KR100510919B1 - 화학적-기계적 폴리싱공정시 다중파장분광계를 사용하여 두께를 모니터하는 장치 및 방법 - Google Patents

화학적-기계적 폴리싱공정시 다중파장분광계를 사용하여 두께를 모니터하는 장치 및 방법 Download PDF

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Publication number
KR100510919B1
KR100510919B1 KR10-1998-0020320A KR19980020320A KR100510919B1 KR 100510919 B1 KR100510919 B1 KR 100510919B1 KR 19980020320 A KR19980020320 A KR 19980020320A KR 100510919 B1 KR100510919 B1 KR 100510919B1
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KR
South Korea
Prior art keywords
film thickness
substrate
monitor
polishing
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR10-1998-0020320A
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English (en)
Korean (ko)
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KR19980087551A (ko
Inventor
지리 피센
죤 필덴
샤켓 채다
쥬니어 로이드 제이. 라콤
라훌 제어라쓰
윌버 씨. 크루셀
Original Assignee
램 리서치 코포레이션
케이엘에이-텐코어 코오포레이션
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Publication of KR19980087551A publication Critical patent/KR19980087551A/ko
Application granted granted Critical
Publication of KR100510919B1 publication Critical patent/KR100510919B1/ko
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR10-1998-0020320A 1997-05-28 1998-05-28 화학적-기계적 폴리싱공정시 다중파장분광계를 사용하여 두께를 모니터하는 장치 및 방법 Expired - Lifetime KR100510919B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/863,644 US6111634A (en) 1997-05-28 1997-05-28 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US8/863,644 1997-05-28
US08/863644 1997-05-28

Publications (2)

Publication Number Publication Date
KR19980087551A KR19980087551A (ko) 1998-12-05
KR100510919B1 true KR100510919B1 (ko) 2005-11-22

Family

ID=25341477

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0020320A Expired - Lifetime KR100510919B1 (ko) 1997-05-28 1998-05-28 화학적-기계적 폴리싱공정시 다중파장분광계를 사용하여 두께를 모니터하는 장치 및 방법

Country Status (7)

Country Link
US (1) US6111634A (enExample)
EP (1) EP0881040B1 (enExample)
JP (1) JPH1177525A (enExample)
KR (1) KR100510919B1 (enExample)
AT (1) ATE222523T1 (enExample)
DE (1) DE69807287T2 (enExample)
TW (1) TW455937B (enExample)

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WO2015167790A1 (en) * 2014-04-30 2015-11-05 Applied Materials, Inc. Serial feature tracking for endpoint detection

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ATE222523T1 (de) 2002-09-15
DE69807287D1 (de) 2002-09-26
TW455937B (en) 2001-09-21
US6111634A (en) 2000-08-29
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