KR100651667B1 - The wrought aluminium alloy board material excellent in thermal conductivity and formability, and its manufacture method - Google Patents

Abstract

An aluminum alloy sheet material having excellent electroconductivity, thermal conductivity and molding processability in press molding and having high strength is obtained.

In mass%, Si: 0.2-1.5%, Mg: 0.2-1.5%, Ti: 0.015 sec.-0.2%, Mn: 0.02-0.15%, Cr: 0.02-0.14% Or two kinds are contained, remainder consists of Al and an unavoidable impurity, electrical conductivity is 50% IACS or more, and thermal conductivity is 200 w / m * K or more. When cold-rolling the aluminum alloy material of the said component, during the cold rolling, the solution treatment of 500-570 degreeC is performed, and after the cold rolling of the final cold rolling rate of 5-40%, the annealing heated to 150-190 degreeC is carried out. Do it. Excellent conductivity, thermal conductivity, high molding performance and strength can be ensured, and materials suitable for use in plasma displays, electronic components, and the like can be obtained.

Description

Aluminum alloy board with excellent thermal conductivity and formability and its manufacturing method {THE WROUGHT ALUMINIUM ALLOY BOARD MATERIAL EXCELLENT IN THERMAL CONDUCTIVITY AND FORMABILITY, AND ITS MANUFACTURE METHOD}

1 is a graph showing a correlation between electrical conductivity and thermal conductivity.

INDUSTRIAL APPLICABILITY The present invention is suitable for electronic imaging parts such as plasma displays, electronic parts such as computers, and general household telephone product parts, and the like. In particular, an aluminum alloy plate having excellent thermal conductivity and formability, which is suitable for use as a heat sink and a case body. And a method for producing the aluminum alloy plate.

Plasma display is composed of an image part that illuminates an image and an integrated part of an electronic part, and has a structure that is thinly hung on the wall in terms of function, so that the image part and the electronic part are in close proximity, and the thermal effect on the electronic part is reduced. You need to do it minimally. The image portion that illuminates the image is a collection of light emitting elements, and since the high voltage is loaded on the elements, the amount of heat generated is large, and the influence on the surroundings is inevitable. In addition, the heat generated by the plasma display, which illuminates the clear image, changes the conductivity of the structure functioning as the electric circuit, and thus not only causes noise to the accurately adjusted electronic circuit, but also significantly affects the semiconductor electronic components used. It is likely to go. Therefore, in order to protect the electronic parts that have excellent functions from the heat generation of the image part, a heat dissipation part is placed between the image part and the electronic part integration part, and the heat of the image part is dispersed to avoid heating to the local part. We install hot air balloon.

By the way, it is known that the Al-Si-Mg alloy widely used for automobile exterior materials etc. can secure high electrical conductivity by adjusting rolling conditions and heat processing conditions (for example, Nonpatent literature 1, patent document 1, 2) In view of such high electrical conductivity, it is also used in electric wires and busbars. In addition, the electrical conductivity and the thermal conductivity show a high correlation as shown in Fig. 1, and the material having high conductivity can be said to be a material having high thermal conductivity. That is, the Al-Si-Mg alloy having high electrical conductivity has good thermal conductivity, and can be said to be a suitable material as a heat dissipation member for shielding and diffusing heat generated in the image portion with respect to the electronic component integrated portion. In addition, although the heat dissipation part is located at the same time between the image part and the integrated part of the electronic part, and also requires a function as a structural member and excellent strength and formability, Al-Si-Mg alloy is formed to form a part shape. It is also equipped with a castle. For this reason, Al-Si-Mg alloy is widely used as a heat sink material of said plasma display.

