KR100651177B1 - Bump Type Conductive Particle Composition with Anisotropic Conduction and Anisotropic Conductive Film Using the Same - Google Patents

Abstract

The present invention is to immobilize the first metal layer plated on the surface of the polymer resin particles or the projection-forming fine particles of the inorganic fine particles or the organic particles treated with a functional group having a chemical affinity with the metal on the surface of the substrate fine particles of the metal particles The present invention relates to a projection conductive fine particle and an anisotropic conductive film comprising the same, wherein the surface of the second metal layer is plated.

Accordingly, according to the configuration of the present invention, by forming a plurality of projections on the surface of the substrate fine particles to maximize the contact area between the conductive fine particles and the connecting body after heating and pressing in the thermosetting adhesive resin of the anisotropic conductive film to minimize the interface deviation This can provide fine particles exhibiting stable conductivity in the z-axis direction.

In addition, by increasing the surface area of the fine particles individually, there is an excellent effect that a more stable connection resistance value can be obtained by minimizing the fluidity that the fine particles escape between the connecting bodies due to heat and pressure.

Anisotropic conductive film, protrusions, conductive fine particles, metal plating layer

Description

Bump Type Conductive Particle Composition with Anisotropic Conduction and Anisotropic Conductive Film Using the Same}

1 is a cross-sectional view of the substrate fine particles of the projection-type conductive fine particles according to the present invention, respectively, cross-sectional views of the metal fine particles, primary core material conductive particles,

2 is a flow chart schematically showing the surface treatment process of the projection-type conductive fine particles according to the present invention,

3 is a schematic cross-sectional view and a front view of the protruding conductive fine particles according to the present invention;

Figure 4 is a cross-sectional view schematically showing the configuration between the substrate and the anisotropic conductive film molded from the resin composition containing the projection conductive fine particles according to the present invention, showing a model before the pressing,

5 is a cross-sectional view schematically showing a state after the compression of the anisotropic conductive film adhesive and the substrate of FIG.

6 is a cross-sectional view schematically showing a state before the projection conductive fine particles according to the present invention is connected to the bump electrode of the circuit board;

7 is a cross-sectional view schematically showing a state after the protruding conductive fine particles according to the present invention are connected to a bump electrode of a circuit board.

<Brief description of the main symbols in the drawings>

1 conductive fine particles 3 integrated circuit for driving

4: liquid crystal display substrate

5: anisotropic film containing conductive fine particles

10: base material fine particles 10a: metal fine particles

10b: primary core material conductive particles 11: polymer resin particles

12: first metal layer 13: second metal layer

21 projection-forming microparticles 31 bump electrode

41: wiring pattern

The present invention relates to conductive fine particles and an anisotropic conductive film comprising the same, and more particularly, to a projection-type conductive fine particles having a structure in which the protrusions are discontinuously fixed and complexed on the surface of the conductive fine particles and an anisotropic conductive film comprising the same will be.

Recently, as the high resolution and colorization of the liquid crystal display device progress, the pixel pitch decreases, and the number of leads printed on the liquid crystal display panel increases. Due to such technical requirements, packaging technology for connection between substrates has been developed in response to this, and as the circuit becomes finer, the packaging technology has also been developed in various ways.

Typical anisotropic conductive film adhesives are placed between the connecting parts of the circuit board, heated and pressed, whereby terminals adjacent in the direction parallel to the substrate (x- and y-axis directions) do not conduct electricity, but in the vertical direction (z). Axially adjacent terminals are electrically connected.

This conductive function is achieved by conductive fine particles dispersed in the adhesive polymer material in the film, the conductive fine particles have been prepared by coating a metal material on the surface of the polymer substrate fine particles made of a polymer component, a method for producing such conductive fine particles Japanese Unexamined Patent Publication Nos. 52-147797, 61-277104, 1-225776, 1-247501, 4-4147513 and the like.

