KR100532679B1 - loading device of bonding equipment for flexible circuit board of flat panel display - Google Patents

Abstract

The present invention relates to a loading device of a circuit board bonding machine of a flat panel display, and more particularly, can be easily loaded without being limited by the size and shape of the glass and the circuit board to be loaded, as well as glass and bonding at the time of bonding. The present invention relates to a loading device of a circuit board bonding machine of a flat panel display, which can prevent a setting position of a circuit board from being changed to obtain a more improved bonding quality.

Such an apparatus includes a worktable, a loading portion provided on an upper side of the worktable, for loading glass and a circuit board, and a bonding portion for bonding a pattern portion of the glass and the circuit board loaded in the loading portion, to a circuit board bonding of a flat panel display. In the apparatus,

The loading unit includes a circuit board stage on which a circuit board is loaded, a glass stage installed adjacent to the circuit board stage and loaded with glass, a scan plate provided between the circuit board stage and the glass stage, Correction means for correcting the height deviation between the glass stage and the scan plate.

Description

Loading device of bonding equipment for flexible circuit board of flat panel display}

The present invention relates to a loading device of a circuit board bonding machine of a flat panel display, and more particularly, can be easily loaded without being limited by the size and shape of the glass and the circuit board to be loaded, as well as glass and bonding at the time of bonding. The present invention relates to a loading device of a circuit board bonding machine of a flat panel display, which can prevent a setting position of a circuit board from being changed to obtain a more improved bonding quality.

In general, flat panel displays such as LCD, ELD, and fluorescent display tube (VFD) are gradually thin and short, and as a result, circuit boards or driving chips are directly bonded to the pattern portion of the glass. The bonding operation is performed by a circuit board bonding apparatus provided with a loading unit and a bonding unit, respectively.

To bond the glass and the circuit board to the circuit board bonding apparatus, the glass and the circuit board are loaded and set in the loading unit, respectively, and the bonding is performed while pressing the bonding head with the bonding head. At this time, the anisotropic conductive film is bonded to the pattern portion of the glass in advance, so that the film is melted and the one or more patterns formed on the pattern portion are bonded in an insulated state.

In addition, as described above, a polarizer is formed on the rear portion of the glass loaded in the loading unit for smooth image realization on most of the remaining regions except for the pattern portion, and the polarizer may have a thickness of 10 μm to 10 μm depending on the type and size of the glass. Since the height deviation from the scan plate occurs when the glass is loaded in the glass stage and formed in a 40 μm thickness range, the scan plates corresponding to the scan plate may be manufactured to smoothly support the pattern portion. Bonding is performed while resetting these each time.

Briefly describing the general structure of the conventional circuit board bonding apparatus, a work table, a loading portion provided on the work surface and loading glass and a circuit board, and a pattern portion of the glass and circuit board loaded on the loading portion Bonding unit for bonding,

The loading section includes a glass stage on which glass is loaded, a circuit board stage on which a circuit board is loaded adjacent to the glass stage, and a pattern portion of the glass and the circuit board. It includes a scanning plate and a supporting scan plate.

However, in the conventional circuit board bonding apparatus, the scan plate must be reset every time so as to be smoothly supported according to the thickness of the polarizing plate formed on the loaded glass. Excessive time is taken and there is a problem that the work efficiency is significantly reduced.

In addition, even if the loading unit resets the scan plate to correspond to the thickness of the polarizing plate of the glass every time, most of the set scan plates are protruded or set lower than the lower side of the pattern portion of the glass so that the deviation occurs. At the time of bonding, the setting position of the glass loaded on the glass stage is changed by the vertical pressure of the bonding head, and thus the bonding precision with the circuit board is lowered, causing excessive defect rate and lowering productivity.

The present invention has been made to solve the conventional problems as described above, the object of the present invention can be easily loaded irrespective of the size and thickness of the polarizing plate of the glass, as well as the glass and the scan plate at the time of bonding The present invention provides a loading device of a circuit board bonding machine of a flat panel display that can automatically obtain vertical bonding quality by automatically correcting vertical deviations.

