KR100592718B1 - Boat-Assembly for Semiconductor Manufacture Process and Semiconductor Manufacture Method and Semiconductor Manufacture Apparatus - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention provides a boat apparatus of a semiconductor manufacturing apparatus for processing a large amount of wafers, and a semiconductor manufacturing method and a manufacturing apparatus for applying the same to a boat apparatus of the semiconductor manufacturing apparatus so that the process may be performed in the same manufacturing apparatus even if the wafer diameter is changed.

The present invention for this purpose is installed radially symmetrically to the large support (9 ') in which the wafer mounted in the large reaction chamber (12') is elevated, and to the outer side to provide a loading position to the robot arm (5) A plurality of boats 20 providing a loading opening: a rotating device 22 for rotating and placing each of the boats 20 in a loading position for loading / unloading wafers into the plurality of boats 20 '. It provides a boat system made.

The boat apparatus is applied to provide a boat apparatus divided into a small-diameter wafer boat apparatus 14b and a large-diameter wafer boat apparatus 14a in an atmospheric chamber 16 in which wafers are stacked to wait for the boat. Of the boat apparatuses 14a and 14b via the exchanger 18 at the cassette stage 1 and robot arm 5 and the reaction chamber 12 in a position where they are commonly fixed in the same manufacturing apparatus. In addition to the arrangement of the boat 20b of the small-diameter boat apparatus according to the present invention, the boat 20b of the small-diameter boat apparatus is arranged to process wafers of different diameters in the same semiconductor manufacturing apparatus. will be.

Description

Boat apparatus of semiconductor manufacturing apparatus and semiconductor manufacturing method and semiconductor manufacturing apparatus using same {Boat-Assembly for Semiconductor Manufacture Process and Semiconductor Manufacture Method and Semiconductor Manufacture Apparatus}

1 is a conceptual diagram showing a conventional semiconductor manufacturing apparatus,

2A is a conceptual diagram illustrating a semiconductor manufacturing apparatus equipped with a boat apparatus according to the present invention;

2b is an external view illustrating a boat apparatus according to the present invention;

2 is an external view illustrating that the boat for the large-diameter wafer and the boat for the small-diameter wafer are replaced in the atmospheric chamber of the semiconductor manufacturing apparatus according to the present invention;

3 is a plan explanatory view showing that the boat for the large-diameter wafer and the boat for the small-diameter wafer are replaced in the atmospheric chamber of the semiconductor manufacturing apparatus according to the present invention.

-Explanation of symbols for the main parts of the drawings-

1-cassette stage, 5-robot arm,

6,6 '-Lift, 9,9'-Support,

10a, 10b-wafer, 12, 12 '-reaction chamber,

14a, 14b-boating device, 16-atmospheric chamber,

18-changer, 20,20a, 20b-boat,

21-diffuser, 22,22 '-rotator,

24-base panel, 26-rail section,

The present invention provides a boat apparatus of a semiconductor manufacturing apparatus for processing a large amount of wafers, and this is applied so that the process is performed in the same manufacturing apparatus even if the wafer diameter is changed, thereby providing compatibility of the manufacturing apparatus according to the wafer diameter and The present invention relates to a semiconductor manufacturing method and a device for manufacturing the same which improve productivity.

In general, a semiconductor is formed on a wafer by treating its surface according to each process.

For example, surface-polished wafers undergo circuit design and mask fabrication, followed by various steps such as oxidation process, photoresist coating process, exposure process, developing process, etching and chemical vapor deposition.

In order to perform such a series of processes, an apparatus for transferring a wafer must be provided, and a semiconductor manufacturing process is performed with a clean process that does not allow invasion of foreign substances during the process.

Therefore, in a large-scale semiconductor automation process, the cassette 3 in which the wafer 2 is stacked is used in the cassette stage 1 which provides the blocked space as shown in FIG. 1, and the wafer 2 in the cassette 3 is used. The robot arm 5 with the lifting device 6 is interposed between the cassette 3 and the boat apparatus 4 for loading / unloading.

The boat apparatus 4 includes a boat 8 on which wafers are stacked and a lift device 6 'for transferring the wafers to the reaction chamber, and a reaction chamber for supporting the boat 8 and ensuring uniformity of the reaction gas. It consists of a support (9) and the like including a rotating device and a boat cap for rotation in.

