KR100599549B1 - Film carrier tape for mounting electronic devices thereon - Google Patents

Abstract

Provided are a flat film carrier tape for mounting electronic components, which can improve reliability during conveyance or mounting on a semiconductor mounting line.

On the surface of the insulating layer 11, the wiring pattern 13 which consists of the conductive layer 12, and the several sprocket holes 14 provided in the both sides of the wiring pattern 13 are provided, and the sprocket hole 14 is surrounded by In the film carrier tape 10 for mounting electronic components provided with the metal layer 16, the metal layer 16 is provided substantially continuously along the longitudinal direction of the insulating layer 11, and the area between the sprocket holes 14 is provided. By satisfying the condition of 0.3 ≦ w ₁ ≦ (w ₂ +1.1) when the width w ₁ [mm] of the metal layer 16 of the metal layer 16 and the width of the sprocket hole 14 are w ₂ [mm] The stress between the metal layer 16 and the insulating layer 11 is appropriately opened, so that the flat film carrier tape 10 for mounting electronic components can improve the reliability of the semiconductor mounting line.

Insulating layer, conductive layer, wiring pattern, sprocket hole, solder resist, slit, COF, photoresist, photomask.

Description

Film carrier tape for electronic component mounting {FILM CARRIER TAPE FOR MOUNTING ELECTRONIC DEVICES THEREON}

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the film carrier tape for electronic component mounting which concerns on Embodiment 1 of this invention, (a) is a top view, (b) is sectional drawing, and (c) is a principal part enlarged plan view.

It is sectional drawing explaining one example of the manufacturing method of the film carrier tape for electronic component mounting which concerns on Embodiment 1 of this invention.

3 is an enlarged plan view of a main part of a film carrier tape for mounting an electronic component according to Embodiment 2 of the present invention.

It is an enlarged plan view of the principal part of the film carrier tape for electronic component mounting which concerns on Embodiment 3 of this invention.

FIG. 5 is a graph showing the relationship between the widths w ₁ and w ₃ of the metal layers and the amount of deformation in the wave form after the solder resist layer is formed. FIG.

(Explanation of the sign)

10 Film Carrier Tape for Mounting Electronic Components

11 insulating layer 12 conductive layer

13 Wiring patterns 14 Sprocket Holes

15 Solder Resist Layer 16 Metal Layer

Laminated Film for 17 Slits 20 COF

21 Photoresist Material Coating Layer

22 Photomask 23 Resist Pattern for Wiring Pattern

24 Resist Pattern for Metal Layer

TECHNICAL FIELD This invention relates to the film carrier tape for mounting electronic components used for mounting electronic components, such as IC or LSI.

BACKGROUND With the development of the electronics industry, the demand for printed wiring boards for mounting electronic components such as ICs (Integrated Circuits) and LSIs (Large Integrated Circuits) is increasing rapidly. However, miniaturization, light weight, and high functionality of electronic devices are required. As a mounting method of an electronic component, the mounting method using the film carrier tape for electronic component mounting, such as TAB tape, T-BGA tape, ASIC tape, is employ | adopted in recent years. In particular, in the electronics industry using liquid crystal display devices (LCDs), such as personal computers, mobile phones, and the like, where high definition, thinness, and narrow frame area of a liquid crystal screen are desired, their importance is increasing.

In addition, with the miniaturization of electronic devices and the like, thinning of film carrier tapes for mounting electronic components has been desired. In recent years, COF (chip-on-film) tapes and the like using insulating layers having a relatively thin film thickness have been proposed.

Such a film carrier tape for mounting an electronic component includes, for example, a step of forming a sprocket hole for conveyance or the like on both sides in a width direction of an insulating layer made of polyimide, and an insulating layer while conveying the insulating layer using the sprocket hole. Forming a mask pattern by forming a photoresist coating layer on the copper foil provided on one side of the film, exposing and developing the photoresist coating layer, patterning the photoresist coating layer, and forming a copper foil through the mask pattern It manufactures through the process of forming a wiring pattern by etching, and the process of forming a soldering resist layer on each wiring pattern.

However, in the type where the thickness of the insulating layer such as the COF tape described above is relatively thin, the rigidity of the sprocket hole cannot be sufficiently secured, causing a problem that the sprocket hole is deformed at the time of conveyance.

Therefore, in order to solve such a problem, the structure which secured tape conveyance strength by providing a reinforcement layer (metal layer) continuously around the each sprocket hole (sprocket hole) over the longitudinal direction of an electrically insulating flexible tape (insulation layer) It is proposed (for example, refer patent document 1).

