KR100625743B1 - Method and apparatus for electronic part inspection - Google Patents

Abstract

The present invention relates to a device and a method for inspecting an ultra-small electronic component, the present invention relates to a feeder for supplying an electronic component, a feeder for moving the electronic component supplied from the supply by vibrating, And inspection means for photographing the shape of each side of the electronic component disposed in the upper position and moved through the feeder. The feeder has a conveyance path formed as a v-shaped groove so that the electronic component moves forward and rotates step by step at an angle in one direction. The v-shaped grooves are formed to gradually change the left and right inclination angles of the grooves according to the moving direction of the electronic components for the rotation of the electronic components.

Description

Apparatus and method for inspecting electronic components {METHOD AND APPARATUS FOR ELECTRONIC PART INSPECTION}

1 is a block diagram for explaining the present invention;

2 is a conceptual diagram illustrating the device configuration of the present invention;

3 is a perspective view showing a feeder in the present invention;

4 is a plan view showing a feeder;

5A and 5B are views for explaining blocks constituting a rotation area;

6 is a diagram for explaining inspection means;

7 is a view illustrating a process in which the electronic component is rotated step by step in the rotation region;

8 to 10 are views for explaining the process of extracting the electronic component determined as defective;

11 is a flowchart of the operation of the inspection means according to the present invention.

* Explanation of symbols for the main parts of the drawings

110: supply unit

120: feeder

122: transfer path

160: inspection means

b1: first block assembly

b2: second block assembly

b3: third block assembly

x: corner of v-groove

p1: left side of the v-groove

The present invention relates to an apparatus and method for inspecting microelectronic components.

In general, it is essential to work to check the status by performing a defect inspection of the electronic components before being installed in semiconductor equipment or electronic devices.

 However, most of the conventional inspection of the electronic component is carried out by several people in the workplace using a device such as a microscope, but it takes a long time to inspect a large amount of electronic components, there is a limit in accuracy There is a problem in that workability is inferior to the inspection.

In order to solve the above problem, two circular plates made of stainless steel are used or two drums are adsorbed by vacuum at the side of the drum and then rotated, and another drum is adsorbed at the end of the rotation. In order to inspect the electronic components, but this also has a problem that takes a lot of time and accuracy in the inspection of the electronic products.

In other words, the above method can be performed faster than manual inspection, but it takes a long time to inspect a large amount of the operation is repeated several times, the adsorption of the drum to check the four sides of the electronic component Because of the need to repeat a lot of time and accuracy is a problem.

Therefore, due to the above problems, the defect inspection on the conventional electronic components can be reversed to the rapidly developing semiconductor technology, and this reduces the productivity and economical efficiency, and at the same time uses the electronic components that have not been properly inspected. There are always problems that minimize the reliability and satisfaction of the user.

The present invention has been made to solve such a conventional problem, and an object thereof is to provide a new type of electronic component inspection apparatus and method that does not require fine adjustment.

Another object of the present invention is to provide a new type electronic component inspection apparatus and method which is small in volume and simple in construction.

A feature of the present invention for achieving the above object is a feeder for moving the electronic component supplied from the supply unit by vibration, and the electronic component disposed at an upper position of the feeder and moved through the feeder. Inspection means for photographing the shape of each surface, the feeder

The electronic component moves forward and has a conveyance path formed to rotate step by step at an angle in one direction.

According to the present invention, the feeder includes: an alignment area in which electronic parts supplied from the supply unit are aligned; And a rotational region extending from the alignment region and in which the electronic components aligned in the alignment region are rotated. The rotation area is composed of a plurality of blocks, each of the plurality of blocks is formed with a V-shaped groove for forming the transfer path on the upper surface.

According to the present invention, for the rotation of the electronic component, the V-shaped grooves are formed to gradually change the left and right inclination angle of the groove in accordance with the direction of the electronic component, the corner of the V-shaped grooves are the progress of the electronic component It gradually decreases with direction. The corners of the pre-V grooves are changed in one direction according to the advancing direction of the electronic component.

