KR100475468B1 - Electric contact element for testing electro device - Google Patents

Abstract

The present invention relates to an electrical contact for inspecting an electronic device, the present invention is to form a first photoresist film of a predetermined thickness on the entire surface of the sacrificial substrate, patterning to form a first photoresist pattern for opening the region where the tip portion is to be formed, A trench having a tip portion formed on a sacrificial substrate using the first photoresist pattern as an etch mask, removing the photoresist pattern by ashing, and then forming a zigzag beam having one or more bent portions including a trench Conductive to form a second photoresist pattern for forming a part, and to form a beam part and a tip part by using a chemical vapor deposition (CVD), physical vapor deposition (PVD) or plating method on a sacrificial substrate on which the second photoresist pattern is formed A material is formed to a predetermined thickness to fill the open portion of the second photoresist pattern, and then the top surface of the sacrificial substrate is formed. Carbonizing, removing the third photoresist pattern and the second photoresist pattern to form a beam part and an armrest, forming a post part including a bump of a predetermined size in a terminal of the electrical component, and sacrificing the post part An end portion of the beam portion opposite to the armrest is connected to the substrate using a connecting means, and the sacrificial substrate is removed by a wet etching method.

Description

Electric contact element for testing electro device

The present invention relates to an electrical contact for inspecting an electronic device, and more particularly, to double the physical force (F) of the electrical contact by using an armrest, and to enable the electronic device to be electrically tested for the normal existence of the electronic device. An electrical contact for device inspection.

In general, a semiconductor chip is implemented on a semiconductor substrate by performing a series of semiconductor manufacturing processes such as an oxidation process, a diffusion process, an ion implantation process, an etching process, and a metal process, and the chip implemented on the semiconductor substrate is an EDS. The chips are sorted into normal and bad chips through electrical die sorting, and only the normal chips are sliced and packaged.

In this case, the EDS contacts an electrical contact such as a probe card to a pad of a chip to apply an electrical signal to detect a response electrical signal corresponding to an applied electrical signal, thereby detecting whether the chip is normal or abnormal. It is a process to confirm.

In addition, a flat panel display device such as an LCD (Liquid Crystal Display) is also applied by applying an electrical signal by contacting an electrical contact with a predetermined portion of the flat panel display device manufactured by performing a series of flat display device manufacturing processes. By detecting the response electric signal corresponding to the electric signal, the LCD panel is checked whether it is normal or abnormal.

As described above, the conventional electrical contactor that tests the normality of the flat panel display such as the semiconductor chip or the LCD should be able to cope with the fine pitch interval of the semiconductor device, which has recently been highly integrated with 1GDRAM and the like. It should be possible to use the signal to be fast response time of the signal, to maintain a certain strength not to be worn by repeated contact, to maintain a predetermined contact resistance to excellent electrical conductivity, to ensure sufficient OD (Over Drive) R & D is in progress.

In particular, the electrical contact should be suppressed to the maximum generation of particles (Particles) in the process of repeatedly contacting the highly integrated semiconductor device, it should be excellent in electrical conductivity, the tip portion of the plurality of electrical contacts collectively on the pad Research and development is underway to ensure sufficient OD (Over Drive) to be contacted.

As shown in FIG. 1, the conventional electrical contact includes a terminal and a post portion of an electronic component 10 such as a printed circuit board (PCB) in which a predetermined circuit pattern is implemented. 12 is connected, the post portion 12 and the beam portion 14 are connected, and the beam portion 14 and the tip portion 16 are integrally connected.

At this time, the post portion 12, the beam portion 14 and the tip portion 16 may be provided separately and connected to each other by the bonding means, the beam portion 14 is formed in a bar shape of a constant width (Bar).

In particular, the tip portion 16 is formed in a pyramid shape with an angled edge and a pointed end.

Accordingly, the tip portion 16 of the electrical contact body has a constant OD and repeatedly contacts the pad of the semiconductor chip with a constant physical force F to apply a predetermined electrical signal to the semiconductor chip to test whether the semiconductor chip is normal.

However, the tip portion of the conventional electronic device inspection device needs to increase the constant physical force (F) enough to secure the constant OD to penetrate the oxide film formed on the pad of the semiconductor chip. There is a problem.

