KR100531689B1 - equipment to bond anisotropic conductive film - Google Patents

Abstract

The anisotropic conductive film can be easily bonded to the circuit board for the image pickup device. In particular, by bonding the anisotropic conductive film at the position corresponding to the perforation area for bonding the image pickup device on the circuit board, not only the bonding quality but also the work efficiency and productivity It relates to an anisotropic conductive film bonding apparatus that can significantly improve the.

Such a bonding apparatus is an apparatus for bonding an anisotropic conductive film to a circuit board having a perforated region for bonding an imaging device in a pattern portion region,

The worktable provides a space for bonding the anisotropic conductive film and the circuit board, and has a means for loading the circuit board in a bondable state corresponding to the work space of the workbench, and is rotated about a single axis by a driving source. A rotating table for moving the substrate to the process areas for bonding, a cleaning part positioned on the work table corresponding to the rotating table, for cleaning the pattern area of the circuit board, and spaced apart from the cleaning part on the work table. A film bonding unit for bonding the anisotropic conductive film to the pattern portion of the circuit board and corresponding to the rotary table, and bonding the film bonding unit to correspond to the position of the circuit board by scanning the positions of the circuit board and the anisotropic conductive film on the work table. Compensation means for changing the position,

The correction means senses a position of the substrate scan member and the film scan member for scanning the positions of the circuit board and the anisotropic conductive film on the work table, and the positions of the circuit board and the anisotropic conductive film scanned by the scan members. A control unit for controlling the film bonding position so that the perforated areas are bonded to each other and bonded within an allowable range, and the bonding of the film bonding portion so as to correspond to the position of the circuit board while the operation is controlled by the control unit. It includes a transfer device for changing the position.

Description

Anisotropic conductive film bonding apparatus {equipment to bond anisotropic conductive film}

The present invention relates to an anisotropic conductive film bonding apparatus, and more particularly, it is possible to easily bond an anisotropic conductive film to a circuit board for an imaging device, in particular at a position corresponding to a perforation area for bonding of the imaging device on a circuit board. The present invention relates to an anisotropic conductive film bonding apparatus capable of significantly improving bonding efficiency as well as bonding quality by bonding an anisotropic conductive film.

In general, an image pickup device such as a CCD is widely used for transferring images through a display device by converting an image of a subject into a current intensity in a method and security field, etc. In recent years, a personal portable terminal such as a mobile phone In addition, the field of use is gradually increasing for the purpose of implementing ordinary camera functions in personal digital assistants (PDAs).

The imaging device used in the personal portable terminal is capable of capturing an object guided through a lens unit inside a main body such as a phone or a PDA, and is attached to a circuit board for converting light reflected from the object into an electric current intensity. The image is implemented through the display unit of the PDA main body and can be stored as picture files of various formats.

A circuit board on which the imaging device is installed, that is, a flexible printed circuit board such as an FPC, has a structure in which a predetermined area is perforated so that the lower side can be seated smoothly when the imaging device is coupled. It has a structure in which patterns for electrically connecting with the lead portions of the image pickup device are formed.

In addition, in the pattern area of the circuit board, an anisotropic conductive film having a backing paper and an insulating adhesive layer formed thereon such that a plurality of patterns are insulated from each other before bonding the imaging device can be bonded to the lead parts of the imaging device. After the bonding, the image pickup device is bonded onto the film.

In this case, the anisotropic conductive film perforates the region corresponding to the through portion in the film so that the through portion perforated in the pattern portion of the circuit board is not covered by the film. Bonding around the border.

Briefly explaining the bonding process of the film as described above, first, by setting the anisotropic conductive film to be moved along a predetermined section wound on the film supply device, that is, two reels, and moving the film in one direction by a cutter or the like The insulating adhesive layer is cut to a size corresponding to the pattern portion of the circuit board, and a perforated portion corresponding to the through portion of the circuit board is formed by a punching action or the like.

