KR100632885B1 - 리소그래피 장치, 디바이스 제조방법 및 그 제조된 디바이스 - Google Patents
리소그래피 장치, 디바이스 제조방법 및 그 제조된 디바이스 Download PDFInfo
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- KR100632885B1 KR100632885B1 KR1020040016170A KR20040016170A KR100632885B1 KR 100632885 B1 KR100632885 B1 KR 100632885B1 KR 1020040016170 A KR1020040016170 A KR 1020040016170A KR 20040016170 A KR20040016170 A KR 20040016170A KR 100632885 B1 KR100632885 B1 KR 100632885B1
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- Prior art keywords
- cooling element
- coil
- cooling
- radiation
- coil arrangement
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000001816 cooling Methods 0.000 claims abstract description 63
- 238000000926 separation method Methods 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 37
- 230000006399 behavior Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Linear Motors (AREA)
- Windings For Motors And Generators (AREA)
Abstract
Description
Claims (10)
- 삭제
- - 방사선의 투영빔을 공급하는 방사선시스템;- 필요한 패턴에 따라 상기 투영빔을 패터닝하는 역할을 하는 패터닝수단을 지지하는 지지구조체;- 기판을 유지하는 기판테이블; 및- 상기 기판의 타겟부상에 상기 패터닝된 빔을 투영하는 투영시스템; 및- 1이상의 냉각 요소와 열접촉하는 코일 배치를 포함하는 로렌츠 액츄에이터을 포함하는 리소그래피투영장치에 있어서,상기 코일 배치는,- 상기 냉각 요소와의 양호한 열접촉이 이루어지도록 배치된 높은 열전도물질로 구성된 1이상의 분리층들에 의하여 서로로부터 분리된 복수의 코일을 포함하며,상기 분리층들은 상기 코일 배치면과 평행하고, 상기 냉각 요소는 상기 코일 배치로부터 반경방향 바깥쪽에 위치되는 것을 특징으로 하는 리소그래피투영장치.
- 삭제
- 제2항에 있어서,상기 분리층들은 상기 코일 배치면과 평행한 제1층들 및 상기 코일 배치면과 수직한 제2층들을 포함하고, 상기 냉각 요소는 상기 코일 배치로부터 반경방향 바깥쪽으로 위치된 제1요소들 및 상기 코일 배치의 축선방향 위쪽 또는 아래쪽에 위치된 제2요소들을 포함하는 것을 특징으로 하는 리소그래피 투영장치.
- 제2항 또는 제4항에 있어서,상기 냉각 요소, 상기 분리층들, 또는 상기 냉각요소 및 분리층들은 강(steel)으로 형성되는 것을 특징으로 하는 리소그래피 투영장치.
- 제2항 또는 제4항에 있어서,상기 냉각 요소, 상기 분리층들, 또는 상기 냉각요소 및 분리층들은 세라믹으로 형성되는 것을 특징으로 하는 리소그래피 투영장치.
- 제2항 또는 제4항에 있어서,상기 냉각판은 냉각 채널을 포함하는 판이며, 상기 냉각 채널을 통하여 냉각유체가 순환될 수 있는 것을 특징으로 하는 리소그래피 투영장치.
- 제7항에 있어서,상기 냉각 채널은 원형 또는 직사각형 단면을 가지는 것을 특징으로 하는 리소그래피 투영장치.
- 제2항 또는 제4항에 있어서,상기 분리층들은 냉각 채널을 포함하며, 상기 냉각 채널을 통하여 냉각 유체가 순환될 수 있는 것을 특징으로 하는 리소그래피 투영장치.
- - 부분적 또는 전체적으로 방사선감응재층으로 덮인 기판을 제공하는 단계;- 방사선시스템을 사용하여 방사선의 투영빔을 제공하는 단계;- 패터닝수단을 사용하여 상기 투영빔의 단면에 패턴을 부여하는 단계;- 상기 방사선감응재층의 타겟부상에 상기 방사선의 패터닝된 빔을 투영하는 단계;- 1이상의 냉각 요소와 열접촉하는 코일 배치를 포함하는 로렌츠 액츄에이터를 작동시키는 단계를 포함하는 디바이스제조방법에 있어서,상기 코일 배치는,- 상기 냉각 요소와의 양호한 열접촉이 이루어지도록 배치된 높은 열전도물질로 구성된 1이상의 분리층들에 의하여 서로로부터 분리된 복수의 코일을 포함하는 것을 특징으로 하는 디바이스 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03251456A EP1457827A1 (en) | 2003-03-11 | 2003-03-11 | Lithographic apparatus, device manufacturing method and device manufactured thereby |
EP03251456.4 | 2003-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040080355A KR20040080355A (ko) | 2004-09-18 |
KR100632885B1 true KR100632885B1 (ko) | 2006-10-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020040016170A KR100632885B1 (ko) | 2003-03-11 | 2004-03-10 | 리소그래피 장치, 디바이스 제조방법 및 그 제조된 디바이스 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7079226B2 (ko) |
EP (1) | EP1457827A1 (ko) |
JP (1) | JP4334376B2 (ko) |
KR (1) | KR100632885B1 (ko) |
CN (1) | CN100561347C (ko) |
SG (1) | SG146423A1 (ko) |
TW (1) | TWI242235B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101276599B1 (ko) | 2009-09-16 | 2013-06-19 | 에이에스엠엘 네델란즈 비.브이. | 액추에이터, 리소그래피 장치 및 액추에이터 구성 방법 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005295762A (ja) * | 2004-04-05 | 2005-10-20 | Canon Inc | ステージ装置および露光装置 |
US7956982B2 (en) * | 2005-11-18 | 2011-06-07 | Asml Netherlands B.V. | Apparatus for cooling |
NL2003139A1 (nl) * | 2008-07-31 | 2010-02-02 | Asml Holding Nv | Cooling of actuator coils. |
