KR100418511B1 - Exposure method of substrate and apparatus the same - Google Patents

Abstract

According to the present invention, an exposure mask having a unit exposure circuit pattern and a position recognition pattern is exposed to a band-shaped material on which a photoresist film is formed, and after the exposure is completed, the position recognition mark exposed on the substrate material is detected and the alignment criteria A substrate exposure method of a semiconductor device which aligns positions of subsequent exposure areas, and a device thereof are provided.

Description

Exposure method of substrate and apparatus the same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate exposure method of a semiconductor device and a device therefor, and more particularly, an alignment of a material (hereinafter, abbreviated as substrate material) to a continuous circuit board formation and a feeding pitch of the circuit board material The present invention relates to a method for exposing a circuit board material for a semiconductor device and a device having an improved structure capable of increasing the degree of accuracy.

Typically, the substrate used as the substrate of the semiconductor device is a band-shaped substrate such as a thin metal formed on a film of an organic compound such as polyimide or polyamide, or a thin metal made of copper, copper alloy or iron alloy. In order to install various electronic devices on the material, the substrate material is transferred and stopped for each region of a predetermined pattern, and then an exposure process of aligning the mask and the substrate material and exposing the substrate material is performed.

For example, in the case of a lead frame that transmits and supports the functions of a semiconductor device to an external circuit, the lead frame is manufactured by stamping and etching, that is, by etching a substrate material. The etching method is a photosensitive film forming process, an exposure process, a developing process and an etching process, and a cleaning process while continuously supplying a substrate material by a reel to reel method or by supplying a substrate material on a unit strip. And so on. Similarly, a thin metal, such as copper, is deposited on the polyimide film, and a predetermined unit substrate is continuously formed thereon through photosensitive film formation, exposure, development, and etching processes as described above.

Korean Unexamined Patent Publication No. 2000-0057786 discloses an example of an apparatus for exposing during a process of manufacturing a substrate through an etching process for such a material.

The disclosed exposure apparatus is a device for sequentially exposing a pattern formed on an exposure mask to a band-like substrate material, comprising: a conveying mechanism for conveying the band-shaped substrate material on a stage in a longitudinal direction; a moving mechanism for transferring the substrate material to the stage; A control unit for controlling the transfer mechanism and the transfer mechanism is provided, and the control unit repeats the transfer and transfer of the substrate material by the transfer mechanism and the transfer mechanism to expose a plurality of rows of mask patterns on the substrate material.

In the exposure apparatus as described above, as shown in FIG. 1, the substrate material 100 is moved between the rollers 11 and 12 in close contact with each other, and the rotation speed of the rollers 11 and 12 is sensed. Thereby moving the substrate material 100 to a predetermined pitch. However, this transfer has a problem that the substrate material 100 is not accurately moved by the slip phenomenon of the roller 11 and the substrate material 100, the surface of the roller (11) 12 and the substrate material 100 is There is a problem that the substrate material is contaminated due to direct contact. In order to compensate for this problem, an alignment hole or alignment mark was formed on one side of the substrate material, and the hole or mark was recognized by a vision device such as a CCD camera to improve the degree of alignment. In such a case, however, accurate work must be performed through a separate process before the substrate material is introduced into the exposure apparatus, and a process error occurs in the process of forming the mark or hole. Done.

And the configuration for transferring the substrate material in the state as described above in the rollers are disclosed in US Pat. Nos. 5,198,857 and 5,075,718.

Meanwhile, another method of moving the substrate material to a predetermined pitch forms holes 101 having a constant pitch at the edge of the substrate material 100, and the sprockets are formed in the holes 101. The substrate material 100 is transferred by rotating the sprocket 15 by coupling the teeth of 15), and at this time, the substrate material is transferred as the number of rotations of the sprocket 100 or the number of the holes 101. I have sensed the distance. However, the hole 101 as described above is formed by mechanical processing or etching by punching, and there is a machining deviation depending on the shape, size, and position of the hole 101, which makes it difficult to accurately align. Control of the exposure position is difficult. In addition, when the polyimide-based film becomes thin, there is a problem that the movement and alignment using the holes are difficult.