In addition, the insulating adhesive layer cut into the shape corresponding to the pattern portion of the circuit board as described above consists of a process of bonding the insulating adhesive layer while the operator directly removes from the backing paper and manually attaches to the pattern portion of the circuit board.

However, as described above, the bonding process of the anisotropic conductive film is performed by a worker manually bonding the cut and perforated insulating adhesive layer to the pattern area of the circuit board by the film supply apparatus, thus bonding by manual labor. Not only can the process not be able to expect satisfactory efficiency, but also takes too much time, so there is a limit to obtaining more improved work efficiency and productivity.

In addition, if the worker bonds the insulating adhesive layer by hand, it is difficult to bond the perforations formed in the insulating adhesive layer and the penetration part of the circuit board within the tolerance range, so that satisfactory bonding accuracy and quality cannot be obtained, thereby causing excessive defect rate. That is one factor.

In addition, when the bonding quality and precision of the anisotropic conductive film are degraded as described above, smooth bonding may not be performed when bonding the image pickup device to the circuit board, which may further reduce work efficiency and productivity.

 The present invention has been made to solve the conventional problems as described above, an object of the present invention can easily bond an anisotropic conductive film to a circuit board for bonding the image pickup device in a single area, in particular, a circuit board Since the bonding position of the film is automatically corrected and bonded according to the position of, satisfactory bonding accuracy and bonding quality can be obtained, thereby providing an anisotropic conductive film bonding apparatus which can greatly improve work efficiency and productivity.

In order to realize the object of the present invention as described above, an apparatus for bonding an anisotropic conductive film to a circuit board having a perforated region for bonding the image pickup device in the pattern portion region,

The worktable provides a space for bonding the anisotropic conductive film and the circuit board, and has a means for loading the circuit board in a bondable state corresponding to the work space of the workbench, and is rotated about a single axis by a driving source. A rotating table for moving the substrate to the process areas for bonding, a cleaning part positioned on the work table corresponding to the rotating table, for cleaning the pattern area of the circuit board, and spaced apart from the cleaning part on the work table. A film bonding unit for bonding the anisotropic conductive film to the pattern portion of the circuit board and corresponding to the rotary table, and bonding the film bonding unit to correspond to the position of the circuit board by scanning the positions of the circuit board and the anisotropic conductive film on the work table. Compensation means for changing the position,

The correction means senses a position of the substrate scan member and the film scan member for scanning the positions of the circuit board and the anisotropic conductive film on the work table, and the positions of the circuit board and the anisotropic conductive film scanned by the scan members. A control unit for controlling the film bonding position so that the perforated areas are bonded to each other and bonded within an allowable range, and the bonding of the film bonding portion so as to correspond to the position of the circuit board while the operation is controlled by the control unit. Provided is an anisotropic conductive film bonding apparatus including a transfer device for changing a position.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, the anisotropic conductive film bonding apparatus according to the present invention includes a work table 2 which provides a space for bonding an anisotropic conductive film F and a circuit board B for an imaging device. Bonding the circuit board (B) while having a means (L) for loading the circuit board (B) in a bondable state corresponding to the working space of the work table (2) and rotating about a single shaft center by the drive source (M). A rotary table 4 for moving to process areas for cleaning, and a cleaning unit for cleaning the pattern portion B1 area of the circuit board B, which is located on the work table 2 corresponding to the rotary table 4 (6) and anisotropic conductive film (F) on the pattern portion (B1) of the circuit board (B) and positioned to correspond to the rotary table (4) spaced apart from the cleaning portion (6) on the work table (2) The film bonding unit 8 for bonding and the position of the circuit board (B) and the anisotropic conductive film (F) on the work table (2) by scanning the circuit To correspond to the position of (B) comprises a correction means (10) for changing the position of the bonding film bonding portion 8.

The work table 2 serves as a kind of table for providing an area, that is, a work space for bonding the anisotropic conductive film F to the circuit board B, and may be manufactured in the same shape as in FIG. 1 or in another shape. .