However, the conductive fine particles composed of only a uniform metal layer on the surface of the polymer-based fine particles have a higher coefficient of linear expansion than that of the binder when the polymer resin particles are made of an elastic material such as silicone or rubber. Therefore, the connection resistance becomes unstable when positioned between the electrical connection electrodes due to heating and pressurization, thereby increasing the resistance due to the deviation of the interface between the conductive particles and the connection pattern and reducing the connection reliability after thermal aging.

In addition, the conventional conductive fine particles are inferior in dispersibility due to aggregation in the crude liquid, and when the prepared anisotropic conductive connection material is placed between the electrode and the terminal to be connected and heated and pressed to bond, the general conductive fine particles are heat and pressure. It is fluidized by, and as a result, the conductive fine particles located between the upper and lower connectors come out between the bumps, and thus, the amount of conductive fine particles that play a role of conducting between the connecting bodies is reduced, thereby reducing the conductance.

In order to solve the above problems, Japanese Patent No. 3083535 et al. Employs a hybridizer of Nara Machinery Corporation to fix polymer fine protrusion particles on the surface of polymer resin particles by a dry air flow friction method to impart protrusions to the metal layer. A plating method has been disclosed.

However, in the case of using the above apparatus for compounding between particles, the smaller the specific gravity difference between particles, the more difficult it is to obtain a uniform compounding. For this reason, it is difficult to uniformly form protrusions when immobilized using polymer particles having similar specific gravity as described above, and the fixed protrusion-forming fine particles have a low binding force with the polymer resin particles, thereby pre-treating and plating metal layer plating. There is a drawback of deviation.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to plate a first metal layer on the surface of the polymer resin particles, fix the protrusion-forming fine particles, and then plate the second metal layer to connect the conductive particles and the connection pattern. At the interface of, it is possible to minimize the increase in resistance value when peeling occurs, to facilitate dispersion by preventing the aggregation of the conductive fine particles, and to prevent the loss due to the movement of the conductive fine particles during the circuit connection using heating and pressurization. The purpose is to provide.                         

In addition, another object of the present invention is to provide an anisotropic conductive film containing the projection-type conductive fine particles.

In order to achieve the above object, the present invention provides a process of coating a first metal layer on a surface of a polymer resin particle or an organic fine particle treated with an inorganic fine particle or a functional group having a chemical affinity with a metal on the surface of a substrate fine particle which is a metal fine particle. After immobilizing the formed fine particles, the surface-like conductive fine particles are plated with a second metal layer.

delete

The projection-type conductive fine particles are characterized in that one or more projections are discontinuously fixed to the surface of the substrate fine particle.

The maximum height from the surface of the substrate fine particles to the second metal layer is 1.1 to 10 times the minimum height. When the substrate fine particles are metal bodies, plating of the first metal layer is unnecessary, and the maximum height from the surface of the metal fine particles to the second metal layer is 1.1 to 10 times the minimum height.

The second metal layer is plated using gold, platinum, silver, and the like, which have lower electrical connection resistance and excellent conductivity than the first metal layer.

delete

The inorganic fine particles are characterized by being monodisperse silica fine particles having a size of 100 to 800 nm.

The functional group having a chemical affinity with the metal is characterized in that the thiol group or carboxy group, hydroxy group, glycol group, aldehyde group, oxazole group, amine group, amide group, imide group, nitro group, nitrile group, sulfone group.

The particle size of the protrusion-forming fine particles is characterized in that about 0.5 to 20% of the particle size of the polymer substrate fine particles.

The protrusion-forming fine particles cover 0.1 to 99.9% of the surface area of the substrate fine particles.

The protruding conductive fine particles have an average particle diameter of 1 to 20 µm.

The protruding conductive fine particles are characterized by having a specific gravity of 1.5 to 3.5 g / cm 3.

In addition, the present invention provides an anisotropic conductive adhesive film, characterized in that the protrusion-like conductive fine particles are dispersed by molding in an insulating adhesive resin.