In addition, in the manufacturing process of the above-mentioned film carrier tape for mounting an electronic component, especially each process of forming a photoresist layer or a solder resist layer or a tin plating process, a spacer member having embossing in a region where a wiring pattern is not formed ( A so-called hardening (cure) process or a heating step for preventing the occurrence of whiskers is introduced by winding a film carrier tape to a reel together with an embossed spacer film (see Patent Document 2, for example).

(Patent Document 1)

Japanese Unexamined Patent Publication No. 4-48629 (Figures 1 to 3, Utility Model Registration Claim)

(Patent Document 2)

Japanese Laid-Open Patent Publication No. 2001-77157 (paragraph [0006])

However, in the film carrier tape for mounting an electronic component provided with the reinforcing layer described above, the height in the lengthwise direction of both sides of the film carrier tape for mounting the electronic component as the final product, that is, in the region where the sprocket hole is present, is about 1 to 2 mm. There is a problem that the deformation of the wave occurs.

Such a noticeable wave deformation is not seen in a normal product without a reinforcing layer provided around the sprocket hole, and in the curing step or the heating step to prevent the occurrence of whiskers, the metal layer and It is thought that the difference in material property values between the insulating layers, for example, the difference in linear expansion coefficient, tensile strength, or elongation rate, is caused by complicated influences of treatments such as heating and cooling during the manufacturing process.

And the film carrier tape for mounting an electronic component deformed in such a wave form cannot be conveyed by positioning with a pin roller or the like smoothly in a semiconductor mounting line, and cannot follow a guide or the like provided in a conveying path, There is a problem that it leads to poor mounting, etc., resulting in product defects.                         

In view of such circumstances, the object of the present invention is to provide a flat film carrier tape for mounting electronic components that can improve the reliability at the time of conveyance or mounting in a semiconductor mounting line.

The 1st aspect of this invention which solves the said subject has the wiring pattern which consists of a conductive layer on the surface of an insulating layer, and the some sprocket hole provided in the both sides of the said wiring pattern, The electron provided with the metal layer around the said sprocket hole In the film carrier tape for component mounting, the metal layer is provided substantially continuously along the longitudinal direction of the insulating layer, and the width (w ₁ ) [mm] of the metal layer in the region between the sprocket holes corresponds to When the width of the sprocket hole is w ₂ [mm], the film carrier tape for mounting electronic components is characterized by satisfying the condition of 0.3 ≦ w ₁ ≦ (w ₂ +1.1).

In this first aspect, since the width (w ₁₎ of the metal layer by a predetermined amount open properly the stress generated between the metal layer and the insulating layer, is reduced deformation of the wave generated in the film carrier tape and electronic components. Thereby, the flat film carrier tape for electronic component mounting is implement | achieved, and the reliability at the time of conveyance or mounting in a semiconductor mounting line improves.

In the second aspect of the present invention, in the first aspect, the width (w ₃ ) [mm] of the metal layer in the region where the sprocket hole is present is (w ₂ +0.2) ≦ w ₃ ≦ (w ₂ +1.6) The film carrier tape for electronic component mounting is satisfied.

In this 2nd aspect, the stress which arises between an insulating layer and a metal layer is moderately opened, and the deformation | transformation of the wave form which arises in the film carrier tape for electronic component mounting is reduced more effectively.

In a third aspect of the present invention, in the second aspect, the width w ₃ [mm] of the metal layer in the region where the sprocket hole is present is (w ₂ +0.2) ≤ w ₃ ≤ (w ₂ +1.1) The film carrier tape for electronic component mounting is satisfied.

In this 3rd aspect, the stress which arises between an insulating layer and a metal layer is moderately opened, and the deformation | transformation of the wave form which arises in the film carrier tape for electronic component mounting is reduced more effectively.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the width (w ₁ ) [mm] of the metal layer and the width (w ₃ ) [mm] of the metal layer in a region where the sprocket hole is present. ] is in the film carrier tape for mounting electronic components w _1, characterized in that to satisfy the relation of <w _3.

In this fourth aspect, the stress generated between the insulating layer and the metal layer is appropriately opened, and the deformation of the wave shape generated in the film carrier tape for electronic component mounting is more effectively reduced.

In the fifth aspect of the present invention, in any one of the first to fourth aspects, the metal layer is discontinuous in the longitudinal direction of the insulating layer by slits provided for each of the sprocket holes of a predetermined number. It is on the mounting film carrier tape.

In this fifth aspect, the stress generated between the insulating layer and the metal layer is appropriately opened, so that the deformation of the wave shape generated in the film carrier tape for electronic component mounting is more effectively reduced.

In the sixth aspect of the present invention, in any one of the first to fifth aspects, an area in which the metal layer does not exist is provided between the metal layer and the opening edge portion of the sprocket hole. Is in the film carrier tape.