The worktable 2 may be made of a metal material having excellent durability and the like, and the upper work area may prevent the surface from being easily damaged or deformed by load or impact, and may also maintain a constant flatness. It should be made to

The rotary table 4 is used to move the circuit board B from the worktable 2 to the cleaning section 6 described later and the process regions corresponding to the film bonding section 8. As shown in FIG. 1, for example, a plate-like structure made of a "+" shape and positioned in the same posture as shown in the drawing on the work table 2 is shown as an example.

The rotary table 4 is set rotatably on a single shaft center by a drive source M such as, for example, an indexing drive table or a servo motor on the work table 2, and the rotation of the table 4 is performed. By this means, the means (L) for loading the circuit board (B) can be moved to the process areas for bonding.

The loading means (L) is for loading the circuit board (B) is supplied to the cleaning and bonding area for bonding of the anisotropic conductive film (F) by the rotary table (4) to enable the operation, Figure 2 As shown in the drawings, a plurality of circuit boards B includes a substrate tray L1 accommodated therein, and a fixing tray L2 fixed to the rotary table 4 and detachably fixing the substrate tray L1.

The substrate tray L1 is for accommodating a plurality of circuit boards B. In the present embodiment, the circuit board B for the imaging device is, for example, in the shape of a “T” as shown in FIG. 2. And a pattern part B1 and a through part B2 having the same patterns as shown in the drawing are formed therein, and the substrate tray L1 has an accommodating groove having a shape corresponding to the circuit board B. 12 may be formed to allow the circuit boards B to be received in the receiving grooves 12 in the same posture as shown in the drawing.

At this time, the receiving grooves 12 have a groove structure in which the circuit boards B can be accommodated in a horizontal state on the work table 2, and the material of the substrate tray L1 is excellent in durability and wear resistance. Synthetic resin can be used.

The substrate tray L1 having the above-described structure is detachably loaded in the magazine 14 as shown in FIG. 1, and as shown in the drawing, is attached to the rotary table 4 of the work table 2, that is, the fixing tray L2. It can be made to be loaded and unloaded. In this case, the substrate tray L1 may be loaded and unloaded by, for example, a well-known transfer device such as an operator or an adsorber, although not shown in the drawings.

The fixing tray L2 is to detachably fix the substrate tray L1 to the rotary table 4. In this embodiment, the fixing tray L2 is the substrate tray L1 as shown in FIG. 2. It has a size corresponding to) and is capable of supporting the lower side of the substrate tray (L1), and a pair of four in the same position as shown in the drawing to correspond to the process areas described later in the rotary table (4) The installed one is shown as an example.

The fixing tray L2 is provided with a fixing protrusion 16a as shown in FIG. 2 to detachably fix the substrate tray L1 in a horizontal state to the rotary table 4, and the substrate tray ( On the L1) side, a fixing groove 16b corresponding to the fixing protrusion 16a may be formed as shown in the drawing, and may be detachably fixed by fitting.

In this case, as shown in FIG. 3, suction holes 18 may be formed in the fixing protrusion 16a to fix the circuit boards B accommodated in the substrate tray L1 in a horizontal state.

As shown in FIG. 1, as shown in FIG. 1, a negative pressure action of air is generated from the vacuum generator V provided at the center of the rotary table 4, so that the circuit boards B are formed on the substrate tray L1. It is made to be fixed to the receiving grooves 12 in a horizontal state.

The fixing tray L2 may be made of the same synthetic resin or metal as the substrate tray L1.

The work table 2 is provided with a cleaning part 6 for cleaning the pattern part B1 area of the circuit board B loaded on the rotary table 4 by physical contact. In this embodiment, as shown in Figure 1 is installed in the same position as in the figure corresponding to the radius of rotation of the rotary table 4, the cleaning operation of the circuit board (B) is performed by the pad (P) for cleaning. It is shown as an example.

4 and 5, the cleaning pad P is connected to be wound by the supply and recovery rollers 22a and 22b installed in the case 20 as shown in the drawing, and the two rollers. It may have a structure set so that the pads (P) are sequentially transferred while passing through the pressure roller (22c) located between (22a, 22b).

