 주식회사 디엠에스 | 임프린트 장치 |
KR101568271B1 (ko) | 2009-12-30 | 2015-11-12 | 엘지디스플레이 주식회사 | 평판 표시 소자의 제조 장치 및 방법 |
CN105034344A (zh) * | 2015-06-01 | 2015-11-11 | 青岛博纳光电装备有限公司 | 一种大面积纳米压印软模具复制装置及方法 |
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