[Non-Conventional Document 1] "Regarding Recent Aluminum Alloys for Challenge," Sumitomo Denki Symbol, Published in January, 1976, No. 112

[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-226628

[Patent Document 2] Japanese Patent Application Laid-Open No. 2000-87198

However, the heat dissipation material currently used for components for plasma displays has a focus on improving conductivity and securing strength, and is not sufficiently press-formable, which is excellent in mass productivity to secure component shapes, and large in determining shapes. It is a constraint. Particularly, in bending after the introduction of tensile deformation during press molding, cracking cannot be avoided in the outer peripheral portion of the bending, and it is necessary to bend with a large bending radius which is not suitable for the surrounding shape. In addition, to secure the strength, combined with an electronic device or the like, the strength of the structure, the function of preventing scratches and deformation due to collision, etc., are required, and the thermal conductivity, the conductivity, and the formability can be ensured. Development of lightweight aluminum alloys is expected.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides an aluminum alloy plate having excellent thermal conductivity and conductivity, and high formability, and a method for producing the same, by optimizing components or by optimizing manufacturing conditions. will be.

That is, in the aluminum alloy plate material excellent in the thermal conductivity and formability of this invention, invention of Claim 1 is mass%, Si: 0.2-1.5%, Mg: 0.2-1.5%, Ti: 0.015 second-0.2%, It contains one kind or two kinds of Mn: 0.02 ~ 0.15%, Cr: 0.02 ~ 0.14%, the balance consists of Al and unavoidable impurities, the conductivity is 50% IACS or more and the thermal conductivity is 200w / mK or more It features.

The invention of the aluminum alloy plate material excellent in the thermal conductivity and formability of a 2nd base material is further characterized by containing Cu: 0.01 to 1% by mass% in invention of a 1st base material.

The invention of the aluminum alloy plate material excellent in the thermal conductivity and formability of the third substrate is characterized in that, in the invention of the first substrate, the rare earth element is contained in an amount of 0.01% to 0.2% by mass%.
The invention of the aluminum alloy plate material excellent in the thermal conductivity and formability of the base material of claim 4 is characterized in that, in the invention of the base material of claim 2, the rare earth element is contained in a mass% of 0.01 to 0.2%.

Invention of the aluminum alloy plate material excellent in the thermal conductivity of a 5th base material and a moldability is the invention of any one of Claims 1-4, In addition, it contains Be: 0.0020 to 0.02% by mass%, It is characterized by the above-mentioned. .

As for invention of the aluminum alloy plate material excellent in the thermal conductivity of a 6th base material, and a moldability, in the invention of any one of Claims 1-4, the yield strength in a tensile test is 200 Mpa or more and the bending in 180 degree bending test. The limit is characterized by satisfying the following formula (1).

^{y≤-0.23x 3 + 1.0286x 2 -0.5786x} + 0.1 ... (One)

X: plate thickness (mm), y = limit bending radius (mm)
In the invention of the aluminum alloy sheet having excellent thermal conductivity and formability of the seventh substrate, in the invention of the fifth substrate, the yield strength in the tensile test is 200 MPa or more and the bending limit in the 180 ° bending test is represented by the following formula (1) It is characterized by satisfying.
^{y≤-0.23x 3 + 1.0286x 2 -0.5786x} + 0.1 ... (One)
X: plate thickness (mm), y = limit bending radius (mm)

Invention of the aluminum alloy plate material excellent in the thermal conductivity and formability of Claim 8 is used for the heat sink or case body for electric and electronic components in the invention as described in any one of Claims 1-4.
The invention of the aluminum alloy plate material which is excellent in the thermal conductivity and formability of Claim 9 is used for the heat sink or case body for electric and electronic components in invention of Claim 5, It is characterized by the above-mentioned.
The invention of the aluminum alloy plate material which is excellent in the thermal conductivity and formability of Claim 10 is used for the heat sink or case body for electric and electronic components in invention of Claim 6, It is characterized by the above-mentioned.

