KR100528678B1 - 폴리싱 패드 컨디셔닝 헤드를 위한 시브이디 다이아몬드기판과 그 제조방법 - Google Patents

폴리싱 패드 컨디셔닝 헤드를 위한 시브이디 다이아몬드기판과 그 제조방법 Download PDF

Info

Publication number
KR100528678B1
KR100528678B1 KR10-2000-7000234A KR20007000234A KR100528678B1 KR 100528678 B1 KR100528678 B1 KR 100528678B1 KR 20007000234 A KR20007000234 A KR 20007000234A KR 100528678 B1 KR100528678 B1 KR 100528678B1
Authority
KR
South Korea
Prior art keywords
delete delete
substrate
diamond
polishing pad
diamond particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR10-2000-7000234A
Other languages
English (en)
Korean (ko)
Other versions
KR20010021676A (ko
Inventor
짐머제리더블유.
Original Assignee
모간 어드밴스드 세라믹스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모간 어드밴스드 세라믹스, 인코포레이티드 filed Critical 모간 어드밴스드 세라믹스, 인코포레이티드
Publication of KR20010021676A publication Critical patent/KR20010021676A/ko
Application granted granted Critical
Publication of KR100528678B1 publication Critical patent/KR100528678B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR10-2000-7000234A 1997-07-10 1998-07-02 폴리싱 패드 컨디셔닝 헤드를 위한 시브이디 다이아몬드기판과 그 제조방법 Expired - Lifetime KR100528678B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US5214597P 1997-07-10 1997-07-10
US60/052,145 1997-07-10
US9/094,930 1998-06-15
US09/094,930 1998-06-15
US09/094,930 US5921856A (en) 1997-07-10 1998-06-15 CVD diamond coated substrate for polishing pad conditioning head and method for making same
PCT/US1998/013865 WO1999002309A1 (en) 1997-07-10 1998-07-02 Cvd diamond coated substrate for polishing pad conditioning head and method for making same

Publications (2)

Publication Number Publication Date
KR20010021676A KR20010021676A (ko) 2001-03-15
KR100528678B1 true KR100528678B1 (ko) 2005-11-15

Family

ID=26730242

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7000234A Expired - Lifetime KR100528678B1 (ko) 1997-07-10 1998-07-02 폴리싱 패드 컨디셔닝 헤드를 위한 시브이디 다이아몬드기판과 그 제조방법

Country Status (5)