The present invention is to solve the above problems, it is possible to improve the precision of the control of the movement position during the sequential transfer of the continuous substrate material in the longitudinal direction, in particular, by accumulating the distance between the unit exposure areas in the conventional cumulative SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate material exposure method of a semiconductor device capable of reducing the amount of scrap existing between exposure areas formed to reduce a tolerance, and an apparatus thereof.

Another object of the present invention is to provide a substrate material exposure method of a semiconductor device and a device for improving the accuracy of an exposure pattern according to an exposure position formed on a substrate material, thereby reducing defects in subsequent processes.

1 is a perspective view showing a part of a conventional exposure apparatus,

2 is a partially cutaway perspective view schematically showing a transfer apparatus of a conventional substrate material,

3 is a block diagram showing a substrate material exposure method of a semiconductor device according to the present invention;

4 is a perspective view showing an exposure apparatus of a substrate material according to the present invention.

In order to achieve the above object, the substrate exposure method of the semiconductor device of the present invention

A first step of preparing a strip-shaped substrate material on which a photosensitive film is formed;

A second step of preparing an exposure mask on which the unit exposure pattern and the position recognition mark pattern are formed;

Exposing the substrate material using the exposure mask;

A fourth step of transferring the substrate material on which the exposure is completed;

And a fifth step of detecting the position recognition mark exposed on the substrate material and aligning the position of the subsequent exposure pattern formation region with the alignment reference.

The exposure apparatus of the substrate for semiconductor devices of the present invention for achieving the above object,

A light source for exposure, an exposure stage, transfer means for transferring the continuous substrate material on the exposure stage at predetermined intervals, and a unit provided on the exposure stage to expose the substrate material An exposure mask provided with an exposure pattern, at least one position recognition pattern, recognition means installed on one side of the exposure stage to recognize a position recognition mark exposed by the position recognition pattern, and information detected by the recognition means. And control means for aligning positions of subsequent exposure patterns of the substrate material.

The control means controls the transfer means to align the exposure positions of the exposure mask and the substrate material, and one side of the exposure mask is further provided with a driver for changing the position of the exposure mask, which is controlled by the control means. By shifting the position of the exposure mask, the exposure positions of the exposure mask and the substrate material are aligned. And the recognition means may be a CCD camera.

Hereinafter, a method of manufacturing a substrate of a semiconductor device and a preferred embodiment of the device will be described in detail with reference to the accompanying drawings.

A substrate material exposure method of a semiconductor device according to the present invention is as follows. As shown in FIG. 3, a first step of preparing a substrate material wound on a reel and having a photosensitive film formed on a surface thereof is performed. A second step of preparing an exposure mask for exposing the substrate material is performed. The exposure mask is provided with a unit exposure pattern and at least one position recognition pattern for exposing the substrate.

When the preparation of the band-like substrate material and the exposure mask is completed as described above, the exposure area of the substrate material is exposed using the exposure mask to form a first exposure pattern and a first position recognition mark on the substrate material. Carry out the steps. The light irradiated from the light source of the substrate material using the exposure mask as described above may be made by irradiating the photosensitive film of the substrate material through the exposure mask and the optical means.

As described above, when the formation of the first exposure pattern and the first position recognition mark is completed, a fourth step of transferring the strip-shaped substrate material to be positioned on the lower surface of the exposure mask is performed. In a fourth step of transferring the substrate material, a fifth step of detecting a first position recognition mark formed on the substrate material and setting a position for subsequent exposure using the position reference of the region to be subsequently exposed therefrom is performed. As described above, when the setting of the position is completed, the sixth step of exposing the second exposure pattern and the second position recognition mark is performed by exposing as described above. After setting the position to be subsequently exposed based on the second position recognition mark, the substrate material is exposed to perform a seventh step of exposing the third exposure pattern and the third position recognition mark. In this manner, the exposure patterns and the position recognition marks are continuously exposed in the longitudinal direction of the strip-shaped substrate material.