Here, the semiconductor manufacturing apparatus for processing the wafer 2 extremely includes a batch type and a processing time including a substrate loading boat 8 for loading a large amount of the wafer 2 therein in order to improve the processing capability. There is a single sheet, which is processed one by one in order to reduce, and what is shown represents a batch.

The robot arm 5 is driven by the elevating device 6 according to the stacking up and down of the wafer 2 in the boat 8, and the wafer is loaded / loaded in each slit (not shown) of the rod constituting the boat 8. Unloading, the boat 8 is inserted into the reaction chamber 7 by the elevator 6 'after the wafer 2 is loaded.

On the other hand, the wafer 2 is, for example, has a diameter of 4 inches and 6 inches, 8 inches and 12 inches, and thus the boat 8 is provided.

That is, the three-point support boat 8, which has a loading opening that is open to the side in order to load / unload wafers from the robot arm 5 to the boat 8, is mainstream. In order to meet the diameter of the wafer, the boat 8 is manufactured.

In addition, the boat 8 has a side open for loading / unloading the wafer 2 and has a shape of a tripod that is biased.

On the other hand, the reaction chamber 7 eventually provides a closed space for performing the semiconductor manufacturing process, and includes an inlet / outlet apparatus for the reaction gas and a heating apparatus for performing the annealing process.

Thereby, the reaction chamber 7 provides a processing apparatus in an enclosed space for performing a semiconductor manufacturing process, and the cassette stage 1, the robot arm 5, and the boat apparatus 4 in the atmospheric chamber are It is to provide a transfer device to the process equipment.

Here, since such a semiconductor manufacturing apparatus needs an additional apparatus for providing a series of processes to the reaction chamber, there is a need for a structure in which a large amount of wafers are loaded in order to improve the productivity of the semiconductor.

Of course, a large amount of wafers are processed by the batch processing process described above, but a simple increase in the number of stacks above and below has a problem of excessively increasing the installation space of the manufacturing apparatus, and reactant gas in the reaction chamber which is a vertical reactor. The provision of a structure for uniform distribution should be considered.

On the other hand, the semiconductor manufacturing apparatus is followed by irrationality to be provided for each process according to the above-described wafer diameter.

In more detail, as described above, the boat apparatus 4 and the reaction chamber 7 corresponding to one-to-one correspond to the diameter of the standardized wafer, and accordingly, in the semiconductor manufacturing apparatus, the wafer diameter is different. If you change the line-by-line manufacturing device according to the aperture or most parts replacement work is required.

That is, when the diameter of the wafer is changed, the boat apparatus 4 and the reaction chamber 7 need to be replaced, and the semiconductor manufacturing process is a series of processes in which several steps are combined. Replacement will result in long process downtime.

Of course, it is also possible to separately prepare a manufacturing apparatus according to each aperture of the wafer, but this should take into consideration the physical space of the factory and excessive equipment input, and also in the arrangement of different apparatuses according to the aperture, depending on the order quantity. The placement rate can be flexibly changed, provided that the boats and reaction chambers provided in accordance with the dimensions of the wafer are difficult to be compatible with the flexibility of such fabrication.

In addition, based on the reaction chamber for large-diameter wafers, only the boat can be replaced. However, the use of a small-diameter boat in the reaction chamber of large-diameter wafers is a waste of equipment and input materials, and productivity is expected to decrease compared to a manufacturing apparatus.

In particular, when the boat for a small diameter wafer is put into the reaction chamber of a large diameter wafer, the problem that uniformity with respect to a process gas falls is caused.

That is, in order to secure the yield in the semiconductor manufacturing process, it is required to maintain a uniform distribution and concentration of gas over the entire surface of the semiconductor substrate in the process gas input process.

Here, in a reaction chamber in which a process is performed while injecting a process gas, a gas injection hole is disposed at a specific position, and the process gas acts on the wafer by diffusion, and the low pressure is maintained at a low pressure compared to the gas input in most processes. In order to achieve this, a gas outlet is formed on the opposite side and a vacuum pump is connected thereto.

