KR100485949B1 - Production Method Of ACF For Low Mobility - Google Patents
Production Method Of ACF For Low Mobility Download PDFInfo
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- KR100485949B1 KR100485949B1 KR10-2001-0068958A KR20010068958A KR100485949B1 KR 100485949 B1 KR100485949 B1 KR 100485949B1 KR 20010068958 A KR20010068958 A KR 20010068958A KR 100485949 B1 KR100485949 B1 KR 100485949B1
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- anisotropic conductive
- resin
- conductive film
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Abstract
본 발명은 주로 LCD 패키징에 접속재료로서 사용되는 이방성 도전필름에 관한 것으로서, 특히 폴리머 비이드인 폴리에틸렌 옥사이드를 첨가하여 유동성을 개선하는 것을 목적으로 한 것이다. 이를 위해 솔벤트(solvent), 접착물질(adhesive elements) 및 폴리머 비이드(polymer bead)를 섞어 1차 여과하는 공정(10); 상기 1차 여과된 용액에 레진(resin)과 도전볼을 넣고 교반한 후 2차 여과하는 공정(20); 상기 2차 여과된 용액을 이형 필름(100)에 코팅처리 하는 공정(30); 상기 필름을 소정 치수로 절단 하는 공정(40); 및 상기 절단된 필름을 패킹하는 공정(50);이 요구되어진다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive film mainly used as a connecting material in LCD packaging, and is particularly aimed at improving fluidity by adding polyethylene oxide as a polymer bead. To do this, the first step (10) by mixing the solvent (adhesive), adhesive elements (adhesive elements) and polymer beads (polymer bead); Putting a resin (resin) and a conductive ball into the first filtered solution, stirring and then performing secondary filtration; Coating (30) the secondary filtered solution on a release film (100); Cutting the film to a predetermined dimension (40); And a process 50 for packing the cut film.
Description
본 발명은 유동성이 개선된 이방성 도전필름에 관한 것으로써, 보다 상세하게는 LCD 패키징에 접속재료로서 사용되는 이방성 도전필름의 유동성을 개선할 수 있는 이방성 도전필름에 관한 것이다.The present invention relates to an anisotropic conductive film with improved fluidity, and more particularly, to an anisotropic conductive film capable of improving the fluidity of an anisotropic conductive film used as a connecting material for LCD packaging.
최근 액정디스플레이의 고해상도, 칼라화가 진행되면서 픽셀피치(Pixel pitch)의 감소 및 그 판넬 위에 인쇄된 리드(Lead)수가 증가되고 있는 추세에 있다. 이러한 기술적 요구에 의해 LCD 판넬과 드라이버 IC 및 PCB를 접속하는 LCD 패키징기술도 이에 대응하여 발전해오고 있다. Recently, as the resolution and colorization of liquid crystal displays have progressed, the pixel pitch has decreased and the number of leads printed on the panel has increased. Due to these technical requirements, LCD packaging technology connecting LCD panels, driver ICs, and PCBs has been developed in response.
특히, LCD 패키징 기술 중에서도 가장 많이 사용되고 있는 것으로 COF(Chip-On-Film)법에 의한 LCD 판넬과 PCB의 전기적 접속을 이방성 도전막을 이용하여 패킹하는 법이며, 또한 차세대 LCD 패키징법으로 드라이버 IP 베어 칩을 LCD 판넬 위에 직접 IC 접속법으로 접속시키고 PCB와의 접속은 FPC를 이용하여 이방성 도전필름(Anisotropic Conductive Film)으로 접속시키는 패키징법이 이용되고 있다. In particular, the most widely used LCD packaging technology is the method of packing the electrical connection between the LCD panel and PCB by the COF (Chip-On-Film) method using an anisotropic conductive film, and the driver IP bare chip as the next-generation LCD packaging method. A packaging method is used in which an IC is connected directly on an LCD panel and an PCB is connected to an anisotropic conductive film using an FPC.