Exposing the band-like substrate material, that is, the substrate material constituting the substrate of the semiconductor device by using the above-described method, can precisely control the interval between the exposure position of the exposure pattern and the next exposure pattern. That is, since the reference by the position of the position recognition mark is applied only to the adjacent exposure pattern, it is possible to fundamentally reduce the occurrence of cumulative error according to the position of the position recognition pattern. Accordingly, by uniformizing the intervals between the exposure patterns, it is possible to reduce the scrap of the substrate material positioned between the exposure patterns as scrap, and to reduce the occurrence rate of defects due to the positional difference of the exposure patterns in the subsequent process.

4 shows an example of a substrate exposure apparatus of a semiconductor device according to the present invention.

Referring to the drawings, the exposure apparatus includes a supply reel 51 wound around the substrate material 100 on which the photoresist film is formed for exposure and a winding reel 52 provided to be spaced apart from the supply reel 51 by a predetermined distance. An exposure stage 53 is installed between the supply reel 51 and the winding reel 52 so as to be lifted and lowered by a driving part 53a. A substrate supplied from the supply reel 51 is disposed above the exposure stage. The workpiece 100 is located. The exposure stage 53 may be provided with a separate fixing means, for example, a suction means (not shown) for fixing the substrate material exposed during the exposure. An upper part of the exposure stage 53 includes an illumination system 61 including an exposure lamp 61a, optical means 62 for focusing light emitted therefrom, a predetermined unit exposure pattern 71 and at least one An exposure unit 60 having an exposure mask 70 having a location recognition mark pattern 72 for forming the location recognition mark 102 is provided. Here, the position recognition pattern 72 formed on the exposure mask 70 is preferably formed in a diagonal direction of the unit exposure pattern 71, but is not limited thereto and does not interfere with the unit exposure pattern 71 without a predetermined distance therefrom. It may be formed in a spaced position. In addition, the position recognition mark may be formed in the unit exposure pattern.

On both sides of the stage 53, supply parts 80 and 90, which are supply means for continuously supplying the substrate material at a predetermined pitch, are respectively provided. Each of the supply units 80 and 90 drives at least one of the upper and lower rollers 81, 82, 91, 92 and the upper and lower rollers 81, 82, 91, 92, which are in close contact with the substrate material therebetween. Stepping motors 83 and 93. The upper and lower rollers 81, 82, 91, 92 are formed so that the diameter D1 of both edges is larger than the diameter D2 of the center portion so as to hold the edge of the substrate material 100, respectively. At this time, it is preferable that the diameter of the edge of the roller which opposes an exposure surface among the said rollers is formed larger than the diameter of a center part. The upper and lower rollers 81 and 82 and 91 and 92 may be manufactured by installing two rollers spaced at predetermined intervals from the driving shaft. And at one side of the stage, that is, the exit side to which the substrate material is moved, the sensing means 210 for detecting the position recognition mark 72 formed by exposing the substrate material is provided, the information detected by the sensing means 210 By controlling the stepping motors 83 and 93 of the supply unit 80 and 90 to align the subsequent exposure positions of the substrate material 100. The recognition means consists of a CCD camera. Although not shown in the drawings, the exposure mask may be positioned by the driver to align the exposure pattern of the substrate material.

The operation of the substrate exposure apparatus of the semiconductor device configured as described above and the exposure method through the same will be described in more detail as follows.