In this sixth aspect, since the metal layer is not provided at the periphery of the opening of each sprocket hole, the metal piece or the metal powder which contacts the pin roller, positioning pin, etc. which are inserted into each sprocket hole at the time of manufacture or mounting, and causes a short circuit, and causes a short circuit. Back does not occur.

Embodiment of the Invention

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail based on embodiment.

(Embodiment 1)

1 is a schematic diagram showing a film carrier tape for mounting an electronic component according to Embodiment 1 of the present invention, (a) is a plan view, (b) is a sectional view, and (c) is an enlarged plan view of a main part.

As shown, the film carrier tape 10 for electronic component mounting of this embodiment is a COF film carrier tape, and the wiring pattern which consists of the conductive layer 12 provided in one surface side of the tape-shaped insulating layer 11 ( 13 and a plurality of sprocket holes 14 provided on both sides in the width direction of the wiring pattern 13.

The wiring pattern 13 is continuously provided on the surface of the insulating layer 11. In addition, although the wiring pattern 13 is mentioned later in detail, the conductive layer 12 by exposure, image development, and etching after photoresist application on the conductive layer 12 provided in the surface of the insulating layer 11 is carried out. It is formed by patterning.

Moreover, on the wiring pattern 13, the soldering resist layer 15 formed by apply | coating the soldering resist material coating solution by the screen printing method is provided. That is, the inner lead 13a which is a part of the wiring pattern 13 extends and is provided in the center part of the wiring pattern 13, respectively, as shown to FIG. 1 (a). On the other hand, the outer lead 13b which is a part of the wiring pattern 13 and becomes a terminal part for external connection is provided outside the solder resist layer 15 on the opposite side to the inner lead 13a.

Here, as the material of the insulating layer 11, for example, polyester, polyamide, polyether sulfone, liquid crystal polymer and the like can be used in addition to polyimide, and in particular, it is synthesized from pyromellitic dianhydride and aromatic diamine. The wholly aromatic polyimide (for example, brand name: kafton; the product made by Toray Dupont), the wholly aromatic polyimide which has a biphenyl skeleton (for example, brand name: Eupyrex; product made by Ubekosan Co., Ltd.) Preference is given to using. The thickness of such insulating layer 11 is generally 12.5-125 micrometers, Preferably it is 12.5-75 micrometers, More preferably, it is 12.5-50 micrometers.

In addition, although aluminum, gold, silver, etc. can also be used as a material of the conductive layer 12, a copper layer is common. Moreover, as a copper layer, all, such as the copper layer formed by vapor deposition and plating, an electrolytic copper foil, and a rolled copper foil, can be used. The thickness of the conductive layer 12 is generally 1-70 micrometers, Preferably it is 5-35 micrometers.

Moreover, around the sprocket hole 14, the metal layer 16 for reinforcing each sprocket hole 14 in the positioning conveyance of a semiconductor mounting line is provided. That is, the metal layer 16 is discontinuous with the wiring pattern 13 around the plurality of sprocket holes 14 provided on both sides in the width direction of the insulating layer 11 and along the longitudinal direction of the insulating layer 11. It is installed continuously. And this metal layer 16 is formed with the wiring pattern 13 by patterning the conductive layer 12 in this embodiment, for example, and the dummy wiring for ensuring the intensity | strength of each sprocket hole 14 is carried out. And the like.

Here, in the present invention, the width w ₁ [mm] of the metal layer 16 in the region between each sprocket hole 14 is 0.3 ≦ w when the width of the sprocket hole 14 is defined as w ₂ . ₁ ? (W ₂ +1.1), preferably 0.5? W ₁ ? (W ₂ +1.0) to satisfy the condition (see Fig. 1 (c)). For example, in this embodiment, the width w ₁ of the metal layer 16 was 2.4 mm. Here, the minimum value of the width of the metal layer is set to 0.3 mm in order to secure the rigidity between the sprocket holes 14 and to obtain a desired tape conveyance strength.

In the present invention, when the width w ₃ [mm] of the metal layer 16 in the region where the sprocket hole 14 is present, the width of the sprocket hole 14 is defined as w ₂ (w ₂ +0.2) It is preferable to satisfy the condition of? ≦ w ₃ ≦ (w ₂ +1.6), and more preferable conditions are (w ₂ +0.2) ≦ w ₃ ≦ (w ₂ +1.1). For example, in the present embodiment, the width w ₁ of the metal layer 16 in the region between each sprocket hole 14 and the width (the width of the metal layer 16 in the region where the sprocket hole 14 exists) w ₃ ) was the same width, that is, w ₁ = w ₃ . Here, the minimum value of the width w ₃ of the metal layer 16 is set to w ₂ +0.2 mm in order to secure the rigidity of each sprocket hole 14 and obtain a desired tape conveyance strength.

