KR100426039B1 - 칩 실장방법 및 장치 - Google Patents

칩 실장방법 및 장치 Download PDF

Info

Publication number
KR100426039B1
KR100426039B1 KR10-1998-0703668A KR19980703668A KR100426039B1 KR 100426039 B1 KR100426039 B1 KR 100426039B1 KR 19980703668 A KR19980703668 A KR 19980703668A KR 100426039 B1 KR100426039 B1 KR 100426039B1
Authority
KR
South Korea
Prior art keywords
chip
thin film
film substrate
unit
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-1998-0703668A
Other languages
English (en)
Korean (ko)
Other versions
KR19990067640A (ko
Inventor
레이푸 잉그마 나이홀름
Original Assignee
텔레폰아크티에볼라게트 엘엠 에릭슨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 텔레폰아크티에볼라게트 엘엠 에릭슨 filed Critical 텔레폰아크티에볼라게트 엘엠 에릭슨
Publication of KR19990067640A publication Critical patent/KR19990067640A/ko
Application granted granted Critical
Publication of KR100426039B1 publication Critical patent/KR100426039B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
KR10-1998-0703668A 1995-11-29 1996-11-27 칩 실장방법 및 장치 Expired - Fee Related KR100426039B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9504271-9 1995-11-29
SE9504271A SE508763C2 (sv) 1995-11-29 1995-11-29 Förfarande och anordning för chipmontering

Publications (2)

Publication Number Publication Date
KR19990067640A KR19990067640A (ko) 1999-08-25
KR100426039B1 true KR100426039B1 (ko) 2004-06-18

Family

ID=20400409

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0703668A Expired - Fee Related KR100426039B1 (ko) 1995-11-29 1996-11-27 칩 실장방법 및 장치

Country Status (10)

Country Link
US (1) US6242274B1 (https=)
EP (1) EP0864173A1 (https=)
JP (1) JP3856475B2 (https=)
KR (1) KR100426039B1 (https=)
CN (1) CN1100345C (https=)
AU (1) AU7716496A (https=)
CA (1) CA2238754C (https=)
SE (1) SE508763C2 (https=)
TW (1) TW313687B (https=)
WO (1) WO1997020344A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805493B2 (en) 1996-03-12 2004-10-19 3M Innovative Properties Company Optical connector assembly using partial large diameter alignment features
US5940562A (en) * 1996-03-12 1999-08-17 Minnesota Mining And Manufacturing Company Stubless optoelectronic device receptacle
US5953032A (en) * 1997-06-10 1999-09-14 Lexmark International, Inc. Method for forming and inspecting a barrier layer of an ink jet print cartridge
DE19903652B4 (de) * 1999-01-29 2005-04-14 Ab Elektronik Gmbh Verfahren zur Herstellung von gehäusten Schaltkreiseinheiten
US6318909B1 (en) 1999-02-11 2001-11-20 Agilent Technologies, Inc. Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
DE29907270U1 (de) * 1999-04-23 1999-07-29 Sick AG, 79183 Waldkirch Verbindungsvorrichtung
US6600853B2 (en) * 2000-09-21 2003-07-29 Corona Optical Systems, Inc. Electro-optic interconnect circuit board
DE10132794A1 (de) * 2001-07-06 2003-01-30 Siemens Ag Kopplung an in Leiterplatten eingebettete Lichtleiter
FR2827467B1 (fr) * 2001-07-13 2003-12-12 Kingpak Tech Inc Structure de boitier empilee de detecteur d'image
FR2827425B1 (fr) * 2001-07-13 2004-07-02 Kingpak Tech Inc Structure empilee d'un detecteur d'image et procede pour fabriquer celle-ci
US7532782B2 (en) * 2002-04-18 2009-05-12 Pivotal Decisions Llc Flexible optical circuit apparatus and method
JP4510629B2 (ja) * 2002-09-09 2010-07-28 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体デバイスの製造方法
US6902329B2 (en) * 2003-02-12 2005-06-07 Lockheed Martin Corporation Method and apparatus for the integration of parallel optical transceiver package
US6896421B2 (en) * 2003-02-26 2005-05-24 Lockheed Martin Corporation Method and apparatus for assembly of an optoelectronic device with an optical connector
JP3807385B2 (ja) * 2003-05-14 2006-08-09 セイコーエプソン株式会社 光モジュール及びその製造方法、光通信装置、電子機器
KR20060101755A (ko) * 2003-08-26 2006-09-26 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 인쇄 회로 기판, 인덕터 및 인덕터 제조 방법
EP2094158B1 (en) * 2006-11-21 2018-05-02 STOCO 10 GmbH Ingestible electronic capsule and in vivo drug delivery or diagnostic system
GB2453765A (en) * 2007-10-18 2009-04-22 Novalia Ltd Product packaging with printed circuit and means for preventing a short circuit
US8535956B2 (en) 2012-02-14 2013-09-17 International Business Machines Corporation Chip attach frame