Country Link
US (1) US5921856A (https=)
JP (1) JP4354630B2 (https=)
KR (1) KR100528678B1 (https=)
TW (1) TW411302B (https=)
WO (1) WO1999002309A1 (https=)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328108B1 (ko) 1996-10-15 2002-03-09 아사무라 타카싯 반도체 기판용 연마패드의 드레서, 그 제조방법 및 그것을 사용한 화학적 기계적 연마방법
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US7368013B2 (en) * 1997-04-04 2008-05-06 Chien-Min Sung Superabrasive particle synthesis with controlled placement of crystalline seeds
US7323049B2 (en) * 1997-04-04 2008-01-29 Chien-Min Sung High pressure superabrasive particle synthesis
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US6679243B2 (en) 1997-04-04 2004-01-20 Chien-Min Sung Brazed diamond tools and methods for making
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US7124753B2 (en) * 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US7491116B2 (en) * 2004-09-29 2009-02-17 Chien-Min Sung CMP pad dresser with oriented particles and associated methods
JP3052896B2 (ja) * 1997-06-13 2000-06-19 日本電気株式会社 研磨布表面のドレス治具及びその製造方法
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6093280A (en) * 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
US6159087A (en) * 1998-02-11 2000-12-12 Applied Materials, Inc. End effector for pad conditioning
KR19990081117A (ko) * 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
DE19833476B4 (de) 1998-07-24 2005-08-25 Huss, Ralf, Dr. Genetisch modifizierte CD34-Negative, adhärent wachsende hämatopoetische Stammzellen und deren Verwendung in der Gentherapie
US6206759B1 (en) 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
US6217418B1 (en) * 1999-04-14 2001-04-17 Advanced Micro Devices, Inc. Polishing pad and method for polishing porous materials
WO2000078504A1 (en) * 1999-06-19 2000-12-28 Speedfam-Ipec Corporation Method and apparatus for increasing the lifetime of a workpiece retaining structure and conditioning a polishing surface
DE19938781B4 (de) * 1999-08-16 2004-09-09 Infineon Technologies Ag Konditionierscheibe zum Konditionieren von CMP-Pads
US6290883B1 (en) * 1999-08-31 2001-09-18 Lucent Technologies Inc. Method for making porous CMP article
US6281129B1 (en) * 1999-09-20 2001-08-28 Agere Systems Guardian Corp. Corrosion-resistant polishing pad conditioner
US6240415B1 (en) 1999-10-07 2001-05-29 J. Seth Blumberg Corporate and entertainment management interactive system using a computer network
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
JP3527448B2 (ja) * 1999-12-20 2004-05-17 株式会社リード Ｃｍｐ研磨布用ドレッサー及びその製造方法
US20020027294A1 (en) * 2000-07-21 2002-03-07 Neuhaus Herbert J. Electrical component assembly and method of fabrication
US6853087B2 (en) 2000-09-19 2005-02-08 Nanopierce Technologies, Inc. Component and antennae assembly in radio frequency identification devices
KR100380183B1 (ko) * 2000-09-22 2003-04-11 한국과학기술연구원 랩핑용 ｃｖｄ다이아몬드 정반 및 이의 제작방법
US6551176B1 (en) 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
EP1328373A2 (en) * 2000-10-24 2003-07-23 Nanopierce Technologies Inc. Method and materials for printing particle-enhanced electrical contacts
US6815052B2 (en) * 2000-12-01 2004-11-09 P1 Diamond, Inc. Filled diamond foam material and method for forming same
US6632127B1 (en) 2001-03-07 2003-10-14 Jerry W. Zimmer Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same
JPWO2003009362A1 (ja) * 2001-07-19 2004-11-11 株式会社ニコン 研磨体、ｃｍｐ研磨装置及び半導体デバイスの製造方法
US7037177B2 (en) * 2001-08-30 2006-05-02 Micron Technology, Inc. Method and apparatus for conditioning a chemical-mechanical polishing pad
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US7118461B2 (en) * 2002-03-25 2006-10-10 Thomas West Inc. Smooth pads for CMP and polishing substrates
US7410483B2 (en) * 2003-05-23 2008-08-12 Novare Surgical Systems, Inc. Hand-actuated device for remote manipulation of a grasping tool
DE10328842B4 (de) * 2003-06-26 2007-03-01 Siltronic Ag Suszeptor für eine chemische Gasphasenabscheidung, Verfahren zur Bearbeitung einer Halbleiterscheibe durch chemische Gasphasenabscheidung und nach dem Verfahren bearbeitete Halbleiterscheibe
US20050025973A1 (en) * 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7089925B1 (en) 2004-08-18 2006-08-15 Kinik Company Reciprocating wire saw for cutting hard materials
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7658666B2 (en) * 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8678878B2 (en) * 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
