KR100616765B1 - 확산 접합된 스퍼터 타켓 조립체 및 그 제조 방법 - Google Patents
확산 접합된 스퍼터 타켓 조립체 및 그 제조 방법 Download PDFInfo
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- KR100616765B1 KR100616765B1 KR1020017007462A KR20017007462A KR100616765B1 KR 100616765 B1 KR100616765 B1 KR 100616765B1 KR 1020017007462 A KR1020017007462 A KR 1020017007462A KR 20017007462 A KR20017007462 A KR 20017007462A KR 100616765 B1 KR100616765 B1 KR 100616765B1
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- target
- backing plate
- bonding
- inner layer
- assembly
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/26—Alloys of Nickel and Cobalt and Chromium
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (24)
- 접합된 스퍼터 타켓 및 백킹판 조립체의 형성 방법으로서,(a) Co 및 그 합금으로부터 선택되는 금속으로 구성되고, 접합면을 구비하는 타켓을 제공하는 단계와,(b) Al 및 Al 합금과 Cu 및 Cu 합금으로 이루어진 그룹에서 선택된 금속으로 구성되고, 접합면을 구비하는 백킹판을 제공하는 단계와,(c) 상기 타켓의 접합면과 상기 백킹판의 접합면이 서로에 대하여 인접하도록 상기 타켓과 상기 백킹판을 위치시키는 단계와,(d) 조립체를 형성하기 위하여, Ib족 금속과 그 합금으로부터 선택된 금속을 함유하는 접합 내부층을, 상기 타켓과 상기 백킹판의 접합면 사이에 제공하는 단계, 및(e) 상기 타켓과 상기 백킹판을 함께 확산 접합하기 위하여, 상기 조립체를 온도 및 압력 강화 조건에 노출시키는 단계를 포함하고,상기 온도는 190℃ 내지 400℃ 사이에 있는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 접합 내부층은 5 내지 100미크론의 두께를 갖는 금속 포일(foil)인 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 내부층은 적어도 하나의 접합면을 코팅함으로써 제공되는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 3 항에 있어서, 상기 코팅은 스퍼터 코팅에 의하여 제공되는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 3 항에 있어서, 상기 코팅은 플라즈마 스프레이에 의하여 제공되는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 3 항에 있어서, 상기 코팅은 전기도금에 의하여 제공되는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 단계 (e)이전에 상기 접합면들 중의 적어도 하나를 거칠게 가공하는 단계를 추가로 포함하는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 단계 (e)는 고온 등압 성형(HIP)을 포함하는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 단계 (e)는 진공의 고온 가압 성형을 포함하는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 단계 (e)에서의 압력은 10 내지 30 ksi인 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 단계 (e)에서의 온도는 250℃ 내지 400℃인 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항에 있어서, 상기 단계(c) 이후, 상기 타겟은 60% 이상의 자기 관통 플럭스를 갖는 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 12 항에 있어서, 상기 자기 관통 플럭스는 65% 이상인 접합된 스퍼터 타켓 및 백킹판 조립체 형성 방법.
- 제 1 항 내지 제 13 항 중 어느 한 항에 따라서 제조된 스퍼터 타켓 조립체.
- Co 또는 Co 합금으로 본질적으로 구성된 타겟과, 백킹판, 및 상기 타켓과 상기 백킹판 사이에 위치하고 Ag 또는 Ag 합금으로 구성되는 내부층을 포함하고,상기 백킹판은 Al 또는 Al 합금 또는 Cu 또는 Cu 합금을 포함하며,상기 타겟은 60% 이상의 자기 관통 플럭스를 갖는 스퍼터 타켓 조립체.
- 제 15 항에 있어서, 상기 타켓 및 상기 백킹판은 상기 내부층을 따라 서로에 대해 확산 접합되며,상기 타켓은 65% 이상의 자기 관통 플럭스를 갖는 스퍼터 타켓 조립체.
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11435198P | 1998-12-29 | 1998-12-29 | |
US60/114,351 | 1998-12-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010101225A KR20010101225A (ko) | 2001-11-14 |
KR100616765B1 true KR100616765B1 (ko) | 2006-08-31 |
Family
ID=22354715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020017007462A KR100616765B1 (ko) | 1998-12-29 | 1999-12-17 | 확산 접합된 스퍼터 타켓 조립체 및 그 제조 방법 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1147241B1 (ko) |
JP (1) | JP2002534604A (ko) |
KR (1) | KR100616765B1 (ko) |
DE (1) | DE69940277D1 (ko) |
WO (1) | WO2000040770A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101414352B1 (ko) | 2013-05-27 | 2014-07-02 | 한국생산기술연구원 | 금속재 브레이징용 페이스트 대체 코팅 및 그에 따른 금속재 접합 방법 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7041204B1 (en) | 2000-10-27 | 2006-05-09 | Honeywell International Inc. | Physical vapor deposition components and methods of formation |
JP2002294437A (ja) * | 2001-04-02 | 2002-10-09 | Mitsubishi Materials Corp | 銅合金スパッタリングターゲット |
KR20060037255A (ko) * | 2003-08-11 | 2006-05-03 | 허니웰 인터내셔널 인코포레이티드 | 타겟/벡킹 플레이트 구조물 |
KR100784992B1 (ko) * | 2006-09-05 | 2007-12-14 | 한국생산기술연구원 | 코팅용 타겟 제조방법 및 그 제품 |
CN104690410A (zh) * | 2013-12-05 | 2015-06-10 | 有研亿金新材料股份有限公司 | 一种靶材组件的制备方法 |
CN110662314B (zh) * | 2019-09-10 | 2022-05-20 | 博宇(天津)半导体材料有限公司 | 一种加热器及其制备方法 |
CN112091401B (zh) * | 2020-09-11 | 2022-04-12 | 宁波江丰电子材料股份有限公司 | 一种钛铝合金靶材及其焊接的方法 |
CN112935512A (zh) * | 2021-03-26 | 2021-06-11 | 宁波江丰电子材料股份有限公司 | 一种钴靶材与铜铬合金背板的扩散焊接方法 |
CN115233169B (zh) * | 2022-06-22 | 2023-09-05 | 苏州六九新材料科技有限公司 | 一种铝基管状靶材及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW234767B (ko) * | 1992-09-29 | 1994-11-21 | Nippon En Kk | |
BE1007535A3 (nl) * | 1993-09-24 | 1995-07-25 | Innovative Sputtering Tech | Gelaagde metaalstructuur. |
US6073830A (en) * | 1995-04-21 | 2000-06-13 | Praxair S.T. Technology, Inc. | Sputter target/backing plate assembly and method of making same |
US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
US5803342A (en) * | 1996-12-26 | 1998-09-08 | Johnson Matthey Electronics, Inc. | Method of making high purity copper sputtering targets |
KR20010005546A (ko) * | 1997-03-19 | 2001-01-15 | 존슨매테이일렉트로닉스, 인코퍼레이티드 | 후면에 확산 니켈 플레이트된 타겟과 그의 생성방법 |
-
1999
- 1999-12-17 DE DE69940277T patent/DE69940277D1/de not_active Expired - Lifetime
- 1999-12-17 EP EP99966419A patent/EP1147241B1/en not_active Expired - Lifetime
- 1999-12-17 KR KR1020017007462A patent/KR100616765B1/ko not_active IP Right Cessation
- 1999-12-17 WO PCT/US1999/030213 patent/WO2000040770A1/en active IP Right Grant
- 1999-12-17 JP JP2000592462A patent/JP2002534604A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101414352B1 (ko) | 2013-05-27 | 2014-07-02 | 한국생산기술연구원 | 금속재 브레이징용 페이스트 대체 코팅 및 그에 따른 금속재 접합 방법 |
Also Published As
Publication number | Publication date |
---|---|
WO2000040770A1 (en) | 2000-07-13 |
JP2002534604A (ja) | 2002-10-15 |
EP1147241B1 (en) | 2009-01-07 |
EP1147241A1 (en) | 2001-10-24 |
KR20010101225A (ko) | 2001-11-14 |
EP1147241A4 (en) | 2007-05-02 |
DE69940277D1 (de) | 2009-02-26 |
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