At this time, when the boat for a small diameter wafer is put into the reaction chamber of the large diameter wafer, the space for providing the reaction chamber becomes excessively large relative to the mounting space of the boat, whereby the dense and small portions of the gas distribution of the reaction chamber are removed. Difference occurs.

This is especially true because the structure provided by the boat, along with the occupied space of the boat in the reaction chamber, is not symmetrical, so that a rod, such as a tripod, for loading / unloading wafers into the boat, as described above, It is a structure of a tripod that is biased for loading / unloading and cannot provide a symmetrical structure.

After all, in the case of changing the diameter of the wafer in a limited factory facility, it is necessary to replace the boat or the reaction chamber inside the manufacturing apparatus according to the manufacturing apparatus differently or according to the size of the wafer. It caused most of the replacement work.

Accordingly, the present invention has been made to solve the above problems, it is an object of the present invention to provide a boat apparatus of a semiconductor manufacturing apparatus for processing a large amount of wafers to improve its productivity.

In addition, the manufacturing process according to each wafer diameter is shared through such a boat device, so that even if different wafers are introduced according to the size, the boat and the reaction chamber are not replaced, thereby providing compatibility of the manufacturing device according to the wafer size. Another object of the present invention is to provide a semiconductor manufacturing method and apparatus for improving the productivity of semiconductor manufacturing.                         

To this end, the present invention provides a boat apparatus for loading a large amount of wafers by horizontally arranging wafers vertically and horizontally, and in connection with this, a reaction chamber for providing a semiconductor manufacturing process is installed on a large diameter wafer, and the reaction chamber The large diameter wafer boat and the small diameter wafer boat are separately installed in the atmospheric chamber via a transfer device so that the lifting device can be lifted to the large diameter reaction chamber through each lifting device. Boats for small-diameter wafers are provided in plural according to the mounting space for large-diameter wafers so as to make the most of the process space provided by the reaction chamber.

DETAILED DESCRIPTION Hereinafter, the most preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. . Other objects, features, and operational advantages, including the purpose, working effects, and the like of the present invention will become more apparent from the description of the preferred embodiment.

For reference, the embodiments disclosed herein are presented by selecting the most preferred examples to help those skilled in the art from understanding various embodiments, and the technical spirit of the present invention is not necessarily limited or limited by the embodiments. Various changes and modifications can be made without departing from the spirit of the invention, and other equivalent embodiments are possible.

2 is an explanatory view showing a boat apparatus of the present invention in which a plurality of boats are combined, and FIG. 3 is a boat for a large diameter wafer and a boat for a small diameter wafer replaced in a standby chamber of a semiconductor manufacturing apparatus according to the present invention. Fig. 4 is an explanatory view showing the appearance, and Fig. 4 is a plan explanatory view thereof.

The present invention provides a large reaction chamber 12 'provided by processing a large amount of wafers, a large support 9' on which the wafer mounted on the reaction chamber 12 'is elevated, and a large support 9'. A plurality of boats 20 radially symmetrically mounted to the robot arm 5 and providing a loading opening in an outward direction to provide a loading position to the robot arm 5; The boat apparatus of the semiconductor manufacturing apparatus which consists of the rotating apparatus 22 which rotates and arrange | positions each said boat 20 to a loading position in order to load / unload a wafer into the wafer.

Here, the rotating device 22 is characterized in that the rotating device for rotating the support (9 ') for the uniform distribution of the reaction gas in the reaction chamber is used.

Here, the bottom of the boat 20 is characterized in that the rotary device 22 'for separately rotating the entire support (9) in the reaction chamber (12') is performed for each boat is installed separately. .

Here, the boat 20 arranged symmetrically to the support is a diffusion inductor 21 which induces uniform diffusion of the reaction gas by means of a symmetrical resistance to the reaction gas flow in the pipe section in the reaction chamber 12 which is a vertical reactor. It is characterized by that).