At this time, the cleaning pad (P) may be a pad containing a cleaning liquid for cleaning the circuit board (B), the recovery roller 22b is provided with a motor 24 as shown in FIG. By the driving of the motor 24, the cleaning pad P may be wound around the recovery roller 22b while passing through the pressure roller 22c on the supply roller 22a side.

The supply and recovery operation of the cleaning pad P as described above is set such that cleaning is performed while being sequentially supplied to the pressure roller 22c according to the required cleaning conditions.

In addition, the case 20 may perform an operation for cleaning by the cleaning pad P while passing through the pattern portion B1 areas of the plurality of circuit boards B stored in the substrate tray L1. The guider and the slider as in 4 are installed to be movable in the posture as shown in the drawing on the work table 2 by the transfer unit U1 slid by a pneumatic action or the like.

In the cleaning part 6 having the above-described structure, the cleaning pad P corresponds to the area of the pattern part B1 of the circuit boards B loaded on the substrate tray L1 in the rotary table 4. By the transfer unit U1, it moves in the same direction as in FIG. 5, and wash | cleans by physical contact by the press action of the said pressure roller 22c.

The film bonding part 8 is for bonding the anisotropic conductive film F to the pattern part B1 of the circuit board B in the work table 2. Referring to FIGS. 6 and 7, anisotropic conductivity A bonding head 26 for bonding the film F, reels R1 and R2 for supplying and recovering the anisotropic conductive film F so as to be bonded corresponding to the bonding head 26, and the bonding. And a cutter 28 for cutting the anisotropic conductive film F supplied to the head 26 into a shape corresponding to the pattern portion B1 of the circuit board B. In this embodiment, the film bonding portion 8 is set to the fixed plate 30 as shown in Figure 6 in the same state as shown in the drawing as an example.

The bonding head 26 performs a bonding operation while moving in the up and down direction corresponding to the pattern portion B1 of the circuit board B located in the bonding area by the rotation table 4 on the fixed plate 30. It may have a structure that is fixed to the piston rod of the cylinder (C1) as shown in Figure 6 and set in the state as shown in the figure.

The bonding head 26 has a conventional structure having a pressing surface capable of bonding the insulating adhesive layer F1 cut to a predetermined size by a cutter 28 to be described later corresponding to the pattern portion B1 of the circuit board B. The material may be made of metal or synthetic resin.

The supply reel (R1) and recovery reel (R2) is made of a conventional reel (reel) structure, the anisotropic conductive film (F) has a section corresponding to the bonding head 26 to be supplied and recovered The fixing plate 30 may be installed as shown in FIG. At this time, the motor 32 is installed on the recovery reel R2 side, and the anisotropic conductive film F wound around the supply reel R1 by the rotation of the motor 32 corresponds to the bonding head 26. It is made so that it can be recovered while passing through the bonding point, the anisotropic conductive film (F) is a conventional insulating film made of the insulating adhesive layer (F1) and backing paper (F2) as shown in FIG.

The cutter 28 has a physical shape such that the anisotropic conductive film F, that is, the insulating adhesive layer F1 supplied to the bonding head 26 has a size and shape corresponding to the pattern portion B1 of the circuit board B. In order to cut by the in-contact, in the present embodiment, the cutter 28 is set so that the cutting operation is made while sliding up and down by the cylinder C2 in the housing 34 as shown in FIG. As shown in the drawing, the plate 30 corresponding to the film transfer section between the supply reel R1 and the bonding head 26 is shown as an example.

In the cutter 28, the anisotropic conductive film F supplied to the bonding head 26 is cut by one cutting operation corresponding to the pattern portion B1 and the penetrating portion B2 of the circuit board B. FIG. The insulating adhesive layer F1 may be cut to the same size as that of FIG. 7, and the perforated part F3 may be formed inside the cut insulating adhesive layer F1 as shown in the drawing. At this time, the perforated portion (F3) is a structure formed by punching through the backing paper (F2) as well as the insulating adhesive layer (F1), for example, by the punching action during the cutting operation of the cutter (28).