In order to realize the object of the present invention as described above, a bonding section for bonding a work section, a loading section installed on the upper side of the work table and loading glass and a circuit board, and a pattern section of the glass and the circuit board loaded in the loading section. In a circuit board bonding apparatus of a flat panel display comprising a portion,

The loading unit includes a circuit board stage on which a circuit board is loaded, a glass stage installed adjacent to the circuit board stage and loaded with glass, a scan plate provided between the circuit board stage and the glass stage, Provided is a loading device for a circuit board bonding machine for a flat panel display including correction means for correcting a height deviation between a glass stage and a scan plate.

Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings. In this embodiment, a single circuit board bonding apparatus provided with one bonding portion and one loading portion corresponding thereto will be described as an example.

1, 2, and 3, the loading device of the circuit board bonding machine of the flat panel display according to the present invention is provided on the work table 2 and the upper side of the work table 2, the glass G and the circuit. The loading section 4 for loading the substrate B, the bonding section 6 for bonding the glass G loaded in the loading section 4 and the pattern sections G1, B1 of the circuit board B, In the circuit board bonding apparatus of a flat panel display comprising:

The loading section 4 includes a circuit board stage S1 on which the circuit board B is loaded, a glass stage S2 installed adjacent to the circuit board stage S1 and loaded with a glass G; A scan plate (P) installed between the circuit board stage (S1) and the glass stage (S2), and correction means (18) for correcting a height deviation between the glass stage (S2) and the scan plate (P). It includes.

The workbench 2 serves as a kind of table, and may be formed in a box shape in which a constant work space is provided, and on the upper side, a surface is easily prevented from being damaged or deformed by a load or an impact, and is always a constant flatness. The top plate 8 made of a metal material may be installed so that) is maintained.

Supports 10 for supporting the bottom surface may be installed on the lower side of the work table (2), the support 10 is provided with a cushioning member such as rubber or spring to sufficiently damp vibration or shock It can be made of a structure that can be made.

The loading unit 4 may be integrally fixed or movable at a predetermined position on the work table 2, and is fixed by a fastening member such as a bolt at the upper plate 8 of the work table 2. It is to one thing.

The circuit board stage S1 of the loading unit 4 may be made of a plate-shaped metal material having a size that allows the circuit board B to be loaded smoothly, and the position of the upper plate 8 may be changed. An example of what is fixed above the manual stage 12 is shown as an example.

The manual stage 12 (manual stage) has a structure in which three stages are stacked so as to respectively correct positions in the X direction, the Y direction, and the θ direction from the upper side, and these stages are provided with adjustment knobs, respectively. The setting position of the circuit board stage (S1) can be easily changed, and this stage is made of the same or similar structure as that widely used for setting the position and direction of the fatigue feeding object in semiconductor equipment, etc. Is omitted.

The circuit board stage (S1) is formed with a suction hole (H1) for fixing the loaded circuit board (B) in a vacuum and one or more suction holes (H1) are formed in a predetermined arrangement on the surface of the stage. And a negative pressure from the hose 13 connected to a separate vacuum generator (not shown).

The material of the circuit board stage (S1) may be made of a metal material (eg, aluminum) that prevents the conduction of foreign matter to the loaded fatigue loading object and does not cause scratches. If so, various materials (eg, synthetic resin materials) may be used.

The glass stage (S2) may be made of a plate-like metal material having a size that the glass (G) can be smoothly loaded, a plurality of suction holes (H2) is formed on the surface and the suction hole (H2) The adsorption holes H1 of the circuit board stage S1 are connected to the hose 14 to fix the glass G by vacuum.

The material of the glass stage (S2) may be the same aluminum or synthetic resin material as the circuit board stage (S1).

The guide pins 16 for guiding the loading position of the glass G to be loaded may be installed in two directions on the surface of the glass stage S2.

The guide pins 16 may be used as a conventional circular pin having a constant diameter, and the glass (G) to be loaded is guided by the line contact in two directions perpendicular to each other at the time of loading the glass (G) Precise loading accuracy can be obtained.

Although the glass stage S2 is not shown in the drawing, a plurality of stages corresponding to the glass stage S2 may be manufactured in order to achieve optimal loading and setting according to the shape or size of the glass G to be loaded.