In addition, about the relationship between the width | variety of the metal layer 16 in the width direction one side of each sprocket hole 14, and the width | variety of the metal layer 16 in the other side, it is preferable that it is the same width. It may not be. Moreover, it is preferable to provide the metal layer 16 inside inner side of the width direction both ends of the insulating layer 11. This is to prevent a metal piece, metal powder, or the like from being generated when the metal layer 16 comes into contact with a guide or the like provided in the conveying path during manufacture or mounting.

Here, as for the width w ₂ of the sprocket hole 14, the tape (insulation layer 11) width is 1.42 ± 0.03mm and the tape width is 70mm according to EIAJ (Japan Electromechanical Industry Association) standard at 35 mm and 48 mm width. In Eq. 1.98 ± 0.03 mm, the standard values are specified. As for the pitch of the sprocket hole 14, a standard value is defined at 4.75 ± 0.05 mm.

As described above, in the present embodiment, the metal layer 16 is insulated from the metal layer 16 in the curing step described later by restricting the width w ₁ of the metal layer 16 in the region between each of the sprocket holes 14 to a predetermined amount. The stress generated between the layers 11 can be appropriately opened, and it is possible to reduce the deformation of the wave shape occurring in the longitudinal direction on both sides in the width direction of the film carrier tape 10 for electronic component mounting, which is the final product. That is, the flat film carrier tape 10 for mounting electronic components can be realized, and the reliability of the semiconductor mounting line can be improved.

Moreover, since the rigidity of the whole tape does not become large too much, even when a conveyance path is curved, the tape itself can follow a conveyance path freely and can convey it suitably.

In addition, the film carrier tape 10 for mounting electronic components having such a configuration is, for example, supplied with a size corresponding to 5 to 10 semiconductors and cut into strips to a mounting apparatus to mount electronic components such as semiconductors. do. At this time, since the metal layer 16 is provided around the sprocket hole 14, the rigidity of the sprocket hole 14 can be ensured and an electronic component can be mounted with high precision.

Here, with reference to FIG. 2, an example of the manufacturing method of the film carrier tape 10 for electronic component mounting mentioned above is demonstrated. 2 is sectional drawing explaining one manufacturing method of the film carrier tape for electronic component mounting.

In the manufacturing method of this embodiment, after each manufacturing process mentioned later, although not shown in figure, the embossed spacer film which has an uneven part in the area | region where a wiring pattern is not formed is wound with a film carrier tape (COF laminated | multilayer film) in a reel, In addition, the hardening process to heat is introduced as needed.

First, as shown to Fig.2 (a), the COF laminated | multilayer film 20 in which the conductive layer 12 was formed on the insulating layer 11 is prepared.

Next, as shown in FIG. 2B, the sprocket hole 14 is formed by penetrating the insulating layer 11 and the conductive layer 12 by punching or the like. This sprocket hole 14 may be formed from the surface of the insulating layer 11, and may be formed from the back surface of the insulating layer 11.

Next, as shown in Fig. 2 (c), a photoresist material coating solution is applied over a region where the wiring pattern 13 on the conductive layer 12 is formed using a general photolithography method. And heat-cure at about 60-100 degreeC, and the photoresist material application layer 21 is formed. Furthermore, after positioning the insulating layer 11 by inserting a positioning pin into the sprocket hole 14, the photoresist material coating layer 21 is patterned by exposing and developing through the photomask 22. The wiring pattern resist pattern 23 as shown in Fig. 2 (d) is formed.

Subsequently, as shown in FIG. 2 (d), for example, in the present embodiment, the resist material coating solution is partially applied to the region corresponding to the sprocket hole 14 by using a transfer method, and the metal layer ( 16), a resist pattern 24 for metal layer is formed. For example, in this embodiment, the width w ₁ of the metal layer 16 in the area | region between each sprocket hole 14, and the width w of the metal layer 16 in the area | region where the sprocket hole 14 exists. ₃₎ to form the same width, i.e., w ₁ = w ₃ such that the metal layer resist pattern for 24. In addition, the resist pattern 24 for metal layers may be formed before forming the resist pattern 23 for wiring patterns, and may be separately formed by the transfer method before forming the sprocket hole 14. Of course, the resist pattern 23 for wiring patterns and the resist pattern 24 for metal layers may be formed simultaneously.

Next, the wiring pattern resist pattern 23 and the metal layer resist pattern 24 are used as mask patterns, and the conductive layer 12 is dissolved and removed with an etching solution. The wiring pattern resist pattern 23 and the metal layer resist are further removed. By dissolving and removing the pattern 24 with an alkaline solution or the like, the wiring pattern 13 and the metal layer 16 are formed as shown in Fig. 2E.