LCD 패키징에 접속재료로서 사용되는 이방성 도전필름(ACF)은 열경화형 접착제중에 도전성 미립자를 분산시켜 이형 처리한 PET 필름상에 코팅하는 방법으로 접착필름 형태로 제조한 Z-축 도전성접착제 필름을 의미하며, X-Y 평면방향으로는 절연성을 지닌다. 이러한 이방성 도전필름은 지난 10년간 일본의 히다찌 화성사(일본특허공개 5-21094, 5-226020, 7-302666, 7-302667, 7-302668 등) 및 소니케미칼사(일본 특허공개 7-211374, 8-311420, 9-199206, 9-199207, 9-31419, 9-63355, 9-115335)등에 의해 많은 연구 및 상품화가 진행되어 오고 있으나 아직까지 LCD공정상 많은 개선이 요구되어지고 있다. Anisotropic conductive film (ACF), which is used as a connecting material for LCD packaging, refers to a Z-axis conductive adhesive film prepared in the form of an adhesive film by dispersing conductive fine particles in a thermosetting adhesive and coating it on a release treated PET film. In other words, it has insulation in the XY plane direction. Such anisotropic conductive films have been manufactured by Hitachi Chemical Co., Ltd. (Japanese Patent Publication No. 5-21094, 5-226020, 7-302666, 7-302667, 7-302668, etc.) and Sony Chemical Company (Japanese Patent Publication No. 7-211374, 8-311420, 9-199206, 9-199207, 9-31419, 9-63355, 9-115335), and many researches and commercialization has been progressed, but many improvements are still required in the LCD process.
이방성 도전필름에 가장 중요하게 고려되어지는 특성으로는 접착력, 접속저항, 신뢰성, 절연성, 공정성 등이 있는데 지금까지의 연구과정을 통하여 이러한 특성들은 많은 향상을 이룰 수가 있었으나, 대량생산에 필수 요소인 공정성에서는 많은 어려움을 겪어 왔다. 특히 공정성에 가장 많은 영향을 끼치는 이방성 도전필름의 성질로 유동성을 지목할 수가 있는데, 단적인 예로 이방성 도전필름의 유동성이 높은 경우, LCD판넬에 본딩 시키는 과정에서 툴바(Tool bar)에 이물질이 묻어 라인이 정지되거나, 이방성 도전필름이 릴(Reel)에서 풀려 나오면서 접촉부분에 이물질을 묻혀 공정성을 떨어뜨리는 경우가 있었다. The most important characteristics considered for anisotropic conductive films include adhesion, connection resistance, reliability, insulation, and fairness. Through the research process up to now, these characteristics can be improved, but fairness is essential for mass production. Esau has experienced many difficulties. Particularly, fluidity can be considered as the property of anisotropic conductive film which has the most influence on processability. For example, if the liquidity of anisotropic conductive film is high, foreign matters are attached to the toolbar during bonding to LCD panel. In some cases, the anisotropic conductive film is stopped or reeled out of the reel, so that foreign substances are buried in the contact portion, thereby degrading fairness.
기존의 제조공정에서는 유동성을 낮추고자, 처방에 들어가는 솔벤트(Solvent)와 접착 물질(Adhesive elements)의 양의 비율을 변화시켜 보았다. 그런데 기준에 도달하는 공정특성을 지니는 이방성 도전필름을 제조하기도 하였으나, 원재료마다 맡은 역할이 있어 그 양이 변할 경우 이방성 도전필름의 최종 특성에 영향을 미치는 이유로 다른 특성이 저하되는 결과를 가져왔다. 즉,접착물질의 비율을 변화시켜 유동성을 개선하였다고 해도, 접착력과 신뢰성 등에 영향을 미치게 되어 실용성이 없어진다는 단점이 있었다. In the existing manufacturing process, to reduce the fluidity, the ratio of the amount of solvent and adhesive elements in the prescription was changed. By the way, the anisotropic conductive film having the process characteristics to reach the standard was also manufactured, but the role of each raw material has a role to play, and if the amount is changed, the other properties are deteriorated as a result of affecting the final properties of the anisotropic conductive film. That is, even if the fluidity is improved by changing the proportion of the adhesive material, there is a disadvantage in that it will affect the adhesion and reliability, etc., and the practicality is lost.