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4104728A (en) 1973-06-06 1978-08-01 Sharp Kabushiki Kaisha Electronic apparatus equipped on a flexible substratum
US4415983A (en) 1980-03-04 1983-11-15 Texas Instruments Incorporated System and method for aligning a display device
JPH0360080A (ja) * 1989-07-27 1991-03-15 Sharp Corp 受光装置
US5199093A (en) * 1990-05-22 1993-03-30 Bicc Plc. Multi-part optical fibre connectors
US5168537A (en) 1991-06-28 1992-12-01 Digital Equipment Corporation Method and apparatus for coupling light between an optoelectronic device and a waveguide
JPH05102262A (ja) * 1991-10-03 1993-04-23 Hitachi Ltd 半導体装置及びそれを実装した実装装置
US5230030A (en) 1992-04-24 1993-07-20 Motorola, Inc. Interface coupling electronic circuitry
JPH0653454A (ja) * 1992-07-29 1994-02-25 Nec Kyushu Ltd イメージセンサのガラスキャップ封止構造
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
GB9223306D0 (en) * 1992-11-06 1992-12-23 Bt & D Technologies Ltd Optoelectronic devices
US5309537A (en) 1993-04-05 1994-05-03 Motorola, Inc. Optoelectronic coupling device and method of making
US5337391A (en) * 1993-05-03 1994-08-09 Motorola, Inc. Optoelectronic sub-module and method of making same
US5420954A (en) * 1993-05-24 1995-05-30 Photonics Research Incorporated Parallel optical interconnect
US5367593A (en) * 1993-09-03 1994-11-22 Motorola, Inc. Optical/electrical connector and method of fabrication
US5434940A (en) * 1994-03-24 1995-07-18 The Whitaker Corporation Active fiber needle
EP0753893B1 (en) * 1995-07-13 2004-04-21 Eastman Kodak Company An image sensor assembly and packaging method

Also Published As

Publication number Publication date
WO1997020344A1 (en) 1997-06-05
CN1203698A (zh) 1998-12-30
AU7716496A (en) 1997-06-19
SE9504271L (sv) 1997-05-30
SE508763C2 (sv) 1998-11-02
CA2238754C (en) 2008-01-15
SE9504271D0 (sv) 1995-11-29
JP2000501239A (ja) 2000-02-02
EP0864173A1 (en) 1998-09-16
TW313687B (https=) 1997-08-21
CN1100345C (zh) 2003-01-29
JP3856475B2 (ja) 2006-12-13
CA2238754A1 (en) 1997-06-05
US6242274B1 (en) 2001-06-05
KR19990067640A (ko) 1999-08-25

Similar Documents

Publication Publication Date Title
KR100426039B1 (ko) 칩 실장방법 및 장치
US5535296A (en) Integrated optoelectronic coupling and connector
US5774614A (en) Optoelectronic coupling and method of making same
US5940562A (en) Stubless optoelectronic device receptacle
US6241399B1 (en) Ferrule assembly and optical module
EP0982610B1 (en) Optical subassembly for use in fiber optic data transmission and reception
US9170387B2 (en) Optical component assemblies
US7306377B2 (en) Integrated optical sub-assembly having epoxy chip package
US20030085054A1 (en) Enhanced flex cable
US8834041B2 (en) Ferrule-based optical component assemblies
KR20000016280A (ko) 광전 장치 리셉터클 및 그 제조 방법_
US6685363B2 (en) Passive self-alignment technique for array laser transmitters and receivers for fiber optic applications
JP2003294997A (ja) コネクタシステムおよびコネクタシステムの製造方法
JPH06273641A (ja) 光コネクタ及びそれに使用する光結合装置
US9103999B2 (en) Optical data communication module having EMI cage
US5539200A (en) Integrated optoelectronic substrate
US6491446B1 (en) Passive self-alignment technique for array laser transmitters and receivers for fiber optic applications
US8469606B2 (en) Optoelectronic interconnection system
US20060028926A1 (en) Substrate, substrate adapted for interconnecting optical elements and optical module
JP2006030813A (ja) 光ファイバモジュール
KR20070084915A (ko) 연성 광보드상의 광원 및 광수신 소자 집적 구조
US7004642B2 (en) Opto-electrical module packaging
KR100814394B1 (ko) 광 모듈 및 이를 이용한 광 연결 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20080324

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20090325

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20090325

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000