In more detail, in order to double the constant physical force (F), the length of the beam portion should be formed short, but if the length of the beam portion is short, it is difficult to secure a constant OD, and the beam portion is locally excessively stressed. There is a problem that is broken.

In addition, although the beam portion requires a predetermined elastic force, there is a problem in that the elastic force of the beam portion is lowered because the length of the beam portion is shortened.

It is an object of the present invention to provide an electrical contact for electronic device inspection that can electrically test the presence or absence of an electronic device by doubling the physical force (F) of the electrical contact using the armrest.

One embodiment of the present invention for achieving the above object is a sacrificial substrate formed with a first photosensitive film having a predetermined thickness on the front; An opening for patterning the first photoresist to form a tip; Forming a tip portion using the first photoresist pattern as an etch mask, and removing the photoresist pattern formed on the sacrificial substrate by ashing and forming a tip portion rounded by one or more N (natural water) order anisotropic etching. Trench for; Open portions of the second photoresist pattern by forming conductive materials for the beam part and the tip part, which are applied by using a chemical vapor deposition (CVD), a physical vapor deposition (PVD), or a plating method, on a sacrificial substrate having the second photoresist pattern formed thereon. A beam portion and an armrest having a zigzag shape having one or more bent portions including the trench formed by filling the upper surface of the sacrificial substrate after removing the third photoresist pattern and the second photoresist pattern; A post portion including a bump of a predetermined size in a terminal of the electrical component; And connecting means for connecting an end portion of the beam portion opposite to the armrest on the post portion and the sacrificial substrate, wherein the armrest is formed in the beam portion when the sacrificial substrate is removed by a wet etching method. As an electrical contact for inspecting an electronic device, the above-mentioned problem is solved.

In addition, another embodiment of the present invention,

A sacrificial substrate having a first photoresist film of a predetermined thickness formed on a front surface thereof; An opening for patterning the first photoresist to form a tip; A tip portion is formed using the first photoresist pattern as an etch mask, and the first photoresist pattern formed on the sacrificial substrate is removed by ashing and is rounded by one or more N (natural number) order anisotropic etching. Trenches for forming tip portions; Opening the second photoresist pattern by forming a conductive material for a beam part and a tip part coated by using a chemical vapor deposition (CVD), a physical vapor deposition (PVD) or a plating method on a sacrificial substrate having a second photoresist pattern formed thereon. A beam portion and an armrest having a zigzag shape having at least one bent portion including the trench formed by filling the portion and then planarizing the top surface of the sacrificial substrate and removing the third photoresist pattern and the second photoresist pattern; A post portion including a bump of a predetermined size in a terminal of the electrical component; Connecting means for connecting an end portion of the beam portion opposite to the armrest formed on the post portion and the sacrificial substrate; And a tip part formed on the beam part when the sacrificial substrate is removed by a wet etching method, wherein the armrest corresponds to the bent part corresponding to any one of the bent parts of the beam part formed in the zigzag shape. An electrical contact for an electronic device inspection, which is formed on the electrical structure at a position to solve the above problem.

In addition, another embodiment of the present invention, a sacrificial substrate formed on the front surface of the first photosensitive film having a predetermined thickness; An opening for patterning the first photoresist to form a tip; A tip portion is formed using the first photoresist pattern as an etch mask, and the first photoresist pattern is removed by ashing on the sacrificial substrate and is rounded by one or more N (natural water) order anisotropic etching Trenches for forming portions; Opening the second photoresist pattern by forming a conductive material for a beam part and a tip part coated by using a chemical vapor deposition (CVD), a physical vapor deposition (PVD) or a plating method on a sacrificial substrate having a second photoresist pattern formed thereon. A beam portion and an armrest having a zigzag shape having at least one bent portion including the trench formed by filling the portion and then planarizing the top surface of the sacrificial substrate and removing the third photoresist pattern and the second photoresist pattern; A post portion including a bump of a predetermined size in a terminal of the electrical component; And a connecting means connecting the post portion and the end portion of the beam portion opposite to the armrest formed on the sacrificial substrate, and the armrest and the tip portion are formed in the beam portion when the sacrificial substrate is removed by a wet etching method. As an electrical contact for inspecting an electronic device, the above-mentioned problem is solved.

Here, the above-mentioned problem is solved as an electrical contact body for an electronic device inspection, wherein a coating film is formed on an outer surface of the armrest by an insulating material.