EP1896651B1 (en) * 2005-06-03 2008-12-03 M-real Oyj Method and apparatus for mechanical defibration of wood
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
TW200726582A (en) * 2005-10-04 2007-07-16 Mitsubishi Materials Corp Rotary tool for processing flexible materials
JP2007152493A (ja) * 2005-12-05 2007-06-21 Ebara Corp 研磨パッドのドレッサー及びその製造方法
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
JP4854445B2 (ja) * 2006-09-25 2012-01-18 三菱マテリアル株式会社 Ｃｍｐコンディショナおよびその製造方法
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
CN101903131B (zh) * 2007-11-13 2013-01-02 宋健民 Cmp垫修整器
TWI388402B (en) * 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
EP2259900A1 (en) * 2008-03-10 2010-12-15 Morgan Advanced Ceramics, Inc. Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
DE102008016463A1 (de) * 2008-03-31 2009-10-01 Texas Instruments Deutschland Gmbh Verfahren zur Planarisierung einer Halbleiterstruktur
US8252263B2 (en) * 2008-04-14 2012-08-28 Chien-Min Sung Device and method for growing diamond in a liquid phase
KR101413030B1 (ko) * 2009-03-24 2014-07-02 생-고벵 아브라시프 화학적 기계적 평탄화 패드 컨디셔너로 사용되는 연마 공구
SG176629A1 (en) * 2009-06-02 2012-01-30 Saint Gobain Abrasives Inc Corrosion-resistant cmp conditioning tools and methods for making and using same
EP2474025A2 (en) 2009-09-01 2012-07-11 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
WO2012162430A2 (en) 2011-05-23 2012-11-29 Chien-Min Sung Cmp pad dresser having leveled tips and associated methods
GB201116305D0 (en) 2011-09-21 2011-11-02 Df & G Ltd Composition
KR101186165B1 (ko) * 2012-02-06 2012-10-02 한국과학기술연구원 신선 다이용 다이아몬드 및 그 제조방법
US9457450B2 (en) * 2013-03-08 2016-10-04 Tera Xtal Technology Corporation Pad conditioning tool
GB201305217D0 (en) * 2013-03-21 2013-05-01 For Your Diamonds Only Ltd Cleaning method
JP5824182B1 (ja) 2015-06-29 2015-11-25 ジャスト株式会社 把持具の把持面のめっき処理方法及び把持具
JP2018032745A (ja) * 2016-08-24 2018-03-01 東芝メモリ株式会社 ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法
US12043785B2 (en) 2017-07-11 2024-07-23 3M Innovative Properties Company Abrasive articles including conformable coatings and polishing system therefrom
KR102502899B1 (ko) * 2017-12-28 2023-02-24 엔테그리스, 아이엔씨. Cmp 연마 패드 컨디셔너
CN110052962A (zh) * 2019-04-25 2019-07-26 西安奕斯伟硅片技术有限公司 一种抛光垫修整器、加工装置及方法
DE102019218725A1 (de) 2019-12-03 2021-06-10 Robert Bosch Gmbh Verfahren zum Bilden eines elektrischen Kontakts und Verfahren zum Bilden einer Halbleitervorrichtung
KR20240128469A (ko) * 2023-02-17 2024-08-26 삼성전자주식회사 화학 기계적 연마 장치 및 화학 기계적 연마 방법
CN117161959B (zh) * 2023-09-25 2025-08-22 中南钻石有限公司 一种降低单晶金刚石外延衬底偏向角度的加工装置及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2277520A (en) * 1936-03-02 1942-03-24 Carborundum Co Method of making coated abrasives
US2201195A (en) * 1939-09-22 1940-05-21 Carborundum Co Granular coated material
US3334041A (en) * 1964-08-28 1967-08-01 Norton Co Coated abrasives
US4486200A (en) * 1980-09-15 1984-12-04 Minnesota Mining And Manufacturing Company Method of making an abrasive article comprising abrasive agglomerates supported in a fibrous matrix
CH669138A5 (de) * 1982-11-22 1989-02-28 Schweizer Schmirgel Schleif Schleifmittel auf dehnbarer und flexibler unterlage.
US4576612A (en) * 1984-06-01 1986-03-18 Ferro Corporation Fixed ophthalmic lens polishing pad
US4991362A (en) * 1988-09-13 1991-02-12 Minnesota Mining And Manufacturing Company Hand scouring pad
US4992082A (en) * 1989-01-12 1991-02-12 Ford Motor Company Method of toughening diamond coated tools
KR0145062B1 (ko) * 1989-06-15 1998-07-15 스즈끼 테이이찌 다이어몬드 피복 부재
US5376444A (en) * 1990-07-27 1994-12-27 Grotepass; Wilhelm P. Diamond coated wear resistant tools
US5186973A (en) * 1990-09-13 1993-02-16 Diamonex, Incorporated HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films
DE69123749T2 (de) * 1990-10-09 1997-06-05 Minnesota Mining & Mfg Erodierbare agglomerate enthaltendes beschichtetes schleifmittel
DE69332263T2 (de) * 1992-06-30 2003-08-07 Sumitomo Electric Industries, Ltd. Schneidwerkzeug unter Anwendung von aus der Dampfphase abgeschiedenem polykristallinem Diamant für die Schneidkante und Verfahren zu dessen Herstellung
SE503038C2 (sv) * 1993-07-09 1996-03-11 Sandvik Ab Diamantbelagt skärande verktyg av hårdmetall eller keramik
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5643669A (en) * 1996-02-08 1997-07-01 Minnesota Mining And Manufacturing Company Curable water-based coating compositions and cured products thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same

