KR100642415B1 - 프로그램 가능한 공정 변수를 갖는 웨이퍼 처리 리액터 시스템 및 방법 - Google Patents

프로그램 가능한 공정 변수를 갖는 웨이퍼 처리 리액터 시스템 및 방법 Download PDF

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KR100642415B1
KR100642415B1 KR1020017003276A KR20017003276A KR100642415B1 KR 100642415 B1 KR100642415 B1 KR 100642415B1 KR 1020017003276 A KR1020017003276 A KR 1020017003276A KR 20017003276 A KR20017003276 A KR 20017003276A KR 100642415 B1 KR100642415 B1 KR 100642415B1
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South Korea
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recipe
reactor
value
variable
values
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KR1020017003276A
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English (en)
Korean (ko)
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KR20010075100A (ko
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더글라스 브이. 푸트남-피트
타미 제이. 트레이시
커티스 엠. 오타구로
도날드 더블유. 데이비슨
리디아 제이. 영
재 파크
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20010075100A publication Critical patent/KR20010075100A/ko
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32096—Batch, recipe configuration for flexible batch control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
KR1020017003276A 1998-09-14 1999-09-13 프로그램 가능한 공정 변수를 갖는 웨이퍼 처리 리액터 시스템 및 방법 KR100642415B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15284998A 1998-09-14 1998-09-14
US09/152,849 1998-09-14

Publications (2)

Publication Number Publication Date
KR20010075100A KR20010075100A (ko) 2001-08-09
KR100642415B1 true KR100642415B1 (ko) 2006-11-03

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ID=22544714

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017003276A KR100642415B1 (ko) 1998-09-14 1999-09-13 프로그램 가능한 공정 변수를 갖는 웨이퍼 처리 리액터 시스템 및 방법

Country Status (4)

Country Link
JP (1) JP4789323B2 (ja)
KR (1) KR100642415B1 (ja)
TW (1) TW464916B (ja)
WO (1) WO2000015870A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7254453B2 (en) * 2002-11-21 2007-08-07 Advanced Micro Devices, Inc. Secondary process controller for supplementing a primary process controller
US7822570B2 (en) 2006-11-17 2010-10-26 Lam Research Corporation Methods for performing actual flow verification
US7881886B1 (en) 2006-11-17 2011-02-01 Lam Research Corporation Methods for performing transient flow prediction and verification using discharge coefficients

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172008A (ja) * 1995-12-06 1997-06-30 Applied Materials Inc Ｓａｃｖｄ酸化物膜とｐｅｃｖｄ酸化物膜との間に良好な界面を形成する方法及び装置
JPH10154706A (ja) * 1996-11-13 1998-06-09 Applied Materials Inc 浅いトレンチ分離のための方法及び装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58128728A (ja) * 1982-01-28 1983-08-01 Toshiba Mach Co Ltd 半導体気相成長装置
EP0085397B1 (en) * 1982-01-28 1988-04-27 Toshiba Kikai Kabushiki Kaisha Semiconductor vapor phase growing apparatus
JP2985342B2 (ja) * 1991-04-05 1999-11-29 富士電機株式会社 プラズマ処理装置の運転制御装置
JPH09134886A (ja) * 1995-11-08 1997-05-20 Kokusai Electric Co Ltd 半導体製造装置のランピング温度制御方法
US5803107A (en) * 1996-03-29 1998-09-08 Lam Research Corporation Method and apparatus for pressure control in vacuum processors
JP3268628B2 (ja) * 1996-09-03 2002-03-25 東京エレクトロン株式会社 自動制御方法及びその装置
JPH10141870A (ja) * 1996-11-05 1998-05-29 Kokusai Electric Co Ltd 処理炉の温度監視装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172008A (ja) * 1995-12-06 1997-06-30 Applied Materials Inc Ｓａｃｖｄ酸化物膜とｐｅｃｖｄ酸化物膜との間に良好な界面を形成する方法及び装置
JPH10154706A (ja) * 1996-11-13 1998-06-09 Applied Materials Inc 浅いトレンチ分離のための方法及び装置

Also Published As

Publication number Publication date
JP4789323B2 (ja) 2011-10-12
JP2002525842A (ja) 2002-08-13
KR20010075100A (ko) 2001-08-09
TW464916B (en) 2001-11-21
WO2000015870A1 (en) 2000-03-23

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