Here, the insulating material is an electrical contact for electronic device inspection, characterized in that the polyimide (Polyimide) or parylene (Parylene), to solve the above problems.

At this time, the connecting means is an electrical contact for electronic device inspection, characterized in that one of soldering (Soldiring) or brazing (Brazing) or plating or conductive adhesive, solving the above problems.

And when the at least one bent portion is formed in the beam portion, the armrest is formed between an arbitrary bent portion of the bent portion and an upper surface of the electrical component corresponding to the bent portion. As an electrical contact body, the above-mentioned subject is solved.

In addition, the above-described problem is solved by the armrest, which is formed in the beam portion formed on the opposite side of the tip portion.

In addition, the above-mentioned problems are solved as the electrical contact body for an electronic device inspection, wherein the respective armrests are formed to face each other.

In addition, the armrest is formed between the bent portion of the beam portion closest to the tip portion and the upper surface of the electrical component, an electrical contact for an electronic device inspection, the above-mentioned problem is solved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A is a cross-sectional view illustrating an electrical contact body according to a first embodiment of the present invention, and FIG. 2B is a perspective view.

Electronic device inspection apparatus according to a first embodiment of the present invention, as shown in Figs. 2a and 2b is made of a terminal and the bump of a predetermined size, such as a PCB having a predetermined circuit pattern is implemented The post part 22 is connected, and the beam part 24 having the tip part 26 at the post part 22 and the end part is connected by soldering, brazing, plating, and conductive adhesive. It is connected by means 28.

At this time, the beam portion 24 is formed in a zigzag shape having one or more bent portions, the lower side of the bent portion of the beam portion 24 adjacent to the tip portion 26, that is, the opposite side of the tip portion 26 according to the present invention An arm rest 32 is provided.

The outer surface of the armrest 32 has an insulating coating layer 34 such as polymide and parylene, in order to prevent static electricity from being generated by contact with the electrical component 20. It is formed more.

Hereinafter, the beam unit of the electronic device inspection apparatus according to the present invention will be described in more detail with reference to FIGS. 5A to 5F.

As shown in FIG. 5A, the beam part 24 of the electronic device inspection apparatus according to the present invention has a predetermined length of a bar-shaped first end 100, a second end 102, and a third end 104. It may be bent at an angle and may have a zigzag shape in which two bent portions are formed.

In this case, the armrest 106 is provided on the lower side of the bent portion of the beam portion between the second end 102 and the third end 104, and the tip 108 is provided at the end of the third end 104. .

In addition, the beam part 24 of the electronic device inspection apparatus according to the present invention includes the bar-shaped first stages 110, 120, 130, 140, and 150, and the second stage 112, as shown in FIGS. 5B to 5F. , 122, 132, 142, 152, the third stage 114, 124, 134, 144, 154 and the fourth stage 116, 126, 136, 146, 156 are bent at a predetermined angle to form three bends It may be made in a zigzag shape.

At this time, the armrest 118, 128, 138, on the lower side of the bent portion of the beam portion between the second stage 112, 122, 132, 142, 152 and the third stage 114, 124, 134, 144, 154. 148, 158 are provided, and tip portions 119, 129, 139, 149, and 159 are provided at the ends of the fourth ends 116, 126, 136, 146, and 156.

In this case, as shown in FIG. 5F, the beam part 24 may be reduced in width from the post part direction toward the tip part 159 to actively correspond to the fine pitch of the highly integrated semiconductor device.

That is, the width of the beam part 24 decreases from the first end 150 to the fourth end 156 so that the beam parts 24 having the tip parts 159 radially arranged next to each other are placed in contact with pads of the semiconductor element. It is possible to easily cope with the fine pitch of the highly integrated semiconductor device.

Therefore, the tip portion 26 of the electronic device inspection device has a constant OD and penetrates an oxide film formed on the pad of the semiconductor chip with a constant physical force (F) and contacts a pad of the chip to apply a predetermined electrical signal to the semiconductor chip. Test

At this time, the beam portion 24 is bent by a predetermined physical force (F), the tip portion 26 and the pad of the semiconductor chip contact, the armrest 30 and the electrical structure 20 of the lower side of the beam portion 24. ) The upper surface comes into contact.