In connection with such a semiconductor manufacturing apparatus, a semiconductor manufacturing method and a semiconductor manufacturing apparatus, in which a large diameter wafer and a small diameter wafer are processed in the same semiconductor manufacturing apparatus, are provided. The boat apparatus in which the wafer is loaded / unloaded in 16 is divided into the boat apparatus 14b for small-diameter wafers and the boat apparatus 14a for large-diameter wafers according to the diameter of the wafer, and the boat apparatuses 14a ( 14b) is arranged to be shared by the same semiconductor manufacturing apparatus, so that any one of the boat apparatuses 14a and 14b is disposed in the atmospheric chamber 16 through the exchange apparatus 18, while the boat of the small diameter boat apparatus ( 20b) symmetrically radially arranges the plurality of boats 20b according to the process space provided by the reaction chamber 12 for the large-diameter wafer, and forms the loading opening of the boat 20b outward. And it rotates through the rotation device 22 includes a boat unit (14b) is a semiconductor manufacturing method of processing provides a mounting location to the individual boat (20b) to process wafers of different diameters on the same semiconductor manufacturing equipment.

Here, the common use of the small-diameter boat 20b to the reaction chamber 12 for large-diameter wafers is such that each boat 20b is symmetrically disposed in the pipe cross section provided by the reaction chamber 12, and the reaction chamber 12 is a vertical reactor. It is characterized by inducing a uniform diffusion of the reaction gas by the symmetrical resistance to the reaction gas flow in the).

In addition, the sharing of the small-diameter boat 20b to the reaction chamber 12 for large-diameter wafers allows each individual boat 20b to rotate independently to react with the process gas, thereby allowing the individual boat 20b to rotate within the entire support 90. The rotation of the) is characterized in that it is further performed.

Accordingly, the present invention provides a semiconductor manufacturing apparatus, and the present invention provides a processing apparatus of a semiconductor manufacturing process and has a common reaction chamber 12 installed on the basis of a large diameter wafer 10a and a large diameter according to the large diameter wafer 10a. A plurality of small-diameter wafer boats 20b in the area of the mounting area of the wafer boating device 14a and adjacent to the large-caliber wafer boating device, which are separately installed and are the same as the support for the large-diameter wafer 9. And a plurality of boat apparatuses comprising a boat apparatus 14b for a small diameter wafer, in which: the boat apparatus 14a and 14b is provided adjacent to the common reaction chamber 7, and a boat apparatus is provided. And a standby chamber 16 which provides a space for exchanging them. The plurality of boat apparatuses 14a and 14b are installed in the atmospheric chamber 16 and any one of the plurality of boat apparatuses 14a and 14b. Single boat By selecting a semiconductor manufacturing apparatus comprising the exchange device 18 to provide a loading / unloading arrangement in which the position of a fixed location public reaction chamber 12 and the robot arm (5).

Here, in the boat apparatus 14b for small-diameter wafers, a plurality of boats 22b are symmetrically arranged on the support 9 for large-diameter, and the plurality of boats 22b are radially arranged and rotated so that the robot arm ( 5) to provide a loading opening to the outside to provide a loading position, the rotating device for providing the loading position is characterized in that the boat rotating device for the uniform reaction to the reaction gas in the reaction chamber.

In addition, the boat apparatus 14b for small-diameter wafers is characterized in that the rotating apparatus 22 which performs rotation with respect to each boat as well as the rotation of the whole support 9 in the common reaction chamber 12 is installed separately. do.

As described above, the present invention first provides a boating apparatus for loading a large amount of wafers by horizontally arranging the wafers vertically and horizontally, and is developed therefrom to separate the processes in the same manufacturing apparatus according to each aperture of the wafer. The present invention provides a semiconductor manufacturing method and a manufacturing apparatus which provide compatibility of a manufacturing apparatus according to a wafer diameter and improve the productivity of semiconductor manufacturing.

That is, the boat apparatus of the present invention provides the arrangement of a plurality of boats 20 for processing a large amount of wafers, and this is applied to the manufacturing method and the apparatus of the present invention in which wafers of different diameters are matched to any one wafer diameter. As a result, the semiconductor manufacturing method and apparatus of the present invention share the cassette stage 1 and the robot arm 5 in a reaction chamber and a transfer device, which are processing apparatuses, based on the large-diameter wafer 10a. The small-diameter wafer 10b is applied through the boat apparatus and the exchange apparatus.

Accordingly, in the manufacturing apparatus of the present invention, in contrast to the conventional manufacturing apparatus, there is only an increase in the atmospheric chamber, unlike the manufacturing apparatus installed separately according to the diameter, and the reduction of the input equipment by the common use of the apparatus is also the same.

