KR100450310B1 - Method for manufacturing probe for testing flat pannel display, probe thereby, probe assembly having it - Google Patents

Abstract

The present invention relates to a method for manufacturing a probe for inspecting a flat panel display device, a probe according thereto, and a probe assembly having the same.

The method of manufacturing a probe according to the present invention may include forming a first passivation pattern on a sacrificial substrate, the first passivation pattern defining a region in which a plurality of contacts spaced apart from each other by a predetermined interval, on the sacrificial substrate on which the first passivation pattern is formed. Forming a conductive film filling the opening of the first protective film pattern, removing the first protective film pattern on the sacrificial substrate on which the conductive film is formed, and forming a central portion of the conductive film on the sacrificial substrate from which the first protective film pattern is removed. Forming a second protective film pattern to define an opening, inserting a reinforcing plate into an open portion of the second protective film pattern, and removing the second protective film pattern and the sacrificial substrate to form a contact member formed of the conductive film. Comprising the step of forming, the probe according to the invention, spaced at a predetermined interval below the reinforcing plate in a row A plurality of listed contacts are attached by an adhesive means, and the probe assembly according to the present invention includes a probe block fixed to a lower surface of a contact member in direct contact with an inspection part of a test object, a probe holder fixing the probe block, and the probe. In the probe assembly for inspecting a flat panel display device having a manipulator which is connected to a holder to allow the probe block to move up and down by physical force, wherein the probe block has an inclined surface inclined at a predetermined angle inwardly. And a probe having a reinforcing plate attached to an upper center of the plurality of contacts arranged in a line at predetermined intervals on an inclined surface of the probe block, wherein one end of the contact is connected to a tape carrier package (TCP). It is done.

Therefore, it is possible to actively cope with the fine pitch of the highly integrated flat panel display device, and has an effect of excellent reproducibility and productivity.

Description

Method for manufacturing probe for inspecting flat panel display device, probe according thereto, and probe assembly having same {Method for manufacturing probe for testing flat pannel display, probe hence, probe assembly having it}

The present invention relates to a method for manufacturing a probe for inspecting a flat panel display device, a probe according thereto, and a probe assembly having the same. More specifically, the present invention relates to a flat panel display device having excellent reproducibility and productivity by using MEMS (Micro Electro Mechanical System) technology. It relates to a method for manufacturing a test probe, a probe according thereto, and a probe assembly having the same.

In general, a TFT-LCD (Thin Film Transistor Liquid Crystal Display) is a kind of flat panel display, in which a myriad of thin film transistors (TFTs) and pixel electrodes are arranged, a lower plate having a predetermined size, a color filter for displaying color, and The common electrode is sequentially formed to have a top plate spaced apart from the bottom plate and a liquid crystal filled in the spaced space between the top plate and the bottom plate.

Such a TFT-LCD includes a charge region and an auxiliary charge region formed by a liquid crystal between a TFT, which is a switching element, and an upper and lower electrodes, and a gate driving electrode for driving on and off of the TFT and an external image signal. The predetermined screen (including a video) is turned on by the video signal electrode or the like which is applied.

After manufacturing of such a flat panel display device, such as a TFT-LCD, the electrode of the probe assembly is contacted with a pad electrode of the flat panel display device to apply an electric signal to check whether the flat display device is normal and to display a defective display device. We are in the process of removing the test early.

Such a flat panel display device is tested using a probing apparatus having a probe assembly, and the probe assembly of the probing apparatus is a needle type, a blade type, a film type, or the like. It is developed and used in various forms.

However, recently, as the flat panel display device is highly integrated, the line width of the pattern of the flat panel display device is extremely small.

Accordingly, there is an urgent need to develop a probe assembly capable of coping with fine pitch of a flat panel display device and having excellent reproducibility and productivity.

Disclosure of Invention An object of the present invention is to provide a method for manufacturing a flat panel display inspection probe capable of actively responding to a fine pitch of a flat panel display device pattern by using a MEMS process, a probe according thereto, and a probe assembly having the same.

Another object of the present invention is to provide a method for manufacturing a probe for inspecting a flat panel display device having excellent reproducibility and productivity by using a MEMS process, a probe according thereto, and a probe assembly having the same.

1A to 1P are cross-sectional views illustrating a method of manufacturing a probe for inspecting a flat panel display device according to a first embodiment of the present invention.

2A to 2I are cross-sectional views illustrating a method of manufacturing a probe for inspecting a flat panel display device according to a second exemplary embodiment of the present invention.

3A to 3T are cross-sectional views illustrating a method of manufacturing a probe for inspecting a flat panel display device according to a third exemplary embodiment of the present invention.

4 is a perspective view illustrating a method of manufacturing a probe for inspecting a flat panel display device according to a fourth exemplary embodiment of the present invention.

5A is an exploded perspective view illustrating a probe according to an embodiment of the present invention, and FIG. 5B is a cross-sectional view.

6 is a perspective view for explaining a probe assembly according to an embodiment of the present invention.

7 is a cross-sectional view illustrating a probe assembly according to an embodiment of the present invention.

According to an aspect of the present invention, there is provided a method of fabricating a flat panel display probe, the method including: forming a first passivation layer pattern on a sacrificial substrate, the first protective layer pattern defining a region where a plurality of contacts spaced apart from each other by a predetermined interval are formed; Forming a conductive film filling an open portion of the first passivation layer pattern on the sacrificial substrate on which the first passivation layer pattern is formed; Removing the first passivation layer pattern to form a contact made of the conductive layer on the sacrificial substrate; Forming a second passivation layer pattern defining a central portion of the contact on the sacrificial substrate on which the contact is formed; Forming an insulating plate by filling an insulating material in the second passivation layer pattern; Forming a third passivation layer pattern on a rear surface of the sacrificial substrate to define a central portion of the contact; Forming a trench to open a contact formed on the front surface of the sacrificial substrate by performing an etching process on the back surface of the sacrificial substrate using the third passivation pattern as a mask; Inserting a reinforcement plate into the trench; Removing the second passivation layer pattern and the third passivation layer pattern; And removing the sacrificial substrate to complete the probe.