Another feature of the invention is the step of supplying an electronic component to the feeder of the feeder; Moving and rotating the electronic component supplied to the feed path of the feeder such that the right side and the upper surface of the electronic component are exposed; Photographing a right side and an upper side of the electronic component rotated on the feed path of the feeder; Determining whether or not a defective image is captured; When the failure is determined, operating the air injection device to extract the object from the feeder path; Moving and rotating the electronic component supplied to the feeder path of the feeder such that the left side and the bottom surface of the electronic component are exposed; Photographing a left side and a bottom of the electronic component rotated on the feeder of the feeder; Determining whether or not a defective image is captured; And upon failure determination, operating the air jetting device to extract the object from the feeder's conveying path.

For example, the embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. These examples are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 13. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

1 to 4, the inspection apparatus 100 of the present invention is an apparatus for inspecting a completed electronic component before being installed in a semiconductor device or an electronic device. The configuration of the feeder 120, the feeder 120 for moving and gradually rotating the electronic parts (inspection object) 10 of the cube supplied from the supply unit 110, the feeder 120, this feeder Inspection means 160 and the like disposed on the upper portion.

Reference numeral 190 denotes a part receiver for receiving an electronic component that is separated from the transfer path 122 of the feeder 120, 192 is a container for recovering a good product, and 194 is a defective container for recovering a defective product.

The supply unit 110 is a bowl for sequentially discharging the electronic component 10 supplied through a hopper (not shown) containing a large amount for inspecting the completed electronic component 10 by vibrating action It consists of feeder. The electronic parts discharged from the supply unit 110 are supplied to the feed path 122 of the feeder (aka liner feeder).

The feeder 120 is the most important component in the present invention, an alignment area (a) for receiving and aligning the electronic component 10 from the supply unit 110, and a rotation area (b) connected to the alignment area. It includes. In these regions, a V-groove-shaped transfer path 122 near a straight line is formed. The feeder 120 has an upper surface 124 formed to be inclined downward so that an electronic component separated from the transfer path 122 naturally falls (flows). Electronic components falling from the upper surface 124 of the feeder are contained in the component receivers 190 installed on both sides of the feeder, and the electronic components 10 are disposed in front of the defective container 194 by vibrating action of the feeder. ) Is recovered.

The alignment area (a) may be composed of one or two long blocks, and the transport path formed in the block is formed of approximately V-shaped grooves.

The transfer path of the rotation area b is formed such that the electronic component 10 moves forward and rotates the electronic component by one angle at a predetermined angle in one direction.

The rotation area b is formed by combining three block assemblies b1, b2, and b3 in a row. Each of these block assemblies consists of a combination of three blocks with V-shaped grooves p having different angles of inclination. That is, the rotation area b is composed of a combination of nine blocks 1-1 to 3-3. Here, it is not important how many of the blocks are made. Importantly, the structural characteristics of the V-shaped grooves p formed in the blocks (left and right tilt angles, heights and corner positions) of the electronic parts The rotation takes place.

As shown in FIGS. 5A and 5B, 1-1 block 130 of the first block assembly b1, V-shaped grooves p of 1-2 blocks 132, and 1-3 blocks 134 are shown. The left side p1 changes from a 20 degree slope to a 45 degree and a 70 degree slope from the initial vertical. In addition, the V-groove slopes of the 2-1 and 3-1 blocks 136 and 142 are the same as those of the 1-1 block 130, and the V-groove slopes of the 2-2 and 3-2 blocks 138 and 144 are It can be seen that the same as the 1-2 block 132, the V-shaped groove slope of the 2-3 and 3-3 blocks (140, 146) is the same as the 1-3 block (134).

And, the corner x of the V-shaped groove p of each of the block assemblies is gradually lowered along the traveling direction (arrow direction) of the electronic component. In addition, the corners x of the V-groove of the second block assembly b2 are positioned to be moved to the left side than the corners x of the V-groove of the first block assembly, and the V-grooves of the third block assembly b3 may be The corners are moved to the left than the corners of the V-groove of the second block assembly.

Due to the structural features of the V-shaped grooves p as described above, the electronic component is gradually rotated in the left direction while being moved.

