KR100573327B1 - 전자 회로에서의 전도체 조성물의 용도 - Google Patents

전자 회로에서의 전도체 조성물의 용도 Download PDF

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Publication number
KR100573327B1
KR100573327B1 KR1020037013228A KR20037013228A KR100573327B1 KR 100573327 B1 KR100573327 B1 KR 100573327B1 KR 1020037013228 A KR1020037013228 A KR 1020037013228A KR 20037013228 A KR20037013228 A KR 20037013228A KR 100573327 B1 KR100573327 B1 KR 100573327B1
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South Korea
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composition
component
weight percent
particles
present
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KR1020037013228A
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English (en)
Korean (ko)
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KR20030085104A (ko
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사라 제인 미어스
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이 아이 듀폰 디 네모아 앤드 캄파니
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
    • C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/5805—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/44—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the composition of the continuous phase
    • C03C2217/45—Inorganic continuous phases
    • C03C2217/452—Glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
    • C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
    • C03C2217/475—Inorganic materials
    • C03C2217/479—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40—Metallic constituents or additives not added as binding phase
    • C04B2235/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40—Metallic constituents or additives not added as binding phase
    • C04B2235/405—Iron group metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020037013228A 2001-04-09 2002-04-04 전자 회로에서의 전도체 조성물의 용도 Expired - Fee Related KR100573327B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0108886.3A GB0108886D0 (en) 2001-04-09 2001-04-09 Conductor composition II
GB0108886.3 2001-04-09
PCT/US2002/010505 WO2002082472A2 (en) 2001-04-09 2002-04-04 The use of conductor compositions in electronic circuits

Publications (2)

Publication Number Publication Date
KR20030085104A KR20030085104A (ko) 2003-11-01
KR100573327B1 true KR100573327B1 (ko) 2006-04-24

Family

ID=9912546

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037013228A Expired - Fee Related KR100573327B1 (ko) 2001-04-09 2002-04-04 전자 회로에서의 전도체 조성물의 용도

Country Status (9)

Country Link
US (1) US7189343B2 (enExample)
EP (1) EP1377988A2 (enExample)
JP (1) JP2004524665A (enExample)
KR (1) KR100573327B1 (enExample)
CN (1) CN1608298B (enExample)
AU (1) AU2002248745A1 (enExample)
GB (1) GB0108886D0 (enExample)
TW (1) TWI316722B (enExample)
WO (1) WO2002082472A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040104262A1 (en) * 2001-04-09 2004-06-03 Mears Sarah Jane Use of conductor compositions in electronic circuits
GB0307547D0 (en) 2003-04-01 2003-05-07 Du Pont Conductor composition V
US7384577B2 (en) * 2005-03-09 2008-06-10 E.I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US20060231802A1 (en) 2005-04-14 2006-10-19 Takuya Konno Electroconductive thick film composition, electrode, and solar cell formed therefrom
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US7611645B2 (en) * 2005-04-25 2009-11-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions and the use thereof in LTCC circuits and devices
US7824579B2 (en) * 2005-06-07 2010-11-02 E. I. Du Pont De Nemours And Company Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
US7771623B2 (en) * 2005-06-07 2010-08-10 E.I. du Pont de Nemours and Company Dupont (UK) Limited Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
US20070023388A1 (en) * 2005-07-28 2007-02-01 Nair Kumaran M Conductor composition for use in LTCC photosensitive tape on substrate applications
US20100193494A1 (en) * 2009-02-02 2010-08-05 Basf Catalysts Llc Conductive Compositions

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583931A (en) 1969-11-26 1971-06-08 Du Pont Oxides of cubic crystal structure containing bismuth and at least one of ruthenium and iridium
JPS5222596A (en) 1975-08-15 1977-02-19 Mitsui Toatsu Chem Inc Refinement of phosphoric acid
US4366094A (en) 1981-02-02 1982-12-28 E. I. Du Pont De Nemours And Company Conductor compositions
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
US4371459A (en) * 1981-12-17 1983-02-01 E. I. Du Pont De Nemours And Company Flexible screen-printable conductor composition
JPS6166303A (ja) * 1984-09-06 1986-04-05 太陽誘電株式会社 配線基板の製造方法
US5162062A (en) 1991-06-17 1992-11-10 E. I. Du Pont De Nemours And Company Method for making multilayer electronic circuits
JPH0640821A (ja) 1992-07-24 1994-02-15 Toshiba Silicone Co Ltd 防カビ性ポリオルガノシロキサン組成物
US5378408A (en) * 1993-07-29 1995-01-03 E. I. Du Pont De Nemours And Company Lead-free thick film paste composition
JPH0773731A (ja) * 1993-09-06 1995-03-17 Dai Ichi Kogyo Seiyaku Co Ltd 厚膜導電性ペースト組成物
US5518663A (en) 1994-12-06 1996-05-21 E. I. Du Pont De Nemours And Company Thick film conductor compositions with improved adhesion
JPH09139278A (ja) 1995-11-14 1997-05-27 Dai Ichi Kogyo Seiyaku Co Ltd ヒーター用抵抗体ペースト
DE19647044A1 (de) 1996-11-14 1998-05-20 Degussa Paste für Einbrennschichten
DE69934925T2 (de) * 1998-02-23 2007-06-28 Murata Mfg. Co., Ltd., Nagaokakyo Widerstandsmaterial, Widerstandspaste und Widerstand aus diesem Material und Keramisches Mehrschichtsubstrat
JP3484983B2 (ja) * 1998-07-28 2004-01-06 株式会社村田製作所 導電性ペースト及びガラス回路基板

Also Published As

Publication number Publication date
US20040099848A1 (en) 2004-05-27
EP1377988A2 (en) 2004-01-07
TWI316722B (en) 2009-11-01
GB0108886D0 (en) 2001-05-30
WO2002082472A2 (en) 2002-10-17
KR20030085104A (ko) 2003-11-01
CN1608298A (zh) 2005-04-20
JP2004524665A (ja) 2004-08-12
CN1608298B (zh) 2010-10-13
AU2002248745A1 (en) 2002-10-21
US7189343B2 (en) 2007-03-13
WO2002082472A3 (en) 2002-12-12

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