The present invention will be described in more detail. First, a large support 9 'is provided in a large reaction chamber provided to process a large amount of wafers, and a plurality of boats 20 are provided in the support 9'. Arranged radially.

In order to load / unload wafers individually into such a plurality of boats 20, a rotating device for providing a loading opening to the robot arm in the standby chamber should be provided.

Here, the loading opening means that the rod opens to a separate boat, so that the plurality of small-diameter boats 20 mounted on the large support 9 region are radially formed with the loading opening radially. In accordance with the rotation of the robot arm (5) to provide the arrangement position.

The rotating device is different from the rotating device that rotates the wafer to induce a uniform distribution of the reaction gas in the reaction chamber. However, in the present invention, when the rotating device is mounted in the reaction chamber, it is used for loading / unloading the wafer. Rotating devices for loading are shared, whereby the advantage of eliminating the addition of a separate device can be obtained when a plurality of boats are mounted.

On the other hand, mounting of a plurality of boats 20 to one support 9 will provide a symmetrical structure for reactant gas diffusion in the reaction chamber 12 '.

For example, when a boat is arranged for gas flows up and down the reaction chamber 12 ', which is a vertical reactor, the rods forming the boat provide a structure in which the reaction chamber is biased in a pipe section as described above. Done.

Accordingly, it is not possible to guarantee a uniform diffusion of the reaction gas, and incidentally, a rotary device is provided to induce a uniform distribution of the reaction gas.

On the other hand, in the present invention, the plurality of boats 20 naturally forms a symmetrical arrangement according to the arrangement of the boat, which is a circular region in the support, which is a circular region. It provides a diffusion induction guide that leads to.

In addition, the rods constituting the boat 20 also provides a structure that is arranged symmetrically to each other, when the rotation by the rotary device 22 is added to such a structure can further increase the uniform distribution of the reaction gas have.

In addition to this, in the present invention, a plurality of boats may further add a separate rotary device 22 'to the bottom thereof.

In this case, with the rotation of the support, a plurality of boats are rotated individually, and this is to induce a uniform gas distribution even in this unit with the space surrounding one boat as a unit.

Next, when the boat apparatus for processing a small diameter wafer on the basis of a large diameter wafer according to the boat apparatus is applied to the present invention in which the plurality of boats are arranged, the boat apparatus according to the caliber is shared in the same semiconductor manufacturing apparatus. Can be.

That is, according to the present invention, the boat apparatus for loading / unloading the wafer in the atmospheric chamber 16 in which the wafers are stacked and waiting for the boat, according to the size of the wafer, the boat apparatus 14b for small diameter wafers and the boat apparatus for large diameter wafers ( 14a) and the exchanger 18 at the arrangement position to the cassette stage 1, the robot arm 5, and the reaction chamber 12 having a batch in which the same manufacturing apparatus is commonly fixed according to the diameter of the wafer. One of the boat apparatuses 14a and 14b is disposed through the boat apparatus. The boat 20b of the small-diameter boat apparatus is provided with a plurality of boats according to the process space provided by the reaction chamber 12 for the large-diameter wafer. 20b) symmetrically arranged radially, while also forming the loading opening of the boat 20b to the outside and rotating through the rotating device 22 included in the boat device (14b) mounting position to the individual boat (20b) Same semiconductor fabrication by providing Provided are a semiconductor manufacturing method for processing wafers of different diameters in an apparatus.

And, for this method, the present invention provides a process apparatus of the semiconductor manufacturing process and the common reaction chamber 12 installed on the basis of the large-diameter wafer (10a) and: boat apparatus for a large-diameter wafer according to the large-diameter wafer (10a) 14a) and a small-diameter wafer adjacent to the large-diameter wafer boat apparatus, which are separately installed, and are the same as the large-diameter wafer support 9, in which a plurality of small-diameter wafer boats 20b are disposed in an area of the mounting area. A plurality of boat apparatuses comprising a boat apparatus 14b for a boat; a standby chamber 16 adjacent to the common reaction chamber 7 to provide a space for waiting of the boat apparatuses, and to provide a space for replacing the boat apparatuses; : A plurality of boat devices 14a, 14b are installed in the atmospheric chamber 16, and any one of the plurality of boat devices 14a, 14b is selected to fix a fixed position. Provides a semiconductor manufacturing apparatus comprising a exchange apparatus (18) providing a loading / unloading arrangement position of the common reaction chamber 12 and the robot arm (5).