Claim 11 The invention of the manufacturing method of the aluminum alloy plate material excellent in the thermal conductivity and formability of the substrate is Si: 0.2 to 1.5%, Mg: 0.2 to 1.5%, Ti: 0.015 seconds to 0.2%, Mn: 0.02 to The solution treatment which contains 0.15%, Cr: 0.02 to 0.14%, 1 type or 2 types and heats it to 500-570 degreeC during cold rolling, when the remainder cold-rolls the aluminum alloy material which consists of Al and an unavoidable impurity. Then, after cold rolling with a final cold rolling rate of 5 to 40%, annealing heated to 150 to 190 ° C by a batch annealing furnace or a continuous annealing furnace is performed, and the conductivity is 50% IACS or more and the thermal conductivity is 200 w / m. It is characterized by obtaining the aluminum alloy plate of K or more.

Invention of the manufacturing method of the aluminum alloy plate material excellent in the thermal conductivity and formability of Claim 12 WHEREIN: In the invention of Claim 11, the said aluminum alloy material also contains Cu: 0.01 to 1% by mass%, It is characterized by the above-mentioned. do.

The invention of the method for producing an aluminum alloy sheet material having excellent thermal conductivity and formability of a base material according to claim 13 is the invention of the base material according to claim 11 or 12, wherein the aluminum alloy material further contains a rare earth element: 0.01 to 0.2% by mass%. It features.

Invention of the aluminum alloy plate material excellent in the heat conductivity and formability of Claim 14 is the invention of Claim 11 or 12 WHEREIN: The said aluminum alloy material is further characterized by containing Be: 0.0020 to 0.02% by mass%.
Invention of the aluminum alloy plate material excellent in the thermal conductivity and formability of Claim 15 is the invention of Claim 13 WHEREIN: The said aluminum alloy material is further characterized by containing Be: 0.0020 to 0.02% by mass%.

Next, the conditions, such as the alloying component prescribed | regulated by the aluminum alloy plate of this invention or its manufacturing method, are demonstrated.

Si: 0.2 ~ 1.5%

Si and Mg are important components in securing the properties such as strength, formability and electrical conductivity of the alloy. The amount of Si secures the component strength after molding in balance with the amount of Mg, but in the range exceeding 1.5%, the influence on the electrical conductivity is particularly large, and the bending workability is hindered. On the other hand, when the amount of Si is less than 0.2%, it causes a lack of strength after molding. Therefore, the amount of Si is made into 0.2 to 1.5% of range. For the same reason, the lower limit is preferably 0.4% and the upper limit is 1.1%.

Mg: 0.2 ~ 1.5%

Mg is an effective component for improving the tensile strength, improving the cracking limit in press molding, and securing the part strength. Although the Mg content is effective in improving the strength, in the range exceeding 1.5%, the electrical conductivity is particularly a large inhibitor. In addition, when the content is less than 0.2%, it is difficult to secure the strength. Therefore, Mg content is made into 0.2 to 1.5% of range. For the same reason, the lower limit is preferably 0.4% and the upper limit is 0.8%.

Ti: over 0.015% to 0.2%

Ti prevents slab cracking during casting, and also serves to reduce the surface roughness during processing such as bending, extension, and shrinkage by miniaturizing the grain size. However, with 0.015% or less of content, it is difficult to fully acquire these effects. On the other hand, when Ti is contained in excess of 0.2%, it becomes a large inhibitor of conductivity and thermal conductivity, and the intermetallic compound increases and the moldability worsens. For this reason, Ti content is set to 0.015 second-0.2%.

Moreover, it is preferable to set a minimum as 0.04% and an upper limit as 0.10% for the same reason as mentioned above.

Cr: 0.02 ~ 0.14%

Mn: 0.02 ~ 0.15%

Trace amounts of Cr are effective for miniaturization of grains and prevent surface roughness from occurring during processing such as bending, extension, and shrinkage. Trace amounts of Mn are effective for miniaturization of grains and improve workability such as bending, extension, and shrinkage. Therefore, one or both of Cr and Mn are contained to improve moldability. However, if each contains less than 0.02%, the said effect cannot fully be obtained. On the other hand, when it exceeds 0.14% in Cr and 0.15% in Mn, Fe and an intermetallic compound are produced and workability, such as bending, extension, and shrinkage, is inhibited. Therefore, it is set in the range of 0.02 to 0.14% in Cr and 0.02 to 0.14% in Mn. For the same reason, the lower limit of Cr is preferably set to 0.02% and the upper limit to 0.06%, and the lower limit of Mn is preferably set to 0.04% and the upper limit to 0.10%. In addition, when it contains both Cr and Mn, it is preferable to limit the total content of both to 0.2% or less. This is because if the total amount exceeds 0.2%, it will affect the quenching sensitivity during the solution treatment, and this will cause the strength of the final product and the moldability to be impaired.

