KR20020068245A - 비접촉 반송장치 - Google Patents
비접촉 반송장치 Download PDFInfo
- Publication number
- KR20020068245A KR20020068245A KR1020010042479A KR20010042479A KR20020068245A KR 20020068245 A KR20020068245 A KR 20020068245A KR 1020010042479 A KR1020010042479 A KR 1020010042479A KR 20010042479 A KR20010042479 A KR 20010042479A KR 20020068245 A KR20020068245 A KR 20020068245A
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- fluid
- wafer
- conveying apparatus
- swirl flow
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Pinball Game Machines (AREA)
Abstract
Description
Claims (8)
- 내주면이 원주형상 또는 다각형상인 오목부;상기 오목부 개구측에 형성되고, 대상물과 대향하는 평탄형 끝면; 및공급유체를 오목부의 내주면에 면하는 분출구로부터 오목부내로 그 오목부의 내주방향을 따라 토출시키는 유체통로를 구비하는 것을 특징으로 하는 비접촉 반송장치.
- 제1항에 있어서, 상기 오목부의 내부에 둘레벽을 설치해서 선회류통로를 형성한 것을 특징으로 하는 비접촉 반송장치.
- 내주면이 원주형상 또는 다각형상인 오목부와, 그 오목부 개구측에 형성되고, 대상물과 대향하는 평탄형 끝면과, 공급유체를 오목부의 내주면에 면하는 분출구로부터 오목부내로 그 오목부의 내주방향을 따라 토출시키는 유체통로를 갖는 선회류형성체를 복수개 기저면에 설치해서 구성한 것을 특징으로 하는 비접촉 반송장치.
- 대상물에 대향하는 평탄면을 갖는 판형상의 베이스체의 일개소이상에, 내주면이 원주형상 또는 다각형상인 오목부와, 그 오목부의 내주면에 면하는 분출구로부터 오목부내로 공급유체를 내주방향을 따라 토출시키는 유체통로를 형성해서 구성한 것을 특징으로 하는 비접촉 반송장치.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 이온공급원을 설치하고, 상기 장치가 비접촉으로 유지하고 있는 대상물에 이온을 접촉시키는 것을 특징으로 하는 비접촉 반송장치.
- 제5항에 있어서, 상기 이온공급원을 오목부내에 면하도록 설치한 것을 특징으로 하는 비접촉 반송장치.
- 제5항에 있어서, 상기 장치가 비접촉으로 유지하고 있는 대상물에 면하도록 상기 이온공급원을 오목부밖에 설치한 것을 특징으로 하는 비접촉 반송장치.
- 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 공급유체는 초음파주파수의 진동을 갖는 유체인 것을 특징으로 하는 비접촉 반송장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001044173A JP3981241B2 (ja) | 2000-06-09 | 2001-02-20 | 旋回流形成体および非接触搬送装置 |
JPJP-P-2001-00044173 | 2001-02-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020068245A true KR20020068245A (ko) | 2002-08-27 |
KR100630360B1 KR100630360B1 (ko) | 2006-09-29 |
Family
ID=18906206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010042479A KR100630360B1 (ko) | 2001-02-20 | 2001-07-13 | 비접촉 반송장치 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100630360B1 (ko) |
AT (1) | ATE445909T1 (ko) |
DE (1) | DE60140172D1 (ko) |
TW (1) | TW500651B (ko) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100859835B1 (ko) * | 2008-05-13 | 2008-09-23 | 한국뉴매틱(주) | 비접촉식 진공패드 |
KR101258405B1 (ko) * | 2012-01-19 | 2013-04-26 | 로체 시스템즈(주) | 글라스 디스크 반송장치 |
WO2013064904A2 (en) * | 2011-10-31 | 2013-05-10 | Masahiro Lee | Ultrathin wafer transport systems |
KR101423822B1 (ko) * | 2012-06-28 | 2014-07-28 | 세메스 주식회사 | 웨이퍼 이송을 위한 비접촉 척 |
KR102053435B1 (ko) * | 2019-08-12 | 2019-12-06 | 주식회사 디에스이엔티 | 자동 반전용 인쇄회로기판 적재장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI569355B (zh) * | 2014-07-23 | 2017-02-01 | Harmotec Co Ltd | Control device and control method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6353945A (ja) * | 1986-08-25 | 1988-03-08 | Hitachi Ltd | 受け渡し装置 |
JPH0346250A (ja) * | 1989-07-14 | 1991-02-27 | Kawasaki Steel Corp | ウエハ搬送装置 |
JPH04341438A (ja) * | 1991-05-16 | 1992-11-27 | Toshiba Corp | 非接触ハンドリング装置 |
JPH0722175B2 (ja) * | 1991-05-24 | 1995-03-08 | 九州電子金属株式会社 | 半導体基板の非接触搬送装置 |
US6099056A (en) * | 1996-05-31 | 2000-08-08 | Ipec Precision, Inc. | Non-contact holder for wafer-like articles |
JP3725615B2 (ja) * | 1996-06-21 | 2005-12-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3445138B2 (ja) * | 1998-03-06 | 2003-09-08 | 株式会社西部技研 | 無接触搬送装置 |
US6095582A (en) * | 1998-03-11 | 2000-08-01 | Trusi Technologies, Llc | Article holders and holding methods |
-
2001
- 2001-07-05 TW TW090116445A patent/TW500651B/zh not_active IP Right Cessation
- 2001-07-12 DE DE60140172T patent/DE60140172D1/de not_active Expired - Lifetime
- 2001-07-12 AT AT01306016T patent/ATE445909T1/de not_active IP Right Cessation
- 2001-07-13 KR KR1020010042479A patent/KR100630360B1/ko active IP Right Grant
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100859835B1 (ko) * | 2008-05-13 | 2008-09-23 | 한국뉴매틱(주) | 비접촉식 진공패드 |
WO2013064904A2 (en) * | 2011-10-31 | 2013-05-10 | Masahiro Lee | Ultrathin wafer transport systems |
WO2013064904A3 (en) * | 2011-10-31 | 2013-07-18 | Masahiro Lee | Ultrathin wafer transport systems |
KR101258405B1 (ko) * | 2012-01-19 | 2013-04-26 | 로체 시스템즈(주) | 글라스 디스크 반송장치 |
KR101423822B1 (ko) * | 2012-06-28 | 2014-07-28 | 세메스 주식회사 | 웨이퍼 이송을 위한 비접촉 척 |
KR102053435B1 (ko) * | 2019-08-12 | 2019-12-06 | 주식회사 디에스이엔티 | 자동 반전용 인쇄회로기판 적재장치 |
Also Published As
Publication number | Publication date |
---|---|
KR100630360B1 (ko) | 2006-09-29 |
DE60140172D1 (de) | 2009-11-26 |
ATE445909T1 (de) | 2009-10-15 |
TW500651B (en) | 2002-09-01 |
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