The insulating adhesive is made of a resin component having an epoxy group or an acrylic group and a resin component for film formation.

The anisotropic conductive adhesive film is characterized by further comprising a curing agent and an additive.

Hereinafter, the protrusion type conductive fine particles and the anisotropic conductive film including the same according to the present invention will be described in detail with reference to FIGS. 1 to 6.

1 and 2, the conductive fine particles 1 dispersed and contained in the anisotropic conductive film of the present invention have a structure in which a plurality of protrusions are discontinuously fixed to the plated surface by applying a protrusion to the conductive fine particles. At this time, the surface of the substrate fine particles is characterized in that the organic or inorganic projection-like fine particles 21 are fixed discontinuously, the second metal layer is plated thereon.

As the substrate fine particles 10 of the protruding conductive fine particles 1, both the primary core material conductive particles 10b or the metal fine particles 10a obtained by plating the first metal layer on the surface of the polymer resin particles 11 can be applied.

The protruding conductive fine particles 1 have a structure in which organic or inorganic protruding fine particles 21 are fixed to the surfaces of the base fine particles 10a and 10b, and the second metal layer 13 is plated thereon. At this time, the second metal layer 13 is preferably a gold plating layer.

In addition, the thickness of the second metal layer plated on the surfaces of the substrate fine particles 10a and 10b and the projection-forming fine particles 21 is preferably 1 to 5% of the particle size of the substrate fine particles 10a and 10b.

When the substrate fine particles 10 are primary core conductive particles 10b, the protruding conductive fine particles 1 are formed of a first metal layer 12 plated with a metal component on the surface of the polymer resin particle 11, and sequentially The organic or inorganic protrusion-forming fine particles 21 are fixed, and the outermost part has a structure in which the second metal layer 13 is plated.

At this time, the primary core conductive particles (10b) are spherical fine particles, the resin of the polymer resin particles used at this time is a phenol resin, urea resin, melamine resin, fluorine resin, polyester resin, epoxy resin, silicone resin, polyimide resin Thermosetting polymer resins such as polyurethane resins, propylene resins, polyolefin resins, as well as polyethylene resins, polypropylene resins, polybutylene resins, polymethacrylic resins, methylene resins, polystyrene resins, acrylonitrile-styrene resins, acrylics Ronitrile-styrene-butadiene resin, vinyl resin, divinylbenzene resin, polyamide resin, polyester resin, polycarbonate resin, polyacetal resin, polyether sulfone resin, polyphenyloxide resin, polyphenylene sulfide resin, polysulfone Thermoplastic polymer resins such as resins and polyurethane resins. The polymer resin particles 11 can be synthesized by an emulsion polymerization method.

In addition, the first metal layer 12 is preferably a nickel plating layer 12. Cobalt, copper, zinc, iron, lead, aluminum, manganan, chrome, palladium, ruthenium, rhodium, vanadium (cobalt) instead of nickel Other conductive metals such as vanadium, zirconium, indium, rhenium, titanium, molybdenum, tin and tungsten may also be used.

In this case, the thickness of the first metal layer 12 to be plated on the surface of the polymer resin particles 11 is preferably 1 to 5% of the particle diameter of the polymer resin particles 11.

As described above, when the specific gravity of the polymer resin particles 11 is plated on the surface of the polymer resin 11 and the specific gravity is increased by increasing the specific gravity, the projection-forming microparticles may be formed on the surface of the plated substrate fine particle 10 when the air flow is composited. 21) increase the bonding rate and bonding strength.

The particle diameter of the protruding electroconductive fine particles 1 of the present invention is 1-20 탆. Moreover, it is preferable that the specific gravity of the said protrusion electroconductive fine particles (1) particle is 1.5-3.5 g / cm <3>.

An electroless plating method may be used as a method of plating the surface of the polymer resin particle 11 with the first metal component. The technique of forming the metal layer using the electroless plating method can be easily carried out by those skilled in the art.

