KR100436577B1 - Manufacturing Method of anisortropic conductive adhesive films - Google Patents
Manufacturing Method of anisortropic conductive adhesive films Download PDFInfo
- Publication number
- KR100436577B1 KR100436577B1 KR10-2001-0067240A KR20010067240A KR100436577B1 KR 100436577 B1 KR100436577 B1 KR 100436577B1 KR 20010067240 A KR20010067240 A KR 20010067240A KR 100436577 B1 KR100436577 B1 KR 100436577B1
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- South Korea
- Prior art keywords
- resin
- conductive
- die
- anisotropic conductive
- conductive adhesive
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000002313 adhesive film Substances 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000002245 particle Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 239000004840 adhesive resin Substances 0.000 claims abstract description 13
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 12
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 12
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 238000001125 extrusion Methods 0.000 claims abstract description 3
- 239000008187 granular material Substances 0.000 claims abstract description 3
- 239000000155 melt Substances 0.000 claims abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
- B29C48/154—Coating solid articles, i.e. non-hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/005—Dendritic macromolecules
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
Abstract
본 발명은 다수의 미세 단자부들을 전기 접속하기 위한 이방성 도전필름 제조방법에 관한 것으로, 이방성 도전 접착 필름 제조방법에 있어서, (a) 열가소성 접착수지와 도전성 입자를 수지의 용융점 이상에서 용융 혼합하여 냉각 시킨 후 알갱이 형태로 단락시켜서 도전성 혼합물을 제조 공정과; (b) 상기 도전성 혼합물을 용융 압출시켜 일정한 형태의 다이에 연속 공급시키는 용융 압출 공정과; (c) 상기 다이로부터 압출되어 나온 수지를 이형필름상에 도포시킨 후 냉각시키는 도포 냉각공정을 거쳐서 제조된 것을 특징으로 한다.The present invention relates to an anisotropic conductive film manufacturing method for electrically connecting a plurality of fine terminal parts, in the anisotropic conductive adhesive film manufacturing method, (a) a thermoplastic adhesive resin and conductive particles are cooled by melting and mixing at or above the melting point of the resin And then shorting the granules to form a conductive mixture; (b) a melt extrusion process of melt extruding the conductive mixture to continuously supply the die to a die of a predetermined form; (c) The resin extruded from the die is coated on a release film, and then subjected to an application cooling process for cooling.
Description
본 발명은 다수의 미세 단자부들을 전기 접속하기 위한 이방성 도전필름 제조방법에 관한 것으로, 특히 액정표시장치의 단자부들을 전기 접속하기 위한 이방성 도전필름(이하, ACF ; anisortropic conductive adhesive films) 제조방법에 관한 것이다.The present invention relates to a method for manufacturing an anisotropic conductive film for electrically connecting a plurality of fine terminal parts, and more particularly to a method for manufacturing an anisotropic conductive film (hereinafter referred to as ACF) for electrically connecting terminal parts of a liquid crystal display device. .
소형이고 고성능의 전자 장치에 있어서는 회로 기판의 단자들을 접속하기 위해, 미세하고 조밀한 배선기구가 요구된다. 오늘날 ACF는 그러한 배선기구 중의 하나로서 유용하며, 접속부재로서의 역할을 하고 있다. ACF는 열가소성 및 열경화성 수지부와, 이 수지부내에 충분한 양으로 분산된 금속, 흑연 또는 그와 유사한 도전물질의 입자로서 구성된다. ACF를 접속하고자 하는 두 부분 사이에 위치시킨 후 가열 및 가압하여 ACF로 하여금 이 두 부분을 서로 접착시키도록 한다.In small and high-performance electronic devices, fine and compact wiring mechanisms are required to connect the terminals of the circuit board. Today ACF is useful as one of such wiring mechanisms and serves as a connecting member. The ACF consists of thermoplastic and thermoset resin portions and particles of metal, graphite or similar conductive materials dispersed in sufficient amounts in the resin portions. The ACF is placed between the two parts to be connected and then heated and pressurized to cause the ACF to bond the two parts together.