Subsequently, as shown in Fig. 2 (f), after forming a tin plating layer (not shown) on the surfaces of the wiring pattern 13 and the metal layer 16, the embossed spacer is sandwiched between and wound around the reel, The heat treatment is performed at 80 to 200 ° C. This prevents the occurrence of whiskers. Next, the soldering resist layer 15 is formed using the screen printing method, for example. For example, in this embodiment, by forming the soldering resist layer 15 so that the center part of the wiring pattern 13 may be surrounded, the inner lead 13a is formed in the center part of the wiring pattern 13, and the soldering resist layer ( The outer lead 13b is formed outside the 15. This is wound up in a reel with an embossed spacer sandwiched therebetween, and heated to about 100 to 200 ° C to cure. Thereby, the film carrier tape 10 for electronic component mounting as shown in FIG. 1 is completed.

In the manufacturing process of the film carrier tape 10 for mounting electronic components, in particular, the step of forming the resist patterns 23 and 24 and the curing step introduced in the step of forming the solder resist layer 15, the present embodiment is carried out. In the form, the internal stress generated between the insulating layer 11 and the metal layer 16 is appropriately opened by limiting the width w ₁ of the metal layer 16 in the region between each of the sprocket holes 14 to a predetermined amount. can do. For this reason, the deformation | transformation of the wave shape generate | occur | produces over the longitudinal direction in the width direction both sides of the film carrier tape 10 for electronic component mounting can be reduced by such a stress. That is, the flat film carrier tape 10 for mounting electronic components can be realized. Moreover, the rigidity of the sprocket hole 14 can be improved by the metal layer 16, and sufficient tape conveyance strength can be ensured. Therefore, for example, when mounting an electronic component or the like, a pin roller or the like can be inserted into the sprocket hole 14 to smoothly carry out positioning conveyance, and can also follow a guide or the like installed in a conveying path, thereby providing a semiconductor mounting line. The reliability at the time of conveyance or mounting can be improved.

In addition, in this embodiment, although the metal layer 16 was continuously provided in the same width | variety over the longitudinal direction of the insulating layer 11 as mentioned above, the shape of a metal layer is not specifically limited, of course. Hereinafter, the shape of a metal layer is illustrated based on embodiment.

(Embodiment 2)

3 is an enlarged plan view of a main part of a film carrier tape for mounting an electronic component according to Embodiment 2 of the present invention.

As shown in FIG. 3A, the metal layer 16A is formed between the sprocket holes 14 rather than the width w ₃ of the metal layer 16A in the region where the sprocket holes 14 are present. The width w ₁ [mm] of 16A) is small, that is, provided under the condition of w ₁ <w ₃ .

As shown in Fig. 3B, the metal layer 16B is continuously corresponding to a predetermined number, for example, 3 to 8 sprocket holes 14 group in the longitudinal direction of the insulating layer 11. It is provided and is discontinuous through the slit 17 for each of these sprocket hole 14 groups.

The length L [mm] in the longitudinal direction of the metal layer 16B is about 10 to 40 mm corresponding to 3 to 8 parts of the sprocket hole 14, and preferably 10 to 10 equivalent to 3 to 6 parts. 30 mm. For example, in this embodiment, it was set to 17-19 mm corresponded to the four sprocket holes 14. In addition, although the width | variety of the slit 17 is not specifically limited, For example, it is preferable that it is about 0.1-2.0 mm.

Moreover, as shown to FIG. 3 (c), the metal layer 16C is provided with the slit 17 in the metal layer 16A mentioned above.

As described above, in the film carrier tape for mounting electronic components of the present embodiment, the width, shape, and the like of the metal layers 16A, 16B, and 16C are limited to a predetermined amount, so that the insulating layer 11 and the metal layer 16 are limited. The stress which arises in between can fully be opened, and the deformation | transformation of the wave shape of the film carrier tape for electronic component mounting can be reduced more effectively.

In particular, in the present embodiment, although not directly involved in the reinforcement of the width w ₁ of the metal layer 16A in the region between each sprocket hole 14, that is, each sprocket hole 14, the reinforcement of the film carrier tape By limiting the width w ₁ of the metal layer 16A involved as small as possible, the portion around each sprocket hole 14 and each sprocket hole 14 while ensuring the reinforcing effect of each sprocket hole 14. The balance of the stress generated between the metal layer 16A and the insulating layer 11 in the portion between them can be adjusted over the longitudinal direction of the tape (see FIG. 3 (a)). Further, by providing the slits 17 in the metal layers 16B between the sprocket holes 14 at predetermined intervals, the same effect as that in which the width w ₁ of the metal layer 16A described above is limited can be obtained ( See FIG. 3 (b)). Furthermore, it is more effective to limit the width of the metal layer 16C in the region between each sprocket hole 14 and to provide the slits 17 at predetermined intervals (see Fig. 3 (c)).

