TWI316722B - The use of conductor compositions in electronic circuits - Google Patents

The use of conductor compositions in electronic circuits Download PDF

Info

Publication number
TWI316722B
TWI316722B TW091107083A TW91107083A TWI316722B TW I316722 B TWI316722 B TW I316722B TW 091107083 A TW091107083 A TW 091107083A TW 91107083 A TW91107083 A TW 91107083A TW I316722 B TWI316722 B TW I316722B
Authority
TW
Taiwan
Prior art keywords
composition
particles
present
amount
glass
Prior art date
Application number
TW091107083A
Other languages
English (en)
Chinese (zh)
Inventor
Jane Mears Sarah
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of TWI316722B publication Critical patent/TWI316722B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
    • C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/5805—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/44—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the composition of the continuous phase
    • C03C2217/45—Inorganic continuous phases
    • C03C2217/452—Glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
    • C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
    • C03C2217/475—Inorganic materials
    • C03C2217/479—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40—Metallic constituents or additives not added as binding phase
    • C04B2235/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40—Metallic constituents or additives not added as binding phase
    • C04B2235/405—Iron group metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW091107083A 2001-04-09 2002-04-09 The use of conductor compositions in electronic circuits TWI316722B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0108886.3A GB0108886D0 (en) 2001-04-09 2001-04-09 Conductor composition II

Publications (1)

Publication Number Publication Date
TWI316722B true TWI316722B (en) 2009-11-01

Family

ID=9912546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091107083A TWI316722B (en) 2001-04-09 2002-04-09 The use of conductor compositions in electronic circuits

Country Status (9)

Country Link
US (1) US7189343B2 (enExample)
EP (1) EP1377988A2 (enExample)
JP (1) JP2004524665A (enExample)
KR (1) KR100573327B1 (enExample)
CN (1) CN1608298B (enExample)
AU (1) AU2002248745A1 (enExample)
GB (1) GB0108886D0 (enExample)
TW (1) TWI316722B (enExample)
WO (1) WO2002082472A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040104262A1 (en) * 2001-04-09 2004-06-03 Mears Sarah Jane Use of conductor compositions in electronic circuits
GB0307547D0 (en) 2003-04-01 2003-05-07 Du Pont Conductor composition V
US7384577B2 (en) * 2005-03-09 2008-06-10 E.I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US20060231802A1 (en) 2005-04-14 2006-10-19 Takuya Konno Electroconductive thick film composition, electrode, and solar cell formed therefrom
US7611645B2 (en) * 2005-04-25 2009-11-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions and the use thereof in LTCC circuits and devices
US7771623B2 (en) * 2005-06-07 2010-08-10 E.I. du Pont de Nemours and Company Dupont (UK) Limited Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
US7824579B2 (en) 2005-06-07 2010-11-02 E. I. Du Pont De Nemours And Company Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
US20070023388A1 (en) * 2005-07-28 2007-02-01 Nair Kumaran M Conductor composition for use in LTCC photosensitive tape on substrate applications
US20100193494A1 (en) * 2009-02-02 2010-08-05 Basf Catalysts Llc Conductive Compositions

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583931A (en) * 1969-11-26 1971-06-08 Du Pont Oxides of cubic crystal structure containing bismuth and at least one of ruthenium and iridium
JPS5222596A (en) 1975-08-15 1977-02-19 Mitsui Toatsu Chem Inc Refinement of phosphoric acid
US4366094A (en) * 1981-02-02 1982-12-28 E. I. Du Pont De Nemours And Company Conductor compositions
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
US4371459A (en) * 1981-12-17 1983-02-01 E. I. Du Pont De Nemours And Company Flexible screen-printable conductor composition
JPS6166303A (ja) * 1984-09-06 1986-04-05 太陽誘電株式会社 配線基板の製造方法
US5162062A (en) * 1991-06-17 1992-11-10 E. I. Du Pont De Nemours And Company Method for making multilayer electronic circuits
JPH0640821A (ja) * 1992-07-24 1994-02-15 Toshiba Silicone Co Ltd 防カビ性ポリオルガノシロキサン組成物
US5378408A (en) * 1993-07-29 1995-01-03 E. I. Du Pont De Nemours And Company Lead-free thick film paste composition
JPH0773731A (ja) * 1993-09-06 1995-03-17 Dai Ichi Kogyo Seiyaku Co Ltd 厚膜導電性ペースト組成物
US5518663A (en) * 1994-12-06 1996-05-21 E. I. Du Pont De Nemours And Company Thick film conductor compositions with improved adhesion
JPH09139278A (ja) * 1995-11-14 1997-05-27 Dai Ichi Kogyo Seiyaku Co Ltd ヒーター用抵抗体ペースト
DE19647044A1 (de) * 1996-11-14 1998-05-20 Degussa Paste für Einbrennschichten
EP1655743B1 (en) * 1998-02-23 2010-09-15 Murata Manufacturing Co., Ltd. Resistor material, resistive paste and resistor using the resistor material, and multi-layered ceramic substrate
JP3484983B2 (ja) 1998-07-28 2004-01-06 株式会社村田製作所 導電性ペースト及びガラス回路基板

Also Published As

Publication number Publication date
US20040099848A1 (en) 2004-05-27
JP2004524665A (ja) 2004-08-12
KR20030085104A (ko) 2003-11-01
US7189343B2 (en) 2007-03-13
WO2002082472A3 (en) 2002-12-12
CN1608298A (zh) 2005-04-20
AU2002248745A1 (en) 2002-10-21
KR100573327B1 (ko) 2006-04-24
CN1608298B (zh) 2010-10-13
EP1377988A2 (en) 2004-01-07
WO2002082472A2 (en) 2002-10-17
GB0108886D0 (en) 2001-05-30

Similar Documents

Publication Publication Date Title
TWI409827B (zh) Copper conductor paste, conductor circuit boards and electronic components
US20110140055A1 (en) Conductive compositions and the use thereof
JPH0334162B2 (enExample)
US8097062B2 (en) Use of conductor compositions in electronic circuits
CN100358053C (zh) 用在电子电路中的导体成分
US7189343B2 (en) Use of conductor compositions in electronic circuits
TW201040989A (en) Compositions and method for increasing resistivity of electrically-conductive pattern
TWI317526B (en) A composition and a method for increasing the resistivity of an electrically-conductive pattern
US6787068B1 (en) Conductor composition
TW522410B (en) Conductor composition
JPH01192780A (ja) 銅導体組成物
HK1063689A (en) Conductor compositions and the use thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees