KR100457342B1 - Wafer transfer apparatus to prevent wafer from being damaged and improve productivity - Google Patents

Wafer transfer apparatus to prevent wafer from being damaged and improve productivity Download PDF

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KR100457342B1
KR100457342B1 KR1019970054901A KR19970054901A KR100457342B1 KR 100457342 B1 KR100457342 B1 KR 100457342B1 KR 1019970054901 A KR1019970054901 A KR 1019970054901A KR 19970054901 A KR19970054901 A KR 19970054901A KR 100457342 B1 KR100457342 B1 KR 100457342B1
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wafer
robot arm
drive motor
switching means
wafer transfer
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KR1019970054901A
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Korean (ko)
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KR19990033526A (en
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임기열
이호제
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삼성전자주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A wafer transfer apparatus is provided to prevent a wafer from being damaged and improve productivity by controlling the malfunction of a driver motor by a switch installed in a robot arm and by stopping the operation of the driver motor. CONSTITUTION: A switching unit for setting the transfer range of a robot arm(12) is installed in a predetermined position of a rail for guiding the transfer of the robot arm that is driven by a driver motor to load/unload a wafer. When the switching unit is switched, the power supplied to the driver motor is intercepted to stop the robot arm.

Description

웨이퍼 이송장치Wafer Transfer Device

본 발명은 웨이퍼 이송장치에 관한 것으로서, 보다 상세하게는 로봇아암을 이용하여 웨이퍼를 로딩/언로딩 하는 중에 구동모터의 오동작에 의한 웨이퍼 손상을 방지하도록 구동모터를 단속하는 웨이퍼 이송장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer device, and more particularly, to a wafer transfer device for controlling a drive motor to prevent wafer damage due to a malfunction of the drive motor during loading / unloading of a wafer using a robot arm.

종래의 반도체장치 제조공정에서 웨이퍼를 이송하는 로봇아암은 구동모터에 의해 레일을 따라 구동되고, 캐리어에 장착되어 있는 웨이퍼를 흡착하여 각 공정이 수행되는 스테이지에 이송한다.In a conventional semiconductor device manufacturing process, a robot arm for transferring a wafer is driven along a rail by a drive motor, and absorbs a wafer mounted on a carrier and transfers the wafer to a stage where each process is performed.

이때 로봇아암이 캐리어 내부로 입사하는 길이는 웨이퍼의 중심부를 흡착하는 길이로 제한되게 설계되어 있다. 그러나 구동모터의 이상동작에 의한 로봇아암의 동작은 웨이퍼의 중심부를 흡착하는 길이 이상으로 입사되어서 로봇아암에 의한 웨이퍼손상이 발생된다.At this time, the length that the robot arm enters into the carrier is designed to be limited to the length that absorbs the center portion of the wafer. However, the operation of the robot arm due to the abnormal operation of the drive motor is incident beyond the length for absorbing the center portion of the wafer, resulting in wafer damage by the robot arm.

그런데 구동모터에 인가되는 펄스신호가 인가되는 경로에 연결되는 컨넥터의 접촉불량이 발생되거나, 구동모터를 구동하는 프로그램에 의한 에러발생, 또는 구동모터의 이상에 의해 로봇아암이 오동작을 하는 경우가 발생된다. 로봇아암이 웨이퍼를 이송중이거나, 웨이퍼에 근접되게 위치해 있을 경우에 로봇아암에 의해 웨이퍼가 손상될 위험이 있다.However, contact failure of the connector connected to the path to which the pulse signal applied to the driving motor is applied, an error caused by a program that drives the driving motor, or a robot arm malfunctions due to an abnormality of the driving motor. do. There is a risk of damaging the wafer by the robot arm when the robot arm is transporting the wafer or positioned close to the wafer.

즉, 웨이퍼가 깨지거나 웨이퍼의 뒷면에 긁힘(Scratch)이 발생하면, 사진공정에서는 스테이지 포커스(Stage Focus)로 정렬불량의 원인이 되었고, 이온주입 및 식각공정에서는 긁힘에 의해 웨이퍼가 깨지는 현상이 발생되었다.In other words, if the wafer is broken or scratches occur on the back side of the wafer, it may cause misalignment due to stage focus in the photographing process, and the wafer may be broken due to scratching in the ion implantation and etching process. It became.