In view of the above, by adopting the shapes of the metal layers 16A, 16B, and 16C of the present embodiment and the like, the deformation of the wave shape occurring in the longitudinal direction on both sides in the width direction of the film carrier tape for mounting the electronic component, which is the final product, is more effectively. It can reduce, and the effect which can improve the reliability at the time of conveyance or mounting in a semiconductor mounting line is achieved.

(Embodiment 3)

4 is an enlarged plan view of a main portion of a film carrier tape for mounting an electronic component according to Embodiment 3 of the present invention.

As shown in FIG. 4, a region where the metal layer 16D does not exist is provided between the metal layer 16D and the opening edge portion of the sprocket hole 14. The width w ₄ of the region where the metal layer 16D does not exist is preferably about 0.1 to 0.3 mm. In addition, although not shown, you may provide the area | region where a metal layer does not exist between each metal layer 16A-16C of Embodiment 2 mentioned above, and the periphery edge of the opening of each sprocket hole 14. As shown in FIG.

Thus, the same effect as each embodiment mentioned above can be acquired by providing the area | region in which the metal layer 16D does not exist between the metal layer 16D and the periphery edge part of the opening of each sprocket hole 14. As shown in FIG. Moreover, in this embodiment, when manufacturing or mounting, the pin roller, positioning pin (not shown), etc. which are inserted into the sprocket hole 14, and the metal layer 16D contact and debris of the metal layer 16D, ie, a metal piece or a metal powder, Back does not occur. Therefore, a problem such as short circuit of a wiring pattern, which is caused by such a metal piece, metal powder, or the like, can be reliably prevented.

Here, Examples 1 to 8 and Comparative Examples 1 and 2 having different shapes and width dimensions of the metal layer were prepared, and the stresses generated between the insulating layer and the metal layer in consideration of the balance of the material property values between the insulating layer and the metal layer. The conditions suitable for opening the film carrier tape for mounting a flat electronic component by appropriately opening it were examined.

(Example 1)

After forming a plurality of sprocket holes (w ₂ = 1.42mm) on both sides of the insulating layer having a tape width of 35 mm, the conductive layer provided on the insulating layer is patterned to form a wiring pattern, and the width of the insulating layer on which the sprocket holes are formed. After forming a metal layer having a width w ₁ = 2.4, w ₃ = 2.4 [mm] continuously in the regions on both sides of the direction, and forming a tin plating layer on each wiring pattern, a solder resist layer was further formed. It was set as the film carrier tape for electronic component mounting of Example 1 (refer FIG. 1 (c)).

(Example 2)

The same thing as Example 1 was used as the film carrier tape for electronic component mounting of Example 2 except having provided the slit for every four sprocket holes (refer FIG. 3 (b)). In addition, the length of each metal layer in the longitudinal direction was L = 18.0 mm.

(Example 3)

Width _{w 1 = 2.2, w 3 =} 2.2 [mm] except that a metal layer was set to the Example 1, a film carrier tape for mounting electronic components of the third embodiment that are identical (see Fig. 1 (c)).

(Example 4)

The same thing as Example 3 was used as the film carrier tape for electronic component mounting of Example 4 except having provided the slit for every four sprocket holes (refer FIG. 3 (b)). In addition, the length of the metal layer in the longitudinal direction was L = 18.4 mm.

(Example 5)

Width _{w 1 = 1.5, w 3 =} 2.9 [mm] except that a metal layer was the same as in Example 1 to Example 5, an electronic parts packaging film carrier tape for (see Fig. 3 (a)).

(Example 6)

The same thing as Example 5 was used as the film carrier tape for mounting electronic components of Example 6 except that the slit was provided for every four sprocket holes (refer FIG. 3 (c)). In addition, the length of each metal layer in the longitudinal direction was L = 18.0 mm.

(Example 7)

Width _{w 1 = 1.0, w 3 =} 2.2 [mm] except that a metal layer is formed of the same was as in Example 1 to Example 7, an electronic parts packaging film carrier tape (see Fig. 3 (a)).

(Example 8)

The same thing as Example 7 was used as the film carrier tape for mounting electronic components of Example 8 except that the slit was provided for every four sprocket holes (refer FIG. 3 (c)). In addition, the length of the metal layer in the longitudinal direction was L = 18.4 mm.

(Comparative Example 1)

Width _{w 1 = 2.7, w 3 =} 2.7 were [mm] of the metal layer as a continuous film carrier tape for mounting electronic components of Comparative Example 1 that is formed over the longitudinal direction of the insulating layer.