When the tip portion 26 and the pad of the semiconductor chip contact each other, the torsion phenomenon occurs because the beam portion 24 has a zigzag shape having one or more bent portions, and the armrest 30 is provided on the lower side of the beam portion. As a result of the torsion phenomenon, the pressing force of the tip portion 26 applied to the semiconductor chip is doubled, thereby easily contacting through the oxide film formed on the pad of the semiconductor chip.

3A is a cross-sectional view illustrating an electronic device inspection apparatus according to a second exemplary embodiment of the present invention, and FIG. 3B is a perspective view.

In the electronic device inspection apparatus according to the second embodiment of the present invention, as shown in FIGS. 3A and 3B, the shape of the beam part 44 is the same as that of the first embodiment, and the arm is different from that of the first embodiment. The rest 50 is characterized in that it is provided on the electrical component 40 at a position corresponding to the bent portion of the beam portion 44 closest to the tip portion 46.

At this time, the outer surface of the armrest 50 is an insulating coating film (Coating layer: 52) such as polymide (Polymide) and parylene (Parylene) in order to prevent the static electricity generated by contact with the beam portion 44 Formed.

Accordingly, the tip portion 46 of the electronic device inspection device has a constant OD and a predetermined physical force (F) to penetrate the oxide film formed on the pad of the semiconductor chip and apply a predetermined electrical signal while contacting the pad of the chip so that the semiconductor chip is normally present. Test

At this time, the beam portion 44 is bent by a predetermined physical force (F), the tip portion 46 and the pad of the semiconductor chip is in contact, the lower surface of the beam portion 44 and the arm rest on the electrical component 40 ( 50) comes into contact.

When the tip portion 46 and the pad of the semiconductor chip contact each other, the beam portion 44 has a zigzag shape having at least one bent portion, and the armrest 50 is provided on the electrical component 40 to torsion phenomenon. This occurs, and the torsion phenomenon doubles the pressing force of the tip portion 46 applied to the pad of the semiconductor chip to easily penetrate the oxide film formed on the upper surface of the pad of the semiconductor chip and make contact with the pad.

4A is a cross-sectional view illustrating an electronic device inspection apparatus according to a third exemplary embodiment of the present invention, and FIG. 4B is a perspective view.

In the electronic device inspection apparatus according to the third embodiment of the present invention, as shown in FIGS. 4A and 4B, the shape of the beam part 64 is the same as that of the first embodiment, and the arm is different from the first embodiment. The beams 64 and the beam portion 64 closest to the tip portion 66 and the beam portion 64 on the lower side of the bend portion adjacent to the tip portion 66, that is, on the opposite side of the tip portion 66, are provided with the rests 70 and 74. It is characterized in that it is provided on each of the electrical component 60 of the position corresponding to the bent portion of.

In this case, the armrests 70 and 74 respectively provided in the beam part 64 and the electric component 60 are spaced apart from each other by a predetermined distance in consideration of the degree of bending of the beam part 64. In order to prevent static electricity from being generated by contact with the beam unit 64, insulating coating layers 72 and 76 such as polymide and parylene are formed, respectively.

Accordingly, the tip portion 66 of the electrical contact body has a constant OD and a predetermined physical force (F) to penetrate the oxide film formed on the pad of the semiconductor chip and contact the pad of the chip while applying a predetermined electrical signal to the semiconductor chip to Test for normality.

At this time, the beam portion 64 is bent by a predetermined physical force (F), so that the tip portion 66 and the pad of the semiconductor chip are in contact with each other, and each arm formed on the lower surface of the beam portion 64 and the electrical component 60. The rests 70, 74 are in contact with each other.

When the tip portion 66 and the pad of the semiconductor chip contact each other, the beam portion 64 has a zigzag shape having at least one bent portion, and the armrest is disposed on the lower portion of the beam portion 64 and the electrical component 60, respectively. The torsion phenomenon is generated by providing 70 and 74. The torsion phenomenon doubles the pressing force of the tip portion 66 applied to the semiconductor chip to easily penetrate the oxide film formed on the upper surface of the pad of the semiconductor chip. It comes in contact with the pad.

6A to 6I are cross-sectional views illustrating a method of manufacturing an electronic device inspection apparatus, in which an arm rest is provided on a lower side of a beam unit according to the first embodiment of the present invention.