Fe: 0.3% or less

Fe can be expected to have a finer grain size, but if it exceeds 0.3%, Fe is a deterrent to moldability. Therefore, Fe content is made into 0.3% or less. In addition, in order to fully acquire the said effect, it is preferable to make Fe content into 0.2% or more.

Cu: 0.01 ~ 1%

Cu is contained as desired in order to ensure strength and formability. However, if it exceeds 1%, moldability and conductivity lowering factors are caused, and if it is less than 0.01%, the above effect cannot be sufficiently obtained. Therefore, when it contains Cu, the content is made into 0.01 to 1% of range. For the same reason, the lower limit is preferably 0.02% and the upper limit is 0.2%.

Rare Earth Element: 0.01 to 0.2%

Rare earth elements are included as desired because they have the effect of making the grain size finer and the crystallized substance size smaller. In order to acquire this effect, 0.01% or more of content is required. On the other hand, when it exceeds 0.2%, since it exists as a crystallized substance and becomes a factor which inhibits moldability, when it contains a rare earth element, the content is prescribed | regulated to 0.01 to 0.2%. For the same reason, the lower limit is preferably 0.02% and the upper limit is 0.1%.

When the rare earth element is contained, one or more kinds of rare earth elements may be contained, or may be contained in the state of mischmetal.

Be: 0.0020 to 0.02%

Be has a function of preventing the productivity of casting and oxidation during hot rolling or continuous casting rolling, and also has an action of improving aging hardenability, and it is desired to be contained. In order to obtain these effects, the content is required to be 0.0020% or more. On the other hand, since the effect is not improved even if the content exceeds 0.02%, the content is defined as 0.0020 to 0.02% when Be is contained. For the same reason, the lower limit is preferably 0.005% and the upper limit is 0.008%.

Manufacture conditions

In this invention, the manufacturing conditions at the time of cold-rolling the aluminum alloy plate obtained by hot rolling or the aluminum alloy plate obtained by continuous casting rolling without hot rolling are defined next.

Solution treatment during cold rolling (500 to 570 ° C)

Converted from the final sheet thickness, the solution treatment is carried out leaving a cold rolling rate of 5 to 40%. The solution treatment conditions at this time are made into the temperature range of 500 degreeC-570 degreeC. If the solution treatment temperature is less than 500 ° C, sufficient solution treatment effect cannot be obtained, and process melting may occur at a temperature exceeding 570 ° C. Moreover, it is preferable to make a minimum into 540 degreeC for the same reason. After the solution treatment, for example, quenching is performed at a cooling rate of 1.0 ° C / sec or more by air cooling or water cooling. If the cooling rate is less than 1.0 ° C / sec, the hardening effect cannot be sufficiently obtained. By the solution treatment, the high capacity of the solute atoms increases, and the strength due to aging can be improved in the final annealing step.

After the solution treatment, cold rolling with a cold rolling ratio of 5 to 40% is performed. The purpose of this rolling is mainly to secure the electrical conductivity and strength, and when the rolling rate is less than 5%, the improvement of the conductivity lowered by the solution treatment cannot be sufficiently obtained, and the yield strength is less than 200 MPa. In rolling exceeding 40%, since elongation rate falls, it becomes the obstacle of molding workability. Therefore, the cold rolling rate (hereinafter referred to as final cold rolling rate) after the solution treatment is in the range of 5 to 40%. In addition, it is preferable that the lower limit of the final cold rolling rate be 10% and the upper limit be 20% for the same reason as above.