Here, the first passivation layer pattern, the second passivation layer pattern, and the third passivation layer pattern may use a photoresist, and a nickel (Ni) or nickel alloy material may be used as the conductive layer.

Further, before the first protective layer pattern is formed on the sacrificial substrate, a process of forming a seed layer on the sacrificial substrate may be further performed, and then the conductive layer may be formed by plating.

In addition, the insulating plate may be made of epoxy, and grinding the rear surface of the sacrificial substrate to a predetermined thickness before forming a third passivation layer pattern defining a center portion of the contact on the rear surface of the sacrificial substrate. The process can be carried out further.

The trench may be formed by Reactive Ion Etching (RIE), and the reinforcement plate may be made of a ceramic material.

In addition, the first passivation layer pattern may define a region where the contact body is to be formed and simultaneously define a region where the alignment key is to be formed, thereby simultaneously forming the contact body and the alignment key on the sacrificial substrate. .

In this case, after preparing the specific sacrificial substrate and the other specific sacrificial substrate from which the second passivation pattern and the third passivation layer pattern are removed, the specific sacrificial substrate is overlapped with the specific sacrificial substrate and another specific sacrificial substrate based on the alignment key. The contact of the probe embodied on another specific sacrificial substrate is vertically positioned between the contact of the probe embodied on and the contact of the probe, and the end of the contact of the probe located on the upper side is lower than the end of the probe It can be formed in a multilayer projecting in the horizontal direction.

In addition, by removing the sacrificial substrate, the prepared specific probe and another specific probe are prepared and attached to overlap each other, such that the contact of the other specific probe is vertically positioned between the contact of the specific probe and the contact. An end of the contact body of the probe to be positioned may be formed in a multi-layer protruding in the horizontal direction than the end of the probe located below.

In addition, another method of manufacturing a probe for inspecting a flat panel display device according to the present invention may include forming a first passivation layer pattern on a sacrificial substrate, the first protective layer pattern defining a region in which a plurality of contacts spaced apart from each other by a predetermined interval are formed; Forming a conductive layer filling an open portion of the first passivation layer pattern on the sacrificial substrate on which the first passivation layer pattern is formed; Removing the first passivation layer pattern on the sacrificial substrate on which the conductive layer is formed; Forming a second passivation layer pattern on the sacrificial substrate from which the first passivation layer pattern is removed to openly define a central portion of the conductive layer; Inserting and reinforcing a reinforcing plate inside an opening of the second passivation pattern; And forming a contact body made of the conductive film by removing the second passivation layer pattern and the sacrificial substrate.

Here, after forming a seed layer on the sacrificial substrate prior to forming the first passivation pattern on the sacrificial substrate, the conductive layer may be formed by plating.

After removing the sacrificial substrate, a process of attaching the insulating plate to the center of the rear surface of the contact may be further performed.

In addition, by removing the sacrificial substrate, the prepared specific probe and another specific probe are prepared and attached so as to overlap each other so that the contact of the other specific probe is vertically positioned between the contact of the specific probe and the contact. An end of the contact body of the probe to be positioned may be formed in a multi-layer protruding in the horizontal direction than the end of the probe located below.

In addition, another method of manufacturing a probe for inspecting a flat panel display device according to the present invention may include forming a first passivation layer pattern on a sacrificial substrate, the first protective layer pattern defining a region in which a plurality of contacts spaced apart from each other by a predetermined interval are formed; Forming a trench on a sacrificial substrate by performing an etching process using the first passivation layer pattern as a mask; Forming a second passivation layer pattern defining the trench region on the sacrificial substrate on which the trench is formed; Forming a conductive layer on the sacrificial substrate, the conductive layer filling the open portion of the second passivation layer pattern; Forming a second passivation layer pattern defining a central portion of the conductive layer on the sacrificial substrate on which the conductive layer is formed; Forming an insulating plate by filling an insulating material in the second passivation layer pattern; Forming a third passivation layer pattern on a rear surface of the sacrificial substrate to define a center portion of the conductive layer; Forming another trench to open a conductive film formed on the entire surface of the sacrificial substrate by performing an etching process on the back surface of the sacrificial substrate using the third passivation layer pattern as a mask; Inserting a reinforcement plate into the trench; Removing the second passivation layer pattern and the third passivation layer pattern; And removing the sacrificial substrate to complete a probe including a contact body.]

Here, the first passivation layer pattern, the second passivation layer pattern, and the third passivation layer pattern may use a photoresist, and the trench may be performed by dry etching.

In addition, nickel (Ni) or a nickel alloy material may be used as the conductive film.

In addition, after the trench is formed on the sacrificial substrate, the seed layer may be further formed on the sacrificial substrate, and then the conductive layer may be formed by plating. Epoxy).

In addition, before the third passivation layer pattern is formed on the back side of the sacrificial substrate, a grinding process of grinding the back side of the sacrificial substrate to a predetermined thickness may be further performed to adjust the etching depth of the subsequent trench formation process.

In addition, the trench into which the reinforcement plate is inserted may be formed by Reactive Ion Etching (RIE), and the reinforcement plate may be made of a ceramic material.

In addition, the first protective layer pattern is formed in a shape that defines a region where the contact is to be formed and simultaneously defines a region where an align key is to be formed, thereby forming the alignment key in addition to the trench in which the contact is formed on the sacrificial substrate. The trenches to be formed can be formed at the same time.

In this case, after preparing the specific sacrificial substrate and the other specific sacrificial substrate from which the second passivation pattern and the third passivation layer pattern are removed, the specific sacrificial substrate is overlapped with the specific sacrificial substrate and another specific sacrificial substrate based on the alignment key. The contact of the probe embodied on another specific sacrificial substrate is vertically positioned between the contact of the probe embodied on and the contact of the probe, and the end of the contact of the probe located on the upper side is lower than the end of the probe It can be formed in a multilayer projecting in the horizontal direction.

The probe for inspecting a flat panel display device according to the present invention is characterized in that a plurality of contact members arranged in a line are spaced apart by a predetermined distance from the lower part of the reinforcing plate by an adhesive means.

In this case, an insulating plate may be further attached to the back of the contact.

Then, the probe is overlapped in a plurality of layers by the contact means so that the contact of the other specific probe is vertically positioned between the contact and the contact of the specific probe, and the end of the contact of the probe located at the upper It may be formed as a multi-layer protruding in the horizontal direction than the end of the probe to be located.

In addition, the probe assembly for inspecting a flat panel display device according to the present invention may be connected to a probe block fixed to a lower surface of a contact member in direct contact with an inspection portion of a test object, a probe holder fixing the probe block, and a probe force to a physical force. In the probe assembly for inspecting a flat panel display device having a manipulator to allow the probe block to flow up and down, the probe block is formed with an inclined surface inclined at a predetermined angle to the inside of the probe block. A probe having a reinforcing plate is further provided at an upper center of the plurality of contacts arranged in a line at predetermined intervals on an inclined surface, and one end of the contact is connected to a tape carrier package (TCP).

Here, the probe block and the probe may be adhered to each other by an adhesive, and the contacts of the probe may be connected to each other through a TCP (Tape Carrier Package) and a guide film.

The probe attached to the probe block may be formed of two or more layers.

In this case, the contact of the probe consisting of the two or more layers are vertically positioned between the contact of the probe located on the lower side, the end of the contact of the probe located on the lower end of the contact of the probe located on the top It can protrude more horizontally.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A to 1P are cross-sectional views illustrating a probe for inspecting a flat panel display device according to an exemplary embodiment of the present invention.

The probe for inspecting a flat panel display device according to the present invention may be a seed layer having a predetermined thickness by a deposition process such as sputtering on a sacrificial substrate 10 such as silicon. : 16) and coating the first photoresist 18, which functions as a protective film, on the seed layer 16 at a predetermined thickness.

At this time, the seed layer 60 may be formed of a titanium layer (Ti layer: 12) and a copper layer (Cu layer: 14) of 5,000 Å thickness, the copper layer 14 in the subsequent plating process It functions substantially as the seed layer 16, and the titanium layer 12 is formed to improve the adhesion between the sacrificial substrate 10 and the copper layer 14.

Next, as shown in FIG. 1B, a first photoresist pattern 20 is formed to define a predetermined area for forming an alignment key with the contact in a subsequent process.

In this case, the first photoresist pattern 20 uses a mask in which a predetermined circuit pattern is formed to form an alignment key with a contact for the first photoresist 18 formed on the sacrificial substrate 10. It can form by exposing and developing.

Subsequently, as shown in FIG. 1C, conductive materials such as nickel (Ni) and nickel alloys (Ni-Co and Ni-W-Co) may be formed on the sacrificial substrate 10 having the first photoresist pattern 20 formed thereon. After the deposition by plating to form the conductive film 22, the top surface of the sacrificial substrate 10 is planarized.

In this case, the planarization process may use methods such as chemical mechanical polishing (CMP) and grinding (Grinding), and the copper layer of the seed layer 16 during the plating process for forming the conductive film 22. 14 functions as a seed of the plating material.

In particular, when the plating process for forming the conductive film 22 is ideally performed and the conductive film 22 is formed only in the open portion of the first photoresist pattern 20, the planarization process may be omitted.

In the case where the conductive film 22 is used in a method other than a plating process, that is, a physical vapor deposition (PVD) or chemical vapor deposition (CVD), the seed layer 16 may be omitted.

Next, as shown in FIG. 1D, the contact 24 and the alignment keys 26a and 26b are formed by exposing a portion of the copper layer 14 by removing the first photoresist pattern 20. In this case, the first photoresist pattern 20 may be removed by a method such as wet etching or dry etching using chemical.

Subsequently, as shown in FIG. 1E, the seed layer 16 composed of the copper layer 14 and the titanium layer 12 exposed by the removal of the first photoresist pattern 20 is integrated with the contact member 24. Using the inkeys 26a and 26b as a mask, the contact 24 and the alignment keys 26a and 26b are completely exposed to the outside by removal by a method such as wet etching using chemicals.

Next, as shown in FIG. 1F, a predetermined amount of the second photoresist 28 is coated on the sacrificial substrate 10 having the contact 24 and the alignment keys 26a and 26b completely exposed to the outside.

In this case, the second photoresist 28 is positioned on the spin chuck to rotate the sacrificial substrate 10 and rotates the sacrificial substrate 10 on the sacrificial substrate 10 through a nozzle. The second photoresist 28 may be sprayed and coated.

Subsequently, as shown in FIG. 1G, a mask having a predetermined circuit pattern is positioned on the sacrificial substrate 10 coated with the second photoresist 28, and then exposed and developed to expose the center portion of the contact 24. And the second photoresist pattern 30 which completely opens the alignment keys 26a and 26b.

Next, as shown in FIG. 1H, a reinforcing plate 32 is formed by closing an insulating material such as epoxy in the center of the contact member 24 opened by the second photoresist pattern 30.

In this case, the epoxy used as the reinforcing plate 32 may be formed using a printing method.

Subsequently, as illustrated in FIG. 1I, the top surface of the sacrificial substrate 10 having the center portion of the contact body 24 closed by the reinforcing plate 32 made of an insulating material such as epoxy is ground to a predetermined thickness to be flattened.

In this case, the grinding process is performed to easily perform the subsequent grinding process of the back surface of the sacrificial substrate 10.

Next, after turning the sacrificial substrate 10 as shown in FIG. 1J, the back surface of the sacrificial substrate 10 is ground to a predetermined thickness so that the etching depth of the sacrificial substrate 10 is adjusted to be lower during the subsequent trench forming process. .

Subsequently, as shown in FIG. 1K, the third photoresist 34 is coated to a predetermined thickness on the back surface of the sacrificial substrate 10 ground to a predetermined thickness.

In this case, the third photoresist 34 is coated by the same method as the first photoresist 18 and the second photoresist 28.

Subsequently, as illustrated in FIG. 1L, the third photoresist 34 is exposed using a mask embodying a predetermined circuit pattern, and then developed, thereby developing a third photoresist pattern 36 which opens the rear center portion of the sacrificial substrate 10. ).