In more detail, the cassette stage 1, the robot arm 5, and the reaction chamber 12 are commonly used in the existing manufacturing apparatus.

The reaction chamber 12 is provided on the basis of the large-diameter wafer 10a, and the boat apparatus 14b for the small-diameter wafer is independently installed in order to apply the small-diameter wafer 10b to the large-diameter reaction chamber 12. .

The common use of the existing device means that the arrangement of the existing device is the same as before, and thus the boat apparatus 14b for the small-diameter wafer is transferred to the arrangement position through a separate exchange device 18.

That is, the standard large-diameter boat apparatus 14a and the small-diameter boat apparatus 14b are exchanged with each other through the exchange apparatus 18 to the arrangement position, where the arrangement position is combined with the position to be introduced into the reaction chamber 12. , The standby position for wafer loading / unloading of the robot arm 5.

The exchange device 18 for this purpose is carried out by the base panel 24 itself is carried out to replace the boat device (14a, 14b), the rail unit 26 and the drive unit (not shown), the exchange device ( An atmospheric chamber 16 is provided which accommodates the working radius of 18).

Boat devices 14a and 14b are independently installed on the exchange device 18, and the support 9 and the lift device 6 'are independently provided.

The boat apparatus is divided into a large-diameter boat apparatus 14a and a small-diameter boat apparatus 14b. For example, the boat apparatus may indicate that a 12-inch large-diameter boat apparatus and a 6-inch small-diameter boat apparatus are separately installed.

Of course, three 6-inch wafers cannot be arranged in the 12-inch wafer area by the correct dimensions, but three 6-inch boats can be mounted in the 12-inch area by the area provided by the support and the tolerance thereof. .

In addition, a plurality of boat arrangements in the support of the 4 inch small diameter boat apparatus based on the 12 inch large diameter boat apparatus is natural, and thus the plurality of boat apparatuses shown may be two or more.

The small-diameter boat apparatus 14b is a boat apparatus according to the present invention described above, and when such a boat apparatus is applied, it improves productivity by itself, and is also shared with a large-diameter boat apparatus to further improve its productivity.

The plurality of boats (20b) is a rotary device for providing a loading opening to the robot arm in the atmospheric chamber for loading and unloading the wafer separately, and a derivative for the uniform distribution of the reaction gas in the large-diameter reaction chamber and for each boat The individual rotating device is as described above.

In addition, the plurality of small diameter boats 20b mounted in the area of the large-diameter support 9 have their loading openings radially formed to provide the robot arm 5 with an arrangement position in accordance with the rotation of the rotating device. It is done.

On the other hand, by the small-diameter boat device 14b equipped with the exchange device 18 and the plurality of boats 20b and the rotating device accordingly, the setting value of the robot arm 5 is variable and will be set in the control unit. .

First, the stacking intervals of the standardized wafer cassettes vary depending on the size, and considering the loading / unloading by adsorbing the center of the wafer, the center coordinates of the wafers provided by the plurality of boats and the center provided by one boat The coordinates will be different.

Accordingly, when the boat apparatus is replaced according to the diameter of the wafer, the control setting value of the robot arm according to the replacement is changed, which is achieved by input of the setting value, and a detailed description thereof will be omitted.

As described above, according to the present invention, by installing a small-diameter boat device separate from the exchange device in the atmospheric chamber based on the large-diameter wafer manufacturing apparatus, by replacing the large-diameter boat apparatus and the small-diameter boat apparatus according to the production situation, The wafer fabrication process of different diameters is performed in one semiconductor fabrication apparatus, thereby improving the productivity and compatibility of the semiconductor fabrication process.

In particular, when a small-diameter boat apparatus is applied, a plurality of small-diameter boats are introduced into the large-diameter reaction chamber to further increase productivity, and the plurality of boats provide a structure symmetrical with respect to the flow of the reaction gas to provide uniform reaction gas. It has the effect of acting as a derivative to induce diffusion.