Annealing after cold rolling (150 ~ 190 ℃)

After cold rolling, annealing is performed to improve the strength by precipitation and to secure conductivity and moldability. When the annealing temperature is lower than 150 ° C., the strength, the electrical conductivity, and sufficient bending performance cannot be obtained. Under conditions exceeding 190 ° C., the bending workability and the electrical conductivity can be improved, but the decrease in strength cannot be avoided. Therefore, the heating temperature in this annealing is 150-190 degreeC.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described.

Although the aluminum alloy used by this invention is obtained by adjusting so that it may become a predetermined component and solvent by a conventional method, as for this invention, the means for obtaining an aluminum alloy is not specifically limited. The aluminum alloy may then be cast to form a slab and obtain an aluminum alloy sheet to be subjected to cold rolling by hot rolling, and further, an aluminum alloy sheet to be subjected to cold rolling from the aluminum alloy by continuous casting rolling. It may be to obtain. That is, as this invention, the manufacturing method of the aluminum alloy plate used for cold rolling is not limited to a specific thing.

In addition, when obtaining the said aluminum alloy plate by casting and hot rolling, it is preferable to perform a homogenization process in order to disperse | distribute the alloy component at the time of casting uniformly before the said hot rolling. It is preferable that this homogenization process is performed at the temperature of 450-550 degreeC for 4 hours or more and 20 hours or less. Moreover, in order to ensure moldability, it is preferable to set the temperature of injection | throwing-in to hot rolling after a homogeneous process as 450-550 degreeC. If the hot rolling temperature is lower than 450 ° C., the rolling load is high, which causes cracking at the end of the rolling. At temperatures exceeding 550 ° C., burn marks on the surface of the rolling roll are generated. As for the completion | finish temperature of hot rolling, 250-300 degreeC is preferable, More preferably, let it be the temperature of 280-300 degreeC.

After this, cold rolling is performed. At this time, the solution treatment is performed at a temperature of 500 to 570 ° C. while leaving a cold ratio of 5 to 40% during cold rolling as described above. Thereafter, cold rolling is performed at the final cold rolling rate to obtain a final cold rolled sheet thickness. After cold rolling, annealing is performed by a batch annealing furnace or a continuous annealing furnace in order to secure electrical conductivity and formability. The heating temperature in this annealing is performed by annealing at 150 ° C to 190 ° C to ensure a yield strength of 200 MPa or more, a conductivity of 50% IACS or more, and good moldability.

Although the obtained aluminum alloy plate is not limited to use for a specific use, it is suitably used for electronic image parts, electronic parts, general household telephone product parts, etc., and is especially suitable for use as a heat sink and a case body in these uses. Do.

The aluminum alloy plate in this invention is processed according to said use. Examples of the processing include bending processing, extension processing, shrinkage processing, and the like, which may be combined. As this invention, the said process content is not specifically limited. And the aluminum alloy plate in this invention can obtain the outstanding bending workability shown by following formula (1).

y≤-0.23x ³ + 1.0286x ² -0.5786x + 0.1... (One)

However, x; plate thickness (mm), y; limit bending radius (mm)

(Example 1)

Hereinafter, the Example of this invention is described, comparing with a comparative example.

The slab of thickness 44mm, width 250mm, and length 400mm is casted by the alloy components shown in Table 1 by semi-continuous casting. After homogeneous treatment at 560 ° C. × 8hr, 5 mm of faceted surface is cut, and the surface is heated to 510 ° C. and hot The sheet | seat of thickness 7.0mm was obtained by rolling.

Cold rolling is carried out to these sheets to obtain a predetermined thickness, and then quenched at a cooling rate of 5 ° C./sec or higher at a heating rate of 5 ° C./min or higher, and then solution solution for 530 to 540 ° C. × 40 sec. Cold rolling was performed at the final cold rolling ratio shown in the drawings, and finally a sheet material having a thickness of 1.0 mm × width of 180 mm × L was obtained. After rolling, annealing was performed at a temperature of 150 to 210 ° C. × 4 hr using a muffle kiln to prepare a test material.