On the other hand, the work table 2 is provided with a correction means 18 for elastically maintaining the vertical deviation between the glass stage (S2) and the scan plate (P), the structure of such means will be described in more detail Same as

The correction means 18 includes a fixed plate 20, a movable plate 24 movably mounted to the fixed plate 20, to which the glass stage S2 is fixed, and the movable plate 24. ) And a support member 26 for supporting a predetermined elastic force.

The fixing plate 20 may be formed in an “L” shape when the vertical portion 20a and the horizontal portion 20b cross each other, and the guide member 22 may be formed on the vertical portion 20a. Installed and the horizontal portion 20b may be fixed by a fastening member such as a bolt in the upper plate (8).

The guide member 22 may be an LM guide consisting of a pair of guiders and sliders.

The movable plate 24 may be formed of, for example, a metal material having an “L” shape in which the vertical portion 24a and the horizontal portion 24b cross each other, and the vertical portion 24a is described above. It is fixed to the guide member 22 is installed to be movable in the vertical direction in the vertical portion (20a) of the fixing plate (20).

4, the horizontal portion 24b of the movable plate 24 is to detachably fix the glass stage S2 with a fastening member such as a fitting or a bolt. 24b) four fixing pins 28 protrudingly fixed to the inside of the rim, and the fixing holes 30 corresponding to the fixing pins 28 are formed in the glass stage S2, and the fitting pins 28 are fitted to the glass stages S2. As an example, the glass stage S2 is detachably fixed.

The fixing pin 28 and the fixing hole 30 is easy to separate and combine, and should be made within a range that does not generate any play after being combined.

When the glass stage S2 is detachably fixed to the movable plate 24 as described above, the glass stages S2 are easily replaced while the glass stages S2 are manufactured in a corresponding shape according to the size and shape of the glass G to be loaded. And setting and bonding.

4 and 5, the vertical movement of the movable plate 24 moving along the guide member 22 between the fixed plate 20 and the vertical portions 20a and 24a of the movable plate 24. An adjusting member 32 may be installed to adjust the directional movement range, and a conventional micro meter may be used.

The adjustment member 32 may be installed on the fixed plate 20 and contact with the ground protrusion 34 protruding from the rear of the vertical portion 24a of the movable plate 24. The structure that easily adjusts the moving range of 24, that is, when the adjustment knob 32a is rotated in a predetermined direction, the ground projection of the movable plate 24 is contracted or expanded within the set length range. The setting position can be easily changed in contact with (34).

When the adjusting member 32 is installed as described above, the circuit board B may be smoothly set according to the thickness of the polarizing plate G2 formed on the rear portion of the glass G loaded on the glass stage S2. By using the control member 32 so as to increase or decrease the setting position of the movable plate 24 can be set to an optimal state.

The support member 26 moves the movable plate 24 along the guide member 22 so that the folding protrusion 34 of the movable plate 24 moves the adjustment member 32. To support with a constant elastic force so that the state in contact with (32b) can be maintained, in the accompanying drawings a leaf spring having a fixed length is fixed to the vertical portion (20a) of the fixed plate 20 and the free end side An example of supporting the lower surface of the horizontal portion 24b of the movable plate 24 by elasticity is shown as an example.

In the above description, the leaf spring is used as the support member 26, but is not limited thereto. In addition, although not shown in the drawing, a low friction cylinder, a bellows cylinder, etc., which maintain a constant repulsive force on the tension coil spring or the piston rod In this case, the tension coil springs or cylinders described above should be set to exert a repulsive force that allows the movable plate 24 to move upward.

The correction means 18 having the above-described structure has the external stage when the external force is applied when the external force is applied from the upper side of the glass stage S2, and then the external force is removed after the stage S2 is moved downward along the guide member 22. Since the glass member S2 is returned to its original position by the support member 26, the glass stage S2 may be elastically supported within the set movement range.

The scan plate P may be made of a plate-like transparent material having a predetermined thickness, and may be fixed to the upper plate 8 by a separate fastening member.

On the upper side of the scan plate P, a planar support surface 36 is formed to smoothly scan and support the glass G and the pattern portions G1 and B1 of the circuit board B. do.

As the material of the scan plate P, quartz may be used. In addition, the transparent synthetic resin does not cause deformation when contacted with the glass G. Acrylic, etc.) may be used.