따라서 본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로써, 본 발명의 목적은 폴리머 비이드(Polymer bead)형태를 가지는 폴리에틸렌 옥사이드(Poly ethylene oxide)를 첨가 시켜 이방성 도전필름의 유동성을 낮추어 공정성을 향상시키는 것이다.Therefore, the present invention has been made to solve the above problems, an object of the present invention is to add a polyethylene oxide having a polymer bead (Polymer bead) form to lower the fluidity of the anisotropic conductive film processability To improve.
상기와 같은 본 발명의 목적은, 솔벤트(solvent), 접착물질(adhesive elements) 및 폴리머 비이드(polymer bead)를 섞어 1차 여과하는 공정(10); 상기 1차 여과된 용액에 레진(resin)과 도전볼을 넣고 교반한 후 2차 여과하는 공정(20); 상기 2차 여과된 용액을 이형 필름(100)에 코팅처리 하는 공정(30); 상기 필름을 소정 치수로 절단 하는 공정(40); 및 상기 절단된 필름을 패킹하는 공정(50);으로 이루어지는 것을 특징으로 하는 유동성이 개선된 이방성 도전 필름의 제조 방법에 의하여 달성될 수 있다.The object of the present invention as described above, the first step of mixing the solvent (adhesive), the adhesive material (adhesive elements) and the polymer bead (polymer bead) by primary filtration (10); Putting a resin (resin) and a conductive ball into the first filtered solution, stirring and then performing secondary filtration; Coating (30) the secondary filtered solution on a release film (100); Cutting the film to a predetermined dimension (40); And a step (50) of packing the cut film. It can be achieved by a method for producing an anisotropic conductive film having improved fluidity.
그리고, 상기 폴리머 비이드(polymer bead)는 폴리에틸렌 옥사이드(poly ethylene oxide)인 것이 바람직하다.In addition, the polymer beads are preferably polyethylene oxide.
또한, 상기 코팅공정(30)은 상기 필름(100)에 상기 코팅레진(110)을 입히고, 균일하게 퍼지도록 하는 코팅 나이프(120)에 통과시키는 공정(200); 및 상기 코팅공정(200)이 된 후 고온의 열로 건조시키는 공정(210);을 포함하는 것이 가능하다.In addition, the coating process 30 is a step (200) to pass through the coating knife 120 to spread the coating resin 110 on the film 100, evenly spread; It is possible to include; and a step of drying the high temperature heat 210 after the coating step 200.
본 발명의 그 밖의 목적, 특정한 장점들 및 신규한 특징들은 첨부된 도면들과 연관되어지는 이하의 상세한 설명과 바람직한 실시예들로부터 더욱 분명해질 것이다.Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings.
이하에서는 첨부된 도면을 참조하여 본 발명의 실시예를 상세히 설명하도록 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일 실시예에 따른 유동성이 개선된 이방성 도전필름의 제조방법에 관한 순서도이다. 도 1에 도시된 바와 같이, 1단계는 솔벤트(Solvent), 접착 물질(Adhesive elements) 및 폴리머 비이드(Polymer bead)를 섞어 1차 여과하는 공정이다. 이 때 폴리머 비이드로써는 폴리에틸렌 옥사이드(Poly ethylene oxide)를 사용한다. 1 is a flowchart illustrating a method of manufacturing an anisotropic conductive film having improved flowability according to an embodiment of the present invention. As shown in FIG. 1, the first step is a process of primary filtration by mixing a solvent, an adhesive element, and a polymer bead. In this case, polyethylene oxide is used as the polymer bead.
2단계는 1차 여과과정을 한 액에 레진(Resin)과 도전볼을 넣고 교반한 후에 2차 여과하는 공정이다.The second step is a step of putting the resin (Resin) and the conductive ball in the first filtration process and stirring, and then the second filtration.
3단계는 2차 여과과정이 끝난 용액을 이형필름(100)에 코팅처리하는 공정이다. The third step is a process of coating the release film 100 with the solution of the second filtration process.
4단계는 코팅처리한 이형필름(100)을 규격에 맞게 소정 치수로 절단하는 공정이다.Step 4 is a process of cutting the coated release film 100 to a predetermined size in accordance with the standard.
5단계는 소정 치수로 절단된 이방성 도전필름을 패킹하는 공정이다. 이 때 패킹은 포장을 하는 단계로서 이물질이나 공기가 들어가 산화하는 것을 막는 진공의 상태로 진행된다. Step 5 is a process of packing the anisotropic conductive film cut to a predetermined dimension. At this time, the packing is a packaging step and proceeds in a vacuum state to prevent foreign matter or air from entering and oxidizing.
도 2는 도 1에 도시된 순서도중 코팅과정의 공정도이다. 도 2에 도시된 바와 같이, 1단계는 Pay-off쪽에서 필름(100)이 풀리면서 진행되고 코팅나이프(120)를 통과하기 전에 코팅레진(110)이 입혀지게 된다. 그런 후, 코팅레진(110)을 필름(100)위에 균일하고 평평하게 입히기 위해 코팅나이프(120)에 통과시키는 공정이다. FIG. 2 is a flowchart of a coating process in the flowchart shown in FIG. 1. As shown in FIG. 2, the first step proceeds while the film 100 is released from the pay-off side, and the coating resin 110 is coated before passing through the coating knife 120. Thereafter, the coating resin 110 is passed through the coating knife 120 to coat the film 100 uniformly and evenly.
2단계는 코팅레진(110)을 필름(100)에 완전히 부착시키기 위하여 고온의 열로 건조시키는 공정이다. 그런 후에 필름(100)은 Take-up쪽으로 감기게 된다.In the second step, the coating resin 110 is dried by high temperature heat in order to completely adhere the film 100. After that, the film 100 is wound to the take-up.
이하 상기와 같은 구성을 갖는 유동성이 개선된 이방성 도전필름 제조방법의 작용 및 효과에 대해 설명하기로 한다. Hereinafter will be described the operation and effects of the improved anisotropic conductive film manufacturing method having a fluidity as described above.
상기와 같은 본 발명에 따른 유동성이 개선된 이방성 도전필름의 제조방법에 의하면, 다른 제품특성에 영향을 미치지 않으면서 유동성을 개선시킬 수 있으며, 나아가 접속저항, 접착력 및 신뢰성 등 다른 특성을 향상시키면서 기준에 맞는 유동특성을 지니는 이방성 도전필름을 제조할 수가 있다. 또한 유동성이 개선된 이방성 도전필름을 통하여, 공정성 향상을 꾀할 수가 있으며 이는 제품 생산성 향상과 직결된다는 장점이 있다.According to the manufacturing method of the anisotropic conductive film with improved fluidity according to the present invention as described above, it is possible to improve the fluidity without affecting other product characteristics, further improving the other properties such as connection resistance, adhesion and reliability It is possible to manufacture an anisotropic conductive film having a flow characteristic to match. In addition, through the anisotropic conductive film with improved fluidity, it is possible to improve the processability, which is directly connected to the product productivity.
비록 본 발명이 상기 언급된 바람직한 실시예와 관련하여 설명되어졌지만, 발명의 요지와 범위로부터 벗어남이 없이 다양한 수정이나 변형을 하는 것이 가능하다. 따라서 첨부된 특허청구의 범위는 본 발명의 요지에서 속하는 이러한 수정이나 변형을 포함할 것이다. Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. Accordingly, the appended claims will cover such modifications and variations as fall within the spirit of the invention.