In the manufacturing method of the electronic device inspection apparatus according to the first embodiment of the present invention, as shown in FIG. 6A, a first photoresist film having a predetermined thickness including a photoresist or the like is formed on the entire surface of the sacrificial substrate 200 made of silicon. After forming, the first photosensitive film pattern 202 for opening the region where the tip portion is to be formed is formed by patterning.

In this case, the first photoresist layer pattern 202 formed of the photoresist may be formed by spray coating a photoresist or the like on the sacrificial substrate 200 while rotating the sacrificial substrate 200, and then exposing and developing the photoresist.

Next, as illustrated in FIG. 6B, an etching process is performed using the first photoresist pattern 202 as an etching mask to form a trench 204 in which a tip portion is to be formed in a subsequent process on the sacrificial substrate 200. do.

In this case, the etching process for forming the trench 204 may be a wet etching process using a chemical or a dry etching process using a reaction gas. After the trench 204 is formed, the trench is etched one or more times by N (animal number) difference to increase the depth of the trench 204, and the inner surface of the trench 204 is rounded one or more times. The rounded tip portion 218 is formed by N (natural number) order anisotropic etching.

Subsequently, as shown in FIG. 6C, the first photosensitive film pattern 202 is removed by ashing or the like, and then a second portion for forming a zigzag beam portion including the trench 204 having one or more bent portions is formed. The photosensitive film pattern 206 is formed.

In this case, the second photoresist layer pattern 206 may also be formed by continuously performing coating, exposure and development processes of the photoresist in the same manner as the first photoresist layer pattern.

Next, as shown in FIG. 6D, the beam part and the tip part are formed on the sacrificial substrate 200 on which the second photoresist pattern 206 is formed by CVD (Physical Vapor Deposition), PVD (Physical Vapor Deposition) and plating. After the conductive material 208 is formed to a predetermined thickness to fill the open portion of the second photoresist layer pattern 206, the top surface of the sacrificial substrate 200 is planarized.

Subsequently, as shown in FIG. 6E, the armrest forming portion to be formed by a subsequent process is opened at a position closest to the trench 204 where the tip portion is to be formed on the sacrificial substrate 200 on which the planarization process is completed. Three photoresist pattern 210 is formed.

In this case, the third photoresist pattern 210 is a pattern for forming an armrest at a position closest to the tip portion among the bent portions of the zigzag-shaped beam portion having one or more bent portions to be formed by a subsequent process.

Next, as illustrated in FIG. 6F, the conductive material 211 is predetermined by chemical vapor deposition (PVD), physical vapor deposition (PVD), plating, and the like on the sacrificial substrate 200 on which the third photoresist pattern 210 is formed. After filling the open portion of the third photoresist pattern 210 by forming a thickness, the top surface of the sacrificial substrate 200 is planarized.

In this case, the top surface of the sacrificial substrate 200 on which the conductive material 211 is formed may be planarized using a chemical mechanical polishing (CMP), an etchback, a grinding, or the like.

Subsequently, as shown in FIG. 6G, the beam part 214 and the armrest 212 are formed by removing the third photoresist pattern 210 and the second photoresist pattern 206, and the outer surface of the armrest 212 is formed. The coating layer (Coating layer: 216) is formed of an insulating material such as polymide and parylene.

Subsequently, as shown in FIG. 6H, a post portion 302 formed of a bump or the like of a predetermined size is formed in a terminal of an electrical component 300 such as a PCB on which a predetermined circuit pattern is implemented. 302 and the connecting means by the method such as soldering (brazing), brazing (plating) and conductive adhesive to the end of the beam portion 214 opposite to the armrest 212 formed by the preceding process on the sacrificial substrate 200 ( 304).

Finally, as shown in FIG. 6I, the sacrificial substrate 200 is removed by a wet etching method to open the tip part 218 connected to the beam part 214 so that the armrest 212 is provided in the beam part 214. An electronic device inspection device is formed.

7A to 7D are cross-sectional views illustrating a method of manufacturing an electronic device inspection apparatus, in which an armrest is provided on an electrical component, according to a second embodiment of the present invention.

The manufacturing method of the electronic device inspection apparatus according to the second embodiment of the present invention is the same as the manufacturing method of the electronic device inspection apparatus of the first embodiment described above, as shown in FIG. A second photosensitive film pattern for forming a zigzag beam part having one or more bent portions including the trench 402 on the sacrificial substrate 400 having the trench 402 to be formed by the etching process using 404).

