KR100560708B1 - 납땜방법 - Google Patents

납땜방법 Download PDF

Info

Publication number
KR100560708B1
KR100560708B1 KR1020030050542A KR20030050542A KR100560708B1 KR 100560708 B1 KR100560708 B1 KR 100560708B1 KR 1020030050542 A KR1020030050542 A KR 1020030050542A KR 20030050542 A KR20030050542 A KR 20030050542A KR 100560708 B1 KR100560708 B1 KR 100560708B1
Authority
KR
South Korea
Prior art keywords
solder
solder bath
composition
lead
bath
Prior art date
Application number
KR1020030050542A
Other languages
English (en)
Korean (ko)
Other versions
KR20040010350A (ko
Inventor
오야히사시
모리이쿠오
다테야마가즈키
이토히사시
투다다츠야
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20040010350A publication Critical patent/KR20040010350A/ko
Application granted granted Critical
Publication of KR100560708B1 publication Critical patent/KR100560708B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
KR1020030050542A 2002-07-24 2003-07-23 납땜방법 KR100560708B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00215809 2002-07-24
JP2002215809A JP2004063509A (ja) 2002-07-24 2002-07-24 ハンダ付け方法

Publications (2)

Publication Number Publication Date
KR20040010350A KR20040010350A (ko) 2004-01-31
KR100560708B1 true KR100560708B1 (ko) 2006-03-16

Family

ID=31937751

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030050542A KR100560708B1 (ko) 2002-07-24 2003-07-23 납땜방법

Country Status (4)

Country Link
JP (1) JP2004063509A (zh)
KR (1) KR100560708B1 (zh)
CN (1) CN1248817C (zh)
TW (1) TWI221758B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465312B (zh) * 2005-07-19 2014-12-21 Nihon Superior Co Ltd 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法

Also Published As

Publication number Publication date
KR20040010350A (ko) 2004-01-31
TW200403965A (en) 2004-03-01
TWI221758B (en) 2004-10-01
CN1486813A (zh) 2004-04-07
CN1248817C (zh) 2006-04-05
JP2004063509A (ja) 2004-02-26

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E701 Decision to grant or registration of patent right
GRNT Written decision to grant
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