KR100604328B1 - 와이어 본딩용 캐필러리의 본딩 압력 캘리브레이션 방법 - Google Patents
와이어 본딩용 캐필러리의 본딩 압력 캘리브레이션 방법 Download PDFInfo
- Publication number
- KR100604328B1 KR100604328B1 KR1019990012907A KR19990012907A KR100604328B1 KR 100604328 B1 KR100604328 B1 KR 100604328B1 KR 1019990012907 A KR1019990012907 A KR 1019990012907A KR 19990012907 A KR19990012907 A KR 19990012907A KR 100604328 B1 KR100604328 B1 KR 100604328B1
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- South Korea
- Prior art keywords
- input
- capillary
- value
- piezoelectric element
- output
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims abstract description 6
- 238000009530 blood pressure measurement Methods 0.000 claims abstract description 3
- 238000012795 verification Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (2)
- 압력 측정용 압전소자를 이용하여 캐필러리의 본딩 압력에 대한 입출력값 편차를 보정하기 위한 와이어 본딩용 캐필러리의 본딩 압력 캘리브레이션 방법에 있어서,상기 캐필러리를 상기 압전소자의 상부로 이송시키는 이송단계와;상기 캐필러리를 구동하여 상기 압전소자로부터 소정의 제1출력값이 측정될 때까지 입력값인 전기신호를 변화시키면서 그 압전소자를 가압하고, 그 제1출력값이 측정될 때입력된 제1입력값을 검출하는 제1측정단계와;상기 캐필러리를 구동하여 상기 압전소자로부터 소정의 제2출력값이 측정될 때까지 입력값인 전기신호를 변화시키면서 그 압전소자를 가압하고, 그 제2출력값이 측정될 때 입력된 제2입력값을 검출하는 제2측정단계와;상기 제1,2측정단계에서 각각 검출된 제1,2입력값 및 제1,2출력값으로 부터 출력값 변화량에 대한 입력값 변화량의 비 즉, 입출력비를 산출하는 산출단계; 및,상기 산출단계에서 산출된 입출력비를 프로그램에 세팅하는 세팅단계;를 포함하는 것을 특징으로 하는 와이어 본딩용 캐필러리의 본딩 압력 캘리브레이션 방법.
- 제1항에 있어서,상기 산출단계 후에, 그 산출단계에서 산출된 입출력비를 검증하기 위해 임의의 입력값을 입력시켜서 그 때 측정되는 출력값이 상기 입출력비에 의해 계산된 값과 일치하는지를 확인하는 검증단계가 더 포함되는 것을 특징으로 하는 와이어 본딩용 캐필러리의 캘리브레이션 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990012907A KR100604328B1 (ko) | 1999-04-13 | 1999-04-13 | 와이어 본딩용 캐필러리의 본딩 압력 캘리브레이션 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990012907A KR100604328B1 (ko) | 1999-04-13 | 1999-04-13 | 와이어 본딩용 캐필러리의 본딩 압력 캘리브레이션 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000066062A KR20000066062A (ko) | 2000-11-15 |
KR100604328B1 true KR100604328B1 (ko) | 2006-07-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990012907A KR100604328B1 (ko) | 1999-04-13 | 1999-04-13 | 와이어 본딩용 캐필러리의 본딩 압력 캘리브레이션 방법 |
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KR (1) | KR100604328B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3307468B1 (de) * | 2015-06-15 | 2024-05-01 | Hesse GmbH | Automatische bondkraftkalibrierung |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101332867B1 (ko) * | 2012-07-24 | 2013-11-22 | 앰코 테크놀로지 코리아 주식회사 | 와이어 본더의 캐필러리 본드 파워 및 포스 자동 캘리브레이션 장치 |
CN114913969A (zh) * | 2022-05-18 | 2022-08-16 | 河南翔宇医疗设备股份有限公司 | 一种高压输出标定的方法、装置及介质 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60244032A (ja) * | 1984-05-18 | 1985-12-03 | Mitsubishi Electric Corp | ワイヤボンデイング装置 |
JPH1027818A (ja) * | 1996-07-10 | 1998-01-27 | Toshiba Mechatronics Kk | ボンディング装置におけるボンディング荷重検出装置 |
KR100191427B1 (ko) * | 1995-06-30 | 1999-06-15 | 김영환 | 와이어본딩 자동제어장치 및 방법 |
KR200145799Y1 (ko) * | 1996-06-22 | 1999-06-15 | 김영환 | 본딩 압력 측정장치 |
-
1999
- 1999-04-13 KR KR1019990012907A patent/KR100604328B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60244032A (ja) * | 1984-05-18 | 1985-12-03 | Mitsubishi Electric Corp | ワイヤボンデイング装置 |
KR100191427B1 (ko) * | 1995-06-30 | 1999-06-15 | 김영환 | 와이어본딩 자동제어장치 및 방법 |
KR200145799Y1 (ko) * | 1996-06-22 | 1999-06-15 | 김영환 | 본딩 압력 측정장치 |
JPH1027818A (ja) * | 1996-07-10 | 1998-01-27 | Toshiba Mechatronics Kk | ボンディング装置におけるボンディング荷重検出装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3307468B1 (de) * | 2015-06-15 | 2024-05-01 | Hesse GmbH | Automatische bondkraftkalibrierung |
Also Published As
Publication number | Publication date |
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KR20000066062A (ko) | 2000-11-15 |
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