In the above description, the anisotropic conductive film F, that is, the insulating adhesive layer F1, supplied to the bonding head 26 side in one cutting operation by the single cutter 28 is formed on the pattern portion B1 of the circuit board B. And a structure for cutting to the size corresponding to the penetrating portion B2 of the pattern portion B1 and forming the perforation portion B3 as an example in the description and drawings, but is not limited thereto.

For example, although not shown in the drawing, two cutters 28 are installed in a set corresponding to a section for cutting the film so that one side of the cutters forms an insulating adhesive layer F1 of the anisotropic conductive film F as a circuit board B. Cut only to the size corresponding to the pattern portion (B1) of the), and the other cutter may be set to a structure to form the perforated portion (F3) by a punching operation corresponding to the insulating adhesive layer (F1) cut to a predetermined size.

The film bonding part 8 having the above-described structure is cut by the cutter 28 in a size and shape corresponding to the pattern part B1 of the circuit board B so that the insulating adhesive layer F1 of the anisotropic conductive film F is cut. And then supplied to enable bonding in correspondence to the bonding head 26, the circuit board B being loaded on the rotary table 4 and positioned in the bonding region as shown in FIG. 8 by the bonding operation of the bonding head 26. The insulating adhesive layer F1 may be easily bonded to correspond to the pattern portion B1 of the layers.

On the other hand, the film bonding part 8 is the anisotropic conductive film (B) by correcting the bonding position corresponding to the position of the circuit boards (B) of the bonding area by the correction means 10 during the bonding of the anisotropic conductive film (F) ( F) That is, the insulating adhesive layer (F1) is made to be bonded within the allowable range corresponding to the pattern portion (B1) of the circuit board (B).

Referring to FIG. 1, the correction means 10 includes a substrate scan member S1 and a film scan member S2 for scanning positions of the circuit board B and the anisotropic conductive film F on the work table 2. And a control unit 36 which senses the position of the circuit board B and the anisotropic conductive film F scanned by the scanning members S1 and S2 and bonds them within the allowable range. And a transfer device 38 for changing the bonding position of the film bonding part 8 in correspondence with the position of the circuit board B while the operation is controlled by the control unit 36.

In the present embodiment, the substrate scanning member S1 is located between the cleaning part 6 and the film bonding part 8 in correspondence with the rotary table 4 as shown in FIG. 1, and on the substrate tray L1. As an example, it is fixed to the support 40 as shown in the drawing so as to enable scanning of the pattern portions B1 corresponding to the pattern portions B1 of the accommodated circuit boards B.

As the substrate scanning member S1, a conventional micro camera may be used, and the camera may be scanned in the pattern portion B1 of the circuit boards B contained in the substrate tray L1. As described above, it may be a structure installed to be movable in the work platform (2) by the transfer unit (U2).

The substrate scanning member S1 moves along the transfer unit U2 as shown in FIG. 10 in correspondence to the pattern portion B1 region of the circuit board B on which the cleaning is completed in the region of the cleaning portion 6. It may have a structure that scans the position of the circuit board B while scanning the penetrating portion B2 of the pattern portion B1, that is, the perforated corner point.

The film scan member S2 may be the same microcamera as the substrate scan member S1, and the film scan member S2 may be cut into equal portions in the film bonding part 8, that is, the fixed plate 30, as shown in FIG. 6. It may have a structure that is movably fixed to the transfer unit U3 as shown in the figure so as to scan the position of the insulating adhesive layer F1 of the anisotropic conductive film F1.

The film scan member S2 may be set to enable scanning of the perforated portion F3 of the insulating adhesive layer F1, that is, the corner point. In addition, the image data of the insulating adhesive layer F1 and the circuit board B scanned by the film scan member S2 and the substrate scan member S1 are connected to the control unit 36 to be described later.