The length of the scan plate P may be set within a range in which the support surface 36 can maintain a predetermined distance L from the glass stage S2.

The separation distance (L) may be made in the range of 0.2mm to 1mm, if it is shorter than the above range may be in contact with the rear portion of the glass (G) loaded on the glass stage (S2), than the above range Since the loaded glass G must move excessively toward the support surface 36 when bonding is carried out by the long surface bonding part 6, setting precision can be reduced. The separation distance L can easily set the position of the glass stage S2 within the above range by adjusting the adjusting member 32 of the correction means 18.

Scanning such as a micro camera on the lower side of the scan plate P to scan the glass G and the pattern portions G1 and B1 of the circuit board B through the scan plate P. Member 38 may be installed.

The scanning member 38 may be set toward the lower side of the scan plate P from the inside of the upper plate 8 of the work table 2, the scanning member 38, that is, the micro camera The scanned image connected to the monitor 40 installed on the work table 2 is displayed in a conventional manner through the monitor 40.

The worktable 2 is provided with a bonding part 6 for bonding the circuit board B loaded in the loading part 4 and the pattern parts B1 and G1 of the glass G, which is bonded. The unit 6 includes a bonding head 42 and a transfer cylinder 44 for movably fixing the bonding head 42 in a vertical direction, wherein the transfer cylinder 44 includes the above-described loading unit ( It can be firmly fixed to the worktable 2 by the bracket 46 in the position corresponding to 4).

The bonding head 42 is formed with a pressing surface 42a capable of pressing the glass G and the entire pattern portions G1 and B1 of the circuit board B. Although not shown in the drawing, the bonding head 42 generates heat inside. The member is provided to generate a predetermined heat when pressing the pattern portion (G1, B1) of the glass (G) and the circuit board (B) and adhered to the pattern portion (G1) of the glass (B). The anisotropic conductive film (not shown) may be formed while melting and bonding.

The transfer cylinder 44 may be a hydraulic cylinder may be used, and may be set to be controlled to be connected to the switch 48 installed in the worktable 2, the drive is controlled, this time is installed in the transfer cylinder 44 The bonding head 42 should be set in a range in which the pressing surface 42a of the head 42 can press the supporting surface 36 of the scan plate P at a constant pressure.

Referring to Figures 1, 6 and 7, a preferred operating embodiment of the loading device of the circuit board bonding machine of the flat panel display according to the present invention having the above structure will be described in detail as follows.

First, the glass G and the circuit board B are loaded into the loading unit 4, respectively, and the pattern parts G1 and B1 of the glass G and the circuit board B to be loaded are scanned. It is disposed above the support surface 36 of the plate P and loaded so that the pattern portion G1 of the glass G is disposed below the pattern portion B1 of the circuit board B.

The glass G and the circuit board B are fixed to negative pressure through the suction holes HI and H2 drilled through the glass stage S2 and the circuit board stage S1, respectively. The lower surface of the pattern portion G1 of G) and the support surface 36 of the scan plate P may adjust the above-described adjustment member 32 before loading the glass G so that a constant distance L is maintained. The separation distance L is set to be maintained within the range of 0.2 mm to 1 mm by adjusting (see FIG. 3).

When the loading of the glass (G) and the circuit board (B) is completed as described above, the loaded circuit board (B) is operated in the X direction by manipulating the manual stage (12) installed below the circuit board stage (S1). The alignment is performed within the allowable setting range with the pattern portion G1 of the glass G while moving in the Y direction and the θ direction. At this time, the pattern portions G1 and B1 of the glass G and the circuit board B may have their setting states through the scanning member 38 installed under the scan plate P, that is, the micro camera. Displayed through the monitor 40, the operator can easily align.

When the alignment of the glass G and the circuit board B pattern parts G1 and B1 is completed by the above process, the bonding part 8, that is, the moving cylinder 44 is operated to operate the bonding head ( 42 performs bonding while pressing the above-mentioned glass G and the pattern parts G1 and B1 of the circuit board B. FIG.