그런데 종래에는 이와 같은 구동모터의 이상에 의해 로봇아암이 웨이퍼에 손상을 가하는 경우가 발생했는데 이를 방지할 제어수단이 구비되어 있지 않았다.However, in the related art, the robot arm causes damage to the wafer due to such an abnormality of the driving motor, but there is no control means for preventing this.

따라서, 종래에는 전술한 바와 같이 구동모터의 오동작에 의한 로봇아암의 웨이퍼 손상을 방지할 수 있는 장치가 구비되어 있지 않아 생산성을 저하시키는 문제점이 있었다.Therefore, in the related art, as described above, a device capable of preventing wafer damage of the robot arm due to a malfunction of the driving motor is not provided, which causes a problem of lowering productivity.

본 발명의 목적은, 로봇아암을 구동하는 구동모터의 이상동작이 발생하였을 때 로봇아암의 구동에 의해 스위칭되는 수단을 구비하여 구동모터에 인가되는 전원을 차단함으로써 웨이퍼 손상을 사전에 방지하도록 하는 웨이퍼 이송장치를 제공하는 데 있다.An object of the present invention is to provide a wafer for preventing damage to the wafer in advance by cutting off the power applied to the drive motor, by means of switching by driving the robot arm when an abnormal operation of the drive motor for driving the robot arm occurs. To provide a conveying device.

도1은 본 발명에 따른 웨이퍼 이송장치의 실시예를 나타내는 평면도이다.1 is a plan view showing an embodiment of a wafer transfer apparatus according to the present invention.

도2는 본 발명에 따른 웨이퍼 이송장치의 동작을 단속하는 회로도이다.2 is a circuit diagram for interrupting the operation of the wafer transfer device according to the present invention.

※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing

10 : 플레이트 12 : 로봇아암10 plate 12 robot arm

14 : 레일 16 : 리미트스위치(Limit Switch)14 Rail 16 Limit Switch

18 : 작동봉 20 : 구동모터18: operating rod 20: drive motor

22 : 릴레이 24 : 전원공급부22: relay 24: power supply

Vcc : 정전압Vcc: Constant Voltage

상기 목적을 달성하기 위한 본 발명에 따른 웨이퍼 이송장치는, 구동모터에 의해 구동되어서 웨이퍼 로딩 및 언로딩을 수행하는 로봇아암의 이송을 가이드하는 레일의 소정 위치에 상기 로봇아암이 이동범위를 설정하는 스위칭수단이 구성되고, 상기 스위칭수단이 스위칭되면 상기 구동모터에 공급되는 전원이 차단되어 상기 로봇아암이 정지되어 이루어진다.The wafer transfer device according to the present invention for achieving the above object, the robot arm is driven by a drive motor to set the movement range of the robot arm at a predetermined position of the rail for guiding the transfer of the robot arm for performing wafer loading and unloading A switching means is configured, and when the switching means is switched, the power supplied to the drive motor is cut off and the robot arm is stopped.

그리고, 상기 스위칭수단은 상기 레일의 소정 위치에 설치되는 비(B)접점스위치 및 상기 로봇아암의 하부에 설치되어 상기 비접점스위치를 작동하는 작동봉을 구비하고 있다.The switching means includes a non-B contact switch installed at a predetermined position of the rail and an operating rod installed under the robot arm to operate the non-contact switch.

그리고, 상기 스위칭수단과 상기 구동모터 사이에는 릴레이가 연결되어 상기 스위칭수단의 스위칭동작에 의해 연동되어 상기 구동모터의 전원이 온/오프됨이 바람직하다.In addition, it is preferable that a relay is connected between the switching means and the driving motor and interlocked by a switching operation of the switching means to turn on / off the power of the driving motor.

이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도1에서 보는 바와 같이 본 발명에 따른 실시예는, 플레이트(10)상에 로봇아암(12)이 이동하는 경로로서 레일(14)이 형성되어 있다. 플레이트(10)에는 로봇아암(12)이 이동하는 최대이동거리가 설정되는 부위에 리미트스위치(16)가 설치되어 있고, 로봇아암(12)의 하부에는 리미트스위치(16)를 작동하는 작동봉(18)이 설치되어 있다.As shown in FIG. 1, in the embodiment according to the present invention, a rail 14 is formed as a path through which the robot arm 12 moves on the plate 10. The plate 10 is provided with a limit switch 16 at a portion at which the maximum travel distance at which the robot arm 12 moves is set, and an operating rod for operating the limit switch 16 at the lower part of the robot arm 12 ( 18) is installed.