The control unit 36 numerically measures the image data of the circuit board B and the anisotropic conductive film F scanned through the substrate scan member S1 and the film scan member S2, that is, the positional deviation of the subjects. For example, a unit such as a numerically-controlled computer may be used, and may be installed inside or on the side of the work table 2.

For example, the control unit 36 receives image data of the circuit board B and the anisotropic conductive film F scanned by the substrate scan member S1 and the film scan member S2. B) and the position of the through part B2 and the perforation part F3 formed in the film F are numerically calculated to sense their positional deviation, and the anisotropic conductive film F through the sensed numerical data. Structure for correcting the bonding position of the film bonding part 8 while controlling the operation of the transfer device 38 so that the insulating adhesive layer F1 can be bonded within the tolerance range corresponding to the position of the circuit board B. to be.

The transfer device 38 is to fix the position change of the film bonding unit 8 while the operation is controlled by the control unit 36 in the bonding area of the work table 2, in this embodiment the transfer The device 38 is orthogonal to each other as shown in FIG. 6 such that the film bonding part 8, that is, the bonding head 26, can be changed in three or more directions corresponding to the circuit boards B in the bonding area. It consists of two transfer units (U4, U5) and l rotation units (U6) set to the posture, these are laminated to each other as shown in the drawing so that the fixed plate 30 in the work table (2) in three directions Fixing to be movable is shown as an example.

The transfer device 38, that is, the two transfer units (U4, U5) is composed of a guider and a slider as shown in Figure 6 in a set and can be made of a structure that induces a normal linear movement by the pneumatic action, the rotation The unit U6 has a structure for inducing a normal rotational movement such as, for example, an indexing drive table or a servo motor, so that the fixed plate is operated by the operation of the transfer units U4 and U5 and the rotation units U6. The bonding position of the film bonding part 8 is changed while the 30 moves in the bonding area of the work table 2 with respect to the circuit board B in a straight line in two directions orthogonal to each other and on the basis of a single axis. It is structure to let.

In this case, the transfer device 38 moves from one end to the other end gradually in response to the circuit boards 8 accommodated in the substrate tray L1 and corresponding to the circuit board B. 8) may be a structure set to perform the correction operation as described above.

Accordingly, in the anisotropic conductive film bonding apparatus according to the present invention having the above-described structure, a substrate tray L1 in which a plurality of circuit boards B is accommodated on the loading side of the work table 2 is fixed to the rotary table 4. When the tray L2 is loaded, the rotating table 4 rotates in one direction while moving to the cleaning part 6 and the film bonding part 8 area for film bonding, while the pattern part B1 of the circuit board B is moved. In addition, the insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the cleaned pattern portion B1.

That is, when the circuit boards B loaded on the rotary table 4 are positioned in the cleaning part 6 region as shown in FIG. 4, the cleaning pad P is supplied to the supply roller 22a and the recovery roller 22b. The pattern is moved while being guided to the pressure rollers 22c while moving through the pattern unit B1 of the circuit boards B accommodated in the substrate tray L1 along the transfer unit U1 as shown in FIG. 5. The section B1 is cleaned.

Then, when the cleaned circuit board B is supplied to the area corresponding to the substrate scan member S1 by the rotary table 4 as shown in FIG. 9, the substrate scan member S1 is supplied. The position of the through hole B2 formed in the pattern portions B1 is scanned while moving through the pattern unit B1 of the circuit boards B as shown in FIG. 10 along the transfer unit U2. The image data scanned by the substrate scanning member S1 is transferred to the control unit 36.

At this time, in the film bonding region, the insulating adhesive layer cut to the size corresponding to the pattern portion B1 of the anisotropic conductive film F, that is, the circuit board B, during the scanning operation of the substrate scanning member S1 as described above ( The perforations F3 positions of F1 are respectively scanned by the film scan member S2, and the scanned image data is transmitted to the control unit 36 side in the same manner as the substrate scan member S1.