Claims (8)

A reaction chamber is provided for processing a plurality of wafers, and includes a boat on which a plurality of wafers are mounted through a robot arm for processing a wafer in the reaction chamber, and a support for lifting the boat into the reaction chamber. In a boat apparatus of a semiconductor manufacturing apparatus comprising: A plurality of boats 20 are radially symmetrically installed in the support 9 ′ introduced into the reaction chamber 12, and the plurality of boats 20 are provided in the outer side to provide a loading position to the robot arm 5. Rotating each of the boats 20 in the loading position to load / unload the wafer to the plurality of boats (20 ') arranged radially symmetrically in the support (9') is provided to provide a loading opening In addition to the rotating device 22 is installed, the rotating device 22 is a common rotary device for rotating the support (9 ') for the uniform distribution of the reaction gas in the process in the reaction chamber 12 Boat apparatus of a semiconductor manufacturing apparatus characterized by the above-mentioned. (delete) The bottom of the boat 20 is provided with a separate rotary device 22 'for rotating the entire support 9 in the reaction chamber 12' and for each boat. A boat apparatus of a semiconductor manufacturing apparatus characterized by the above-mentioned. 2. The boats (20) according to claim 1, wherein the boats (20) arranged symmetrically to the support induce a uniform diffusion of the reaction gas by means of a symmetrical resistor against the reaction gas flow in the tube section in the reaction chamber (12) which is a vertical reactor. Boat apparatus of a semiconductor manufacturing apparatus, characterized in that the diffusion induction conductor (21). The boat apparatus in which the wafers are loaded / unloaded in the atmospheric chamber 16 where the wafers are stacked and waiting for the boat is divided into the small diameter wafer boating device 14b and the large diameter wafer boating device 14a according to the size of the wafer. The boat apparatuses 14a and 14b are shared by the same semiconductor manufacturing apparatus so that any one of the boat apparatuses 14a and 14b is disposed through the exchange apparatus 18 in the atmospheric chamber 16. On the other hand, the boat 20b of the small-diameter boat apparatus is arranged symmetrically radially into a plurality of boats 20b according to the process space provided by the reaction chamber 12 for the large-diameter wafer, and the boat 20b Process the wafers of different diameters in the same semiconductor manufacturing apparatus by forming the loading openings of the outboard and rotating through the rotating device 22 included in the boat device 14b to provide a mounting position to the individual boat 20b. Semiconductor manufacturing room method. 6. The method of claim 5, wherein the sharing of the small-diameter boat 20b to the reaction chamber 12 for the large-diameter wafer is a vertical reactor by symmetrically placing each boat 20b in a pipe section provided by the reaction chamber 12. A method for manufacturing a semiconductor, characterized by inducing diffusion of a uniform reaction gas by means of symmetrical resistance to the reaction gas flow in the reaction chamber (12). The method of claim 5, wherein the sharing of the small-diameter boat 20b to the reaction chamber 12 for the large-diameter wafer causes each individual boat 20b to rotate independently to react with the process gas, thereby allowing the individual support to rotate within the entire support 90. Semiconductor manufacturing method characterized in that the rotation of the boat (20b) is further performed. A common reaction chamber 12 provided with a process apparatus of a semiconductor manufacturing process and installed on the basis of a large-diameter wafer 10a: a large-diameter wafer boat apparatus 14a according to the large-diameter wafer 10a, and a large-diameter wafer boat apparatus. A plurality of small-diameter wafer boat apparatuses 14b, which are adjacent to each other and are installed separately and are the same as the support for the large-diameter wafer 9, and have a plurality of small-diameter wafer boats 20b disposed in an area of the mounting area thereof. Boat apparatuses: A standby chamber 16 adjacent to the common reaction chamber 7 to provide a space for the boat apparatuses 14a and 14b to stand by, as well as to provide an exchange space for the boat apparatuses. A common reaction chamber installed at 16 and having a plurality of boat apparatuses 14a and 14b installed therein and having a fixed position by selecting any one of the boat apparatuses 14a and 14b. 12) and robots A semiconductor manufacturing apparatus comprising an exchange device (18) for providing a loading / unloading arrangement position on an arm (5).

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