About the test material obtained above, No. 5 test piece prescribed | regulated to JISH 4000 was extract | collected in parallel with a rolling direction, and tensile strength, proof strength, and elongation rate were measured. In addition, about formability, the inside bending radius of 0.5 mm and 180 degree bending is carried out using the test piece of width 20mm taken in parallel with a rolling direction, and the state of the crack and the surface roughness of the bending outer peripheral surface after a test is shown by visual confirmation below. Evaluation was carried out in five steps of 1 to 5. The bending limit was changed to the inner bending radius, bent 180 degrees, and the bending radius was defined as the minimum radius without the occurrence of cracking and no surface roughness (visual confirmation 3 or more).

Evaluation method and 1-5 step evaluation by visual confirmation of the outer peripheral surface of a bending (a numerical value in a table is an average of n = 2).

Evaluation 1: Good outer peripheral surface.

Evaluation 2: Weakly observed surface roughness on the outer circumferential surface.

Evaluation 3: generation of surface roughness (pass).

Evaluation 4: Minor occurrence of necking.

Evaluation 5: necking, occurrence of cracks.

Next, as for the electrical conductivity, the test piece of plate | board thickness x width 10mm x length 550mm was taken in parallel with the rolling direction, the specific resistance was measured by the double bridge method, and the electrical conductivity was computed as 100 pure copper specific resistance value.

No. Aluminum alloy component (mass%) Si Mg Fe Ti Mn Cr Cu Rare earths Be Al Inventive Alloy A 0.40 0.49 0.17 0.02 0.07 - - - - glass B 0.41 0.52 0.17 0.02 - 0.05 - - - glass C 0.45 0.50 0.17 0.03 0.07 0.05 - - - glass D 0.44 0.50 0.17 0.03 0.07 0.05 0.1 - - glass E 0.42 0.51 0.17 0.02 0.12 0.11 - - - glass F 0.40 0.50 0.17 0.10 0.07 - - - - glass G 0.45 0.50 0.17 0.03 0.07 - - 0.1 - glass H 0.45 0.50 0.17 0.03 0.07 - - 0.1 0.005 glass Comparative Alloy a 0.41 0.52 0.17 0.02 - - - - - glass b 0.13 0.49 0.52 0.04 0.01 - 0.13 - - glass c 0.90 0.51 0.28 0.01 0.05 0.21 0.03 - - glass d 0.45 0.52 0.17 0.3 0.07 - - - - glass e 0.43 0.51 0.17 0.03 0.2 - - - - glass

Test No. Alloy No. Final cold rolling rate (%) Annealed (℃) Tensile Strength (MPa) Load capacity (MPa) kidney (%) Bending visual confirmation Bending radius (mm) Conductivity (% IACS)    Invention One A 12.2 150 246 202 16.8 2 0 50.0 2 A 12.4 170 264 236 14.0 2 0 51.5 3 A 11.8 190 237 212 11.3 3 0.3 53.9 4 A 15.3 150 261 212 17.0 2 0 50.0 5 A 15.3 170 266 237 14.2 2 0 51.7 6 A 15.2 190 240 211 10.9 3 0.3 54.0 7 B 32.7 150 269 227 14.3 2 0 53.2 8 B 32.1 170 274 247 11.4 3 0.3 54.9 9 B 31.7 190 239 212 11.0 3 0.3 57.1 10 C 38.8 150 288 250 15.2 2 0 53.7 11 D 15.0 170 260 240 15.0 2 0 51.9 12 E 33 170 272 238 15.8 2 0 54.0 13 F 31 160 280 251 12.0 3 0.3 52.0 14 G 26 165 275 245 11.7 3 0.3 51.0 15 H 19 180 245 217 14.0 2 0 53.0