Next, as shown in FIG. 1M, the etching process is performed using the third photoresist pattern 36 as a mask to completely etch the seed layer 16 to expose the sacrificial substrate 10. ).

In this case, the etching process is a dry etching process using a mixed gas in which SF ₆ , C ₄ F ₈ and O ₂ gas is mixed at a predetermined ratio.

In more detail, the etching process is performed by a known Reactive Ion Etching (RIE) called a Bosch process as one of deep trench etching methods.

Subsequently, as shown in FIG. 1N, a predetermined amount of epoxy used as the adhesive 40 is injected into the trench 38 formed on the rear surface of the sacrificial substrate 10, and then a reinforcement plate 42 made of a ceramic plate having a predetermined size is used. ) Is press-inserted into the trench 38 to embed the reinforcing plate 42 in the trench 38.

Subsequently, as shown in FIG. 1O, the reinforcing plate 42, the insulating plate 32, and the contact body 24 are opened to the outside by removing the second photoresist pattern 30 and the third photoresist pattern 36. .

In this case, the second photoresist pattern 30 and the third photoresist pattern 36 are removed by wet etching or dry etching using chemicals.

Lastly, as shown in FIG. 1P, the center portion of the contact body 32 is insulated by the insulating plate 24 by wet etching the sacrificial substrate 10 using chemicals, and the center portion of the upper surface of the contact body 32 is reinforced. The probe supported by 42 is completed.

At this time, the alignment keys 26a and 26b and the remaining seed layer 16 are removed.

2A to 2I are cross-sectional views illustrating a method of manufacturing a probe for inspecting a flat panel display device according to a second exemplary embodiment of the present invention.

A method for manufacturing a flat panel display inspection probe according to a second embodiment of the present invention is predetermined by a deposition process such as sputtering on a sacrificial substrate 50 such as (Silicon) as shown in FIG. 2A. A thick seed layer 56 is formed, and a first photoresist 58 functioning as a protective film is coated on the seed layer 56 at a predetermined thickness.

In this case, the seed layer 56 may be formed of a titanium layer (Ti layer: 52) and a copper layer (Cu layer: 54), and the copper layer 54 substantially functions as a seed in a subsequent plating process. The titanium layer 52 is formed to improve the adhesion between the sacrificial substrate 50 and the copper layer 54.

Next, as shown in FIG. 2B, a first photoresist pattern 60 defining a predetermined region for forming a contact body in a subsequent process is formed.

In this case, the first photoresist pattern 60 includes a mask on which a predetermined pattern for forming a contact body is formed on the first photoresist 58 formed on the sacrificial substrate 50 in a subsequent process. It can form by exposing and developing after that.

Subsequently, as shown in FIG. 2C, conductive materials such as nickel (Ni) and nickel alloys (Ni-Co and Ni-W-Co) may be formed on the sacrificial substrate 50 on which the first photoresist pattern 60 is formed. After the deposition by plating to form a conductive film 62 to be used as a precursor, the top surface of the sacrificial substrate 50 is planarized.

In this case, the planarization process may use methods such as chemical mechanical polishing (CMP) and grinding (Grinding), and the copper layer 54 of the plating process for forming the conductive layer 62 may be a seed of a plating material. Seed). In particular, when the plating process for forming the conductive film 62 is ideally performed and the conductive film 62 is formed only inside the open portion of the first photoresist pattern 60, the planarization process may be omitted. In the case where the conductive film 62 is used in a method other than a plating process, that is, a physical vapor deposition (PVD) or chemical vapor deposition (CVD), the seed layer 56 may be omitted.

Next, as shown in FIG. 2D, the second photoresist pattern 60 is removed and then etched using the conductive layer 62 formed inside the open portion of the second photoresist pattern 60 as a self-aligning mask. By performing the process, the seed layer 56 including the copper layer 54 and the titanium layer 52 remaining under the second photoresist pattern 60 is removed.

In this case, the second photoresist pattern 60 may be removed by a wet or dry etching method, and the seed layer 56 may also be removed by a wet or dry etching method.

Subsequently, as shown in FIG. 2E, a predetermined amount of the third photoresist 64 is coated on the sacrificial substrate 50 from which the second photoresist pattern 60 is removed.

In this case, the third photoresist 64 may be coated by a general photoresist spin coating method.

Next, as shown in FIG. 2F, a mask having a predetermined pattern is positioned on the sacrificial substrate 50 coated with the third photoresist 64, and then exposed and developed to form a conductive film 62 used as a contact. A third photoresist pattern 66 is formed to open the central portion of the backsheet.

Subsequently, as shown in FIG. 2G, a predetermined amount of an adhesive 67 such as epoxy is introduced into the open portion opened by the third photoresist pattern 66, and then the third photoresist pattern 66 is introduced into the open portion. A reinforcing plate 68 of a ceramic or insulating material having a predetermined size is inserted into the open portion opened by the insert.

Next, as shown in FIG. 2H, the contact body including the reinforcing plate 68 and the conductive film 62 is opened to the outside by removing the third photoresist pattern 66.

Lastly, as shown in FIG. 2I, the sacrificial substrate 50 having the reinforcing plate 68 and the contact member 70 open to the outside and the seed layer 56 under the conductive layer 62 are wet-etched or the like. The probe provided with the contact body 62 is completed by removing it.

In this case, the seed layer 56 and the sacrificial substrate 50 formed of the copper layer 52 and the titanium layer 54 may be sequentially removed by a series of wet etching processes using different chemicals.

In addition, a process of attaching the insulating plate 69 made of an insulator such as epoxy to the back of the contact body 62 of the completed probe is additionally performed.

3A to 3T are perspective views illustrating a method of manufacturing a probe for inspecting a flat panel display device according to a third embodiment of the present invention.

In the method of manufacturing a flat panel display inspection probe according to a third exemplary embodiment of the present invention, as illustrated in FIG. 3A, the first photoresist 202 is coated on a sacrificial substrate 200 such as silicon. .

In this case, the first photoresist 202 may be coated by a known photoresist spin coating method.

Next, as shown in FIG. 3B, a first photoresist pattern 204 is formed to define the shape of the alignment key and the contact by performing a subsequent process inside the sacrificial substrate 200.

In this case, the first photoresist pattern 204 may be formed by aligning a predetermined mask on the sacrificial substrate 200, and then exposing and developing the mask.

Subsequently, as illustrated in FIG. 3C, an etching process is performed using the first photoresist pattern 204 on the sacrificial substrate 200 as a mask to form alignment keys and contacts in the sacrificial substrate 200. First trenches 206a and 206b and second trenches 208 are formed, respectively.

In this case, the first trenches 206a and 206b and the second trench 208 forming process may be performed by a dry etching process using a reaction gas.

Next, as shown in FIG. 3D, after removing the first photoresist pattern 204 on the sacrificial substrate 200 on which the first trenches 206a and 206b and the second trench 208 are formed, sputtering or the like is performed. A seed layer 214 having a predetermined thickness is formed by the deposition process.

In this case, the seed layer may be made of a 500 500 titanium layer (Ti layer: 210) and 5,000 Å copper layer (Cu layer: 212), the copper layer 212 is substantially seeded in a subsequent plating process It functions as the layer 214, and the titanium layer 212 is formed to improve the adhesion between the sacrificial substrate 200 and the copper layer 212.

Next, as shown in FIG. 3E, a predetermined amount of the second photoresist 216 is coated on the sacrificial substrate 200 on which the seed layer 214 is formed.

In this case, the second photoresist 216 may be formed by a known photoresist spin coating method.

Subsequently, as illustrated in FIG. 3F, a region in which the first trenches 206a and 206b and the second trenches 208 are formed is defined by exposing and developing the second photoresist 216 formed on the sacrificial substrate 200. The second photoresist pattern 218 is formed.

Next, as illustrated in FIG. 3G, a conductive material such as nickel (Ni) and nickel alloys (Ni-Co, Ni-W-Co) is plated on the sacrificial substrate 200 on which the second photoresist pattern 218 is formed. By depositing to form a conductive film 220.

At this time, the copper layer 212 of the seed layer 214 during the plating process for forming the conductive film 220 functions as a seed of the plating material.

Next, as illustrated in FIG. 3H, the top surface of the sacrificial substrate 200 on which the conductive film 220 is formed is planarized. In this case, the planarization process of the upper surface of the sacrificial substrate 200 may use a method such as chemical mechanical polishing (CMP) and grinding (Grinding).

In addition, when the plating process for forming the conductive film 220 is ideally performed and the conductive film 220 is formed only inside the open portion of the second photoresist pattern 218, the planarization process may be omitted.

Subsequently, as illustrated in FIG. 3I, a predetermined amount of the third photoresist 222 is coated on the sacrificial substrate 200 on which the planarization process is completed.

In this case, the third photoresist 222 may be coated by a known photoresist spin coating method.

Subsequently, as illustrated in FIG. 3J, a third photoresist pattern 224 is formed to open a central portion of the conductive film 220 formed on the sacrificial substrate 200.

In this case, the third photoresist pattern 224 may be formed by an exposure and development process using a mask.

Next, as shown in FIG. 3K, the insulating plate 226 is formed by filling an insulating material such as epoxy in the open portion opened by the third photoresist pattern 224.

Subsequently, as illustrated in FIG. 3L, the top surface of the sacrificial substrate 200 on which the insulating plate 226 is formed is planarized. In this case, the planarization process may use methods such as chemical mechanical polishing (CMP) and grinding (Grinding).

Subsequently, as shown in FIG. 3M, the sacrificial substrate 200 is turned upside down and the back surface of the sacrificial substrate 200 is ground to a predetermined thickness. The grinding process is performed to adjust the etching height of the sacrificial substrate 200 during the subsequent trench formation process.

Subsequently, as illustrated in FIG. 3N, a fourth photoresist 228 having a predetermined thickness is coated on the rear surface of the sacrificial substrate 200 on which the grinding process is performed. In this case, the fourth photoresist 228 may be formed by a known photoresist coating method.

Next, as shown in FIG. 3O, the fourth photoresist 228 formed on the sacrificial substrate 200 is exposed and developed to open the rear center of the sacrificial substrate 200, that is, the center of the conductive film 220. The fourth photoresist pattern 230 is formed.

Subsequently, as illustrated in FIG. 3P, an etching process is performed using the fourth photoresist pattern 230 as a mask to form a trench 232 that opens the conductive layer 220 on the back surface of the sacrificial substrate 200. . In this case, the etching process is a dry etching process using a mixed gas in which SF ₆ , C ₄ F ₈ and O ₂ gas is mixed at a predetermined ratio.

In more detail, the etching process is performed by a known reactive ion etching (RIE) called a bosch process as one of the tip trench etching methods.

Subsequently, a predetermined amount of epoxy used as the adhesive 234 is introduced into the trench 232 formed on the rear surface of the sacrificial substrate 200, as shown in FIG. 3q, and then a reinforcing plate 236 made of ceramic having a predetermined size is formed. The reinforcement plate 236 is embedded in the trench 232 by press-inserting the inside of the trench 232.

Next, as shown in FIG. 3R, the reinforcing plate 236 flattens the rear surface of the sacrificial substrate 200 embedded in the trench 232.

In this case, the planarization process may use a chemical mechanical polishing (CMP) or grinding process.

Subsequently, as shown in FIG. 3S, the third photoresist pattern 224 and the fourth photoresist pattern 230 and the seed layer 214 are removed.

Finally, as illustrated in FIG. 3T, the sacrificial substrate 200 is etched away to provide a reinforcing plate 236 by the adhesive 234 on the contact 238, and an insulating plate below the contact 238. Complete the provided probe.

4 is a perspective view illustrating a method of manufacturing a probe for inspecting a flat panel display device according to a fourth exemplary embodiment of the present invention.

In the method for manufacturing a flat panel display inspection probe according to the present invention, the first sacrificial substrate 70 and the second sacrificial substrate 72 or the second embodiment in which the contact body shown in FIG. Example of a first sacrificial substrate 70 and a second sacrificial substrate 72 with the contact shown in FIG. 2F fully open to the outside or a first sacrificial substrate with the contact shown in FIG. 3S of the third embodiment fully open to the outside The substrate 70 and the second sacrificial substrate 72 are prepared, respectively.

At this time, the alignment key 78, the insulating plate 74 and the contact member 76 are exposed to the outside on the first sacrificial substrate 70 and the second sacrificial substrate 72 of the first and third embodiments, respectively. The reinforcing plate 74 and the contact body 76 are exposed to the outside on the first sacrificial substrate 70 and the second sacrificial substrate 72 of the second embodiment.

Next, the first sacrificial substrate 70 and the second sacrificial substrate 72 of the first and third embodiments are based on the align key 78 or the second embodiment (the align key is not formed). ) Is visually matched with the insulating plate 74 of the first sacrificial substrate 70 and the second sacrificial substrate 72, and then attached to each other using an adhesive.

In this case, each of the plurality of contacts 76 formed on the second sacrificial substrate 72 is disposed in the space between the plurality of contacts 76 formed on the first sacrificial substrate 70 and the contact 76. By vertically positioning the contact 76 of the second sacrificial substrate 72 is positioned vertically between the contact 76 and the contact 76 of the first sacrificial substrate 70, the second sacrificial substrate An end of the contact body 76 of 70 is formed in a multi-layer protruding in a horizontal direction than the end of the contact body 76 of the first sacrificial substrate 70.

Thereafter, the first and second sacrificial substrates 70 and 72 are removed by wet etching as described above in the first, second and third embodiments, thereby stacking the probe and the probe. Multilayer probes can be produced.

In this case, the present embodiment has been described as being limited to a two-layered probe, but it will be obvious that a multilayer probe having three or more layers can be manufactured according to the manufacturer.

5A is a perspective view illustrating a probe for inspecting a flat panel display device according to an exemplary embodiment of the present invention, and FIG. 5B is a cross-sectional view.

In the probe according to the present invention, as shown in FIGS. 5A and 5B, the insulating plates 84 and 96 formed on the first probe 80 and the second probe 90 are attached to each other by an adhesive means such as an adhesive. The first probe 80 and the second probe 90 are stacked in a double structure.

In this case, the first probe 80 and the second probe 90 may be a plurality of contact members 82 and 92 spaced apart a predetermined distance in the horizontal direction under the reinforcement plates 86 and 98 made of a material such as ceramic. It is attached by adhesives 84 and 94 such as, and the insulating plates 84 and 96 made of an insulating material such as epoxy are attached to the lower center of the contact bodies 82 and 92.

In more detail, the specific contact 92 of the second probe 90 is perpendicular to each other in the space between the specific contact 82 of the first probe 80 and another neighboring specific contact 82, respectively. By positioning, the spacing between the contact body 82 and the contact body 92 of the multilayer probe is extremely tightly controlled.

In addition, the ends of the contact bodies 92 of the second probe 90 are stacked to protrude a predetermined length in the horizontal direction than the ends of the contact bodies 82 of the first probe 80.

In another embodiment, the reinforcing plates 88 and 98 formed on the first probe 80 and the second probe 90 are attached to each other by an adhesive means such as the first probe 80 and the second probe. It is also possible to produce a structure in which 90 is stacked in two layers.

In another embodiment, the insulating plates 84 and 96 of the first probe 80 or the second probe 90 and the reinforcement plates 88 and 98 of the first probe 80 or the second probe 90 may be removed. The first probe 80 and the second probe 90 may be attached to each other by an adhesive means such as an adhesive, and may be manufactured in a double stacked structure.

Therefore, the multilayer probe having a structure in which the first probe 80 and the second probe 90 are stacked is mounted on a probe assembly (not shown) to check whether the flat panel display device is completed by a series of processes. Will be tested.

At this time, one end of the contact body (82, 92) of the probe is in contact with the inspection portion of the flat panel display element, that is, the pad electrode and the other end is connected to the Tape Carrier Package (TCP) connected to the drive chip (flat chip display) It checks whether the device is normal.

FIG. 6 is a perspective view illustrating a probe assembly having a probe for inspecting a flat panel display device according to the present invention as described above, and FIG. 7 is a cross-sectional view thereof.

6 and 7, the probe assembly according to the present invention includes a multilayer probe having a structure in which a first probe (not numbered) and a second probe (not numbered) as shown in FIG. 5 are stacked. The inner side is fixed to the bottom of the probe block (Probe block: 110) having a predetermined angle inclined surface.

As described above, the multilayer probe having the laminated structure has a structure in which the insulating plates 92 and 93 formed on the first probe and the second probe are attached to each other by an adhesive means such as an adhesive.

In this case, the first probe and the second probe have a plurality of contact members 93 and 104 spaced apart at predetermined intervals in the horizontal direction under the reinforcing plates 96 and 102 made of a material such as ceramics. 103, and the insulating plates 92 and 106 made of an insulating material such as epoxy are attached to the lower center of the contact bodies 93 and 104.

In more detail, the specific contact 104 of the second probe is vertically positioned in a space between the specific contact 93 of the first probe and another neighboring specific contact 93 so that the multi-layer probe The gap between the contact 93 and the contact 104 is extremely tightly adjusted.

The end of the contact body 104 of the second probe is laminated so as to protrude a predetermined length in the horizontal direction than the end of the contact body 93 of the first probe.

In addition, the stacked structures of the probes are fixed to each other by an attachment fixing means such as an adhesive or a fixing screw on the inclined surface of the probe block 110, the probe block 110 is acrylic (Acryle) and the like to secure transparency It can also be made of a transparent material.

That is, the probes fixed to the inclined surface of the probe block 110 may be fastened to each other by a fixing screw fastened to the probe block 110 by using an adhesive or penetrating the probe.

In addition, a first interface board 112 is positioned on the probe block 110, and a probe holder 116 is positioned on the first interface board 112 and fastened to each other by a fixing screw 118. have.

At this time, the first interface board 112 and the probe holder 116 are fastened to each other by being fastened to each other by the fixing pin 122.

In addition, the second interface board 114 is fastened to the lower surface of the first interface board 112 in the probe block 110 by the fixing pin 120, and the second interface board 114 is fixed. TCP (Tape Carrier Package: 124) is attached and fixed to the lower side.

Here, the connection relation between one end of the contacts 93 and 104 of the multilayer probe attached to the inclined surface of the probe block 110 and the TCP 124 will be described in more detail. One end is guided through a hole (not numbered) formed in the guide film 126 and connected to a pattern implemented in the TCP 124.

In addition, the probe holder 116 and the menu plater 128 are fastened to each other by the fixing screw 132, and the probe holder 116 connected to the menu plater 128 has a vertical force F of a test process. ) Can flow up and down.

In more detail, one side of the probe holder 116 and the other side of the menu plate 128 are fastened to each other by a guide rail 130, and the probe holder 116 and the upper and lower physical force F of the test process. The first interface board 112 and the probe block 110 connected to each other may flow upward and downward.

In particular, a spring 134 having a predetermined elastic force is installed in the periphery of the fixing screw 132 connecting the probe holder 116 and the menu plate 128 to flow up and down by the vertical force F of the test process. The first interface board 112 and the probe block 110 connected to the probe holder 116 are restored to their original positions by the elastic force of the spring 134.

Therefore, after the flat panel display device manufactured by performing a series of flat panel display device manufacturing processes is moved to the probing apparatus, the probe block 40 is moved up and down by other moving means, and the predetermined electrode pad of the flat panel display device is moved. Applying a physical force (F) to perform an electrical test process for the flat panel display device.

In this case, the contacts 93 and 104 of the multi-layered probe under the probe block 40 are in contact with the electrode pad of the flat panel display device, and the electrical signal applied from the probing device is a TCP (Tape Carrier Package) 124. It is applied to the electrode pad of the flat panel display device through the contact (93, 104) of the probe through.

According to the present invention, by implementing a probe having a plurality of contacts by the MEMS (Micro Electro Mechanical System) technology including a photolithography process that can form a pattern and the gap between the patterns extremely densely Recently, there is an effect that can actively cope with the fine pitch of the highly integrated flat panel display device.

In addition, the use of MEMS technology has the effect of mass production of reproducible products.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made within the spirit of the present invention, and it is obvious that such changes and modifications belong to the appended claims.

Claims (35)

