KR100543506B1 - 척 세정장치 및 세정방법 - Google Patents
척 세정장치 및 세정방법 Download PDFInfo
- Publication number
- KR100543506B1 KR100543506B1 KR1020030053764A KR20030053764A KR100543506B1 KR 100543506 B1 KR100543506 B1 KR 100543506B1 KR 1020030053764 A KR1020030053764 A KR 1020030053764A KR 20030053764 A KR20030053764 A KR 20030053764A KR 100543506 B1 KR100543506 B1 KR 100543506B1
- Authority
- KR
- South Korea
- Prior art keywords
- chuck
- cleaning
- bath
- slots
- horizontal member
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (5)
- 이송장치에 의해 승하강되며, 웨이퍼를 적재하는 슬롯들이 형성된 척을 세정하는 장치에 있어서,상부가 개방된 배스와;상기 배스의 상부에 위치되며, 상기 슬롯에 세정액을 분사하여 상기 슬롯을 세정하는 복수의 세정부들과;가스를 분사하여 상기 척에 잔존하는 세정액을 제거하는 가스분사노즐을 포함하되,상기 배스는,상기 척이 담가지는 세정액으로 채워진 내부세정조와;상기 내부세정조로부터 넘친 세정액이 모이는 외부저장조를 포함하는 것을 특징으로 하는 척 세정장치.
- 제1항에 있어서,상기 척은,복수의 슬롯들이 각각 형성되며, 웨이퍼의 일측을 지지하는 제1수평부재와;복수의 슬롯들이 각각 형성되며, 웨이퍼의 타측을 지지하는 제2수평부재와;상기 제1수평부재 및 상기 제2수평부재를 지지하는 적어도 하나의 수직부재들을 포함하며,상기 내부세정조는,용기와;상기 용기 내부를 구획하는 복수의 격벽들을 구비하되,상기 격벽에 의하여 구획된 영역 중 상기 제1수평부재 및 상기 제2수평부재가 삽입되는 영역에만 세정액이 채워지는 것을 특징으로 하는 척 세정장치.
- 제1항 또는 제2항에 있어서;상기 세정부는;세정액을 공급하는 공급관과;상기 공급관 상에 상기 슬롯과 대향되도록 위치하는 복수의 분사구들을 구비하는 것을 특징으로 하는 척 세정장치.
- 웨이퍼를 적재하는 슬롯들이 형성된 척을 세정하는 방법에 있어서;상기 척을 베스 내의 세정액에 담그어 상기 척을 1차세정하는 단계와;세정된 상기 척을 상기 배스 상부로 승강하는 단계와;상기 세정부로부터 상기 척의 슬롯에 세정액을 분사하여 2차세정하는 단계와; 그리고,상기 척을 향해 상기 가스분사노즐로부터 가스를 분사하여 건조하는 단계를 포함하는 것을 특징으로 하는 척 세정방법.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030053764A KR100543506B1 (ko) | 2003-08-04 | 2003-08-04 | 척 세정장치 및 세정방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030053764A KR100543506B1 (ko) | 2003-08-04 | 2003-08-04 | 척 세정장치 및 세정방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050016848A KR20050016848A (ko) | 2005-02-21 |
KR100543506B1 true KR100543506B1 (ko) | 2006-01-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030053764A KR100543506B1 (ko) | 2003-08-04 | 2003-08-04 | 척 세정장치 및 세정방법 |
Country Status (1)
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KR (1) | KR100543506B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100921520B1 (ko) * | 2007-10-05 | 2009-10-12 | 세메스 주식회사 | 척 세정 장치 및 방법 그리고 이를 구비하는 기판 처리장치 및 그의 척 세정 방법 |
KR101423611B1 (ko) * | 2008-01-16 | 2014-07-30 | 삼성전자주식회사 | 기판 처리 장치, 노광 장치 및 클리닝 툴의 세정 방법 |
CN108816904A (zh) * | 2018-04-27 | 2018-11-16 | 无锡华美钼业有限公司 | 升降式下料清洗的钼杆清洗槽 |
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2003
- 2003-08-04 KR KR1020030053764A patent/KR100543506B1/ko not_active IP Right Cessation
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KR20050016848A (ko) | 2005-02-21 |
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