Test No. Alloy No. Final cold rolling rate (%) Annealed (℃) Tensile Strength (MPa) Load capacity (MPa) kidney (%) Bending visual confirmation Bending radius (mm) Conductivity (% IACS)          Comparative Example One a 12.4 210 ^* 216 188 11.7 3 0.0 55.0 2 a 15.8 210 ^* 213 188 11.6 3 0.0 54.7 3 a 15.9 None ^* 192 170 11.3 3 0.0 49.1 4 a 48.8 ^* 150 288 250 5.2 3 0.0 53.7 5 a 49.3 ^* 170 280 259 6.3 4 0.0 56.4 6 a 48.8 * 200 ^* 234 211 8.7 4 1.0 58.9 7 a 48.7 * 190 244 222 7.2 4 1.0 58.5 8 a 49.3 * 170 280 259 6.3 3 0.5 56.4 9 a 12.6 None ^* 183 163 14.5 3 0.5 49.2 10 A 12.6 None ^* 183 163 14.5 2 0 49.2 11 A 12.4 210 ^* 216 188 11.7 3 0.5 55.0 12 A 48.7 * 190 244 222 7.2 5 ＞ 1.5 58.5 13 A 12.6 None ^* 183 163 14.5 2 0 49.2 14 A 48.8 * 200 ^* 234 211 8.7 4 1.0 58.9 15 B 32.2 210 ^* 217 193 9.1 4 1.0 57.0 16 C 48.6 * None ^* 222 209 5.8 4 1.0 52.5 17 C 57.9 * 150 300 261 8.8 5 ＞ 1.5 47.3 18 C 57.4 * 200 ^* 237 216 7.4 4 1.0 55.4 19 C 57.4 * 190 247 225 5.9 5 ＞ 1.5 55.0 20 C 57.7 * 150 300 261 8.8 5 ＞ 1.5 47.3 21 C 57.3 * 170 285 261 7.6 5 ＞ 1.5 51.7 22 b 5 170 259 212 10.0 3 1.0 48.0 23 c 9 170 261 230 11.0 3 0.5 49.0 24 d 9 170 253 236 15.0 3 0.5 49.0 25 e 15 170 267 242 13.0 4 0.5 52.6

* Outside the scope of the present invention

As shown in Table 2, the invention material which is the aluminum alloy plate of this invention composition has the outstanding characteristic in all of electrical conductivity, thermal conductivity, strength, and bending workability. In particular, the invention examples confirmed that all of the annealing treatments at 150 ° C or higher had high electrical conductivity close to pure aluminum alloy 1100-H24 and tensile test strength of 230 MPa or more, and high bending performance could be secured by the bending test.

On the other hand, in the comparative examples outside the scope of the present invention, as shown in Table 3, the strengths (200 MPa or more), bending workability, and electrical conductivity were all inferior, and all of them were impossible to achieve the object of the present invention.

As described above, according to the aluminum alloy plate excellent in the thermal conductivity and formability of the present invention, the content of Si is 0.2 to 1.5%, Mg: 0.2 to 1.5%, and Ti: 0.015 seconds to 0.2%. It contains 1 type or 2 types of Mn: 0.02-0.15%, Cr: 0.02-0.14%, remainder consists of Al and an unavoidable impurity, electrical conductivity is 50% IACS or more, and thermal conductivity is 200w / m * Since it is more than K, excellent electrical conductivity, thermal conductivity, and high bending molding performance are ensured, and it can greatly contribute to the use of a plasma display, an electronic component, etc.

Moreover, according to the manufacturing method of the aluminum alloy plate excellent in the thermal conductivity and moldability of this invention, in mass%, Si: 0.2-1.5%, Mg: 0.2-1.5%, Ti: 0.015 second-0.2%, and Mn: 0.02 When cold-rolling an aluminum alloy material composed of Al and an unavoidable impurity containing one or two of -0.15% and Cr: 0.02-0.14%, the solution solution is subjected to a solution treatment at 500-570 ° C during cold rolling. Then, after cold rolling with a final cold rolling rate of 5 to 40%, annealing is performed at 150 to 190 ° C., so that the conductivity is 50% IACS or more, the thermal conductivity is 200 w / m · K or more, and the conductivity, thermal conductivity, It is possible to obtain an aluminum alloy plate excellent in strength and bending workability.