Forming a first passivation layer pattern on a sacrificial substrate, the first passivation layer pattern defining a region in which a plurality of contacts spaced apart from each other by a predetermined interval are formed; Forming a conductive film filling an open portion of the first passivation layer pattern on the sacrificial substrate on which the first passivation layer pattern is formed; Removing the first passivation layer pattern to form a contact made of the conductive layer on the sacrificial substrate; Forming a second passivation layer pattern defining a central portion of the contact on the sacrificial substrate on which the contact is formed; Embedding an insulating material in a central portion of the open contact to form an insulating plate; Forming a third passivation layer pattern on a rear surface of the sacrificial substrate to define a central portion of the contact; Forming a trench to open a contact formed on the front surface of the sacrificial substrate by performing an etching process on the back surface of the sacrificial substrate using the third passivation pattern as a mask; Inserting a reinforcement plate into the trench; Removing the second passivation layer pattern and the third passivation layer pattern; And Removing the sacrificial substrate to complete a probe; Method of manufacturing a flat display device inspection probe comprising a. The method of claim 1, wherein the first passivation layer pattern, the second passivation layer pattern, and the third passivation layer pattern use a photoresist. The method of claim 1, wherein a nickel (Ni) or a nickel alloy material is used as the conductive film. The method of claim 1, further comprising forming a seed layer on the sacrificial substrate prior to forming the first passivation pattern on the sacrificial substrate, and then forming the conductive layer by plating. A method of manufacturing a probe for inspecting a flat panel display device. The method of claim 1, wherein the insulating plate is made of epoxy. The grinding process of claim 1, wherein a grinding process of grinding the rear surface of the sacrificial substrate is performed prior to forming a third passivation layer pattern defining a central portion of the contact on the rear surface of the sacrificial substrate. A method of manufacturing a probe for inspecting a flat panel display device. The method of claim 1, wherein the trench is formed by Reactive Ion Etching (RIE). The method of claim 1, wherein the reinforcing plate is made of a ceramic material. The method of claim 1, wherein the first passivation layer pattern is formed in a shape that defines a region where the contact is to be formed and simultaneously defines an area where an align key is to be formed, thereby simultaneously forming the contact and the align key on the sacrificial substrate. Method for manufacturing a flat panel display inspection probe characterized in that it is formed. The method of claim 9, Removing the second passivation layer pattern and the third passivation layer pattern; and completing the probe by removing the sacrificial substrate; As a step intervening between Preparing a first sacrificial substrate and a second sacrificial substrate formed by removing the third and fourth passivation layer patterns; The first sacrificial substrate and the second sacrificial substrate are overlapped with each other based on the alignment key so that the contact bodies of the probes implemented on the first and second sacrificial substrates are spaced up and down at regular intervals, and the first and second sacrificial substrates are positioned above each other. Forming a contact end of the probe to protrude from a contact end of the second probe located below; Method of manufacturing a probe for flat panel display device characterized in that it further comprises. The method of claim 1, Preparing a first probe and a second probe completed through the above steps; By attaching the first and second probes overlap each other, the contacts of the probes implemented on the respective probes are spaced up and down at regular intervals, and the contact ends of the first probes located at the top of the contacts are located below. Forming a protrusion to protrude from a contact end of the second probe; Method of manufacturing a probe for flat panel display device characterized in that it further comprises. Forming a first passivation layer pattern on a sacrificial substrate, the first passivation layer pattern defining a region in which a plurality of contacts spaced apart from each other by a predetermined interval are formed; Forming a conductive layer filling an open portion of the first passivation layer pattern on the sacrificial substrate on which the first passivation layer pattern is formed; Removing the first passivation layer pattern on the sacrificial substrate on which the conductive layer is formed; Forming a second passivation layer pattern on the sacrificial substrate from which the first passivation layer pattern is removed to openly define a central portion of the conductive layer; Inserting and reinforcing a reinforcing plate inside an opening of the second passivation pattern; And Forming a contact made of the conductive film by removing the second passivation layer pattern and the sacrificial substrate; Method of manufacturing a probe for flat panel display element comprising a. The method of claim 12, further comprising forming a seed layer on the sacrificial substrate before forming the first passivation pattern on the sacrificial substrate, and then forming the conductive layer by plating. A method of manufacturing a probe for inspecting a flat panel display device. The method of claim 12, wherein after the removal of the sacrificial substrate, a process of attaching an insulating plate to a center of a rear surface of the contact is further performed. The method of claim 12, Preparing a first probe and a second probe completed through the above steps; By attaching the first and second probes overlap each other, the contacts of the probes implemented on the respective probes are spaced up and down at regular intervals, and the contact ends of the first probes located at the top of the contacts are located below. Forming a protrusion to protrude from a contact end of the second probe; Method of manufacturing a probe for a flat panel display device characterized in that it further comprises. Forming a first passivation layer pattern on a sacrificial substrate, the first passivation layer pattern defining a region in which a plurality of contacts spaced apart from each other by a predetermined interval are formed; Forming a trench defining a contact on a sacrificial substrate by performing an etching process using the first passivation layer pattern as a mask; Forming a second passivation layer pattern defining a region in which the trench is formed on the sacrificial substrate; Forming a conductive film filling the open portion of the second protective film pattern; Forming a third passivation layer pattern on the sacrificial substrate to open a central portion of the conductive layer; Forming an insulating plate by filling an insulating material in an open portion of the third passivation layer pattern; Forming a fourth passivation layer pattern on a rear surface of the sacrificial substrate to open a portion corresponding to a center portion of the conductive layer; Forming a trench for opening the conductive layer on the back surface of the sacrificial substrate by performing an etching process using the fourth passivation layer pattern as a mask; Injecting an adhesive into the trench and embedding a reinforcing plate made of an insulating material on the adhesive; Removing the third and fourth passivation layer patterns; And Removing the sacrificial substrate to complete a probe including a contact; Method of manufacturing a flat display device inspection probe comprising a. 17. The method of claim 16, wherein the first, second, third, and fourth protective layer patterns use photoresist. 17. The method of claim 16, wherein the trench is performed by dry etching. 17. The method of claim 16, wherein nickel (Ni) or a nickel alloy material is used as the conductive film. The method of claim 16, wherein after forming a trench on the sacrificial substrate, and further performing a process of forming a seed layer on the sacrificial substrate, the conductive film is formed by plating. Method of manufacturing a probe for flat panel display device inspection. The method of claim 16, wherein the insulating plate is made of epoxy. 17. The probe for inspecting a flat panel display device according to claim 16, wherein a grinding process of grinding the back surface of the sacrificial substrate to a predetermined thickness is further performed before the fourth passivation layer pattern is formed on the back surface of the sacrificial substrate. Manufacturing method. 17. The method of claim 16, wherein the trench into which the reinforcing plate is inserted is formed by Reactive Ion Etching (RIE). 17. The method of claim 16, wherein the reinforcing plate is made of a ceramic material. The method of claim 16, wherein the first passivation layer pattern has a shape defining a region where the contact is to be formed and simultaneously defining a region where an align key is to be formed, in addition to the trench in which the contact is formed on the sacrificial substrate. A method of manufacturing a probe for inspecting a flat panel display device, characterized in that simultaneously forming a trench in which an alignment key is formed. The method of claim 25, Preparing a first sacrificial substrate and a second sacrificial substrate formed by performing the steps of removing the third and fourth passivation layer patterns; The first sacrificial substrate and the second sacrificial substrate are overlapped with each other based on the alignment key so that the contact bodies of the probes implemented on the first and second sacrificial substrates are spaced up and down by a predetermined distance, and the first sacrificial substrate is positioned above the first sacrificial substrate. Forming a contact end of the probe to protrude from a contact end of the second probe located below; Method of manufacturing a flat display device inspection probe comprising a. A probe for inspecting a flat panel display device, characterized in that a plurality of contacts arranged in a row spaced apart from the reinforcement plate by a predetermined interval are attached by an adhesive means. 28. The probe of claim 27, wherein an insulating plate is further attached to a rear surface of the contact. The method of claim 27, Is formed by overlapping a plurality of the probe, The insulation plates of the probes are attached to each other, and the contact bodies of the plurality of probes are spaced apart by a predetermined interval up and down, and the contact ends of the probes located on the upper side of the probes protrude more than the contact ends of the probes on the lower side of the probe. Probe for inspecting flat panel display elements. Manipulator which is connected to the probe block which is in direct contact with the test part of the test object is fixed to the lower surface, the probe holder for fixing the probe block and the probe holder is connected to the probe holder so that the vertical flow of the probe block can be caused by the physical force In the probe assembly for inspecting a flat panel display device having a (Manuplator), The probe block has an inclined surface that is inclined at a predetermined angle inward, and a probe having a reinforcing plate is further provided at an upper center of the plurality of contacts arranged in a line at predetermined intervals on the inclined surface of the probe block. A probe assembly for inspecting a flat panel display device, which is connected to the Tape Carrier Package (TCP). The probe assembly of claim 30, wherein the probe block and the probe are adhered to each other by an adhesive. 31. The probe assembly of claim 30, wherein the probe block and the probe are fixed to each other by a fixing screw. 31. The probe assembly of claim 30, wherein the contacts of the probe are connected to each other through a tape carrier package (TCP) and a guide film. The probe assembly of claim 30, wherein the probe attached to the probe block comprises two or more layers and multiple layers. The probe according to claim 34, wherein the probe consisting of two or more layers, The contacts implemented on each of the probes are spaced apart by a predetermined interval up and down, The probe assembly of claim 1, wherein each of the probes is formed such that the contact end of the probe located above the protrusion protrudes from the contact end of the contact located below the probe.