KR100549301B1 - Universal solder ball attach tool and its method - Google Patents

Abstract

The present invention relates to a general-purpose solder ball attach device and a method thereof, even if the arrangement position of the solder ball fused to the substrate (substrate) is changed, so that it is possible to simply replace the attachment tool to continue the solder ball attach operation, approximately rectangular plate The bottom surface is divided into a plurality of units in the form, each unit is a flux tool (needle full array) and the upper surface is divided into a plurality of units in the form of a substantially rectangular plate. The unit is divided into a ball stack plate with a full array of grooves of a predetermined depth so as to correspond to the needle, and a bottom surface of the unit in the form of a substantially rectangular plate. Ball attach in which a mask with a solder ball adsorption hole is detachable only in a region corresponding to the position Characterized in that it comprises a tool (ball attach tool).

Solder Ball, Flux Tool, Ball Stack Plate, Ball Attach Tool, Ball Grid Array

Description

Universal solder ball attach device and its method {Universal solder ball attach tool and its method}

FIG. 1A is a flux tool for a conventional solder ball attach, FIG. 1B is a ball stack plate, and FIG. 1C is a ball attach tool.

Figure 2a is a perspective view showing a flux tool of the general purpose solder ball attach apparatus according to the present invention, Figure 2b is a perspective view showing a ball stack plate.

3A is a perspective view showing a ball attach tool in the general purpose solder ball attach apparatus according to the present invention, and FIG. 3B is an exploded perspective view thereof.

4 is a cross-sectional view taken along line 3-3 of FIG. 3A.

5 is a perspective view showing a ball attach tool among other general-purpose solder ball attach apparatus according to the present invention.

6 is a sequential explanatory diagram showing a general purpose solder ball attach method according to the present invention.

<Description of Symbols for Main Parts of Drawings>

10; Flux tool 11; unit

12; Needle 20; Ball stack plate

21; Unit 22; Groove

30; Ball attach tool 31; unit

32; Base plate 33; Vacuum inductor

34; Body 35; Mask

36; Hole 37; volt

The present invention relates to a general-purpose solder ball attach apparatus and method thereof, and in more detail, even if the arrangement positions of solder balls fused to a substrate are changed, the solder ball attach operation can be continued simply by replacing the attachment tool. The present invention relates to a general-purpose solder ball attach apparatus and a method thereof.

In general, a ball grid array (BGA) -based semiconductor package is followed by a process of attaching solder balls to the wiring pattern of the substrate after the molding process is completed. In order to attach the solder balls as described above, a flux tool, a ball stack plate, and a ball attach tool are largely required. Referring to FIG. 1A, the above-described flux tool 10 ′ (flux tool) is illustrated, and FIG. 1B. Referring to FIG. 1, a ball stack plate 20 ′ is shown, and referring to FIG. 1C, a ball attach tool 30 ′ is shown. Referring to this, a brief description of a conventional device structure and solder ball attach method is as follows.

As shown in the drawing, the flux tool 10 'is divided into a plurality of unit 11' areas in a substantially rectangular plate shape, and each unit 11 'has a predetermined length and a plurality of needles in a substantially matrix form. 12 ') are combined. The arrangement position of the needle 12 'is variable depending on the position of the solder ball to be fused to the substrate. Of course, the needle 12 ′ predots a certain amount of sticky flux to the region where the solder balls of the substrate are to be fused.

Subsequently, the ball stack plate 20 'is divided into a plurality of unit 21' areas in the form of a substantially rectangular plate as shown, and each unit 21 'includes a plurality of balls to temporarily position solder balls. The groove 22 'is formed. The arrangement position of the groove 22 'also varies depending on the position of the solder ball to be fused to the substrate. Of course, the groove 22 'position of the ball stack plate 20' and the needle 12 'position of the flux tool 10' must be the same, and are also provided the same.

Subsequently, the ball attach tool 30 'is divided into a plurality of unit 31' areas in the form of a rectangular plate as shown, and each unit 31 'has solder balls from the ball stack plate 20'. A plurality of holes 36 'are formed so as to be placed on the flux doped in the substrate by vacuum adsorption. Of course, the diameter of the hole 36 'is smaller than the diameter of the solder ball, and the arrangement position thereof is also variable depending on the position of the solder ball fused to the substrate.

Therefore, such conventional flux tool 10 ', ball stack plate 20' and ball attach tool 30 'must be changed together when the solder ball arrangement position of the semiconductor package is changed. That is, when the size of the semiconductor package and the diameter of the solder ball are completely changed, the tools 10 ', 30' and the plate 20 'should be changed naturally, but only in a state where the size of the semiconductor package and the diameter of the solder ball are fixed. Even if only the arrangement positions of the solder balls are changed, all the tools and plates must be changed, thereby causing a problem in that the price burden caused by tool and plate manufacture is excessively large.

The present invention is to overcome the above-mentioned conventional problems, an object of the present invention is a general-purpose solder ball attachment that can continue the solder ball attach operation by simply replacing the attachment tool even if the arrangement position of the solder ball fused to the substrate is changed. It is to provide a attachment device and a method thereof.