Referring to FIG. 7, the electronic component 10 is rotated 180 degrees while being moved along the V-shaped groove p) formed in the nine blocks 130-146. The electronic component rotates by 90 degrees while moving from 1-1 block 130 of the first block assembly b1 to 2-1 block 136 of the second block assembly b2, and again, the third block assembly ( It is rotated 90 degrees while moving to 3-1 block 142 of b3).

As such, the V-shaped grooves p formed in the blocks and forming the transport path 122 are formed such that the left and right inclination angles of the grooves, the height of the grooves, and the corners of the grooves are gradually changed according to the moving direction of the electronic component. Has structural features. Due to this structural feature, the electronic component 10 is gradually moved while being moved. Therefore, photographing of four surfaces is possible except for the front and rear cross sections along the moving direction of the electronic component.

Referring to FIGS. 6 and 7, the inspection means 160 may include first to first images for photographing shapes of four surfaces of the electronic component 10 moved through the feed path 122 of the feeder 120. 4 inspection cameras 162a, 162b, 162c, and 162d, and a first microcomputer 164 that receives an image from these inspection cameras and determines good or bad. In addition, the first microcomputer 164 includes a sensing unit 166 that provides location information of an electronic component for inspection.

The first and second inspection cameras 162a and 162b may include two or four blocks of the electronic component on one or two blocks 132 of the first block assembly b1 (blocks in which the right inclination angle of the V-shaped groove maintains 45 degrees). The surfaces 10a and 10b (the right side and the top side) are taken. The third and fourth inspection cameras have two sides 10d and 10c of the electronic component on the 3-2 block 144 of the third block assembly (blocks in which the inclination angle of the left and right sides of the V-shaped groove maintains 45 degrees). (Left side and bottom)

The sensing unit 166 may include first and second sensing cameras 168a and 168b installed at upper portions of the photographing areas of the 1-2 blocks 132 and the 3-2 blocks 144, and the sensing cameras 168a and 168b. The second microcomputer 169 receives the continuously photographed image and determines whether the electronic component 10 is accurately positioned in the photographing area. The second microcomputer 169 provides the location information to the first microcomputer 164. The first microcomputer 164 receives a signal from the second microcomputer 169 to control photographing of the inspection cameras.

In the present embodiment, two sensing cameras are installed, but one sensing camera may be disposed for each inspection camera.

In the inspection apparatus 100 according to the present invention, the electronic component determined as defective in the first microcomputer 164 is immediately extracted from the conveying path 122, and the electronic component determined as good quality continues along the conveying path 122. It is moved and falls to the bins installed in front of the feeder.

8 to 10, the present invention has an air injection device 170 for forcibly disengaging from the transfer path 122 by injecting air to the electronic component determined as defective.

2 and 3, the air injection device 170 is installed in two places (the first block assembly and the third block assembly), respectively. The air injection device 170 has an injection hole 172 formed between 1-2 blocks 132 and 1-3 blocks 134 (or 3-2 blocks and 3-3 blocks), and an air passage connected to the injection holes. 174 and airline 176. The air line is provided with a valve 178 controlled by the first microcomputer.

Meanwhile, the separation preventing means 180 is installed in the blocks 132, 134, 144, and 146 adjacent to the injection hole 172. When the electronic component is extracted by the air spraying device 170, the detachment preventing means 180 is for preventing the electronic component and the electronic components adjacent to the extracted electronic component from being separated.

The separation preventing means 180 is a vacuum hole 182 formed in the right side (or may be formed on the left side) of the V-shaped groove of 1-2 blocks and 1-3 blocks and 3-2 blocks and 3-3 blocks And a vacuum passage 184 and a vacuum line 186 for providing a vacuum to each vacuum hole 182. The vacuum line may be provided with a valve 188 controlled by the first microcomputer, and the vacuum of the vacuum hole may be formed only while air is injected from the injection hole.

On the other hand, the present invention can be variously modified in the inspection apparatus 100 for the electronic component 10 having the above configuration and may take various forms. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

The following describes the operational relationship of the present invention for inspecting completed electronic components prior to installation in semiconductor equipment or electronic devices.

Electronic components are sequentially provided from the supply unit 110 (aka bowl feeder) to the feed path of the feeder 120. The feed path 122 of the feeder 120 is vibrated by a vibrator (not shown), and the electronic components 10 are moved by the vibration.

The electronic component 10 enters the rotation region b through the alignment region a of the feeder, and the electronic component 10 rotates 180 degrees while moving along the V-shaped grooves p of the nine blocks. do.

7 illustrates a step of rotating the electronic component. Referring to FIG. 7, the electronic component 10 rotates by 90 degrees while moving from 1-1 block 130 of the first block assembly to 2-1 block 136 of the second block assembly, and then again to the third It is rotated 90 degrees while moving to block 3-1 of the block assembly 142.

13 is a flowchart for explaining the operation of the inspection means. Referring to FIGS. 13 and 6, the sensing cameras 168a and 168b of the sensing unit 166 continuously photograph the photographing areas of 1-2 blocks 132 and 3-2 blocks 144 (s12). ). The second microcomputer 169 processes the continuous photographed image to determine whether the electronic component 10 is correctly positioned in the photographing area (s14 and s16). When the electronic component is in the correct position, the second microcomputer 169 generates a signal to the first microcomputer 164 (s18), and the first microcomputer 164 receiving the signal transmits a photographing signal to inspection cameras. give. The inspection cameras photograph the electronic components in response to the photographing signal of the first microcomputer 164 (S20). That is, the first and second inspection cameras 162a and 162b are disposed on one or two blocks 132 of the first block assembly b1 (blocks in which the left and right inclination angles of the V-shaped grooves maintain 45 degrees). The two sides (right side and top side) of the electronic component are photographed. In addition, the third and fourth inspection cameras 162c and 162d may be formed on the 3-2 block 144 of the third block assembly b3 (a block in which the right inclination angle of the V-shaped groove maintains 45 degrees). The two sides (left side and bottom) of the camera will be photographed.

Information photographed through the inspection cameras is sent to the first microcomputer 164, and the first microcomputer 164 analyzes the image information to determine whether it is good or bad (S22).

After inspecting the electronic component, the microcomputer 164 controls the valve 178 to inject air through the injection hole 172 when the electronic component determined as a defective product is located on the injection hole 172 (s24, s26). ). The electronic parts are discharged out of the transport path (V-shaped groove) 122 by the air injected from the injection port 172 to fall to the parts receiving 190, this electronic component is a bad container 194 installed in front of the parts receiving 190 ) Is recovered. The electronic component determined as good quality is moved along the transfer path 122 and recovered to the good quality bin 192 installed in front of the feeder.

The electronic component 10 represents a micro component, such as a micro layer ceramic capacitor (MLCC) chip or an MLCL chip, for example. In addition, in this embodiment, although the vibration by a vibrator is used for moving an electronic component, it is not limited to this, Another movement method can also be applied.

In the above, the configuration and operation of the inspection apparatus according to the present invention is shown in accordance with the above description and drawings, but this is merely an example, and various changes and modifications are possible without departing from the technical spirit of the present invention. to be.

Applying the present invention, by mounting the V-groove-processed blocks in the feeder, it is possible to simply implement the movement and rotation of the electronic components, by eliminating the configuration for the rotation motor or alignment in preparation for the existing inspection device, Not only can the overall size be reduced, but there is an advantage that no fine adjustment is required.

Claims (22)