The projection-forming microparticles 21 fixed for the formation of the projections on the surface of the substrate microparticles 10 should not be destroyed upon bonding between the electrodes by heating and pressing. Therefore, the protrusion-forming fine particles 21 are made of hard crosslinked polymer fine particles or inorganic fine particles having high strength such as silica.

In addition, the protrusion forming fine particles 21 are those having a particle size of 0.5 to 20%, preferably 1 to 10% of the particle size of the substrate fine particle 10. This is because when the particle size of the protrusion-forming microparticles 21 is less than 0.5% of the particle size of the substrate fine particle 10, the effect as a protrusion becomes ineffective.

The protrusion-forming fine particles 21 can be fixed to the surface of the substrate fine particle 10 using methods such as dry method using physical / mechanical friction, dry method using physical / chemical friction, and fixing by wet treatment.

After the projection-forming fine particles 21 are fixed in the above-described manner, the projection-type conductive fine particles 1 which are plated with the second metal layer 13 on the surface thereof are dispersed in a crude liquid of a curable epoxy resin or acrylic resin. The dispersed conductive fine particles are processed into an anisotropic conductive film so that when the compression is performed between the connecting electrode of the IC chip and the pattern electrode of the ITO pattern under heating and pressurization, the plurality of protrusion layers on the surface should be maintained. It should not change.

The protrusion-forming microparticles 21 may be basically composed of a crosslinkable polymerizable monomer alone as a polymer crosslinked fine particle, or may be composed of a copolymer of a predetermined amount of a crosslinkable polymerizable monomer and one or more general polymerizable monomers, and may be emulsified. It may be prepared by polymerization, emulsion free polymerization or dispersion polymerization.

In addition, the protrusion-forming fine particles 21 are capable of radical polymerization, and include divinylbenzene, 1,4-divinyloxybutane, divinylsulphone, diallyl phthalate, diallyl acrylamide, triallyl (iso) cyanurate, Allyl compounds such as trially trimellitate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerylyl Tritol tri (meth) acrylate, pentaaryl tritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaaryl tree Acrylic compounds, such as tol penta (meth) acrylate and glycerol tri (meth) acrylate, etc. can be used.

In addition, the protrusion-forming fine particles 21 preferably include functional groups having hard properties and having strong bonding and affinity with metals. That is, the surface of the protrusion-forming fine particles 21 is a carboxyl group, a hydroxy group, a glycol group, an aldehyde group, an oxazole group, an amine group, an amide group, an imide group, a nitro group, a nitrile having a thiol group, a nucleophilic group and a metal affinity functional group. It is preferable to use the thing processed with group, a sulfone group, etc.

Inorganic fine particles may be used as the protrusion forming fine particles 21, and it is generally preferable to use monodisperse silica fine particles in the range of 100 to 800 nm, which may be prepared by a conventional sol-gel method. Can be.

The conductive fine particles dispersed in the thermosetting adhesive resin of the anisotropic conductive film in which protrusions are introduced on the surface of the conductive fine particles by the above method minimize the increase in resistance value when peeling occurs at the interface between the conductive particles and the connection pattern, and prevent the aggregation of the conductive fine particles. By preventing it, it is easy to disperse and plays a role of preventing the loss by the movement of electroconductive fine particles at the time of circuit connection using heating and pressurization.

The protruding conductive fine particles are dispersed in an adhesive resin composition such as an epoxy resin and molded to prepare an anisotropic conductive film, wherein the anisotropic conductive film comprises an insulating adhesive, a curing agent, and a resin component having an epoxy group and a resin component for film formation. Electroconductive fine particles, and an additive. At this time, the additive mainly serves to help dispersibility or film formation.

The anisotropic conductive film is used as an adhesive between the substrates, and is electrically conductive only in the pressing direction (z-axis direction) by thermocompression at the time of circuit connection of the substrate and has no properties in the x-axis and y-axis directions.