First, in order to expose the substrate material 100 using the exposure apparatus, the stepping motors 83 and 93 of the supply units 80 and 90 are operated to drive the upper and lower rollers (81, 82, 91, 92). The exposure area of the substrate material 100 wound around the supply reel 51 is positioned above the stage 53. In this state, the light irradiated from the exposure lamp 61a of the exposure unit 60 is exposed to an exposure mask ( 70 to irradiate the substrate material 100 on the stage to expose the exposure area of the substrate material 100 so that the first exposure pattern 101 and the first position recognition mark 102 are formed on the substrate material. When the exposure is completed as described above, the substrate material 100 is moved by using the supply parts 80 and 90. The movement of the substrate material recognizes the first position recognition mark under the CCD camera which is the recognition means. When the CCD camera recognizes this and the control unit 200 In the case of deviation from the reference set on the basis of the alignment of the teeth, the stepping motors 83.93 of the supply units 80 and 90 are rotated forward and backward to align the positions of the subsequent exposure patterns 101. The alignment of the subsequent exposure patterns The alignment may be performed by controlling an exposure mask adjusting unit, which may be further installed on one side of the exposure mask.When the alignment of the subsequent exposure positions is completed, the exposure pattern and the position recognition mark are exposed on the photosensitive film of the substrate material 100. After the transfer as described above to determine the subsequent exposure position using the position recognition mark.

In the case of a thin metal that needs to be exposed over both sides, an exposure mask and a light source are additionally placed on the upper and lower sides to perform the exposure operation on both sides.

As described above, the substrate exposure method of the semiconductor device and the device according to the present invention are aligned and exposed by using the position recognition mark exposed when the exposure pattern is formed in the previous step when exposing using a mask while transferring the band-like substrate material. Therefore, the accuracy of setting the position of the subsequent exposure pattern can be improved. According to the experiments of the present inventors, when aligning the subsequent exposure position using the exposed position recognition mark, the position error of the subsequent exposure position recognition mark could be reduced to 2 μm or less based on 250 mm. In particular, by making the distance between the exposure patterns constant, defects in the subsequent process for installing the electronic device can be reduced, and the amount of scrap discarded can be reduced. In addition, the present invention has the effect of reducing the manufacturing cost of the device by moving and aligning by the hole or the like formed on the edge of the conventional material.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary and those skilled in the art will understand that various modifications and variations are possible from this. Therefore, the present invention will be defined by the technical spirit of the appended claims the true technical protection scope of the present invention.

Claims (8)

Preparing a strip-shaped substrate material on which a photosensitive film is formed; Preparing at least one exposure mask having a unit exposure pattern and a position recognition pattern; Exposing the substrate material using the exposure mask; Transferring the substrate material on which the exposure is completed; Detecting the position recognition pattern exposed by the position recognition pattern of the exposure mask on the substrate material and aligning the positions of subsequent exposure areas based on the alignment reference. . The method of claim 1 The exposing step A substrate material exposure method of a semiconductor device, characterized in that the upper and lower portions of the substrate material. The method of claim 1 Aligning the position of the subsequent exposure area And controlling a transfer means for transferring the substrate material. The method of claim 1 Aligning the position of the subsequent exposure area An exposure method of a substrate material of a semiconductor device, characterized by controlling the position of an exposure mask. At least one light source At least one exposure stage, transfer means for transferring the continuous substrate material on the exposure stage at predetermined intervals, provided at both sides of the exposure stage, and installed at a predetermined distance apart from the exposure stage to expose the substrate material. At least one exposure mask provided with a unit exposure pattern, at least one position recognition pattern, recognition means installed on one side of the exposure stage to recognize a position recognition mark exposed by the position recognition pattern, and the position recognition means. And control means for aligning subsequent exposure positions of the substrate material by the information detected by the substrate material. The method of claim 5, And said recognizing means comprises a CCD camera. The method of claim 5, The control means for aligning the subsequent exposure positions controls the transfer means to align the subsequent exposure positions. The method of claim 5 An exposure mask driver is further provided on one side of the at least one exposure mask, and the control means for aligning the subsequent exposure positions controls the exposure mask driver to align the subsequent exposure positions. Device