(Comparative Example 2)

Width w ₁ = 3.0, w ₃ = other than the formation of the metal layer of 3.0 [mm] has the same meanings as in Comparative Example 1 to Comparative Example 2 of the electronic parts packaging film carrier tape.

(Test Example 1)

For each of the above Examples 1 to 8 and Comparative Examples 1 and 2, eight samples were prepared, a wiring pattern was formed for each sample, and tin plating was applied on the wiring pattern. The heat treatment was performed for 60 minutes under the temperature condition of about 120 degreeC in the state which inserted the embossing spacer and wound up to the reel. After the solder resist layer was formed, heat treatment was performed for 120 minutes under a temperature condition of about 140 ° C. with the embossed spacers sandwiched and wound on a reel. About each of these samples, it divided into three times after wiring pattern formation, after tin plating, and after solder resist layer formation, and measured about the deformation amount [mm] of the wave shape of the film carrier tape for electronic component mounting. Specifically, the part where the film carrier tape for mounting electronic components of each Example and Comparative Example is placed on the base, and the widthwise both ends of the film carrier tape for mounting the electronic component rise on the base of the base. The maximum height was measured. And the average value of the maximum height of each sample was made into the deformation amount [mm] of the wave shape of the film carrier tape for electronic component mounting. The results are shown in Table 1 below.

In addition, the measurement of the maximum height [mm] from a wavy base is irradiated a laser beam from the vertical direction upper side of the film carrier tape for electronic component mounting mounted on a base, for example, and the distance is reflected by reflection of a laser beam. It carried out using the laser warpage measuring device which can be measured.

(Test Example 2)

The same shape as that of the metal layers of Examples 1 and 3 described above (see Fig. 1 (c)), the width (w ₁ , w ₃ ) [mm] of the metal layer was changed to 1.8 to 3.0 mm, and the solder at that time The change of the strain amount [mm] of the wave shape after forming a resist layer was investigated. The result is shown in FIG. In addition, Figure 5 is a graph showing the relationship between the width of the metal layer (w _1, w ₃₎ and after a solder resist layer formed undulated deformation.

From the results of Table 1, in Examples 1 and 3, compared with Comparative Examples 1 and 2, the width (w ₁ , w ₃ ) of the metal layer is limited to about 60 to 70% of the amount of deformation of the wave form after the solder resist layer is formed. We knew that we could reduce. In addition, in Examples 2 and 4, in addition to the conditions of Examples 1 and 3 above, by providing slits in the metal layers at predetermined intervals, the amount of deformation of the wave form after the formation of the solder resist layer was about 50 compared with those of Comparative Examples 1 and 2. It turned out that it can reduce nearly -65%. In addition, this is supported by the fact that the amount of deformation of the wave shape [mm] decreases sharply when the width w ₁ of the metal layer is smaller than about 2.5 mm, as shown in FIG. 5.

In Example 5, compared with each of Comparative Examples 1 and 2 described above, if the width w ₃ of the metal layer between each sprocket hole is made smaller, the amount of deformation of the wave form after the formation of the solder resist layer can be reduced by about 50%. I knew there was. Moreover, if, because it is considered represent a, trends such as the graph shown in Fig. 5 about the relationship between the width of the metal layer (w ₃₎ and wave deformation, reducing the width (w ₃₎ of the metal layer limits, forming the solder resist layer It is thought that the amount of deformation of the later wave shape can be further reduced. In addition, in Example 6, in addition to the conditions of Example 5 described above, by providing slits at intervals of 18.0 mm, the amount of deformation of the wave form after the solder resist coating heating was reduced by approximately 45% compared to the respective Comparative Examples 1 and 2 described above. I knew I could.

Furthermore, in Example 7, compared to the comparative examples 1 and 2 described above, by limiting the width (w ₁ , w ₃ ) of the metal layer to be smaller, the deformation of the wave shape after the solder resist coating heating can be reduced by about 45%. I knew that. In addition, in Example 8, in addition to the conditions of Example 7, it was found that by providing slits at intervals of 18.4 mm, the amount of deformation of the wave form after the solder resist coating heating can be reduced by about 40%, compared to Comparative Examples 1 and 2. .

Therefore, since the film carrier tape for mounting electronic components can be realized by restricting the widths w ₁ and w ₃ of the metal layer to a predetermined amount or by providing slits, the reliability at the time of conveyance or mounting in the semiconductor mounting line can be improved. Can improve.

Moreover, as shown in the said Table 1, it is clear that the amount of distortion of the wave form of the film carrier tape which arises after wiring pattern formation or after tin plating can be reduced. For this reason, there also exists an effect that generation | occurrence | production of conveyance defects etc. at the time of manufacture of the film carrier tape for electronic component mounting can be prevented.

