KR100592267B1 - 유기 전계 발광 표시장치의 제조방법 - Google Patents
유기 전계 발광 표시장치의 제조방법 Download PDFInfo
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- KR100592267B1 KR100592267B1 KR1020040020282A KR20040020282A KR100592267B1 KR 100592267 B1 KR100592267 B1 KR 100592267B1 KR 1020040020282 A KR1020040020282 A KR 1020040020282A KR 20040020282 A KR20040020282 A KR 20040020282A KR 100592267 B1 KR100592267 B1 KR 100592267B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1233—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with different thicknesses of the active layer in different devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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Abstract
Description
Claims (6)
- 기판상에 반도체층을 형성하는 단계;상기 반도체층을 덮도록 감광막을 도포하는 단계;상기 감광막이 상기 반도체층이 소정 영역별로 상이한 두께를 가지도록 패터닝되는 단계;상기 반도체층에 이온 도핑하는 단계;상기 반도체층의 채널 영역에 대응되도록 게이트 전극을 형성한 후, 상기 반도체층의 소스 및 드레인 영역에 각각 접하도록 소스 및 드레인 전극을 형성하는 단계; 및상기 소스 및 드레인 전극 중 어느 하나에 접속되는 제 1 전극층과, 상기 제 1 전극층에 절연되도록 형성된 제 2 전극층, 및 상기 제 1 전극층과 제 2 전극층의 사이에 개재되고 적어도 발광층을 가지는 유기층을 구비하는 유기 전계 발광 소자 형성 단계를 포함하는 것을 특징으로 하는 유기 전계 발광 표시장치의 제조방법.
- 제 1 항에 있어서,상기 감광막의 패터닝 단계는,상기 감광막이, 상기 반도체층의 채널 영역에 대응되는 위치에 제 1 두께를 가지고, 상기 반도체층의 엘디디 영역에 대응되는 위치에 제 2 두께를 가지며, 상기 제 1 두께가 상기 제 2 두께보다 두껍도록 상기 감광막을 패터닝하는 것을 특징으로 하는 유기 전계 발광 표시장치의 제조방법.
- 제 2 항에 있어서,상기 감광막의 패터닝 단계는 상기 감광막의 제 1 두께 및 제 2 두께에 대응되는 영역별로 상이한 투광량을 가지는 그레이 패턴 마스크를 이용해 노광하는 단계를 포함하는 것을 특징으로 하는 유기 전계 발광 표시장치의 제조방법.
- 제 3 항에 있어서,상기 그레이 패턴 마스크는 상기 채널 영역에는 투광량이 가장 낮은 슬릿 간격, 저농도 채널 영역에는 낮은 투광량의 슬릿 간격, 고농도 채널 영역에는 높은 투광량의 슬릿 간격을 가진 것을 사용하고,상기 감광막은 포지형을 사용하는 것을 특징으로 하는 유기 전계 발광 표시장치의 제조방법.
- 제 3 항에 있어서,상기 그레이 패턴 마스크는 상기 채널 영역에는 투광량이 높은 슬릿 간격, 저농도 채널 영역에는 낮은 투광량의 슬릿 간격, 고농도 채널 영역에는 가장 낮은 투광량의 슬릿 간격을 가진 것을 사용하고,상기 감광막은 네가형을 사용하는 것을 특징으로 하는 유기 전계 발광 표시 장치의 제조방법.
- 제 3 항에 있어서,상기 이온 도핑 단계는, 상기 반도체층에 덮힌 제 1 두께 및 제 2 두께의 감광막 상에 고농도의 이온을 도핑시킴으로써, 상기 반도체층의 양단에 저농도 및 고농도의 이온이 동시에 도핑되는 것을 특징으로 하는 유기 전계 발광 표시장치의 제조방법.
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US10547159B1 (en) * | 2018-12-12 | 2020-01-28 | Trumpf Photonics Inc. | Laterally tailoring current injection for laser diodes |
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JP2002124677A (ja) | 2000-10-13 | 2002-04-26 | Nec Corp | 液晶表示用基板及びその製造方法 |
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