At this time, when the bonding head 42 presses the glass portion G and the pattern portions G1 and B1 of the circuit board B, that is, the correction means 18 provided with the glass stage S2, that is, the movable plate. While 24 is supported by the support member 26, it moves downward along the guide member 22 so that the back surface of the pattern portion G1 of the glass G is the support surface 36 of the scan plate P. Since it is bonded while being supported in contact with the parallel to the glass (G), regardless of the thickness of the polarizing plate (G2) formed on the back of the glass (G), the setting position of the glass (G) remains unchanged and the above separation distance ( L) Bonding in the optimal state while moving within the range.

When the bonding head 42 is returned after bonding for the predetermined bonding time by the bonding head 42, the glass stage S2 is originally set by the repulsive force of the support member 26. That is, the ground protrusion 34 formed at the rear portion of the glass stage S2 moves upward until the ground protrusion 34 is in contact with the movable sleeve 32b of the adjusting member 32 and is then stopped.

After the bonding of the glass G and the circuit board B is completed by the above process, the glass G and the circuit board B may be loaded and bonded in the same manner as the above loading method.

When the size and shape of the glass G to be loaded are changed, the glass stage S2 corresponding thereto is installed on the moving plate 24 of the correction means 18 and the polarizing plate G2 of the glass G is loaded. ) Adjusting the setting position of the glass stage (S2) in the above separation distance (L) by operating the adjusting member 32 according to the thickness and then the circuit board (B) by the loading, setting and bonding method as described above You can bond

In the above description of the preferred embodiment of the loading device of the circuit board bonding machine of the flat panel display according to the present invention, the present invention is not limited thereto, but various modifications within the scope of the claims and the detailed description of the invention and the accompanying drawings. Can be carried out, and this also belongs to the scope of the present invention.

As described above, the loading device of the circuit board bonding machine of the flat panel display according to the present invention can be easily loaded and set regardless of the thickness of the polarizer formed on the glass, and is also corrected by the correction means. Optimum bonding quality can be obtained by bonding while correcting the thickness of the polarizing plate.

In addition, the loading device of the circuit board bonding machine of the flat panel display according to the present invention is not only easy to bond by setting the optimal separation distance with the scan plate according to the glass loaded through the correction means. This can save a lot of time, greatly improving productivity, work efficiency and equipment efficiency.

1 is an overall perspective view of a circuit board bonding machine to which a loading device of a circuit board bonding machine of a flat panel display according to the present invention is applied;

Figure 2 is a full perspective view of the loading device of FIG.

3 is a side cross-sectional view of FIG.

4 is a perspective view showing the correction means of FIG.

5 is a partially enlarged side view for explaining the adjustment member of FIG.

Figure 6 is a side view for explaining an operating embodiment of the loading device of the circuit board bonding machine of the flat panel display according to the present invention.

FIG. 7 is a partially enlarged view illustrating a state in which a circuit board is bonded while the deviation between the glass and the scan plate is corrected by the correction means in the state of FIG. 6.

Claims (5)

A circuit board bonding apparatus for a flat panel display, comprising: a work table, a loading section provided on an upper side of the work table, for loading glass and a circuit board, and a bonding section for bonding the glass and circuit boards loaded in the loading section. The loading unit includes a circuit board stage on which a circuit board is loaded, a glass stage installed adjacent to the circuit board stage, and a glass loaded thereon, a scan plate disposed between the circuit board stage and the glass stage, and the glass stage. Compensation means for correcting the height deviation with the scan plate, The correction means may include: a fixed plate having a guide member installed on the work table and having a transfer section corresponding to a height deviation, and a moving plate installed on the guide member to fix the glass stage to move up and down, and a height; A loading device of a circuit board bonding machine for a flat panel display comprising a support member for supporting the moving plate with an elastic force under a transport section for correcting a deviation. delete The loading apparatus of claim 1, wherein the moving plate is in contact with or separated from the scanning plate in parallel with the scanning plate while moving in the up and down moving range set along the guide member. The loading apparatus of claim 1, wherein the supporting member comprises any one of a tension coil spring, a leaf spring, a no-load cylinder, and a bellows cylinder. The loading apparatus of claim 1, wherein the loading apparatus further comprises an adjusting member for limiting a moving range of the moving plate, wherein the adjusting member is a micrometer. .