Claims (15)

1% or 2 types of Si: 0.2-1.5%, Mg: 0.2-1.5%, Ti: 0.015 second-0.2% by mass%, Mn: 0.02-0.15%, Cr: 0.02-0.14% The aluminum alloy electrolytic plate excellent in thermal conductivity and formability, wherein the remainder is made of Al and an unavoidable impurity, and the electrical conductivity is 50% IACS or more and the thermal conductivity is 200 w / m · K or more. The aluminum alloy whole plate excellent in thermal conductivity and formability of Claim 1 which further contains Cu: 0.01 to 1% by mass. The aluminum alloy telescopic plate according to claim 1, which further contains a rare earth element: 0.01 to 0.2% by mass%. 3. The aluminum alloy body plate excellent in thermal conductivity and formability according to claim 2, further comprising: rare earth element: 0.01 to 0.2% by mass. The aluminum alloy electrical board according to any one of claims 1 to 4, further comprising Be: 0.0020 to 0.02% by mass%. The thermal conductivity and formability according to any one of claims 1 to 4, wherein the bending strength in the tensile strength test of 200 MPa or more and the 180 ° bending test satisfies the following formula (1). This outstanding aluminum alloy body plate. y≤-0.23x ³ + 1.0286x ² -0.5786x + 0.1... (One) X: sheet thickness (mm), y: limit bending radius (mm) The aluminum alloy electroplating plate with excellent thermal conductivity and formability according to claim 5, wherein the bending strength in the tensile test of 200 MPa or more and the 180 ° bending test satisfies the following formula (1). y≤-0.23x ³ + 1.0286x ² -0.5786x + 0.1... (One) X: sheet thickness (mm), y: limit bending radius (mm) The aluminum alloy teleboard according to any one of claims 1 to 4, which is used for heat dissipation plates or case bodies for electric and electronic parts. The aluminum alloy telescopic plate according to claim 5, which is used for a heat sink or a case body for electric and electronic parts. The aluminum alloy body plate excellent in thermal conductivity and formability of Claim 6 used for the heat sink or case body for electric and electronic components. In mass%, Si: 0.2-1.5%, Mg: 0.2-1.5%, Ti: 0.015 sec.-0.2%, Mn: 0.02-0.15%, Cr: 0.02-0.14%, 1 type or 2 types are contained, When the remainder is cold rolled an aluminum alloy material composed of Al and unavoidable impurities, a solution treatment for heating to 500 to 570 ° C is performed during cold rolling, and then quenching is performed at a cooling rate of 1.0 ° C / sec or more by air cooling or water cooling. Then, after cold rolling with a final cold rolling rate of 5 to 40%, annealing heated to 150 to 190 ° C by a batch annealing furnace or continuous annealing furnace is performed, and the electrical conductivity is 50% IACS or more and the thermal conductivity is 200 w / m. A method for producing an aluminum alloy whole body plate having excellent thermal conductivity and formability, comprising obtaining an aluminum alloy plate of K or more. 12. The method for producing an aluminum alloy whole body plate with excellent thermal conductivity and formability according to claim 11, wherein the aluminum alloy material further contains Cu: 0.01 to 1% by mass. The method for producing an aluminum alloy whole body plate with excellent thermal conductivity and formability according to claim 11 or 12, wherein the aluminum alloy material further contains a rare earth element: 0.01 to 0.2% by mass%. The said aluminum alloy material contains Be: 0.0020 to 0.02% by mass%, The manufacturing method of the aluminum alloy body plate excellent in the thermal conductivity and moldability of Claim 11 or 12 characterized by the above-mentioned. The method for producing an aluminum alloy whole body plate with excellent thermal conductivity and formability according to claim 13, wherein the aluminum alloy material further contains Be: 0.0020 to 0.02% by mass.

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