After the trench 402 is formed, the trench 402 is anisotropically etched one or more times, thereby increasing the depth of the trench 402 and rounding the inner surface of the trench 402. The rounded tip part 410 is formed by one or more N (natural number) order anisotropic etching.

Next, a conductive material 406 is formed on the sacrificial substrate 400 on which the second photoresist layer pattern 404 is formed by forming a beam part and a tip part by chemical vapor deposition (PVD), physical vapor deposition (PVD), plating, or the like. After forming a predetermined thickness to fill the open portion of the second photoresist pattern 404, the top surface of the sacrificial substrate 400 is planarized.

Next, as shown in FIG. 7B, the second photosensitive film pattern 404 is removed to form a zigzag beam part 408 having one or more bent portions. In this case, the second photoresist layer pattern 404 is removed by a method such as wet etching.

Subsequently, as illustrated in FIG. 7C, a coating film 506 is formed on an outer surface of an insulating material such as polymide and parylene on an electrical component 500 such as a PCB on which a predetermined circuit pattern is implemented. This formed armrest 504 of a predetermined size is formed.

In this case, the armrest 504 is formed on the electrical structure 500 at a position corresponding to the bent portion of the beam portion 408 adjacent to the beam portion 408 formed in a zigzag shape having one or more bent portions.

In addition, a post part 502 including bumps having a predetermined size is formed in the terminal of the electrical component 500, and the end of the beam part 408 opposite to the post part 502 and the trench 402 is soldered. And connecting means 508 by means of brazing, plating and conductive adhesive.

Finally, as shown in FIG. 7D, the sacrificial substrate 400 is removed by wet etching or the like to open the tip 410 connected to the beam 408 so that the armrest 504 is formed on the electrical component 500. An electronic device inspection apparatus provided is formed.

8A to 8D are cross-sectional views illustrating a method of manufacturing an electronic device test apparatus, in which armrests are provided on a beam unit and an electrical component, respectively, according to a third embodiment of the present invention.

The manufacturing method of the electronic device inspecting apparatus according to the third embodiment of the present invention is the same as the manufacturing method of the electronic device inspecting apparatus of the first embodiment described above, as shown in FIG. A second photosensitive film pattern for forming a zigzag beam part having one or more bent portions including the trench 602 on the sacrificial substrate 600 having the trench 602 on which the tip part is to be formed by an etching process 604 is formed.

After the trench 602 is formed, the trench 602 is anisotropically etched one or more times, thereby increasing the depth of the trench 602 and rounding the inner surface of the trench 602. The rounded din tip 616 is formed by one or more N (natural number) order anisotropic etching.

Next, a conductive material 609 for forming the beam part and the tip part by chemical vapor deposition (PVD), physical vapor deposition (PVD), plating, etc. is formed on the sacrificial substrate 600 on which the second photoresist layer pattern 604 is formed. After forming a predetermined thickness to fill the open portion of the second photoresist layer pattern 604, the top surface of the sacrificial substrate 600 is planarized.

A third photoresist pattern 608 is formed on the sacrificial substrate 600 where the planarization process is completed to open a portion where the armrest is to be formed.

In this case, the third photoresist pattern 608 is a pattern for forming an armrest at a position closest to the tip portion among the bent portions of the zigzag-shaped beam portion having one or more bent portions to be formed by a subsequent process.

Next, the conductive material 609 is formed to a predetermined thickness by chemical vapor deposition (PVD), physical vapor deposition (PVD) and plating on the sacrificial substrate 600 on which the third photoresist pattern 608 is formed. After filling the open portion where the arm rest of the photoresist pattern 608 is to be formed, the top surface of the sacrificial substrate 600 is planarized.

Next, as shown in FIG. 8B, the beam part 614 and the armrest 610 are formed by removing the third photoresist pattern 608 and the second photoresist pattern 604. The outer surface is formed of a coating layer (612) with an insulating material such as polymide and parylene.

Subsequently, as illustrated in FIG. 8C, the coating layer 704 is coated on an outer surface of an insulating material such as polymide and parylene on an electrical component 700 such as a PCB on which a predetermined circuit pattern is implemented. The formed armrest 702 of a predetermined size is formed.