As described above, when the position sensing of the circuit board B and the anisotropic conductive film F is completed, the circuit boards B of the substrate scanning area are rotated by the rotation table 4 as shown in FIG. 6. The control unit 36 is supplied to the bonding area corresponding to (8), and the control unit 36 is formed of the circuit board B and the anisotropic conductive film F scanned through the substrate scan member S1 and the film scan member S2. After the numerical calculation of the image data to sense their position deviation, 38 of the transfer apparatus so that the bonding position of the film bonding portion 8 can be corrected to the bonding position corresponding to the circuit board B. The operation is controlled as follows.

The control unit 36 controls the operation of the transfer device 38, that is, the two transfer units U4 and U5 and the rotation unit U6 corresponding to the position of the circuit board B, while the insulating adhesive layer F1 is controlled. ) To correct the bonding position of the film bonding part 8 while moving the fixing plate 30 in three directions so that the bonding position of the circuit board B can be bonded within the allowable range on the pattern part B1 side of the circuit board B. It is.

Accordingly, the pattern portion of the circuit board B is bonded by the bonding operation of the bonding head 26 whose position is corrected while the bonding position of the film bonding portion 8 is corrected by the control action of the control unit 36 as described above. Corresponding to the (B1) side, the insulating adhesive layer F1 of the anisotropic conductive film F can be bonded within the allowable range as shown in FIG. As described above, the bonding of the insulating adhesive layer F1 is sequentially performed while passing through the pattern portion B1 of the circuit boards B stored in the substrate tray L1 located in the bonding region. After the film bonding part 8 is corrected to a bonding position corresponding to the circuit board B, the film bonding part 8 may be set to bond the insulating adhesive layer F1.

By the above bonding process, the perforated portion F3 of the insulating adhesive layer F1 is bonded within the allowable range in the pattern portion B1 region of the circuit board B at a position corresponding to the through portion B2 formed in the region. Therefore, the image pickup device D may be easily bonded in the post-processing process through the through part B2 and the perforated part F3 of the bonded circuit board B and the insulating adhesive layer F1. .

In the above, a preferred embodiment of the anisotropic conductive film bonding apparatus according to the present invention has been described, but the present invention is not limited thereto, and various modifications can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. This also belongs to the scope of the present invention.

As described above, the anisotropic conductive film bonding apparatus according to the present invention can easily bond the anisotropic conductive film after cleaning the circuit board in a single working area, and in particular, when bonding the circuit board and the anisotropic conductive film, Since the position is sensed by the correction means and can be bonded within the allowable range according to the sensed data, the bonding of the insulating adhesive layer is performed while the bonding position of the film bonding part is automatically corrected in correspondence with the position of the circuit board. In addition to significantly shortening the time required, satisfactory bonding accuracy and quality can be obtained, and work efficiency and productivity can be greatly improved.

In addition, the correction means scans the positions of the circuit board and the anisotropic conductive film in the working area by scanning members, respectively, and by a control unit which numerically calculates the positional deviation of the scanned image data. As the operation of the transfer device is controlled, the bonding position of the film bonding part is corrected in three directions or more corresponding to the position of the circuit board, and thus the bonding accuracy and quality of the insulating adhesive layer can be greatly improved by a simple correction structure. Work compatibility and work efficiency can be obtained.

1 is an overall perspective view for explaining the structure of the anisotropic conductive film bonding apparatus according to the present invention.

2 is a partially enlarged perspective view for explaining the structure of the circuit board loading means of FIG.

3 is a cross-sectional view illustrating the internal structure of FIG. 2.

4 is a partially enlarged perspective view illustrating the structure of the cleaning unit of FIG. 1.

Fig. 5 is a partially enlarged front view for explaining the cleaning action of Fig. 4.

6 is a partially enlarged perspective view for explaining the structure of the film bonding portion of FIG.

FIG. 7 is a partially enlarged perspective view for explaining the cutter structure of FIG. 6. FIG.

