KR100646474B1 - Semiconductor package and its manufacturing method - Google Patents

Abstract

The present invention relates to a semiconductor package and a method of manufacturing the same, which can stack a plurality of semiconductor packages without changing the volume of the semiconductor package, and at the same time to maximize the mounting density and high functionalization, a semiconductor chip having a plurality of input and output pads, A plurality of inner leads formed substantially radially on an outer circumference of the semiconductor chip, an outer lead extending outwardly from the inner lead, a plurality of conductive wires electrically connecting the semiconductor chip and the inner lead, the semiconductor chip, A semiconductor package including a package body formed by encapsulating a conductive wire, an inner lead, and the like in an external environment, wherein a bottom portion of the package body is formed with a predetermined depth, and the recess portion includes a package body. The second semiconductor package is mounted, but the input and output of the second semiconductor package Means is electrically connected to the inner lead.

Description

Semiconductor package and its manufacturing method

1 is a cross-sectional view showing a semiconductor package using a conventional lead frame.

2 is a cross-sectional view showing a semiconductor package according to a first embodiment of the present invention.

3A and 3B are a cross-sectional view and a partial plan view showing a semiconductor package according to a second embodiment of the present invention.

4 is a cross-sectional view showing a semiconductor package according to a third embodiment of the present invention.

5 is a cross-sectional view showing a semiconductor package according to a fourth embodiment of the present invention.

-Description of the main symbols in the drawings-

100 ''; Conventional Semiconductor Package

101-104; Semiconductor package according to the present invention

2; Semiconductor chip 2a; I / O pad

4; Internal lead 6; External lead

8; Conductive wire 10; Package body

10a; Lumbar 12; Circuit board

12a; Land

12b; Bond Finger

19; First semiconductor package 20; Second Semiconductor Package

21; Lead 22; Conductive ball

The present invention relates to a semiconductor package and a method of manufacturing the same, and to describe in more detail, a semiconductor package capable of stacking a plurality of semiconductor packages without changing the volume of the semiconductor package, maximizing the mounting density and realizing high functionalization, and its manufacture It is about a method.

In general, a semiconductor package refers to a device that not only protects a semiconductor chip from an external environment but also easily exchanges electrical signals between the semiconductor chip and a motherboard.

As such a semiconductor package, a conventional semiconductor package 100 'using a conventional lead frame is shown in FIG. 1, and the structure thereof will be briefly described as follows.

As shown, a semiconductor chip 2 having a plurality of input / output pads 2a formed thereon, a chip mounting plate 5 on which the semiconductor chip 2 is mounted with an adhesive interposed therebetween, and the chip mounting plate 5 A plurality of inner leads 4 formed at a predetermined distance apart from each other, an outer lead 6 extending outward from the inner lead 4, and the semiconductor chip 2 and the inner lead 4 electrically connected to each other. A package formed by encapsulating a plurality of conductive wires 8, the semiconductor chip 2, the conductive wires 8, the chip mounting plate 5, the inner lead 4, and the like with an encapsulant to protect the external environment from the external environment. It consists of a body (10).

The semiconductor package 100 ′ is mounted on the motherboard by soldering an external lead 6 extending outside the package body 10. In addition, signal exchange between the semiconductor chip and the motherboard is performed through conductive wires, inner leads and outer leads.

As described above, the semiconductor package using the lead frame has a problem that the semiconductor package occupies a large area on the motherboard due to the external lead, which is the final input / output means, extended to the outer periphery of the package body. have. As described above, since the mounting density of the semiconductor package is small, there is also a problem that the size or volume of the electronic component must be large in order to realize high functionalization of the electronic component.

Recently, laminated semiconductor packages have been manufactured to increase the mounting density on the motherboard and to improve the functionality of the semiconductor packages.

However, such stacked semiconductor packages have a structure in which most of the same type semiconductor packages are stacked, so that the volume, that is, the height of the semiconductor package is increased. As the height of the semiconductor package increases, the mounting density and the electrical performance may be increased, but the volume or height of the electronic component on which the semiconductor package is mounted increases.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and can stack a plurality of semiconductor packages without a volume change, and at the same time maximize the mounting density and implement a high functional semiconductor package and its manufacturing method To provide.