In this case, the armrest 702 is formed at a position that can correspond to each other with the armrest 610 formed in the beam portion 614.

In addition, a post portion 706 formed of a predetermined size bump or the like is formed in the terminal of the electrical component 700, and the end of the beam portion 614 opposite to the post portion 706 and the trench 602 is soldered. And connecting means 708 by brazing, plating, and conductive adhesive.

At this time, the armrest 702 is connected to the armrest 610 formed on the beam portion 614 to face each other at a predetermined interval.

Finally, as shown in FIG. 8D, the sacrificial substrate 600 is removed by a wet etching method to open the tip part 616 connected to the beam part 614 so that the armrests 610 and 702 may have the electrical component 700. And an electronic device inspection apparatus provided in the beam unit 614, respectively.

Hereinafter, with reference to FIGS. 9A and 9B, stress is applied to a zigzag beam portion (an embodiment) having at least one bent portion with an armrest in accordance with the present invention and to a conventional bar-shaped beam portion (comparative example). Look at the simulation results of the distribution of losing stress.

As shown in FIG. 9A, the beam part according to the present invention has a constant stress of about 500 M (Pa) in a portion away from 5.0 × 0-4 (m) to 2.0 × 0-33 (m) from a connecting means such as a bump. On the other hand, as shown in Fig. 9B, the conventional beam portion has a distance of 5.0 × 0-4 (m) to 2.0 × 0-33 (m), that is, 400M (Pa) to 50M (Pa). It can be seen that the stress is applied to a large difference occurs locally.

Therefore, it can be confirmed that by applying even stress to the beam unit according to the present invention, it is possible to prevent a break in the contact process of the series of semiconductor chips.

According to the present invention, it is possible to mass-produce electrical contacts in a reproducible manner using MEMS (Micro Electro Mechanical System) technology, so that the yield, productivity and reliability of electronic device inspection devices such as probe cards having electrical contacts can be improved. It has an effect.

In addition, due to the torsion effect provided through the armrest, a constant physical force (F) that is enough to penetrate the oxide film formed on the pad of the semiconductor chip is doubled to test the semiconductor chip.

In addition, it is possible to prevent the beam part from being broken by applying an even stress to the beam part.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and modifications belong to the appended claims.

1 is a cross-sectional view illustrating a conventional electrical contact for inspecting an electronic device.

2A is a cross-sectional view illustrating an electrical contact for inspecting a first electronic device according to the present invention, and FIG. 2B is a perspective view.

3A is a cross-sectional view illustrating an electrical contact for inspecting a second electronic device according to the present invention, and FIG. 3B is a perspective view.

4A is a cross-sectional view illustrating an electrical contact for inspecting a third electronic device according to the present invention, and FIG. 4B is a perspective view.

FIG. 5 is a perspective view illustrating the beam unit illustrated in FIGS. 2A to 4B.

6A to 6I are cross-sectional views illustrating a method of manufacturing an electrical contact for inspection by the first electronic device of FIG. 1.

7A to 7D are cross-sectional views illustrating a method of manufacturing an electrical contact for inspecting a second electronic device of FIG. 2.

8A to 8D are cross-sectional views illustrating a method of manufacturing an electrical contact for inspecting a third electronic device of FIG. 3.

Figure 9a is a graph showing the result of the stress distribution applied to the beam portion of the electrical contact for the electronic device inspection according to the present invention, Figure 9b is a simulation of the stress distribution applied to the beam portion of the conventional electronic device inspection apparatus A graph showing the results.

*** Explanation of symbols for the main parts of the drawing ***

10, 20, 40, 60: electrical components 12, 22, 42, 62: post portion

14, 24, 44, 64: beam portion 16, 26, 46, 66: tip portion

18, 28, 48, 68: connecting means 30, 50, 70, 74: armrest

32, 52, 72, 76: coating film

Claims (10)