그리고 구동모터(20)의 구동을 단속하는 구체적인 회로는 도2를 참조한다. 도2에서 보는 바와 같이, 정전압이 리미트스위치(16)에 인가되고, 리미트스위치(16)에는 릴레이(22)가 연결되어 있다. 릴레이(22)의 스위칭단자에는 구동모터(20) 및 전원공급부(24)의 일단자가 연결되어 있다. 구동모터(20)의 다른 일단자는 전원공급부(24)에 연결되어 있다.And a detailed circuit for controlling the driving of the drive motor 20, see FIG. As shown in FIG. 2, a constant voltage is applied to the limit switch 16, and a relay 22 is connected to the limit switch 16. One end of the driving motor 20 and the power supply unit 24 is connected to the switching terminal of the relay 22. The other end of the drive motor 20 is connected to the power supply 24.

전술한 바와 같이 구성된 본 발명에 따른 실시예는, 구동모터(20)에 이상이 발생하였을 경우 플레이트(10)에 설치된 리미트스위치(16)를 로봇아암(12)에 설치된 작동봉(18)이 작동하면 구동모터에 인가되는 전원이 차단됨으로써 구동모터가 정지하고, 따라서 로봇아암(12)도 정지함으로써 웨이퍼의 손상을 방지한다.In the embodiment according to the present invention configured as described above, when an abnormality occurs in the drive motor 20, the operating rod 18 installed on the robot arm 12 operates the limit switch 16 installed on the plate 10. When the power applied to the drive motor is cut off, the drive motor is stopped. Accordingly, the robot arm 12 is also stopped to prevent damage to the wafer.

구체적으로, 캐리어(도시하지 않음) 내에 장착되어 있는 웨이퍼는 로봇아암(12)이 구동모터의 작동으로 레일(14)을 따라 캐리어 내부에 입사하면 웨이퍼의 중심부가 진공흡착되어 이송된다. 이때 로봇아암(12)이 캐리어 내부로 입사하는 길이는 웨이퍼의 중심부가 흡착되는 길이로 제한되게 이루어져 있다. 즉 도1의 A 지점은 작동봉(18)이 리미트스위치(16)를 작동하는 지점으로 로봇아암(12)의 이동이 허용되는 최대거리가 되는 지점이다.Specifically, the wafer mounted in the carrier (not shown) is transferred to the center of the wafer by vacuum suction when the robot arm 12 enters the carrier along the rail 14 by the operation of the drive motor. In this case, the length of the robot arm 12 incident into the carrier is limited to the length at which the center portion of the wafer is adsorbed. That is, the point A of FIG. 1 is a point at which the operating rod 18 operates the limit switch 16 to be the maximum distance that the robot arm 12 is allowed to move.

로봇아암(12)이 캐리어 내부로 입사되는 중 구동모터(20)에 이상이 발생하여 오동작을 일으키면 로봇아암(12)은 웨이퍼의 중심부를 흡착하는 길이(A) 이상으로 이동한다. 그러면 리미트스위치(16)를 작동봉(18)이 작동하여 스위칭되어서 리미트스위치(16)는 오프되고, 정전압이 릴레이(22)에 인가되지 않아서 릴레이(22)는 오픈되어 결국 구동모터(20)에 전원이 공급되지 않는다. 구동모터(20)가 구동되지 않으므로 로봇아암(12) 역시 동작이 정지됨으로써 웨이퍼가 손상되지 않는다. 구동모터(20) 오류가 발생하여 웨이퍼가 이송되지 않음으로써 공정은 중지된다. 이후 작업자에 의해 모터가 수리되면 정상적인 공정이 재개된다.If an abnormality occurs in the driving motor 20 while the robot arm 12 is incident into the carrier, and a malfunction occurs, the robot arm 12 moves beyond the length A for absorbing the center portion of the wafer. Then, the limit switch 16 is turned on by operating the operating rod 18 so that the limit switch 16 is turned off, and since the constant voltage is not applied to the relay 22, the relay 22 is opened and finally the driving motor 20 is opened. Power is not supplied. Since the driving motor 20 is not driven, the robot arm 12 also stops operating so that the wafer is not damaged. The drive is stopped because the drive motor 20 fails and the wafer is not transferred. After the motor is repaired by the operator, the normal process resumes.