이 경우 도전입자는 서로 접촉하여, 압력이 가해지는 방향으로 도전부를 형성한다. 이와 동시에 수지부는 경화하여 상기 두 부분을 접착시킨다. 상기 압력이 가해지는 방향의 수직방향으로는 도전입자가 서로 산만하게 위치되어 전기적 절연을 유지한다.In this case, the conductive particles contact each other to form a conductive portion in a direction in which pressure is applied. At the same time, the resin portion is cured to bond the two portions. In the direction perpendicular to the direction in which the pressure is applied, the conductive particles are distracted from each other to maintain electrical insulation.
전술한 특성에 의해, ACF는 납땜이 곤란한 예컨데, 고밀도 인쇄회로기판의 단자부와 일군의 리드를 일시에 접속시키는 것이 요구되는 랜드 또는 다수의 미세한 단자부를 갖는 도트 매트릭스 타입의 표시장치 패널에 바람직하게 적용될 수 있다.Due to the above characteristics, the ACF is difficult to solder, for example, it is preferably applied to a display panel of a dot matrix type having a land or a plurality of fine terminal portions required to temporarily connect a terminal portion of a high density printed circuit board and a group of leads at a time. Can be.
그러나 종래의 ACF를 제조하는 방법에는 해결해야 할 문제점이 있는바, 그 내용은 하기와 같다.However, there is a problem to be solved in the conventional method for producing ACF, the contents are as follows.
즉, 종래에는 ACF를 생산하기 위해서 먼저 각종 수지와 도전입자 및 첨가제를 적절한 유기용에에 용해 및 분산시킨 후, 이 용액을 이형필름이나 기타 여러 기재 위에 코팅장치(예를들어, 콤마코터, 그라비아코어, 리버스코터, 타이코터 등)를 이용하여 도포한 후 건조기에서 열풍건조하는 방법을 사용하였다.That is, conventionally, in order to produce ACF, various resins, conductive particles, and additives are dissolved and dispersed in an appropriate organic solvent, and then the solution is coated on a release film or other substrates (eg, comma coater, gravure). Core, a reverse scotcher, a tie coater, etc.), and a method of hot air drying in a dryer was used.
이것은 첫째, 용액상태로 만들어진 코팅액의 저장안정성이 떨어져 제조 후에 즉시 사용해야 하는 단점이 있다.First, there is a disadvantage that the storage stability of the coating solution made in a solution state to be used immediately after manufacturing.
둘째, 많은 유기용제를 사용하기 때문에 이것을 처리하기 위해 많은 부가장치가 필요할 뿐만 아니라 횐경에 유해한 많은 문제를 일으킬 수 있다.Second, because many organic solvents are used, not only many additional devices are needed to deal with this, but also many problems that are harmful to the environment can be caused.
셋째, 생산 인력의 유기용체 노출에 따른 작업의 기피현상이나, 작업자의 건강문제를 일으킬 수 있다.Third, avoidance of work due to the exposure of organic solvents to production personnel, or may cause worker health problems.
넷째, 유기용제의 재활용이 어려워 경제적인 손실이 발생되어 제조단가가 올라간다.Fourth, it is difficult to recycle organic solvents, resulting in economic losses, leading to higher manufacturing costs.
본 발명은 상기와 같은 종래 기술의 문제점을 해결하기 위한 것으로, 액정표시장치의 단자부들을 전기 접속하기 위한 이방성 도전필름의 제조공정에서 생산되는 도전성 혼합물의 저장안정성을 높여 장시간 보관할 수 있으며, 용제를 사용하지 않아 발생되는 용제의 처리비용 및 생산단가를 낮출 수 있도록 한 이방성 도전 접착 필름 제조방법을 제공함에 그 목적이 있다.The present invention is to solve the problems of the prior art as described above, to increase the storage stability of the conductive mixture produced in the manufacturing process of the anisotropic conductive film for the electrical connection of the terminal portion of the liquid crystal display device can be stored for a long time, using a solvent It is an object of the present invention to provide a method for producing an anisotropic conductive adhesive film that can reduce the processing cost and production cost of the solvent generated by not doing so.
상기의 목적을 달성하기 위한 본 발명의 구체적인 수단은,Specific means of the present invention for achieving the above object,
이방성 도전 접착 필름 제조방법에 있어서,In the anisotropic conductive adhesive film production method,
(a) 열가소성 접착수지와 도전성 입자를 수지의 용융점 이상에서 용융 혼합하여 냉각 시킨 후 알갱이 형태로 단락시켜서 도전성 혼합물을 제조 공정과;(a) melting and mixing the thermoplastic adhesive resin and the conductive particles at a melting point or higher of the resin to cool them, and then shorting them to granules to form a conductive mixture;
(b) 상기 도전성 혼합물을 용융 압출시켜 일정한 형태의 다이에 연속 공급시키는 용융 압출 공정과;(b) a melt extrusion process of melt extruding the conductive mixture to continuously supply the die to a die of a predetermined form;
(c) 상기 다이로부터 압출되어 나온 수지를 이형필름상에 도포시킨 후 냉각시키는 도포 냉각공정을 거쳐서 제조된 것을 특징으로 한다.(c) The resin extruded from the die is coated on a release film, and then subjected to an application cooling process for cooling.
도 1 및 도 2는 본 발명의 일실시예에 따른 이방성 도전 접착 필름의 제조공정도.1 and 2 is a manufacturing process diagram of the anisotropic conductive adhesive film according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 이방성 도전 접착 필름의 단면도.3 is a cross-sectional view of the anisotropic conductive adhesive film according to an embodiment of the present invention.
도 4는 본 발명의 일실시예에 따른 이방성 도전 접착 필름을 적용한 상태의 회로기판의 개략적인 단면도.4 is a schematic cross-sectional view of a circuit board in a state in which an anisotropic conductive adhesive film is applied according to an embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1 및 도 2는 본 발명의 일실시예에 따른 이방성 도전 접착 필름의 제조공정도이다.1 and 2 is a manufacturing process diagram of the anisotropic conductive adhesive film according to an embodiment of the present invention.
본 발명은 열가소성 접착수지와 도전성 입자를 수지의 용융점 이상에서 도 1과 같이 2축 압출기(1)를 사용하여 용융 혼합(compounding)하고, 냉각 시킨 후 알갱이(pellet) 형태로 단락시켜서 도전성 혼합물(composite)을 제조한다.In the present invention, the thermoplastic adhesive resin and the conductive particles are melt-compounded using the twin screw extruder 1 above the melting point of the resin as shown in FIG. 1, cooled, and shorted in a pellet form to form a conductive mixture. ).
상기 열가소성 접착수지는, 폴리에틸렌, 폴리프로필렌, 폴리스틸렌, 폴리아세트산 비닐수지, 폴리아미드수지, 폴리에스테르 또는 이들의 변성수지 혹은 수지혼합물 중에서 어느 하나로 택일된다. 상기 열가소성 접착수지는 연화점이 80∼180℃를 충족함이 바람직하다.The thermoplastic adhesive resin is selected from any one of polyethylene, polypropylene, polystyrene, polyvinyl acetate resin, polyamide resin, polyester, modified resin or resin mixture thereof. The thermoplastic adhesive resin preferably satisfies the softening point of 80 to 180 ℃.
그리고, 상기 도전성 입자는 열가소성 접착제 수지에 대하여 체적비 2∼10%로 첨가되어 있다. 상기 도전성 입자는 입경이 4∼15㎛이고, 금, 은, 철, 구리, 니켈, 알루미늄, 팔라듐 및 이들의 혼합물로 이루어지는 군으로부터 선택된다.The conductive particles are added in a volume ratio of 2 to 10% with respect to the thermoplastic adhesive resin. The said electroconductive particle has a particle diameter of 4-15 micrometers, and is selected from the group which consists of gold, silver, iron, copper, nickel, aluminum, palladium, and mixtures thereof.
상기 2축 압출기(1)는 수지를 용융시키는 용융 존(melting zone)(11)과 전도성 입자가 공급되어 용융된 수지와 혼련되는 혼련 존(compounding zone)(12)으로 순차적으로 구성된다. 이때 각 존의 온도는 도시안된 외부측 제어부에 독립적으로 제어된다. 그리고 혼련존(12)에서 혼합 스크류(mixing screw)는 논-인터메싱(non-intermeshing)으로 구성함이 바람직하다. 이유는,The twin screw extruder 1 is sequentially composed of a melting zone 11 for melting a resin and a mixing zone 12 in which conductive particles are supplied and kneaded with the melted resin. At this time, the temperature of each zone is independently controlled by an external control unit (not shown). And in the kneading zone 12, the mixing screw (mixing screw) is preferably composed of non-intermeshing (non-intermeshing). The reason is,
상기 열가소성 접착수지는 폴리머 이송기(polymer feeder)(13)에 의해 2축 압출기(1)에 공급되고, 이렇게 공급된 수지는 용융 존(11)을 통과하면서 액상으로 변화하여 혼련 존(12)으로 이동한다. 상기 도전성 입자는 비드 이송기(bead feeder)(14)를 통해 용융된 수지와 함께 혼련존(12)으로 이동하여 균질하게 혼련된다. 균질화된 도전성 접착 수지 용액은 노즐(nozzle)이나 다이(die)를 통해 나와 수냉 또는 공냉을 거쳐 알갱이(pallet)이나 시트(sheet)형의 도전성 혼합물이 1차로 제조된다.The thermoplastic adhesive resin is supplied to the twin screw extruder 1 by a polymer feeder 13, and the resin thus supplied changes into a liquid phase while passing through the melting zone 11 to the kneading zone 12. Move. The conductive particles move into the kneading zone 12 together with the molten resin through a bead feeder 14 to be homogeneously kneaded. The homogenized conductive adhesive resin solution exits through a nozzle or a die, and is then subjected to water cooling or air cooling to produce a pellet or sheet-type conductive mixture as a primary.
이와 같이 1차 제조된 상기 도전성 혼합물은 도 2와 같이 1축 압출기(2)로 용융 압출시켜 기어펌프(22)를 통해 일정량을 다이(23)에 연속 공급시켜 용융 상태로 압출되는 이방성 접착수지를 얻는다.The conductive mixture prepared as described above is melt-extruded to the single screw extruder 2 as shown in FIG. 2 and continuously supplied a predetermined amount to the die 23 through the gear pump 22 to be extruded in a molten state. Get
즉, 상기 도전성 혼합물은 다시 도 2와 같이 피더(21)를 통해 1축 압출기(2)에 투입되고, 압출기(2)내에서 용융되어 압출된다. 압출된 용융 상태의 도전성 수지는 기어펌프(22)를 통해 일정 량을 T형 다이(23)에 연속공급되면서 전폭에 걸쳐 균일한 양의 수지 용액이 압출되어 나온다. 이 수지용액은 정밀 가공된 롤(roll) (24)로 지지되어 이동하는 이형필름(5)위로 공급된 후 냉각존(cooling zone)을 통과하면서 두께가 균일하고, 도전성 입자가 균질하게 부포된 ACF로 만들어진다.That is, the conductive mixture is again introduced into the single screw extruder 2 through the feeder 21 as shown in FIG. 2, melted and extruded in the extruder 2. The conductive resin in the extruded molten state is uniformly supplied to the T-type die 23 through the gear pump 22 while a uniform amount of the resin solution is extruded out over the entire width. This resin solution is supported by a precision-processed roll 24, fed onto a moving release film 5, and then passed through a cooling zone to provide a uniform thickness and uniformly dispersed conductive particles. Is made with.
이와 같이 제조 방법으로 제작된 이방성 도전 접착 필름의 단면도가 도 3에 도시되어 있다. 유연성 회로기판(63)상에 접착수지(62)가 도전입자(61)와 함께 코팅되어 있는 것을 나타내고 있다.3 is a cross-sectional view of the anisotropic conductive adhesive film produced by the manufacturing method as described above. The adhesive resin 62 is coated with the conductive particles 61 on the flexible circuit board 63.
도 3과 같이 제조된 이방성 도전 접착 필름이Anisotropic conductive adhesive film prepared as shown in FIG.
도 4는 인쇄회로기판(64)과 유연성 회로기판(63)이 유연성 회로기판전극(65)과 인쇄회로기판전극(66)의 사이에서 배열된 도전입자(61)에 의해 전기적으로 연결되어 있는 상태를 나타내고 있다.4 shows a state in which the printed circuit board 64 and the flexible circuit board 63 are electrically connected by conductive particles 61 arranged between the flexible circuit board electrode 65 and the printed circuit board electrode 66. Indicates.
상술한 바와 같이 본 발명의 이방성 도전 접착 필름 제조방법에 따르면, 제조공정에서 생산되는 도전성 혼합물은 저장안정성이 우수하여 장시간 보관할 수 있으며, 용제를 사용하지 않아 발생되는 용제의 처리비용 및 생산단가를 낮추는 효과가 있다.As described above, according to the anisotropic conductive adhesive film manufacturing method of the present invention, the conductive mixture produced in the manufacturing process is excellent in storage stability and can be stored for a long time, and lowers the processing cost and production cost of the solvent generated by not using a solvent. It works.
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| KR20030050333A (en) * | 2001-12-18 | 2003-06-25 | 태크뱅크 주식회사 | MDC for reducing time of electronic packaging |
| KR100946595B1 (en) * | 2008-03-27 | 2010-03-09 | 엘지이노텍 주식회사 | Method and apparatus for manufacturing Anistropic Conductive Film |
| KR101744821B1 (en) | 2015-12-22 | 2017-06-08 | 현대자동차 주식회사 | Ultra-thin switch and method for manufacturing the same |
| KR102535911B1 (en) * | 2022-08-12 | 2023-05-30 | 오컴퍼니 주식회사 | Solder Particle With Active Coating, Mixture With Solder Particle For Making Film, Film For Connecting Terminals |
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| KR19990014133A (en) * | 1997-07-24 | 1999-02-25 | 구리타 히데유키 | Multi-layered Anisotropic Conductive Adhesive and Manufacturing Method Thereof |
| KR19990076634A (en) * | 1995-12-20 | 1999-10-15 | 스프레이그 로버트 월터 | Blended pressure-sensitive adhesive |
| KR20000051531A (en) * | 1999-01-22 | 2000-08-16 | 한형수 | Metnod for the preparation of the anisotropic conductive film |
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| KR860003909A (en) * | 1984-11-28 | 1986-06-13 | 고니시 히꼬이찌 | Manufacturing method of laminated film |
| KR860004089A (en) * | 1984-11-30 | 1986-06-18 | 고니시 히꼬이찌 | Conductive resin composite and method for manufacturing same |
| KR19990076634A (en) * | 1995-12-20 | 1999-10-15 | 스프레이그 로버트 월터 | Blended pressure-sensitive adhesive |
| KR19990014133A (en) * | 1997-07-24 | 1999-02-25 | 구리타 히데유키 | Multi-layered Anisotropic Conductive Adhesive and Manufacturing Method Thereof |
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| KR20160066706A (en) | 2014-12-03 | 2016-06-13 | 손분자 | Chair for Heating |
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