DE102014212667A1 (de) * | 2014-07-01 | 2016-01-07 | Carl Zeiss Smt Gmbh | Elektrische Spule |
JP2017204499A (ja) * | 2016-05-09 | 2017-11-16 | 株式会社アドバンテスト | マルチカラム荷電粒子ビーム露光装置 |
EP3631957B1 (en) | 2017-05-26 | 2023-09-20 | ASML Netherlands B.V. | Actuator, linear motor and lithographic apparatus |
KR102098867B1 (ko) * | 2018-09-12 | 2020-04-09 | (주)아이테드 | 임프린팅 장치 및 임프린팅 방법 |
Citations (1)
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US6184596B1 (en) * | 1995-06-30 | 2001-02-06 | Nikon Corporation | Stage construction incorporating magnetically levitated movable stage |
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DE59105735D1 (de) * | 1990-05-02 | 1995-07-20 | Fraunhofer Ges Forschung | Belichtungsvorrichtung. |
US5229872A (en) * | 1992-01-21 | 1993-07-20 | Hughes Aircraft Company | Exposure device including an electrically aligned electronic mask for micropatterning |
US5808381A (en) * | 1994-08-09 | 1998-09-15 | Hitachi Metals, Ltd. | Linear motor |
US5920164A (en) * | 1996-10-31 | 1999-07-06 | Mfm Technology, Inc. | Brushless linear motor |
JP2000505958A (ja) * | 1996-12-24 | 2000-05-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 2個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置 |
DE69711929T2 (de) | 1997-01-29 | 2002-09-05 | Micronic Laser Systems Ab Taeb | Verfahren und gerät zur erzeugung eines musters auf einem mit fotoresist beschichteten substrat mittels fokusiertem laserstrahl |
SE509062C2 (sv) | 1997-02-28 | 1998-11-30 | Micronic Laser Systems Ab | Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster |
WO1998040791A1 (en) | 1997-03-10 | 1998-09-17 | Koninklijke Philips Electronics N.V. | Positioning device having two object holders |
US6278203B1 (en) * | 1999-11-22 | 2001-08-21 | Nikon Corporation | Cooling structure for a linear motor |
TWI245482B (en) * | 2000-11-21 | 2005-12-11 | Yaskawa Electric Corp | Linear motor |
KR20030007477A (ko) * | 2001-01-25 | 2003-01-23 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 냉각 수단을 가진 코일 |
JP3809381B2 (ja) * | 2002-01-28 | 2006-08-16 | キヤノン株式会社 | リニアモータ、ステージ装置、露光装置及びデバイス製造方法 |
-
2003
- 2003-03-11 EP EP03251456A patent/EP1457827A1/en not_active Withdrawn
-
2004
- 2004-03-09 SG SG200401157-3A patent/SG146423A1/en unknown
- 2004-03-09 TW TW093106260A patent/TWI242235B/zh not_active IP Right Cessation
- 2004-03-10 JP JP2004066540A patent/JP4334376B2/ja not_active Expired - Fee Related
- 2004-03-10 CN CNB2004100080765A patent/CN100561347C/zh not_active Expired - Lifetime
- 2004-03-10 KR KR1020040016170A patent/KR100632885B1/ko active IP Right Grant
- 2004-03-11 US US10/797,568 patent/US7079226B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6184596B1 (en) * | 1995-06-30 | 2001-02-06 | Nikon Corporation | Stage construction incorporating magnetically levitated movable stage |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101276599B1 (ko) | 2009-09-16 | 2013-06-19 | 에이에스엠엘 네델란즈 비.브이. | 액추에이터, 리소그래피 장치 및 액추에이터 구성 방법 |
US8830020B2 (en) | 2009-09-16 | 2014-09-09 | Asml Netherlands B.V. | Actuator, lithographic apparatus, and actuator constructing method |
Also Published As
Publication number | Publication date |
---|---|
CN1530749A (zh) | 2004-09-22 |
EP1457827A1 (en) | 2004-09-15 |
US20040218166A1 (en) | 2004-11-04 |
CN100561347C (zh) | 2009-11-18 |
JP2004343064A (ja) | 2004-12-02 |
TWI242235B (en) | 2005-10-21 |
US7079226B2 (en) | 2006-07-18 |
TW200503070A (en) | 2005-01-16 |
KR20040080355A (ko) | 2004-09-18 |
SG146423A1 (en) | 2008-10-30 |
JP4334376B2 (ja) | 2009-09-30 |
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