A supply unit for supplying electronic components; A feeder having a conveying path formed so that the electronic component supplied from the supply unit moves forward by vibration and is rotated stepwise by a predetermined angle in one direction; Inspection means for photographing the shape of each face of the electronic component disposed at an upper position of the feeder and moved through the feeder; Extracting means having an air ejecting device for selectively extracting only the defective article from the conveying by the signal generated by the inspecting means; And an anti-separation means for preventing the accompanying detachment of the electronic component located adjacent to the front and rear of the extracted defective article when the defective article is extracted by the air injection apparatus. The method of claim 1, The feeder An alignment area in which the electronic parts supplied from the supply unit are aligned; A rotation region extending from the alignment region and in which the electronic components aligned in the alignment region are rotated, The rotation area is composed of a plurality of blocks formed with a V-shaped groove for forming the transfer path on the upper surface, And the accompanying departure preventing means forms a vacuum hole in one side of the V-shaped groove of the block, and vacuum-adsorbs the electronic component. delete The method of claim 2, In order to rotate the electronic components, the V-shaped grooves are electronic component inspection device, characterized in that formed to gradually change the left and right inclination angle of the groove in accordance with the direction of the electronic component. The method of claim 2, And the corners of the V-shaped grooves are gradually lowered according to the advancing direction of the electronic component. The method of claim 2, The corners of the V-shaped grooves are changed in one direction according to the traveling direction of the electronic component. The method according to claim 1 or 2, And the feeder has an upper surface inclined downward so that the electronic component separated from the transfer path can flow down. The method of claim 2, The rotation area includes first to third block assemblies comprising blocks formed on an upper surface of a V-shaped groove for providing the transport path; In the first block assembly, an edge where a left side and a bottom face of the electronic component meet at a corner of the V-shaped grooves is positioned. While moving to the second block assembly, the corner where the upper surface and the left side of the electronic component meet is located at the corner of the V-shaped groove of the second block assembly, When moving to the third block assembly, the electronic component inspection device, characterized in that the corner where the upper surface and the upper surface of the electronic component meets the corner of the V-shaped groove of the third block assembly. The method of claim 8, In the first block assembly, left and bottom surfaces of the electronic component contact the left and right inclined surfaces of the V-shaped grooves, In the second block assembly, upper and left surfaces of the electronic component contact the left and right inclined surfaces of the V-shaped grooves, In the third block assembly, the right surface and the upper surface of the electronic component is in contact with the left and right inclined surfaces of the V-shaped grooves. The method of claim 2, The inspection means A sensing unit for grasping position information of an electronic component for inspection; A first microcomputer that receives location information from the sensing unit and controls an operation of an inspection camera; And an inspection camera configured to photograph the top, bottom, right side, and left side of the electronic component under the control of the first microcomputer, and provide the photographed image to the first microcomputer. . The method of claim 10, The sensing unit Sensing cameras for continuously photographing the electronic components; And a second micom configured to receive images from the sensing cameras to determine whether the electronic component is located in the correct photographing area, and to provide the location information to the first microcomputer. The method of claim 10, The inspection means An inspection apparatus for an electronic component, characterized in that one inspection camera is disposed on the sensing camera. delete delete The method of claim 2, The extraction means A part receiving device installed on both sides of the feeder and receiving the defective product separated from the conveying path by the air injection device; The air injection apparatus includes an injection hole formed between a block and a block adjacent to each other, an air passage for supplying air to the injection hole, and an air line connected to the air passage. delete delete delete In a method for inspecting completed electronic components before they are installed in semiconductor equipment or electronic devices: Supplying an electronic component to a feeder of a feeder; Moving and rotating the electronic component supplied to the feed path of the feeder such that the right side and the upper surface of the electronic component are exposed; Photographing a right side and an upper side of the electronic component rotated on the feed path of the feeder; Determining whether or not a defective image is captured; When the failure is determined, operating the air injection device to extract the object from the feeder path; Moving and rotating the electronic component supplied to the feeder path of the feeder such that the left side and the bottom surface of the electronic component are exposed; Photographing a left side and a bottom side of the electronic component rotated on the feeder of the feeder secondly; Determining whether or not the defective image is captured; And When the failure is determined, operating the air injection device to extract the object from the feeder path; When the object is extracted by the operation of the air injector, the electronic component positioned adjacent to the front and rear of the object to be extracted is sucked with a vacuum to prevent accompanying departure with the extracted electronic component. Way. The method of claim 19, The shooting step Continuously photographing electronic components entering the photographing area; Comparing the photographed images to determine whether the electronic component is located at a correct position in the photographing area; And photographing the electronic component when the electronic component is positioned at the correct position of the photographing area. The method of claim 19, And the electronic component moves and rotates along a transport path formed of a V-shaped groove. The method of claim 19, And the electronic component is rotated by gradually changing the left and right inclination angles of the V-shaped grooves in accordance with a traveling direction of the electronic component.

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