Fig. 3 is a cross sectional view of the anisotropic conductive film adhesive before the pressing and the substrate according to the present invention, and Fig. 4 shows the anisotropic adhesive film 5 containing the projection conductive fine particles 1 according to the present invention. It is a schematic sectional drawing which shows the electrical connection structure currently crimped | bonded and energized between the electrode 31 and the wiring pattern 41.

5 and 6 show a state in which the protruding conductive fine particles 1 according to the present invention are connected to the bump electrodes 31 and 41 of the circuit boards 3 and 4, and FIG. 6 is a schematic cross sectional view showing a state in which the bump electrodes 31 and 41 are connected.

Referring to the drawings, even when the circuit is compressed, the microparticles 21 forming the protrusions of the conductive microparticles 1 are not deformed by pressure and heat, and the metal layer is formed by penetration of the protrusions and the conductive microparticles into the electrode and the wiring pattern. It is possible to achieve energization between the upper and lower electrode pads 31 and 41.

In the case of the existing conductive fine particles maintaining a uniform particle size, the contact surface between the upper and lower electrode pads 31 and 41 is smaller than the projection conductive fine particles, and thus the connection resistance value is high. Compared with the linear expansion coefficient, the connection reliability tends to be inferior. However, in the case of the projection-type conductive fine particles, the contact resistance between the upper and lower electrodes is increased to lower the connection resistance value, and a highly reliable connection to external force such as temperature change, drop, and vibration can be obtained. have.

The present invention will be further illustrated by the following examples, which are only specific examples of the present invention and are not intended to limit or limit the protection scope of the present invention.

<Example 1>

(1) Primary Heartwood Conductive Particles

Spherical polymer resin particles made of divinylbenzene resin having a uniform particle size were synthesized by an emulsion polymerization method. At this time, the particle diameter of the polymer resin particles was 4 ㎛.

The surface of the polymer resin particles were nickel plated at 70 ° C. and pH 6 for 30 minutes with the composition of NiSO 4 (0.5M), a complexing agent (0.5M), and NaH 2 PO 2 (1M). The metal layer of the plated fine particles produced in the above manner was formed of a nickel plated layer, wherein the film thickness of nickel was 110 nm.

(2) Production of protrusion forming fine particles

In order to form the projection-forming fine particles, styrene (50 parts by weight) monomer and divinylbenzene (DVB, 50 parts by weight) are dispersed in ultrapure water containing potassium persulfate (KPS, 1 part) by water-soluble initiator. And polymerization at 70 ° C. for 24 hours by an emulsion-free polymerization method to obtain fine particles having a diameter of 140 nm. The prepared poly (St-DVB) particles were freeze-dried for 48 hours after removal of unreacted materials and other impurities using a centrifuge to obtain a powder form.

30 g of the poly (St-DVB) particles thus obtained were irradiated with 150 g of an aqueous 0.25% sodium lauryl sulfate (SLS) solution for 10 minutes to redispersed in a glass reactor to prepare a dispersion. After the fine particles were completely dispersed, 100 g of ultrapure water was added again, and the temperature was raised to 72.5 ° C. under a nitrogen atmosphere. 50 g of an aqueous solution of 0.4 g of potassium persulfate (KPS), which is a water-soluble initiator, was added thereto, followed by 30 minutes of styrene (St), divinylbenzene (DVB), and acrylic acid (30 g, 5 g). And 5 g of the mixed monomer mixture was slowly dropped over 3 hours to conduct polymerization. After dropping of the monomer, the reaction was further performed for an additional 3 hours, and fine particles of the poly (St-DVB) / poly (St-DVB-AA) core-shell type prepared were unreacted and an emulsifier using a centrifuge. After removing, the freeze-dried for 48 hours to obtain a projection-forming fine particles of 250nm size in the form of a powder.