전술한 바와 같이 본 발명에 따른 실시예에 의하면, 구동모터(20)의 이상에 의한 로봇아암(12)의 오동작이 방지되어 웨이퍼의 손상을 방지하는 이점이 있다.As described above, according to the embodiment of the present invention, the malfunction of the robot arm 12 due to the abnormality of the driving motor 20 is prevented, thereby preventing the damage of the wafer.

따라서, 본 발명에 의하면 구동모터의 오동작이 로봇아암에 설치된 스위치에 의해 단속되어서 구동모터동작이 정지되어 웨이퍼의 손상이 사전에 방지되어서 생산성 향상의 효과가 있다.Therefore, according to the present invention, the malfunction of the drive motor is interrupted by a switch provided on the robot arm so that the drive motor operation is stopped to prevent damage to the wafer in advance, thereby improving productivity.

이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (3)

구동모터에 의해 구동되어서 웨이퍼 로딩 및 언로딩을 수행하는 로봇아암의 이송을 가이드하는 레일의 소정 위치에 상기 로봇아암이 이동범위를 설정하는 스위칭수단이 구성되고, 상기 스위칭수단이 스위칭되면 상기 구동모터에 공급되는 전원이 차단되어 상기 로봇아암이 정지됨을 특징으로 하는 웨이퍼 이송장치.Switching means for setting the moving range of the robot arm is configured at a predetermined position of the rail to guide the transfer of the robot arm that is driven by a drive motor to perform wafer loading and unloading, and when the switching means is switched the drive motor Wafer transfer apparatus characterized in that the robot arm is stopped by the power supplied to the stop. 제 1 항에 있어서, 상기 스위칭수단은,The method of claim 1, wherein the switching means, 상기 레일의 소정 위치에 설치되는 비(B)접점스위치; 및A non-B contact switch installed at a predetermined position of the rail; And 상기 로봇아암의 하부에 설치되어 상기 비접점스위치를 작동하는 작동봉;An operating rod installed under the robot arm to operate the non-contact switch; 을 구비함을 특징으로 하는 상기 웨이퍼 이송장치.The wafer transfer device characterized in that it comprises a. 제 1 항에 있어서,The method of claim 1, 상기 스위칭수단과 상기 구동모터 사이에는 릴레이가 연결되어 상기 스위칭수단의 스위칭동작에 의해 연동되어 상기 구동모터의 전원이 온/오프됨을 특징으로 하는 상기 웨이퍼 이송장치.The relay is connected between the switching means and the drive motor, the wafer transfer device, characterized in that the power of the drive motor is turned on / off by interlocking by the switching operation of the switching means.
KR1019970054901A 1997-10-24 1997-10-24 Wafer transfer apparatus to prevent wafer from being damaged and improve productivity KR100457342B1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536809A (en) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp Semiconductor substrate transfer arm in semiconductor substrate treatment device
JPH0547900A (en) * 1991-08-09 1993-02-26 Kokusai Electric Co Ltd Vacuum suction wafer transfer method
JPH05308098A (en) * 1991-03-26 1993-11-19 Tokyo Electron Ltd Wafer positioning device
JPH06326172A (en) * 1993-05-10 1994-11-25 Tel Varian Ltd Transfer device
KR19980020173A (en) * 1996-09-05 1998-06-25 김광호 Object detection system and detection method of automatic semiconductor wafer transfer device
KR19980069556A (en) * 1997-02-28 1998-10-26 문정환 Wafer Detection Device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05308098A (en) * 1991-03-26 1993-11-19 Tokyo Electron Ltd Wafer positioning device
JPH0536809A (en) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp Semiconductor substrate transfer arm in semiconductor substrate treatment device
JPH0547900A (en) * 1991-08-09 1993-02-26 Kokusai Electric Co Ltd Vacuum suction wafer transfer method
JPH06326172A (en) * 1993-05-10 1994-11-25 Tel Varian Ltd Transfer device
KR19980020173A (en) * 1996-09-05 1998-06-25 김광호 Object detection system and detection method of automatic semiconductor wafer transfer device
KR19980069556A (en) * 1997-02-28 1998-10-26 문정환 Wafer Detection Device

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