KR100498202B1 - 초박형 후렉시블인쇄회로기판 및 이에 결합되는 발광모듈 - Google Patents
초박형 후렉시블인쇄회로기판 및 이에 결합되는 발광모듈 Download PDFInfo
- Publication number
- KR100498202B1 KR100498202B1 KR1020040081826A KR20040081826A KR100498202B1 KR 100498202 B1 KR100498202 B1 KR 100498202B1 KR 1020040081826 A KR1020040081826 A KR 1020040081826A KR 20040081826 A KR20040081826 A KR 20040081826A KR 100498202 B1 KR100498202 B1 KR 100498202B1
- Authority
- KR
- South Korea
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- light emitting
- ultra
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040081826A KR100498202B1 (ko) | 2004-10-13 | 2004-10-13 | 초박형 후렉시블인쇄회로기판 및 이에 결합되는 발광모듈 |
JP2004328665A JP2006114856A (ja) | 2004-10-13 | 2004-11-12 | 超薄型フレキシブル印刷回路基板及びこれに結合される発光モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040081826A KR100498202B1 (ko) | 2004-10-13 | 2004-10-13 | 초박형 후렉시블인쇄회로기판 및 이에 결합되는 발광모듈 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100498202B1 true KR100498202B1 (ko) | 2005-06-29 |
Family
ID=36383087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040081826A KR100498202B1 (ko) | 2004-10-13 | 2004-10-13 | 초박형 후렉시블인쇄회로기판 및 이에 결합되는 발광모듈 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2006114856A (ja) |
KR (1) | KR100498202B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107911939B (zh) * | 2017-11-24 | 2024-05-10 | 惠州市鹏程电子科技有限公司 | 一种柔性印刷电路板 |
CN111197705A (zh) * | 2018-11-20 | 2020-05-26 | 上海祁仁光电科技有限公司 | 一种超细型led柔性发光条 |
CN110505756B (zh) * | 2019-07-30 | 2020-12-08 | 武汉华星光电技术有限公司 | 软性印刷电路板及显示设备 |
-
2004
- 2004-10-13 KR KR1020040081826A patent/KR100498202B1/ko not_active IP Right Cessation
- 2004-11-12 JP JP2004328665A patent/JP2006114856A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2006114856A (ja) | 2006-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
A302 | Request for accelerated examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090618 Year of fee payment: 5 |
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LAPS | Lapse due to unpaid annual fee |