In order to achieve the above object, the general-purpose solder ball attach apparatus according to the present invention has a shape of a rectangular plate and is divided into a plurality of units at the bottom thereof, and each unit has a flux tool having a full array of needles. ), A substantially rectangular plate shape, the upper surface of which is divided into a plurality of units, each of which has a ball stack plate in which grooves of a predetermined depth are arrayed so as to correspond to the needle, and an approximately rectangular plate shape. The ball attach tool (ball attach tool) is divided into a plurality of units, and each unit is detachable with a mask having a hole for solder ball adsorption in an area corresponding to the solder ball fusion position of the substrate. It is characterized by consisting of.

Here, the ball attach tool is a base plate in the form of a substantially rectangular plate, the bottom of the base plate is coupled to the bolt (bolt), the body of the substantially rectangular parallelepiped penetrated up and down, and the The lower surface may be detachable, and may include a mask in which a plurality of solder ball adsorption holes are formed, and a vacuum derivative positioned between the base plate and the mask to provide a vacuum adsorption force.

In addition, in order to achieve the above object, the general-purpose solder ball attach method according to the present invention comprises the steps of dotting the flux in a full array state on the entire surface of the substrate of the BGA (Ball Grid Array) type semiconductor package, and one surface of the substrate Temporarily arranging the solder balls in other areas corresponding to the whole, and selectively vacuum-adsorbing the solder balls so as to correspond only to the solder ball fusion regions of the substrate, and placing the solder balls on the flux dotted with the substrate; Characterized in that the made up.

According to the general-purpose solder ball attaching device and method according to the present invention as described above, the first embodiment includes a flux tool with a full array of needles and a ball stack plate with a full array of grooves, and then, at a position where solder balls are arranged. By simply replacing the various ball attach tools that are specifically designed, the solder balls can be applied to a variety of BGA type semiconductor packages with different arrangement positions, thus significantly reducing the cost of tool and plate replacement. Of course, in this case, the BGA type semiconductor package has the same size and diameter of solder balls, and corresponds to only different arrangement positions of solder balls.

In addition, the above ball attach tool has an advantage that it can be easily applied to various kinds of BGA type semiconductor packages by simply replacing only the mask on which the solder ball adsorption holes are formed.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

Referring to FIG. 2A, a flux tool 10 of a general purpose solder ball attach apparatus according to the present invention is shown, and referring to FIG. 2B, a ball stack plate 20 is shown.

As shown, the flux tool 10 according to the present invention is divided into a plurality of unit 11 regions in the form of a rectangular plate, each unit 11 has a predetermined length and a plurality of needles 12 in a substantially matrix form. ) Are combined in a full array. The arrangement position of these needles 12 is full arrayed regardless of the position of the solder balls to be fused to the substrate. Of course, these needles 12 dotting a certain amount of sticky flux in the region where the solder ball of the substrate is to be fused in advance, the flux tool 10 of the above structure is not formed of the solder ball of the substrate It will put a certain amount of flux even where it is not.

Subsequently, the ball stack plate 20 according to the present invention is divided into a plurality of unit 21 areas in the form of a substantially rectangular plate as shown, and each unit 21 includes a plurality of temporary balls to temporarily position the solder balls. The grooves 22 are full arrayed. The arrangement position of the grooves 22 is also full arrayed regardless of the position of the solder ball to be fused to the substrate.

Referring to FIG. 3A, a ball attach tool 30 of the general-purpose solder ball attach apparatus according to the present invention is illustrated. Referring to FIG. 3B, an exploded perspective view thereof is illustrated. Referring to FIG. 4, FIG. 3A is illustrated in FIG. 3A. A cross-sectional view taken along line 3-3 is shown.

As shown, the ball attach tool 30 according to the present invention has a substantially rectangular plate shape, the bottom of which is divided into a plurality of units 31, and each unit 31 corresponds to a solder ball fusion position of a substrate. The mask 35 in which the solder ball adsorption | suction hole 36 was formed only in the area | region is removable.

In more detail, the ball attach tool 30 is coupled to a base plate 32 having a substantially rectangular plate shape and a bolt 37 at a lower portion of the base plate 32. A substantially rectangular parallelepiped-shaped body 34, a mask 35 detachably attached to a lower surface of the body 34, and having a plurality of solder ball adsorption holes 36 formed therein, and the base plate 32. ) And a vacuum inductor 33 positioned between the mask 35 and providing a vacuum suction force. Here, the base plate 32 and the vacuum derivative 33 is further formed with a hole 38 so that the vacuum suction force can be transferred to the mask 35. In addition, the bottom surface of the vacuum inductor 33 is formed with a groove 39 in the shape of a substantially circular ring so that the vacuum evenly acts on the mask 35. In addition, the hole 36 formed in the mask 35 has an orientation with the arrangement position of the solder balls to be fused to the substrate. That is, a plurality of masks 35 are provided according to the arrangement positions of the solder balls to be fused to the substrate.