In order to achieve the above object, the semiconductor package according to the present invention includes a semiconductor chip having a plurality of input / output pads formed therein, a plurality of inner leads formed substantially radially on the outer circumference of the semiconductor chip, and an outer portion extending outward from the inner lead. A semiconductor comprising a lead, a plurality of conductive wires electrically connecting the semiconductor chip and the inner lead, and a package body formed by encapsulating the semiconductor chip, the conductive wire, the inner lead, and the like with an encapsulant to protect the external chip from the external environment. In the package, a bottom portion of the package body is formed with a recess having a predetermined depth, and a second semiconductor package is mounted on the recess, and the input / output means of the second semiconductor package is electrically connected to the inner lead. It is characterized by being.

Here, the semiconductor package is a semiconductor chip is mounted on the upper surface of the inner lead, the lower surface of the inner lead may be exposed to the outside of the main portion toward the input and output means of the second semiconductor package.

In addition, the inner lead may be arrayed with rows and columns at ends connected to the input / output means of the second semiconductor package.

The semiconductor package is a semiconductor chip is mounted on the upper surface of the circuit board, the lower surface of the circuit board is exposed to the outside of the main portion toward the input and output means of the second semiconductor package, while the upper surface of the circuit board is electrically connected to the inner lead Can be connected.

The second semiconductor package may be a bottom lead type package in which the input / output means is a lead, or a ball grid array type package in which the input / output means is a conductive ball.

In addition, a method for manufacturing a semiconductor package according to the present invention in order to achieve the above object comprises the steps of providing a lead frame with a plurality of inner leads formed radially around a predetermined region; Mounting a semiconductor chip having a plurality of input / output pads formed on an upper surface of the inner lead; Connecting the input / output pad of the semiconductor chip and the internal lead with conductive wires; Encapsulating the semiconductor chip, the conductive wire and the inner lead with an encapsulant to form a package body, wherein recesses of a predetermined depth are formed in the package body under the semiconductor chip; And mounting a second semiconductor package on a main portion of the package body, wherein the input / output means of the second semiconductor package are electrically connected to the inner lead.

The mounting of the semiconductor chip may allow the semiconductor chip to be directly mounted on the upper surface of the inner lead, and the forming of the package body may allow the lower surface of the inner lead to be exposed to the outside of the main portion of the package body.

In the providing of the lead frame, an end portion connected to the input / output means of the second semiconductor package may have an array having rows and columns.

The semiconductor chip mounting step may include a circuit board having a predetermined size, mounted on an upper surface of the circuit board, wherein the circuit board is electrically connected to an inner lead, and the encapsulation step includes a lower surface of the package body. It can be exposed outside the recess.

The second semiconductor package mounting step may include a bottom lead type package in which the input / output means is a lead-in package, or a ball grid array type package in which the input / output means is a conductive ball.

According to the semiconductor package according to the present invention as described above, while maintaining the volume, in particular the height of the semiconductor package as in the prior art, by implementing a so-called stacked semiconductor package it is possible to increase the mounting density and at the same time to realize high functionalization of the semiconductor package. As a result, the electronic component using the semiconductor package can be further downsized and highly functional.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.

2 is a cross-sectional view showing a semiconductor package 101 according to a first embodiment of the present invention.

As shown, the semiconductor package according to the present invention is largely composed of a first semiconductor package 19 and a second semiconductor package 20, the second semiconductor package 20 on the lower surface of the first semiconductor package 19 ) Is connected.

First, the first semiconductor package 19 includes a semiconductor chip 2 having a plurality of input / output pads 2a formed on an upper surface thereof, and a bottom surface of the semiconductor chip 2 having a radial shape around the semiconductor chip 2. A plurality of inner leads 4 are bonded by means of adhesive (such as adhesive or double-sided adhesive tape). In addition, an outer lead 6 extends outwardly to each of the inner leads 4. The input / output pad 2a and the inner lead 4 of the semiconductor chip 2 are connected to each other by conductive wires 8. In addition, the semiconductor chip 2, the conductive wire 8, the inner lead 4, and the like are encapsulated with an encapsulant so as to be protected from the external environment to form the package body 10.

A predetermined region of the inner lead 4 positioned on the lower surface of the semiconductor chip 2 is exposed to the outside, which is a recessed portion 10a having a predetermined size in the package body 10 formed on the lower surface of the semiconductor chip 2. It is possible by forming a recess. That is, the width of the package body 10 formed on the lower surface of the semiconductor chip 2 is similar to that of the semiconductor chip 2, and the depth is such that the bottom surface of the inner lead 4 is exposed. 10a is formed.