Also Published As

Publication number Publication date
WO1999002309A1 (en) 1999-01-21
JP2001510738A (ja) 2001-08-07
JP4354630B2 (ja) 2009-10-28
TW411302B (en) 2000-11-11
US5921856A (en) 1999-07-13
KR20010021676A (ko) 2001-03-15

Similar Documents

Publication Publication Date Title
KR100528678B1 (ko) 폴리싱 패드 컨디셔닝 헤드를 위한 시브이디 다이아몬드기판과 그 제조방법
US6054183A (en) Method for making CVD diamond coated substrate for polishing pad conditioning head
US7367875B2 (en) CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US20090224370A1 (en) Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
TWI290876B (en) Polishing pad conditioner and methods of manufacture and recycling
US6632127B1 (en) Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same
US6428399B1 (en) Polishing apparatus for polishing a hard material-coated wafer
US8382557B2 (en) Chemical mechanical planarization pad conditioner and methods of forming thereof
TW383252B (en) A kind of coaxial dressing method and apparatus for chemical mechanical polishing
JPH07314302A (ja) 硬質ウエハ−の研磨方法及び研磨装置
US6860803B2 (en) Polishing plate
US5080975A (en) Composite diamond granules
JP3296148B2 (ja) ウエハ−及びその製造方法
JP3713738B2 (ja) ダイヤモンドの研磨方法及び装置
JPH01177973A (ja) 研磨工具
JP4064391B2 (ja) 研磨パッド処理用ＳｉＣ基板
JP2011235435A (ja) 研磨布用ドレッサー
JP3199127B2 (ja) ダイヤモンド含有複合体被覆部材およびその製造方法
TW201024030A (en) Polishing pad dresser
JPH0197570A (ja) メタルボンド砥石用ダイヤモンド砥材
JPH10249735A (ja) 砥石並びにその製造方法及び製造装置
JPH0355163A (ja) 研磨材およびその製造方法
KR20090106214A (ko) 일체형 다이아몬드 컨디셔너 및 그 제조방법
Sung et al. The Fabrication of Ideal Diamond Disk (IDD) by Casting Diamond Film on Silicon wafer
JPH06238563A (ja) 砥石の製造方法及び該方法により得られた砥石

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20000110

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20030702

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20050205

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20050817

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20051026

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20051108

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20051109

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20080814

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20090914

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20101102

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20111028

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20120817

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20120817

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20131126

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20131126

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20150430

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20150430

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20151019

Year of fee payment: 11

PR1001 Payment of annual fee

Payment date: 20151019

Start annual number: 11

End annual number: 11

FPAY Annual fee payment

Payment date: 20161025

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20161025

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20171025

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20171025

Start annual number: 13

End annual number: 13

EXPY Expiration of term
PC1801 Expiration of term

Termination date: 20190102

Termination category: Expiration of duration