8 is a partially enlarged perspective view for explaining a bonding action of the bonding head of FIG. 6.

9 is a partially enlarged perspective view illustrating the structure of a substrate scanning member in the correction means of FIG.

10 is a partially enlarged perspective view for explaining the operation of FIG.

11 is a perspective view illustrating a state in which an insulating adhesive layer of an anisotropic conductive film is bonded to facilitate bonding of an imaging device to a pattern portion of a circuit board by a bonding action of the anisotropic conductive film bonding apparatus according to the present invention.

Claims (7)

An apparatus for bonding an anisotropic conductive film to a circuit board having a perforated area for bonding an image pickup device in a pattern portion area, The worktable provides a space for bonding the anisotropic conductive film and the circuit board, and has a means for loading the circuit board in a bondable state corresponding to the work space of the workbench, and is rotated about a single axis by a driving source. A rotating table for moving the substrate to the process areas for bonding, a cleaning part positioned on the work table corresponding to the rotating table, for cleaning the pattern area of the circuit board, and spaced apart from the cleaning part on the work table. A film bonding unit for bonding the anisotropic conductive film to the pattern portion of the circuit board and corresponding to the rotary table, and bonding the film bonding unit to correspond to the position of the circuit board by scanning the positions of the circuit board and the anisotropic conductive film on the work table. Compensation means for changing the position, The correction means senses a position of the substrate scan member and the film scan member for scanning the positions of the circuit board and the anisotropic conductive film on the work table, and the positions of the circuit board and the anisotropic conductive film scanned by the scan members. A control unit for controlling the film bonding position so that the perforated areas are bonded to each other and bonded within an allowable range, and the bonding of the film bonding portion so as to correspond to the position of the circuit board while the operation is controlled by the control unit. Anisotropic conductive film bonding apparatus comprising a transfer device for changing the position. The anisotropic conductive film bonding apparatus according to claim 1, wherein the rotary table is rotatably fixed by a driving source such as an indexing drive table or a thermo motor on the work table. The method of claim 1, wherein the loading means comprises a substrate tray for receiving a plurality of circuit boards, and a fixing tray fixed to the rotating table and detachably fixing the substrate tray, The two trays are anisotropic conductive film bonding apparatus is formed with a protrusion and a groove corresponding to each other and is separable and fixed by the fitting combination thereof. The method of claim 1, wherein the cleaning unit is set so that the cleaning pad can be supplied and retrieved by the rollers via the cleaning section in a posture corresponding to the circuit board in the cleaning area of the work table, and is physically controlled by the pressing operation of the one side roller. An anisotropic conductive film bonding apparatus for cleaning a pattern portion of a circuit board by phosphorus contact. The method of claim 1, wherein the film bonding unit, a bonding head for bonding the anisotropic conductive film, reels for supplying and recovering the anisotropic conductive film so as to be bonded corresponding to the bonding head, and the anisotropic conductive supplied to the bonding head It includes a cutter for cutting the film into a shape corresponding to the pattern portion of the circuit board, The cutter is an anisotropic conductive film bonding apparatus for cutting the insulating adhesive layer of the anisotropic conductive film to have a size and perforations corresponding to the pattern portion and the through portion of the circuit board in response to the film transfer section between the supply reel and the bonding head. The anisotropic conductive film bonding apparatus according to claim 1, wherein the conveying apparatus is composed of units capable of linear and rotational movement, and the units fix the position of the film bonding unit in three directions or more in the worktable. The method of claim 1, wherein the substrate scanning member and the film scanning member is made of a micro camera, the control unit is made of a unit of the structure capable of numerically calculating the positional deviation of the image data applied from the scanning member, The control unit senses the positional deviation of the perforated area of the circuit board and the anisotropic conductive film by the image data of the scan members, and controls the operation of the transfer device by the sensed data while the anisotropic conductive film is circuited by the device. Anisotropic conductive film bonding apparatus for correcting the bonding position of the film bonding portion to be bonded in the allowable range corresponding to the position of the substrate.