도 1은 본 발명의 일 실시예에 따른 유동성이 개선된 이방성 도전필름의 제조방법에 관한 순서도,1 is a flow chart related to a method for manufacturing an anisotropic conductive film with improved fluidity according to an embodiment of the present invention;
도 2는 도 1에 도시된 순서도중 코팅과정의 공정도이다.FIG. 2 is a flowchart of a coating process in the flowchart shown in FIG. 1.
<주요 도면 부호에 대한 간단한 설명><Short Description of Main Reference Signs>
S10 : 솔벤트, 접착물질, 폴리머 비이드를 섞어 1차 여과하는 공정,S10: process of primary filtration by mixing solvent, adhesive material, polymer beads,
S20 : 레진과 도전볼을 넣고 교반한 후 2차 여과하는 공정,S20: a step of secondary filtration after the addition of the resin and the conductive ball, stirring
S30 : 이형필름에 코팅하는 공정,S30: coating on the release film,
S40 : 소정치수로 절단하는 공정,S40: process of cutting to a predetermined dimension,
S50 : 패킹하는 공정,S50: packing process,
100 : 필름, 100: film,
110 : 코팅 레진,110: coated resin,
120 : 코팅 나이프, 120: coated knife,
S200 : 코팅레진을 입히고 코팅 나이프에 통과 시키는 공정,S200: Process of coating the coating resin and passing it through the coating knife,
S210 : 고온의 열로 건조시키는 공정.S210: Process of drying by high temperature heat.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0068958A KR100485949B1 (en) | 2001-11-06 | 2001-11-06 | Production Method Of ACF For Low Mobility |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0068958A KR100485949B1 (en) | 2001-11-06 | 2001-11-06 | Production Method Of ACF For Low Mobility |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030037866A KR20030037866A (en) | 2003-05-16 |
| KR100485949B1 true KR100485949B1 (en) | 2005-04-28 |
Family
ID=29568234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2001-0068958A KR100485949B1 (en) | 2001-11-06 | 2001-11-06 | Production Method Of ACF For Low Mobility |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100485949B1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07101618A (en) * | 1993-09-30 | 1995-04-18 | Toshiba Corp | Device for sticking adhesive tape piece |
| JPH09150425A (en) * | 1995-11-30 | 1997-06-10 | Sumitomo Bakelite Co Ltd | Anisotropically conductive film |
| JPH10338844A (en) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | Anisotropically conductive film |
| JP2000003621A (en) * | 1998-06-12 | 2000-01-07 | Sekisui Chem Co Ltd | Anisotropic conductive film and conductive connecting structure |
| JP2000021236A (en) * | 1998-06-30 | 2000-01-21 | Mitsui Chemicals Inc | Anisotropic conductive resin composition |
| KR20030001231A (en) * | 2001-06-25 | 2003-01-06 | 텔레포스 주식회사 | Anisotropic conductive adhesives having enhanced viscosity, bonding methods using the same and integrated cirduit pakages |
-
2001
- 2001-11-06 KR KR10-2001-0068958A patent/KR100485949B1/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07101618A (en) * | 1993-09-30 | 1995-04-18 | Toshiba Corp | Device for sticking adhesive tape piece |
| JPH09150425A (en) * | 1995-11-30 | 1997-06-10 | Sumitomo Bakelite Co Ltd | Anisotropically conductive film |
| JPH10338844A (en) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | Anisotropically conductive film |
| JP2000003621A (en) * | 1998-06-12 | 2000-01-07 | Sekisui Chem Co Ltd | Anisotropic conductive film and conductive connecting structure |
| JP2000021236A (en) * | 1998-06-30 | 2000-01-21 | Mitsui Chemicals Inc | Anisotropic conductive resin composition |
| KR20030001231A (en) * | 2001-06-25 | 2003-01-06 | 텔레포스 주식회사 | Anisotropic conductive adhesives having enhanced viscosity, bonding methods using the same and integrated cirduit pakages |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030037866A (en) | 2003-05-16 |
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