(3) Fixation of projection forming fine particles

Nickel plated polymer resin particles and protrusion forming fine particles of Example 1 and Example 2 were composited by a hybridization system of Nara Machinery Co., Ltd. At this time, the input ratio was 7 parts by weight of the projection-forming fine particles to the substrate fine particle 100, and the fine particles fixed to the projections were prepared by physical / chemical friction for 13 minutes at a constant stirring speed of 10,000 rpm.

(4) gold plating

Using the electroless plating method on the surface of the nickel-plated fine particles to which the protrusions prepared by the above method are fixed, a composition of KAuCN (0.5M) and a complexing agent (0.5M) for 30 minutes at 60 ° C. and pH 5 Gold plating was performed. The film thickness plated with gold was 40 nm. The final configuration of the protruding conductive fine particles produced in the above manner consisted of the polymer resin particles, the nickel plating layer, the fine particles for forming the projections, and the gold plating layer on the outermost surface.

(5) Preparation of Anisotropic Conductive Film

Next, to prepare an anisotropic conductive film using the fine particles produced by the above method, 65 parts by weight of NBR rubber, 25 parts by weight of bisphenol A type epoxy resin having an epoxy equivalent of 7000, and 2-methylimidazole 4 as a curing agent. After dissolving the weight part in a mixed solvent of toluene and methyl ethyl ketone, the prepared conductive fine particles were dispersed together with the silane coupling agent, and then coated and dried on a release PET film to prepare an anisotropic conductive film having a thickness of 24 μm. The number of electroconductive fine particles contained in the film per unit area was 18,000 piece / mm <2>.

(6) Evaluation of connection resistance of IC chip

The connection resistance of an IC chip was implemented as follows using the film for anisotropically conductive adhesive manufactured as mentioned above.

The bump height of the evaluation IC chip used was about 40 µm and the size of the IC chip was 6 mm x 6 mm. The board | substrate which formed the wiring pattern by copper and gold plating of 8 micrometers thick on the board | substrate of 0.8-mm-thick BT resin was used. 170 degrees C, pressure 3MPa- in the state in which the said anisotropically conductive adhesive film was described between the IC chip and the substrate (in this case, the sum of the bump height and the wiring pattern height is about 58 µm). It was pressurized for 7 seconds under conditions of a bump, and it crimp | bonded and connected. The connection resistance was evaluated by applying a voltage of 50 V to the two adjacent pins of the connection sample thus made for 10 seconds. After the connection structure sample was aged at 85 ° C., a relative humidity of 85% RH for 1,000 hours, The electricity supply reliability was evaluated by measuring the resistance rise value.

<Examples 2 to 4>

Anisotropic adhesive films were prepared in the same manner as in Example 1, except that the input ratio of the projection-forming fine particles or the conductive fine particle input ratio in the anisotropic conductive film was changed to evaluate connection resistance and current conduction reliability.

<1, 2 in comparison>

In Comparative Examples 1 and 2, connection resistance and conduction reliability evaluation were performed using fine particles having a uniform plating surface of the conductive fine particles.

In the same manner as in Example 1, spherical polymer resin particles made of divinylbenzene resin having a uniform particle size were synthesized by emulsion polymerization. At this time, the particle diameter of the polymer resin particles was 4 ㎛.

Again, the surface of the polymer resin particles was treated with a composition of NiSO 4 (0.5M), a complexing agent (0.5M), and NaH 2 PO 2 (1M) at 70 ° C. for 30 minutes using an electroless plating method. The metal layer of the conductive fine particles produced in the above manner is formed of two layers of an inner nickel layer and an outer gold layer, wherein the film thicknesses of nickel and gold are 110 nm and 40 nm, respectively.

Anisotropic adhesive films were prepared in the same manner as in Example 1 with the conductive fine particles plated by the above method, and connection resistance and current conduction reliability evaluations were performed. The evaluation results are shown in Table 1 below.