Subsequently, the second semiconductor package 20 is electrically connected to the lower surface of the inner lead 4 where the input / output means are exposed to the outside through the recess 10a of the first semiconductor package 19. The thickness of the second semiconductor package 20 is preferably formed to be smaller than the bent height of the outer lead 6 of the first semiconductor package 19, but is not limited thereto. The first semiconductor package 19 It is more preferable in terms of handling the semiconductor package to form the same or smaller depth of the recessed portion 10a.

The second semiconductor package 20 is a bottom lead type semiconductor package as shown in FIG. 2, and is located in the recess 10a, and the lead 21 as an input / output means thereof has an inner lead of the first semiconductor package 19. As shown in FIG. It can be fused by solder to (4).

3A and 3B, the second semiconductor package 20 may be a ball grid array type semiconductor package in which the input / output means is a conductive ball 22, as in the semiconductor package 102 according to the second embodiment of the present invention. have. In the case of using the ball grid array type semiconductor package as described above, it is preferable that the ends of the inner lead 4 of the first semiconductor package 19 have an array with rows and columns as shown in FIG. 3B. However, this does not limit the present invention. As described above, the reason for arranging the ends of the inner lead 4 of the first semiconductor package 19, that is, the lands 4a connected to the conductive balls 22 of the second semiconductor package 20 is usually a ball grid array type semiconductor. The conductive balls 22 of the package are arranged in an array so as to correspond thereto.

4 is a cross-sectional view showing a semiconductor package 103 according to a third embodiment of the present invention.

Since the semiconductor package 103 according to the third embodiment is similar to the first and second embodiments, only the differences will be described as follows.

First, as shown in FIG. 4, the semiconductor chip 2 is mounted on the circuit board 12 of the first semiconductor package 19. Of course, the circuit board 12 has upper and lower circuit patterns (a circuit pattern including a resin layer as a base layer and a boring 12a on the lower surface and a bond finger 12b on the upper surface). The upper and lower circuit patterns can be electrically conductive by via holes (not shown). In addition, a recess 10a having a predetermined depth and size is formed in the package body 10 on the lower surface of the semiconductor chip 2 so that the lower surface of the circuit board 12 is exposed to the outside. On the lower surface of the circuit board 12, a bottom lead type semiconductor package (the second semiconductor package 20) whose input / output means is a lead 21 is connected to the land 12a of the circuit board 12, as shown. have. Of course, it is preferable that the connection means use solder.

On the other hand, as in the semiconductor package 104 of the fourth embodiment of the present invention shown in Figure 5, the second semiconductor package 20 may be a ball grid array type semiconductor package. At this time, as described above, the conductive balls 22 of the second semiconductor package 20 are connected to the lands 12a of the circuit board 12.

Then, the manufacturing method of the semiconductor package by this invention is demonstrated.

1.A step of providing a lead frame, wherein a plurality of inner leads provide a lead frame radially formed around a predetermined area.

2. In the semiconductor chip mounting step, a semiconductor chip having a plurality of input / output pads formed thereon is mounted on an upper region of an inner lead of the lead frame.

3. In the electrical connection step, the input / output pads of the semiconductor chip and the internal leads are connected with conductive wires.

4. In the package body forming step, the semiconductor chip, the conductive wire and the inner lead is encapsulated with an encapsulant to form a package body, and a recess of a predetermined depth is formed in the package body under the semiconductor chip.

5. The second semiconductor package mounting step, the second semiconductor package is mounted on the main portion of the package body, so that the input and output means of the second semiconductor package is electrically connected to the inner lead.

In this case, the mounting of the semiconductor chip may allow the semiconductor chip to be directly mounted on the upper surface of the inner lead, and the forming of the package body may expose the lower surface of the inner lead to the outside of the main portion of the package body.

In the providing of the lead frame, an end portion connected to the input / output means of the second semiconductor package may have an array with rows and columns.

The semiconductor chip mounting step may include a circuit board having a predetermined size, mounted on an upper surface of the circuit board, wherein the circuit board is electrically connected to an internal lead, and the encapsulation step includes a package body having a lower surface of the circuit board. It can be exposed to the outside of the recess.

Finally, the second semiconductor package mounting step may use a bottom lead type package in which the input / output means is a lead-in package, or a ball grid array type package in which the input / output means is a conductive ball.

