KR100630360B1 - 비접촉 반송장치 - Google Patents
비접촉 반송장치 Download PDFInfo
- Publication number
- KR100630360B1 KR100630360B1 KR1020010042479A KR20010042479A KR100630360B1 KR 100630360 B1 KR100630360 B1 KR 100630360B1 KR 1020010042479 A KR1020010042479 A KR 1020010042479A KR 20010042479 A KR20010042479 A KR 20010042479A KR 100630360 B1 KR100630360 B1 KR 100630360B1
- Authority
- KR
- South Korea
- Prior art keywords
- fluid
- contact
- wafer
- concave portion
- conveying apparatus
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Pinball Game Machines (AREA)
Abstract
Description
Claims (8)
- 내주면이 원주형상 또는 다각형상인 오목부;상기 오목부 개구측에 형성되고, 대상물과 대향하는 평탄형 끝면; 및공급유체가 상기 오목부의 내주면에 면하는 분출구로부터 상기 오목부의 내주방향을 따라 토출되어 상기 평탄형 끝면을 통해 외부로 고속 유출될 수 있도록 외부와 상기 오목부를 연결하는 유체통로를 구비하는 것을 특징으로 하는 비접촉 반송장치.
- 제1항에 있어서, 상기 오목부의 내부에 둘레벽을 설치해서 선회류통로를 형성한 것을 특징으로 하는 비접촉 반송장치.
- 내주면이 원주형상 또는 다각형상인 오목부와, 그 오목부 개구측에 형성되고, 대상물과 대향하는 평탄형 끝면과, 공급유체가 상기 오목부의 내주면에 면하는 분출구로부터 상기 오목부의 내주방향을 따라 토출되어 상기 평탄형 끝면을 통해 외부로 고속 유출될 수 있도록 외부와 상기 오목부를 연결하는 유체통로를 갖는 선회류형성체를 복수개 기저면에 설치해서 구성한 것을 특징으로 하는 비접촉 반송장치.
- 대상물에 대향하는 평탄면을 갖는 판형상의 기체의 일개소이상에, 내주면이 원주형상 또는 다각형상인 오목부와, 공급유체가 상기 오목부의 내주면에 면하는 분출구로부터 상기 오목부의 내주방향을 따라 토출되는 유체통로를 형성해서 구성한 것을 특징으로 하는 비접촉 반송장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 이온공급원을 설치하고, 상기 장치가 비접촉으로 유지하고 있는 대상물에 이온을 접촉시키는 것을 특징으로 하는 비접촉 반송장치.
- 제5항에 있어서, 상기 이온공급원을 오목부내에 면하도록 설치한 것을 특징으로 하는 비접촉 반송장치.
- 제5항에 있어서, 상기 장치가 비접촉으로 유지하고 있는 대상물에 면하도록 상기 이온공급원을 오목부밖에 설치한 것을 특징으로 하는 비접촉 반송장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 공급유체는 초음파주파수의 진동을 갖는 유체인 것을 특징으로 하는 비접촉 반송장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2001-00044173 | 2001-02-20 | ||
JP2001044173A JP3981241B2 (ja) | 2000-06-09 | 2001-02-20 | 旋回流形成体および非接触搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020068245A KR20020068245A (ko) | 2002-08-27 |
KR100630360B1 true KR100630360B1 (ko) | 2006-09-29 |
Family
ID=18906206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010042479A KR100630360B1 (ko) | 2001-02-20 | 2001-07-13 | 비접촉 반송장치 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100630360B1 (ko) |
AT (1) | ATE445909T1 (ko) |
DE (1) | DE60140172D1 (ko) |
TW (1) | TW500651B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100859835B1 (ko) * | 2008-05-13 | 2008-09-23 | 한국뉴매틱(주) | 비접촉식 진공패드 |
US8905680B2 (en) * | 2011-10-31 | 2014-12-09 | Masahiro Lee | Ultrathin wafer transport systems |
KR101258405B1 (ko) * | 2012-01-19 | 2013-04-26 | 로체 시스템즈(주) | 글라스 디스크 반송장치 |
KR101423822B1 (ko) * | 2012-06-28 | 2014-07-28 | 세메스 주식회사 | 웨이퍼 이송을 위한 비접촉 척 |
TWI569355B (zh) * | 2014-07-23 | 2017-02-01 | Harmotec Co Ltd | Control device and control method |
KR102053435B1 (ko) * | 2019-08-12 | 2019-12-06 | 주식회사 디에스이엔티 | 자동 반전용 인쇄회로기판 적재장치 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6353945A (ja) * | 1986-08-25 | 1988-03-08 | Hitachi Ltd | 受け渡し装置 |
JPH0346250A (ja) * | 1989-07-14 | 1991-02-27 | Kawasaki Steel Corp | ウエハ搬送装置 |
JPH04341438A (ja) * | 1991-05-16 | 1992-11-27 | Toshiba Corp | 非接触ハンドリング装置 |
JPH04348052A (ja) * | 1991-05-24 | 1992-12-03 | Kyushu Electron Metal Co Ltd | 半導体基板の非接触搬送装置 |
JPH1012710A (ja) * | 1996-06-21 | 1998-01-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11254369A (ja) * | 1998-03-06 | 1999-09-21 | Seibu Giken Co Ltd | 無接触搬送装置 |
JPH11330203A (ja) * | 1998-03-11 | 1999-11-30 | Trusi Technol Llc | 物品ホルダ及び保持方法 |
KR20000016137A (ko) * | 1996-05-31 | 2000-03-25 | 피터 무몰라 | 웨이퍼형 제품용 비접촉 홀더 |
-
2001
- 2001-07-05 TW TW090116445A patent/TW500651B/zh not_active IP Right Cessation
- 2001-07-12 AT AT01306016T patent/ATE445909T1/de not_active IP Right Cessation
- 2001-07-12 DE DE60140172T patent/DE60140172D1/de not_active Expired - Lifetime
- 2001-07-13 KR KR1020010042479A patent/KR100630360B1/ko active IP Right Grant
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6353945A (ja) * | 1986-08-25 | 1988-03-08 | Hitachi Ltd | 受け渡し装置 |
JPH0346250A (ja) * | 1989-07-14 | 1991-02-27 | Kawasaki Steel Corp | ウエハ搬送装置 |
JPH04341438A (ja) * | 1991-05-16 | 1992-11-27 | Toshiba Corp | 非接触ハンドリング装置 |
JPH04348052A (ja) * | 1991-05-24 | 1992-12-03 | Kyushu Electron Metal Co Ltd | 半導体基板の非接触搬送装置 |
KR20000016137A (ko) * | 1996-05-31 | 2000-03-25 | 피터 무몰라 | 웨이퍼형 제품용 비접촉 홀더 |
US6099056A (en) * | 1996-05-31 | 2000-08-08 | Ipec Precision, Inc. | Non-contact holder for wafer-like articles |
JPH1012710A (ja) * | 1996-06-21 | 1998-01-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11254369A (ja) * | 1998-03-06 | 1999-09-21 | Seibu Giken Co Ltd | 無接触搬送装置 |
JPH11330203A (ja) * | 1998-03-11 | 1999-11-30 | Trusi Technol Llc | 物品ホルダ及び保持方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20020068245A (ko) | 2002-08-27 |
DE60140172D1 (de) | 2009-11-26 |
TW500651B (en) | 2002-09-01 |
ATE445909T1 (de) | 2009-10-15 |
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