A sacrificial substrate having a first photoresist film of a predetermined thickness formed on a front surface thereof; An opening for patterning the first photoresist to form a tip; Forming a tip portion using the first photoresist pattern as an etch mask, and removing the photoresist pattern formed on the sacrificial substrate by ashing and forming a tip portion rounded by one or more N (natural water) order anisotropic etching. Trench for; Open portions of the second photoresist pattern by forming conductive materials for the beam part and the tip part, which are applied by using a chemical vapor deposition (CVD), a physical vapor deposition (PVD), or a plating method, on a sacrificial substrate having the second photoresist pattern formed thereon. A beam portion and an armrest having a zigzag shape having one or more bent portions including the trench formed by filling the upper surface of the sacrificial substrate after removing the third photoresist pattern and the second photoresist pattern; A post portion including a bump of a predetermined size in a terminal of the electrical component; And It comprises a connecting means for connecting the end of the beam portion opposite the armrest on the post portion and the sacrificial substrate, The armrest, When the sacrificial substrate is removed by a wet etching method is formed on the upper surface of the bent portion of the beam portion, the electrical contact for the electronic device inspection, characterized in that the coating film is formed on the outer surface of the insulating material . A sacrificial substrate having a first photoresist film of a predetermined thickness formed on a front surface thereof; An opening for patterning the first photoresist to form a tip; A tip portion is formed using the first photoresist pattern as an etch mask, and the first photoresist pattern formed on the sacrificial substrate is removed by ashing and is rounded by one or more N (natural number) order anisotropic etching. Trenches for forming tip portions; Opening the second photoresist pattern by forming a conductive material for a beam part and a tip part coated by using a chemical vapor deposition (CVD), a physical vapor deposition (PVD) or a plating method on a sacrificial substrate having a second photoresist pattern formed thereon. A beam portion and an armrest having a zigzag shape having at least one bent portion including the trench formed by filling the portion and then planarizing the top surface of the sacrificial substrate and removing the third photoresist pattern and the second photoresist pattern; A post portion including a bump of a predetermined size in a terminal of the electrical component; Connecting means for connecting an end portion of the beam portion opposite to the armrest formed on the post portion and the sacrificial substrate; And When the sacrificial substrate is removed by a wet etching method comprises a tip formed on the beam portion, The armrest, An electrical contact for inspection of an electronic device, characterized in that the zigzag-shaped beam portion is formed selectively on the upper surface of the electrical component facing the bent portion and the bending portion, the coating film is formed on the outer surface of the insulating material . A sacrificial substrate having a first photoresist film of a predetermined thickness formed on a front surface thereof; An opening for patterning the first photoresist to form a tip; A tip portion is formed using the first photoresist pattern as an etch mask, and the first photoresist pattern is removed by ashing on the sacrificial substrate and is rounded by one or more N (natural water) order anisotropic etching Trenches for forming portions; Opening the second photoresist pattern by forming a conductive material for a beam part and a tip part coated by using a chemical vapor deposition (CVD), a physical vapor deposition (PVD) or a plating method on a sacrificial substrate having a second photoresist pattern formed thereon. A beam portion and an armrest having a zigzag shape having at least one bent portion including the trench formed by filling the portion and then planarizing the top surface of the sacrificial substrate and removing the third photoresist pattern and the second photoresist pattern; A post portion including a bump of a predetermined size in a terminal of the electrical component; And It comprises a connecting means for connecting the end of the beam portion opposite the armrest formed on the post portion and the sacrificial substrate, The armrest, When the sacrificial substrate is removed by a wet etching method, the beams are formed at predetermined intervals on the bent portion of the beam unit and the upper surface of the electrical component, respectively, and the coating layer is formed on the outer surface by an insulating material. Electrical contacts. delete The method according to any one of claims 1 to 3, wherein the insulating material, Electrical contact for electronic device inspection, characterized in that the polyimide (Polyimide) or parylene (Parylene). 4. The electrical contact of claim 1, wherein the connecting means is one of soldering or brazing or plating or conductive adhesive. The method of claim 1, wherein when the at least one bent portion is formed in the beam portion, the armrest, An electrical contact for electronic device inspection, characterized in that formed between any of the bent portion of the bent portion and the upper surface of the electrical structure corresponding to the bent portion. The armrest according to any one of claims 1 to 3, wherein the armrest is The electrical contact for the electronic device inspection, characterized in that formed on the formed beam portion opposite the tip side. The method of claim 3, wherein each of the armrests, Electrical contact for the electronic device inspection, characterized in that formed to face each other. The armrest according to any one of claims 1 to 3, wherein the armrest is And a contact portion formed between the bent portion of the beam portion closest to the tip portion and an upper surface of the electrical component.