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

Therefore, according to the semiconductor package according to the present invention, while maintaining the volume, in particular, the height of the semiconductor package as in the prior art, by implementing a so-called stacked semiconductor package there is an effect that it is possible to increase the mounting density and high functionality of the semiconductor package.

In addition, the electronic component using the semiconductor package has the effect of further downsizing the size and high functionality.

Claims (12)

A semiconductor chip having a plurality of input / output pads formed on an upper surface thereof, a plurality of inner leads formed around the semiconductor chip, an outer lead extending outwardly from the inner lead, and a plurality of electrically connecting the semiconductor chip and the inner lead The first semiconductor is made of a package body in which a conductive wire, the semiconductor chip, the conductive wire, and an inner lead are sealed with an encapsulant so as to be protected from an external environment, and an encapsulant having a predetermined depth is formed in the encapsulant under the semiconductor chip. A package and a second semiconductor package located in a main portion of the package body of the first semiconductor package, the input / output means being electrically connected to an inner lead of the semiconductor package, The semiconductor chip of the first semiconductor package is adhered to the upper surface of the inner lead, the lower surface of the inner lead is exposed to the lower through the main portion of the package body, the second surface on the lower surface of the inner lead exposed through the package body A semiconductor package, wherein the input / output means of the semiconductor package are electrically connected. delete The semiconductor package according to claim 1, wherein the inner leads are arranged in rows and columns at ends connected to the input / output means of the second semiconductor package. A semiconductor chip having a plurality of input / output pads formed on an upper surface thereof, a plurality of inner leads formed around the semiconductor chip, an outer lead extending outwardly from the inner lead, and a plurality of electrically connecting the semiconductor chip and the inner lead The first semiconductor is made of a package body in which a conductive wire, the semiconductor chip, the conductive wire, and an inner lead are sealed with an encapsulant so as to be protected from an external environment, and an encapsulant having a predetermined depth is formed in the encapsulant under the semiconductor chip. A package and a second semiconductor package located in a main portion of the package body of the first semiconductor package, the input / output means being electrically connected to an inner lead of the semiconductor package, The semiconductor chip and the inner lead of the first semiconductor package are bonded to the upper surface of the circuit board in the form of a flat plate, the circuit board is electrically connected to the inner lead, and the lower surface of the circuit board is lowered through the recessed portion of the package body. The semiconductor package of claim 2, wherein the input and output means of the second semiconductor package are electrically connected to the bottom surface of the exposed circuit board. The semiconductor package according to claim 1, 3 or 4, wherein the second semiconductor package is a bottom lead type package in which the input / output means is a lead. The semiconductor package according to any one of claims 1, 3, and 4, wherein the second semiconductor package is a ball grid array type package in which the input / output means is a conductive ball. Providing a lead frame in which a plurality of internal leads are radially formed around a predetermined region; Mounting a semiconductor chip having a plurality of input / output pads formed on an upper surface of the inner lead; Connecting the input / output pad of the semiconductor chip and the internal lead with conductive wires; Encapsulating the semiconductor chip, the conductive wire and the inner lead with an encapsulant to form a package body, wherein recesses of a predetermined depth are formed in the package body under the semiconductor chip; Mounting a second semiconductor package on a main portion of the package body, wherein the input / output means of the second semiconductor package is electrically connected to the inner lead. 8. The method of claim 7, wherein the mounting step of the semiconductor chip is that the semiconductor chip is mounted directly on the upper surface of the inner lead, the forming the package body is characterized in that the lower surface of the inner lead is exposed to the outside of the main portion of the package body. Method of manufacturing a semiconductor package. The method of claim 7, wherein the providing of the lead frame comprises providing an array in which ends connected to the input / output means of the second semiconductor package have rows and columns. The method of claim 7, wherein the mounting of the semiconductor chip comprises a circuit board having a predetermined size, mounted on an upper surface of the circuit board, wherein the circuit board is electrically connected to an internal lead, and the encapsulation step includes: A method for manufacturing a semiconductor package, characterized in that the lower surface is exposed to the outside of the main portion of the package body. The method of manufacturing a semiconductor package according to any one of claims 7 to 10, wherein the step of mounting the second semiconductor package includes mounting a bottom lead type package in which the input / output means is a lead. The method of manufacturing a semiconductor package according to any one of claims 7 to 10, wherein the second semiconductor package mounting step includes mounting a ball grid array type package in which the input / output means is a conductive ball.

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