Moreover, in each of Examples 1 to 8 described above, an insulating layer having a tape width of 35 mm was used, but similar results and effects were obtained even when the insulating layer having a tape width of 70 mm (69.950 ± 0.2 mm) was used.

(Other embodiment)

As mentioned above, although each embodiment of this invention was described, of course, the film carrier tape for electronic component mounting is not limited to what was mentioned above. For example, in embodiment mentioned above, although the film carrier tape 10 for electronic component mounting which provided the carrier pattern which consists of the wiring pattern 13, the sprocket hole 14, etc. in one row was illustrated and demonstrated, it limits to this. For example, the film carrier tape for electronic component mounting of several lines which provided multiple rows of carrier patterns in parallel may be sufficient.

In addition, in the above-mentioned embodiment, although the film carrier tape 10 for electronic component mounting which is a COF film carrier tape was illustrated, other film carrier tape for electronic component mounting, for example, TAB, CSP, BGA, (micro) -BGA , FC, QFP type, etc. may be sufficient, The structure, etc. are not limited, either.

As described above, according to the present invention, at least the metal layer is provided substantially continuously along the longitudinal direction of the insulating layer, and the width w ₁ [mm] of the metal layer in the region between the sprocket holes is defined as the width of the sprocket hole. When w ₂ [mm] is satisfied by satisfying the condition of 0.3 ≦ w ₁ ≦ (w ₂ +1.1), the stress generated between the metal layer and the insulating layer is appropriately opened, and the film carrier tape for mounting electronic components The deformation of the wave shape occurring at Thereby, the flat film carrier tape for electronic component mounting is implement | achieved, and the reliability at the time of conveyance or mounting in a semiconductor mounting line improves.

Claims (13)

In the film carrier tape for electronic component mounting which has the wiring pattern which consists of a conductive layer on the surface of an insulating layer, and the some sprocket hole provided in the both sides of the said wiring pattern, and the metal layer was provided around the said sprocket hole, The metal layer is provided substantially continuously along the longitudinal direction of the insulating layer, and the width w ₁ [mm] of the metal layer in the region between the sprocket holes is equal to the width of the sprocket hole w ₂ [mm]. The film carrier tape for mounting electronic components, which satisfies the condition of 0.3 ≦ w ₁ ≦ (w ₂ +1.1). The width w ₃ [mm] of the metal layer in the region where the sprocket hole is present satisfies a condition of (w ₂ +0.2) ≤ w ₃ ≤ (w ₂ +1.6). A film carrier tape for mounting electronic components. The width w ₃ [mm] of the metal layer in the region where the sprocket hole is present satisfies a condition of (w ₂ +0.2) ≤ w ₃ ≤ (w ₂ +1.1). A film carrier tape for mounting electronic components. The method of claim 1, wherein the width w ₁ [mm] of the metal layer and the width w ₃ [mm] of the metal layer in a region where the sprocket hole is present satisfy a relationship of w ₁ <w ₃ . A film carrier tape for mounting electronic components. The width w ₁ [mm] of the metal layer and the width w ₃ [mm] of the metal layer in a region where the sprocket hole is present satisfy a relationship of w ₁ <w ₃ . A film carrier tape for mounting electronic components. The width w ₁ [mm] of the metal layer and the width w ₃ [mm] of the metal layer in a region where the sprocket hole is present satisfy a relationship of w ₁ <w ₃ . A film carrier tape for mounting electronic components. The film carrier tape for mounting electronic components according to claim 1, wherein the metal layer is discontinuous in the longitudinal direction of the insulating layer by slits provided for each of the sprocket holes of a predetermined number. The film carrier tape for mounting of an electronic part according to claim 2, wherein the metal layer is discontinuous in the longitudinal direction of the insulating layer by slits provided for each of the sprocket holes of a predetermined number. 4. The film carrier tape for mounting electronic components according to claim 3, wherein the metal layer is discontinuous in the longitudinal direction of the insulating layer by slits provided for each of the predetermined number of sprocket holes. The film carrier tape for mounting of an electronic component as set forth in claim 4, wherein said metal layer is discontinuous in the longitudinal direction of said insulating layer by slits provided for each predetermined number of sprocket holes. 6. The film carrier tape for mounting electronic components according to claim 5, wherein the metal layer is discontinuous in the longitudinal direction of the insulating layer by slits provided for each of the predetermined number of sprocket holes. 7. The film carrier tape for mounting electronic components according to claim 6, wherein the metal layer is discontinuous in the longitudinal direction of the insulating layer by slits provided for each of the predetermined number of sprocket holes. The film carrier tape for mounting electronic components according to any one of claims 1 to 12, wherein a region in which the metal layer does not exist is provided between the metal layer and the opening edge portion of the sprocket hole.

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