Thus, this ball attach tool 30 is provided with a vacuum through the base plate 32 and the vacuum inductor 33, which allows the solder balls to adsorb to the plurality of holes 36 formed in the mask 35. do. Of course, the solder ball adsorbed in this way is seated on the flux that is previously doped on the substrate.

5, there is shown a ball attach tool 40 of another general purpose solder ball attach apparatus in accordance with the present invention.

As shown, another ball attach tool 40 according to the present invention has an integral body 44 coupled to an integral base plate 42 by a bolt 47. Of course, a plurality of solder ball adsorption holes 41 are formed on the bottom of the body 44. Therefore, the ball attach tool 40 having such a structure can replace the body 44 itself according to the type of BGA-based semiconductor package.

6, the general purpose solder ball attach method according to the present invention is shown in sequence.

As shown, it is composed of a flux dotting step (S1), a solder ball pull array step (S2), and a solder ball seating step (S3).

First, in the flux dotting step (S1), the sticky flux is doted in a full array state on one side of the substrate of the BGA-based semiconductor package. That is, the flux is buried in the needle 12 of the flux tool 10 disclosed in the present invention and doted again in the substrate. Of course, the flux tool 10 is a needle 12 is arranged in a full array state. As a result, flux may be applied to areas of unwanted substrate.

Subsequently, in the solder ball pull array step S2, the solder balls are temporarily arrayed in another area corresponding to the entire one surface of the substrate. That is, solder balls are arrayed in the grooves 22 of the ball stack plate 20 disclosed in the present invention. Of course, the grooves 22 are formed in the ball stack plate 20 in a full array state.

Subsequently, in the solder ball seating step (S3), the solder balls are vacuum-adsorbed selectively so as to correspond only to the solder ball fusion regions of the substrate, and are seated on the flux doped on the substrate. That is, by using various ball attach tools 30 disclosed in the present invention, the solder balls arranged in the ball stack plate 20 are selectively adsorbed to be seated on the flux of the substrate. At this time, among the solder balls that are fully arrayed on the ball stack plate 20, some solder balls are not adsorbed by the ball attach tool 30. In other words, the flux is placed in a full array on the substrate and the solder balls are placed in a full array on the ball stack plate 20, but the final ball attach tool 30 adsorbs only the selected solder balls to bump into the substrate. do. Therefore, there are fluxes in which the solder balls are not attached to the substrate, but these fluxes are eliminated in both the reflow process and the cleaning process, and thus do not pose a significant obstacle to the bumping process of the solder balls.

According to the general-purpose solder ball attaching device and method according to the present invention as described above, the first embodiment includes a flux tool with a full array of needles and a ball stack plate with a full array of grooves, and then, at a position where solder balls are arranged. By simply replacing the various ball attach tools that are designed to fit, the solder balls can be applied to a variety of BGA type semiconductor packages with different arrangement positions, which can significantly reduce the cost of tool and plate replacement. Of course, in this case, the BGA type semiconductor package has the same size and diameter of solder balls, and corresponds to only different arrangement positions of solder balls.

In addition, the above-mentioned ball attach tool can be easily applied to various kinds of BGA type semiconductor packages by simply replacing only the mask on which the solder ball adsorption holes are formed.

What has been described above is only one embodiment for carrying out the general-purpose solder ball attach apparatus and method thereof according to the present invention, the present invention is not limited to the above-described embodiment, as claimed in the following claims Without departing from the gist of the present invention, anyone of ordinary skill in the art will have the technical spirit of the present invention to the extent that various modifications can be made.

Claims (3)

The bottom plate is divided into a plurality of units in the form of a rectangular plate, and each unit has needles in a full array not only in the region corresponding to the solder ball fusion region of the substrate but also in the region corresponding to the region where the solder ball is not fused. Flux tool; A ball stack plate in which a top surface is divided into a plurality of units in a rectangular plate shape, each of which has a full array of grooves of a predetermined depth so as to correspond to a full arrayed needle of the flux tool; And, A ball attach tool in which a bottom plate is divided into a plurality of units in the form of a rectangular plate, and in each unit, a mask in which a solder ball adsorption hole is formed only in an area corresponding to a solder ball fusion region of a substrate is formed. General purpose solder ball attach device, comprising a ball attach tool). The method of claim 1, wherein the ball attach tool is a base plate in the form of a rectangular plate (bolt) is coupled to the lower portion of the base plate, the upper and lower body of the substantially rectangular parallelepiped shape, Removable to the lower surface of the body, a general-purpose solder ball attach device comprising a mask (mask) formed with a plurality of solder ball adsorption holes, and a vacuum inductor positioned between the base plate and the mask to provide a vacuum adsorption force . Dotting the flux in the full array state not only in the solder ball fusion region but also in the region where the solder ball is not fused in one of the substrates of the ball grid array (BGA) type semiconductor package; Temporarily placing a solder ball in a full array state in another area corresponding to the flux doped in the full array state; Selectively vacuum-sucking only the solder balls in positions corresponding to the solder ball fusion regions of the substrate among the solder balls positioned in the full array state, and seating only on a specific flux of the substrate;

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