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Content of conductive fine particles (E.A / mm2) 18,000 18,000 26,000 26,000 18,000 26,000 Fine particles for forming projections (nm) 250 250 250 250 - - Area of IC Bump Used for Electrical Evaluation (μm ² ) 3,000 3,000 3,000 3,000 3,000 3,000 Compression load (MPa) 3 3 3 3 3 3 Surface fixation rate of microparticles for protrusion formation (%) 80 40 80 40 - - Connection resistance ◎ ◎ ◎ ◎ △ ◎ Reliability ◎ △ ◎ ◎ × △

Connection resistance standard:

(Double-circle): 1 GPa or less, (triangle | delta): More than 1 GPa 1.2 GPa or less, ×: 1.2 GPa

Reliability Standards:

(Double-circle): It is 0.2 GPa or less rise, (triangle | delta): It is 0.2 kV or more, 0.4 kB or less, and X: 0.4 kPa or more.

As can be seen from the above Examples 1 to 3 and Comparative Examples 1 to 2, the anisotropic conductive film containing the protruding conductive fine particles according to the present invention was able to obtain higher conduction reliability and low connection resistance.

By immobilizing the organic or inorganic fine particles on the surface of the primary core conductive particles or the metal fine particles plated with the first metal, the second metal is sequentially plated on the surface to form conductive fine particles showing a plurality of projections on the surface, Maximizing the contact area between the conductive fine particles and the connecting body during heating and pressing in the thermosetting adhesive resin of the anisotropic conductive film to minimize the deviation of the interface, thereby providing fine particles showing stable conductivity in the z-axis direction, and also conductive fine particles It has the effect of the invention which obtains a more stable connection resistance value by widening an individual surface area and minimizing the fluidity which a microparticle escapes between connections by heat and pressure.

Simple modifications and variations of the present invention can be readily used by those skilled in the art, and all such variations or modifications can be considered to be included within the scope of the present invention.

Claims (13)

After the first metal layer is plated on the surface of the polymer resin particles or the surface fine particles of the substrate, the inorganic fine particles or the organic particles having the surface treated with a functional group having a chemical affinity with the metal are immobilized, and then the surface is fixed. The protruding conductive fine particles, which are plated on a second metal layer. delete In claim 1, The projection-type conductive fine particles are protrusion-shaped conductive fine particles, characterized in that one or more projections are discontinuously fixed to the surface of the substrate fine particle. In claim 1, The first metal layer or metal fine particles may be nickel, cobalt, copper, zinc, iron, lead, aluminum, manganese, chromium, palladium, ruthenium, or rhodium ( One or more selected from the group consisting of rhodium, vanadium, zirconium, indium, rhenium, titanium, molybdenum, tin and tungsten Projective conductive fine particles, characterized in that used. In claim 1, The protruding conductive fine particles, wherein the highest height from the surface of the substrate fine particles to the second metal layer is 1.1 to 10 times the minimum height. In claim 4, The second metal layer is protruding conductive fine particles, characterized in that plated with one or more selected from the group consisting of gold, platinum, silver. delete In claim 1, The functional group having chemical affinity with the metal is one selected from the group consisting of thiol group or carboxyl group, hydroxyl group, glycol group, aldehyde group, oxazole group, amine group, amide group, imide group, nitro group, nitrile group, sulfone group Protrusion type electroconductive fine particles characterized by the above-mentioned. In claim 1, The particle size of the protrusion-forming fine particles is a projection-type conductive fine particles, characterized in that 0.5 to 20% of the primary core conductive particles. In claim 1, The projection-forming fine particles cover 0.1 to 99.9% of the surface area of the substrate fine particles. In claim 1, The protruding conductive fine particles have an average particle diameter of 1 to 20 µm. In claim 1, The protruding conductive fine particles are particles having a specific gravity of 1.5 to 3.5 g / cm 3. Anisotropically conductive adhesive film formed by dispersing the protruding conductive fine particles according to any one of claims 1, 3 to 6, and 8 to 12 in an insulating adhesive resin.

Images